Blade needle mechanism for semiconductor testing device and semiconductor testing device
By designing a conductive blade needle mechanism in a semiconductor test device, using the shrapnel to slide the oxide layer on the chip pad when the test probe is applied to the pressure, the problem of metal oxide layer affecting the test results is solved, and more accurate Test results and pad protection.
Patent Information
- Application Number
- CN202420894479.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-26
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-04-26
AI Technical Summary
During semiconductor testing, the metal oxide layer of the chip pad causes inaccurate test results, especially in the case of bare chips, which are prone to damage to the pads.
Design a blade needle mechanism, including conductive blade needles and shrapnel. When pressure is applied through the target test probe, the shrapnel slides and scrapes away the oxide layer on the pad of the chip to be tested to ensure electrical connection and avoid the oxide layer affecting the test results.
Effectively remove the oxide layer on the chip pad to ensure the accuracy of the test results, avoid pad damage, and improve the reliability of the test.
Smart Images
Figure CN222354018U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor testing, in particular to a blade needle mechanism for semiconductor testing and a semiconductor testing device. Background Art
[0002] Generally, the material of the chip pad is aluminum, and the pad of the packaged device is generally made of copper or tin. Since the above metals are easily oxidized in the air or in some high-temperature processes, the direct contact of the test probe with the oxide layer during the test process will lead to inaccurate test results, mainly because the resistance of the metal oxide is higher than the resistance of the metal pad. In view of the problem of the oxide layer at the pad position in the above test process, the probe is usually used to pierce the oxide layer and then pierce the pad. In the packaged device, such as BGA (Ball Grid Array, ball grid array package) with balls or QFN (Quad Flat No-leads Package, square flat no-lead package) with solder layer, there is a certain thickness, and better electrical performance testing can be achieved after piercing the oxide layer. However, for the bare chip after cracking, the oxide layer of the chip pad is usually only 0.1μm or even thinner, so the use of the above method is likely to cause problems such as chip pad damage.
[0003] Therefore, it is urgent to design a method for removing the metal oxide layer on the surface of the bare chip after cracking to prevent the metal oxide layer on the pad from affecting the test results. Utility Model Content
[0004] One purpose of the utility model is to provide a blade needle mechanism for a semiconductor testing device, so as to solve the technical problem in the prior art that the metal oxide layer on the chip pad affects the test result.
[0005] Another object of the utility model is to provide a semiconductor testing device having the blade needle mechanism.
[0006] In particular, the utility model provides a blade needle mechanism for a semiconductor testing device, comprising:
[0007] Mounting seat;
[0008] At least one blade needle is connected to the mounting seat and has conductive properties, any one of the blade needles is electrically connected to at least one target test probe, the blade needle includes a main body and at least one spring piece connected to the main body, any one of the spring pieces is in contact with a corresponding pad of the chip under test, the spring piece is configured to slide and scrape off the oxide layer on the corresponding pad of the chip under test when the blade needle is subjected to pressure applied by the target test probe, and the corresponding target test probe, the main body, the spring piece and the corresponding pad of the chip under test are electrically connected.
[0009] Optionally, the body comprises:
[0010] a first part, the first part being connected to the spring sheet;
[0011] The second part has one end connected to the first part, and the other end of the second part away from the first part is connected to the mounting seat.
[0012] Optionally, the blade needle mechanism further comprises a rotating shaft, and the second part is rotatably connected to the mounting seat via the rotating shaft.
[0013] Optionally, the rotating shaft is supported by insulating material, and the blade needle is made of conductive material.
[0014] Optionally, the first portion is elastic, and when the blade needle is subjected to pressure from the target test probe, the first portion is deformed under pressure to apply pressure to the spring sheet.
[0015] Optionally, the spring piece is made of metal material, the first part is made of conductive material, and the second part is made of insulating material.
[0016] Optionally, any of the spring sheets is bent inwards; or
[0017] Any of the spring sheets is bent outwards.
[0018] Optionally, there are multiple spring sheets, which form a ring shape and are configured to simultaneously expand outward or contract inward when under pressure.
[0019] Optionally, the plurality of spring sheets are arranged to be bent toward the center position of the formed ring shape; or
[0020] The plurality of elastic sheets are arranged to be bent toward the outer side of the ring shape.
