Chip testing device and chip testing system

Abstract

The utility model provides a chip testing device and a chip testing system, and relates to the technical field of chip testing. According to the utility model, a probe seat is installed on a first PCB through a bolt, the probe seat is provided with an installation position used for installing a tested chip and a test probe installed at the installation position, the test probe penetrates through the probe seat, the top of the test probe is contacted with the tested chip, and the probe seat is provided with at least one second positioning hole at a position close to the installation position. And the shaft pin passes through the second positioning hole and the first positioning hole, so that the bottom of the test probe is in full contact with the first PCB. According to the technical scheme, the gap between the probe seat and the first PCB is reduced equivalently by using the shaft pin, so that the test probe can abut against the first PCB, normal conduction of a circuit is ensured, and the stability of testing the tested chip is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip testing device and a chip testing system. Background Art

[0002] Due to the high-frequency characteristics of silicon carbide devices, small junction capacitance, low gate charge, fast switching speed, and extremely large change rates of voltage and current during the switching process, parasitic stray inductance is very likely to produce voltage overshoot and oscillation under extremely large current change rates (di / dt), resulting in increased device voltage stress, loss, and electromagnetic interference problems. When conducting AC testing of silicon carbide, the generation of parasitic stray inductance is inevitable. The size of the stray inductance is related to the circuit length from the probe seat to the tester. The shorter the line, the smaller the stray inductance.

[0003] In the prior art, the test circuit is usually connected through a flexible flat cable, and there is basically no requirement for the positional relationship between the probe holder and the test machine; however, the cable is long and will produce a large stray inductance. However, if the probe holder is directly installed on the test machine through bolts, there may be a poor contact between the test probe and the circuit board, resulting in a circuit failure. Utility Model Content

[0004] One purpose of the utility model is to provide a chip testing device to solve the technical problem in the prior art that a probe seat is directly installed on a circuit board through bolts, resulting in poor contact between the test probe and the circuit board.

[0005] A further object of the present invention is to avoid deformation of the circuit board.

[0006] Another object of the present invention is to provide a chip testing system having the chip testing device.

[0007] In particular, the purpose of the utility model is to provide a chip testing device, comprising:

[0008] A testing machine, used to test the chip under test;

[0009] A first PCB board is mounted on the top of the test machine, and at least one first positioning hole is provided on the first PCB board;

[0010] At least one probe seat is mounted on the first PCB board by bolts, the probe seat has a mounting position for mounting the chip under test and a test probe installed at the mounting position, the test probe passes through the probe seat, and the top is in contact with the chip under test, and the probe seat is provided with at least one second positioning hole at a position close to the mounting position, so that an axle pin passes through the second positioning hole and the first positioning hole, so that the bottom of the test probe is in full contact with the first PCB board.

[0011] Optionally, the number of the first positioning holes and the number of the second positioning holes are both plural, and each first positioning hole corresponds to one second positioning hole.

[0012] Optionally, a plurality of the first positioning holes are arranged on two opposite sides of the mounting position.

[0013] Optionally, the plurality of first positioning holes are evenly distributed around the mounting position.

[0014] Optionally, it also includes:

[0015] The second PCB board is installed on the test machine and is located between the first PCB board and the test machine. The second PCB board is connected to the first PCB board.

[0016] Optionally, it also includes:

[0017] The support assembly is arranged between the first PCB board and the second PCB board, and is used to support the first PCB board when the chip under test is tested.

[0018] Optionally, the support assembly further includes:

[0019] Metal sheets;

[0020] A first insulating plate, disposed between the metal plate and the first PCB board, for electrical isolation between the metal plate and the first PCB board;

[0021] The second insulating plate is disposed between the metal plate and the second PCB board and is used for electrical isolation between the metal plate and the second PCB board.

[0022] Optionally, the thickness of the metal plate is greater than the thickness of the first insulating plate, and greater than the thickness of the second insulating plate.

[0023] Optionally, there are multiple probe seats, and the multiple probe seats are arranged in a straight line or in a circle.

[0024] In particular, the utility model also provides a chip testing system, including the chip testing device as described above.

[0025] According to the solution of the utility model, the probe seat is installed on the first PCB board by bolts, the probe seat has a mounting position for mounting the chip under test and a test probe installed at the mounting position, the test probe passes through the probe seat, and the top is in contact with the chip under test, and the probe seat is provided with at least one second positioning hole at a position close to the mounting position, so that the second positioning hole and the first positioning hole can be passed through by an axle pin, so that the bottom of the test probe can be fully in contact with the first PCB board. The above technical solution is equivalent to using an axle pin to reduce the gap between the probe seat and the first PCB board, so that the test probe can be pressed against the first PCB board, ensuring the normal conduction of the circuit and ensuring the stability of the test of the chip under test.