[0021] In particular, the utility model also provides a semiconductor testing device, comprising:
[0022] A first test seat, having a limiting portion for placing a chip under test;
[0023] A second test socket having at least one probe assembly, each of which includes at least one test probe;
[0024] at least one blade needle mechanism as described above, the blade needle mechanism being mounted on the second test seat;
[0025] When the first test socket and the second test socket are configured to be interlocked and installed, any of the springs included in the blade needle mechanism slides and scrapes away the oxide layer on the corresponding pad of the chip under test when the blade needle is subjected to pressure applied by the target test probe.
[0026] In the utility model, the blade needle is connected to the mounting seat and has conductive properties. Any blade needle is electrically connected to at least one target test probe. The blade needle includes a main body and at least one spring piece connected to the main body. Any spring piece contacts the corresponding pad of the chip under test. The spring piece is configured to slide and scrape off the oxide layer on the corresponding pad of the chip under test when the blade needle is subjected to pressure applied by the target test probe, thereby avoiding the oxide layer from affecting the test result of the chip under test and ensuring the accuracy of the test result.
[0027] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:
[0029] Figure 1 It is a schematic cross-sectional view of a blade needle mechanism, a chip under test, and a target test probe according to an embodiment of the utility model;
[0030] Figure 2 It is a schematic structural diagram of a blade needle mechanism, a chip under test, and a target test probe according to an embodiment of the utility model;
[0031] Figure 3 is a schematic structural diagram of a blade needle mechanism according to an embodiment of the utility model;
[0032] Figure 4 is a schematic structural diagram of a semiconductor testing device according to an embodiment of the utility model;
[0033] Figure 5 yes Figure 4 A schematic structural diagram of a first test socket in the semiconductor test device shown;
[0034] Figure 6 It is a schematic structural diagram of a blade needle mechanism in a compressed and deformed state according to an embodiment of the utility model.
[0035] Reference numerals:
[0036] 1000-semiconductor testing device, 100-blade needle mechanism, 200-probe assembly, 210-target test probe, 220-probe seat, 300-chip under test, 310-pad, 520-limiting part, 400-second test seat, 500-first test seat, 10-mounting seat, 20-blade needle, 21-spring, 22-main body, 222-second part, 221-first part, 24-rotating shaft, 25-mounting groove. DETAILED DESCRIPTION
[0037] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0038] In the description of the present invention, it is necessary to understand that the terms "upper" and "lower" etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0039] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.
[0040] Unless otherwise clearly specified and limited, the terms "connection", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in the present utility model according to the specific circumstances.
[0041] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.
[0042] Figure 1 1 is a schematic cross-sectional view of a blade needle mechanism 100, a chip under test 300, and a target test probe 210 according to an embodiment of the present utility model. Figure 2 The schematic diagram of the blade needle mechanism 100, the chip under test 300, and the target test probe 210 according to an embodiment of the utility model. In this embodiment, the chip under test 300 refers to a bare chip (bare Die) after splitting. By performing Die-level static and dynamic tests on the chip under test 300, the performance indicators of the chip under test 300 can be screened, and the finished product yield of the module end after packaging can be improved. Figure 1 and Figure 2 As shown, the blade needle mechanism 100 for a semiconductor test device includes a mounting seat 10 and at least one blade needle 20. The mounting seat 10 is mounted on the semiconductor test device, and the semiconductor test device is used to perform a cell test on a chip under test 300. At least one blade needle 20 is connected to the mounting seat 10 and has a conductive property. Any blade needle 20 is electrically connected to at least one target test probe 210. The blade needle 20 includes a body 22 and at least one spring piece 21 connected to the body 22. Any spring piece 21 contacts a corresponding pad 310 of the chip under test 300. The spring piece 21 is configured to slide and scrape off the oxide layer on the corresponding pad 310 of the chip under test 300 when the blade needle 20 is subjected to pressure applied by the target test probe 210. The corresponding target test probe 210, the body 22, the spring piece 21 and the corresponding pad 310 of the chip under test 300 are electrically connected.
[0043] In this embodiment, the spring 21 slides and scrapes off the oxide layer on the pad 310 when the blade needle 20 is subjected to pressure from the target test probe 210, thereby preventing the oxide layer from affecting the test result of the chip under test 300 and ensuring the accuracy of the test result.
[0044] In this embodiment, the body 22 includes a first portion 221 and a second portion 222, and the first portion 221 is connected to the spring 21. Here, the first portion 221 is arranged opposite to the corresponding pad 310 of the chip under test 300. One end of the second portion 222 is connected to the first portion 221, and the other end of the second portion 222 away from the first portion 221 is connected to the mounting seat 10.
[0045] Figure 3 FIG. 1 is a schematic structural diagram of a blade needle mechanism 100 according to an embodiment of the present utility model. Figure 3 As shown, and see Figure 1In this embodiment, the blade needle mechanism 100 also includes a rotating shaft 24, and the second part 222 of the blade needle 20 is rotatably connected to the mounting seat 10 through the rotating shaft 24. The spring piece 21 is configured to move when the first part 221 of the blade needle 20 is pressed and rotates around the rotating shaft 24, so as to scrape off the oxide layer on the pad 310. In this embodiment, the movement in the vertical direction is changed to the movement in the vertical direction and the horizontal direction by the rotation of the rotating shaft 24, so that the spring piece 21 of the blade needle 20 produces a horizontal displacement to scrape off the oxide layer. Here, the spring piece 21 produces a small horizontal displacement. Specifically, the target test probe 210 provides downward pressure (toward the direction of the chip under test 300) to the corresponding blade needle 20, and the blade needle 20 rotates around the rotating shaft 24 to produce a tangential movement trend, which is decomposed into a downward movement trend and a horizontal movement trend (parallel to the direction of the chip under test 300). The downward movement trend increases the pressure of the blade needle 20 on the corresponding pad 310, and the horizontal movement trend causes the blade needle 20 to move horizontally on the surface of the corresponding pad, that is, the spring piece 21 moves and scrapes the surface of the pad 310 under pressure. In this embodiment, the type, structure and size of the corresponding spring piece 21 can be selected according to the range of force required for scraping.
[0046] In this embodiment, there are multiple spring pieces 21. In other embodiments, the number of spring pieces 21 can also be set to one, which can be specifically set according to design requirements.
[0047] In this embodiment, any spring piece 21 is bent inwards or any spring piece 21 is bent outwards. In other embodiments, the structural shape of the spring piece 21 can also be designed according to specific design requirements.
[0048] In this embodiment, the rotating shaft 24 is made of insulating material, and the blade needle 20 is made of conductive material.
[0049] In a preferred embodiment, the outer surface of the spring 21 is gold-plated to prevent oxidation and reduce contact resistance.
[0050] In this embodiment, the first portion 221 is arranged in a horizontal direction, and the second portion 222 and the first portion 221 are arranged in a straight line or at a preset angle. Figure 1 As shown, the second portion 222 is arranged at a preset angle with the first portion 221, and the preset angle is greater than or equal to 90° and less than 180°. Here, the preset angle can be designed according to design requirements, for example, it can be set to 110° or 130°.
[0051] Figure 4 is a schematic structural diagram of a semiconductor testing device 1000 according to an embodiment of the present utility model. Figure 5 yes Figure 4FIG. 1 is a schematic structural diagram of the first test socket 500 in the semiconductor testing device 1000. Figure 4 and Figure 5 As shown, in this embodiment, the semiconductor testing device 1000 includes a first test socket 500, a second test socket 400 and at least one blade needle mechanism 100 as described in any of the above embodiments. The first test socket 500 has a limiting portion 520 for placing the chip under test 300. The second test socket 400 has at least one probe assembly 200, and each probe assembly 200 includes at least one target test probe 210. The blade needle mechanism 100 is installed on the second test socket 400. When the first test socket 500 and the second test socket 400 are arranged to be interlocked and installed, any spring piece 21 included in the blade needle mechanism 100 moves to scrape and remove the oxide layer on the corresponding pad 310 of the chip under test 300 when the blade needle 20 is subjected to pressure applied by the target test probe 210.
[0052] When the first test socket 500 and the second test socket 400 are relatively snap-fitted and installed, the target test probe 210 contacts the first part 221 and provides pressure, causing the blade needle 20 to rotate, forming horizontal and vertical movement components, thereby achieving electrical connection between the target test probe 210, the first part 221, the spring clip 21, and the pad 310. At the same time, the spring clip 21 moves to scrape and remove the oxide layer of the pad 310.
[0053] In this embodiment, the probe assembly 200 includes a probe socket 220 , and the probe socket 220 is mounted on the second test socket 400 .
[0054] See also Figure 1 and Figure 2 , part of the target test probe 210 is inserted into the interior of the mounting seat 10 to contact the blade needle 20. The mounting seat 10 is provided with at least one mounting slot 25, at least part of the body 22 of any blade needle 20 is located in the corresponding mounting slot 25, and the spring piece 21 is located outside the mounting slot 25. It can be understood that at least part of the target test probe 210 is inserted into the interior of the mounting slot 25. In this embodiment, a blade needle 20 is installed in each mounting slot 25. In other embodiments, the number of blade needles 20 in each mounting slot 25 can also be set according to specific design requirements.