[0026] Furthermore, the utility model arranges a support assembly between the first PCB board and the second PCB board, which can avoid.

[0027] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0029] Figure 1 is a schematic structural diagram of a chip testing device according to an embodiment of the utility model;

[0030] Figure 2 yes Figure 1 A schematic cross-sectional view of the chip testing device shown;

[0031] Figure 3 yes Figure 1 A schematic enlarged view of a probe seat in the chip testing device shown.

[0032] Description of reference numerals:

[0033] 100-chip testing device, 10-probe seat, 20-first PCB board, 30-support assembly, 40-second PCB board, 50-testing machine, 60-axis pin, 70-bolt, 11-mounting position, 12-test probe, 13-mounting hole, 14-second positioning hole, 21-first positioning hole, 22-threaded hole, 31-first insulating plate, 32-metal plate, 33-second insulating plate. DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0035] In the description of the present invention, it is necessary to understand that the terms "upper" and "lower" etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0037] Unless otherwise clearly specified and limited, the terms "connection", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in the present utility model according to the specific circumstances.

[0038] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0039] Figure 1 is a schematic structural diagram of a chip testing device 100 according to an embodiment of the present utility model. Figure 2 yes Figure 1 The schematic cross-sectional view of the chip testing device 100 is shown. Figure 3 yes Figure 1 FIG. 1 is a schematic enlarged view of the probe seat 10 in the chip testing device 100. Figures 1 to 3As shown, in this embodiment, the chip testing device 100 includes a tester 50, a first PCB board 20 and at least one probe seat 10. The tester 50 is used to test the chip under test. The first PCB board 20 is installed on the top of the tester 50, and at least one first positioning hole 21 is provided on the first PCB board 20. The probe seat 10 is installed on the first PCB board 20 by bolts 70. The probe seat 10 has a mounting position 11 for mounting the chip under test and a test probe 12 installed at the mounting position 11. The test probe 12 passes through the probe seat 10, and the top contacts the chip under test. The probe seat 10 is provided with at least one second positioning hole 14 at a position close to the mounting position 11, so that the shaft pin 60 passes through the second positioning hole 14 and the first positioning hole 21, so that the bottom of the test probe 12 is fully in contact with the first PCB board 20.

[0040] In order to conduct the circuit, the test probe 12 on the probe seat 10 needs to connect the metal contact of the chip under test and the metal contact of the first PCB board 20, and the tolerance is generally less than 0.2mm. In order to ensure the normal conduction of the circuit, this embodiment uses the shaft pin 60 to reduce the gap between the probe seat 10 and the first PCB board 20, so that the test probe 12 can fully contact the first PCB board 20, ensure the normal conduction of the circuit, and ensure the stability of the test of the chip under test. Here, the positioning error of the shaft pin 60 is about 0.05mm.

[0041] This embodiment adopts a method of directly installing the probe seat 10 on the first PCB board 20 of the test machine 50, reducing the circuit distance between the probe seat 10 and the test machine 50, thereby greatly reducing the stray inductance during AC testing of silicon carbide grains. The stray inductance is reduced from more than 120nH (nanohenry) to 60nH (nanohenry), thereby improving the test performance.

[0042] In this embodiment, the test probe 12 is inserted into the installation position 11, see Figure 2 When the chip under test is placed at the mounting position 11 , it contacts the top of the test probe 12 .

[0043] In this embodiment, the number of the first positioning holes 21 and the number of the second positioning holes 14 are both multiple, and each first positioning hole 21 corresponds to one second positioning hole 14. By providing multiple second positioning holes 14, this embodiment can achieve a better contact effect between the test probe 12 and the first PCB board 20 compared to the solution of providing only one second positioning hole 14.

[0044] In this embodiment, a plurality of first positioning holes 21 are arranged on two opposite sides of the mounting position 11. The number of first positioning holes 21 arranged on each side can be set according to specific design requirements. Figure 3Two first positioning holes 21 are provided on one side of the mounting position 11 , and one first positioning hole 21 is provided on the other side, that is, a total of three first positioning holes 21 are provided.

[0045] In another embodiment, the plurality of first positioning holes 21 are evenly distributed around the mounting position 11. The plurality of first positioning holes 21 can be evenly distributed around the mounting position 11 in a ring shape, and the number of the first positioning holes 21 can be set according to specific design requirements.

[0046] In this embodiment, a plurality of threaded holes 22 are provided on the first PCB board 20, and a plurality of mounting holes 13 are provided on the probe seat 10. The plurality of mounting holes 13 are evenly distributed at the edge of the probe seat 10, and each mounting hole 13 corresponds to a threaded hole 22, so that the bolt 70 passes through the mounting hole 13 and the threaded hole 22, thereby mounting the probe seat 10 on the first PCB board 20.