[0055] Embodiment 2:
[0056] The difference between Example 2 and Example 1 is only that:
[0057] Figure 6 FIG. 1 is a schematic structural diagram of a blade needle mechanism 100 in a compressed and deformed state according to an embodiment of the present invention. Figure 6As shown, the first part 221 is elastic. When the blade needle 20 is subjected to pressure applied by the target test probe, the first part 221 is deformed under pressure to apply pressure to the spring piece 21. In other words, the first part 221 can be elastically deformed under pressure and reset after the pressure is removed. The spring piece 21 is configured to move after the first part 221 is deformed by the pressure applied by the target test probe 210, thereby scraping off the oxide layer on the pad 310. Here, the blade needle 20 only needs to be fixedly connected to the mounting seat 10, and does not need to be rotatably connected to the mounting seat 10 through a rotating shaft.
[0058] In this embodiment, the spring piece 21 is made of metal material, the first portion 221 is made of conductive material, and the second portion 222 is made of insulating material.
[0059] In this embodiment, the first portion 221 is arranged horizontally when not under pressure, and is tilted downward and deformed when under pressure from the target test probe 210, thereby driving the spring 21 to move slightly horizontally. When the pressure is removed, the first portion 221 returns to its original shape.
[0060] Embodiment 3:
[0061] The difference between Example 3 and Example 1 is only that:
[0062] There are multiple spring pieces 21, and the multiple spring pieces 21 form a ring. It can be understood that the multiple spring pieces 21 are arranged around the same circumference. The multiple spring pieces 21 are arranged to expand outward or contract inward at the same time when compressed. Specifically, the multiple spring pieces 21 are arranged to bend toward the center position of the formed ring; or the multiple spring pieces 21 are arranged to bend toward the outside of the ring.
[0063] In another embodiment, the spring sheet 21 may also be configured as an annular spring sheet structure.
[0064] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.
Claims
1. A blade needle mechanism for a semiconductor testing device, characterized in that: include: Mounting seat; At least one blade needle is connected to the mounting seat and has conductive properties, any one of the blade needles is electrically connected to at least one target test probe, the blade needle includes a main body and at least one spring piece connected to the main body, any one of the spring pieces is in contact with a corresponding pad of the chip under test, the spring piece is configured to slide and scrape off the oxide layer on the corresponding pad of the chip under test when the blade needle is subjected to pressure applied by the target test probe, and the corresponding target test probe, the main body, the spring piece and the corresponding pad of the chip under test are electrically connected.
2. The blade needle mechanism according to claim 1, characterized in that: The body comprises: a first part, the first part being connected to the spring sheet; The second part has one end connected to the first part, and the other end of the second part away from the first part is connected to the mounting seat.
3. The blade needle mechanism according to claim 2, characterized in that: The blade needle mechanism also includes a rotating shaft, and the second part is rotatably connected to the mounting seat via the rotating shaft.
4. The blade needle mechanism according to claim 3, characterized in that: The rotating shaft is made of insulating material, and the blade needle is made of conductive material.
5. The blade needle mechanism according to claim 2, characterized in that: The first portion is elastic, and when the blade needle is subjected to pressure from the target test probe, the first portion is compressed and deformed to apply pressure to the spring sheet.
6. The blade needle mechanism according to claim 5, characterized in that: The spring piece is made of metal material, the first part is made of conductive material, and the second part is made of insulating material.
7. The blade needle mechanism according to claim 1, characterized in that: Any of the spring sheets is bent inwards; or Any of the spring sheets is bent outwards.
8. The blade needle mechanism according to claim 7, characterized in that: There are multiple spring sheets, which form a ring shape and are configured to expand outwards or contract inwards simultaneously when under pressure.
9. The blade needle mechanism according to claim 8, characterized in that: The plurality of spring sheets are arranged to bend toward the center position of the formed ring; or The plurality of elastic sheets are arranged to be bent toward the outer side of the ring shape.
10. A semiconductor testing device, characterized in that: include: A first test seat, having a limiting portion for placing a chip under test; A second test socket having at least one probe assembly, each of which includes at least one target test probe; at least one blade needle mechanism according to any one of claims 1 to 9, the blade needle mechanism being mounted on the second test seat; When the first test socket and the second test socket are configured to be interlocked and installed, any of the springs included in the blade needle mechanism slides and scrapes away the oxide layer on the corresponding pad of the chip under test when the blade needle is subjected to pressure applied by the target test probe.