[0047] In this embodiment, the chip testing device 100 further includes a second PCB board 40, which is mounted on the test machine 50 and located between the first PCB board 20 and the test machine 50, and the second PCB board 40 is connected to the first PCB board 20. Here, it is equivalent to that the second PCB board 40 is located above the test machine 50, and the first PCB board 20 is located above the second PCB board 40. The circuit passes through the metal contacts of the chip under test, and sequentially passes through the test probe 12, the first PCB board 20, the second PCB board 40 to the test machine 50.

[0048] In this embodiment, the chip testing device 100 further includes a support assembly 30, which is disposed between the first PCB board 20 and the second PCB board 40, and is used to support the first PCB board 20 when the chip under test is tested. Since the probe seat 10 is subjected to a pressure of about 300N when the chip under test is tested, and the material of the first PCB board 20 is glass fiber, a large deformation will occur when under pressure. In order to reduce the deformation, this embodiment adds a support assembly 30 below the first PCB board 20, so that the deformation of the first PCB board 20 can be reduced.

[0049] In this embodiment, the support assembly 30 further includes a metal plate 32, a first insulating plate 31, and a second insulating plate 33. The first insulating plate 31 is disposed between the metal plate 32 and the first PCB board 20, and is used for electrical isolation between the metal plate 32 and the first PCB board 20. The second insulating plate 33 is disposed between the metal plate 32 and the second PCB board 40, and is used for electrical isolation between the metal plate 32 and the second PCB board 40. Here, the metal plate 32 is 45# steel, and is used to provide force support for the first PCB board 20 during the test of the chip under test, so that the deformation of the first PCB board 20 can be less than 50 microns. In other embodiments, the material of the metal plate 32 can also be selected according to specific design requirements.

[0050] It can be understood that the chip testing device 100 is sequentially arranged from top to bottom with a probe seat 10, a first PCB board 20, a first insulating board 31, a metal plate 32, a second insulating board 33, a second PCB board 40 and a testing machine 50, see Figure 2 .

[0051] In this embodiment, the thickness of the metal plate 32 is greater than the thickness of the first insulating plate 31, and greater than the thickness of the second insulating plate 33. In other embodiments, the thicknesses of the metal plate 32, the first insulating plate 31, and the second insulating plate 33 can be selected according to specific design requirements.

[0052] In this embodiment, there are multiple probe seats 10 , which are arranged in a straight line or in a circle. The specific number of probe seats 10 can be set according to the test requirements of the chip under test.

[0053] This embodiment further provides a chip testing system, which includes the above-mentioned chip testing device 100. The chip testing device 100 will not be described in detail here.

[0054] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A chip testing device, characterized in that: include: A testing machine, used to test the chip under test; A first PCB board is mounted on the top of the test machine, and at least one first positioning hole is provided on the first PCB board; At least one probe seat is mounted on the first PCB board by bolts, the probe seat has a mounting position for mounting the chip under test and a test probe installed at the mounting position, the test probe passes through the probe seat, and the top is in contact with the chip under test, and the probe seat is provided with at least one second positioning hole at a position close to the mounting position, so that an axle pin passes through the second positioning hole and the first positioning hole, so that the bottom of the test probe is in full contact with the first PCB board.

2. The chip testing device according to claim 1, characterized in that: There are multiple first positioning holes and multiple second positioning holes, and each first positioning hole corresponds to one second positioning hole.

3. The chip testing device according to claim 2, characterized in that: The plurality of first positioning holes are arranged on two opposite sides of the installation position.

4. The chip testing device according to claim 2, characterized in that: The plurality of first positioning holes are evenly distributed around the installation position.

5. The chip testing device according to claim 1, characterized in that: Also includes: The second PCB board is installed on the test machine and is located between the first PCB board and the test machine. The second PCB board is connected to the first PCB board.

6. The chip testing device according to claim 5, characterized in that: Also includes: The support assembly is arranged between the first PCB board and the second PCB board, and is used to support the first PCB board when the chip under test is tested.

7. The chip testing device according to claim 6, characterized in that: The support assembly also includes: Metal sheets; A first insulating plate, disposed between the metal plate and the first PCB board, for electrical isolation between the metal plate and the first PCB board; The second insulating plate is disposed between the metal plate and the second PCB board and is used for electrical isolation between the metal plate and the second PCB board.

8. The chip testing device according to claim 7, characterized in that: The thickness of the metal plate is greater than the thickness of the first insulating plate, and greater than the thickness of the second insulating plate.

9. The chip testing device according to any one of claims 1 to 4, characterized in that: There are multiple probe seats, and the multiple probe seats are arranged in a straight line or in a circle.

10. A chip testing system, characterized in that: The invention comprises a chip testing device as claimed in any one of claims 1 to 9.

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