Display module capable of solving problem of position heating of TFT IC chip

Abstract

The utility model discloses a display module capable of solving the problem of heat generation at the position of a TFT IC chip, which comprises a TFT display screen, a backlight structure and heat insulation graphite foam, the TFT display screen comprises upper glass and lower glass, one side of the lower glass extends to form a binding lug boss, and the IC chip is bound on the binding lug boss; the backlight structure is arranged on the side face, close to the lower glass, of the TFT display screen, the backlight structure comprises a backlight support and an LED lamp strip, a containing cavity is formed in the backlight support, and the LED lamp strip is arranged on the side wall, close to the IC chip, of the containing cavity; the heat insulation graphite foam is arranged on the side face, away from the upper piece of glass, of the lower piece of glass, and the heat insulation graphite foam is located at the binding protruding part. Thus, through the heat insulation graphite foam, heat conduction of the LED light bar can be prevented from being conducted to the position of the IC chip, meanwhile, heat concentrated at the position of the IC chip can be diffused, the problem that heat is generated at the position of the TFT IC chip is solved, and then the problem that a black screen occurs due to the fact that the temperature at the position of the IC chip is too high is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of display screen production, in particular to a display module capable of solving the problem of heating at a TFT IC chip position. Background Art

[0002] With the continuous development of display technology, TFT (Thin Film Transitor) display modules are widely used in various electronic devices because of their advantages such as high resolution, high contrast, and high color saturation. However, with the improvement of display resolution, the power consumption of TFT IC chips also increases. In addition, in order to reduce the number of IC chips used and reduce the size of the entire display module, the power consumption of a single IC chip usually increases exponentially. TFT chips include Source Driver IC and Gate Driver IC, and their power consumption is mainly concentrated on Source Driver IC. With the increase of IC chip power consumption, the temperature rise of TFT screen also increases. Generally, the temperature rise requirement is not more than 15°C, and under strict conditions, it is required not to be higher than 13°C. However, when the backlight is not turned on, the temperature rise at the IC chip position of the current display screen is close to 10°C. The narrow-frame display module usually overlaps the position of the IC chip with the position of the backlight LED lamp, which will cause the heat source at the IC chip to overlap with the heat source of the backlight LED lamp, resulting in the temperature at the IC chip position being too high, and even the temperature reaching the clearing point of the liquid crystal, resulting in a black screen problem in the display module. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a display module capable of solving the heating problem at the position of a TFT IC chip, so as to avoid the problem of a black screen due to excessive temperature at the position of the IC chip.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A display module capable of solving the problem of heating at the position of a TFT IC chip comprises: a TFT display screen, a backlight structure and heat-insulating graphite foam, wherein the TFT display screen comprises an upper glass and a lower glass, one side of the lower glass extends in a direction away from the upper glass to form a binding protrusion, and an IC chip is bound to the binding protrusion; the backlight structure is arranged on a side surface of the TFT display screen close to the lower glass, the backlight structure comprises a backlight bracket and an LED light bar, a receiving cavity is provided on the backlight bracket, and the LED light bar is arranged on a side wall of the receiving cavity close to the IC chip; the heat-insulating graphite foam is arranged on a side surface of the lower glass away from the upper glass, and the heat-insulating graphite foam is located at the binding protrusion.

[0006] In one embodiment, the thermal insulation graphite foam includes thermal insulation foam, an adhesive layer and a graphite sheet, and the thermal insulation foam, the adhesive layer and the graphite sheet are stacked in sequence, the graphite sheet is located on a side close to the IC chip, and the thermal insulation foam is located on a side close to the LED light strip.

[0007] In one embodiment, the IC chip is covered with IC protective glue.

[0008] In one embodiment, the IC protective adhesive is silicone adhesive.

[0009] In one embodiment, the TFT display screen further includes an upper polarizer and a lower polarizer, and the upper polarizer, the upper glass, the lower glass and the lower polarizer are stacked in sequence.

[0010] In one embodiment, the LED light bar includes an LED light and an FPC, and the LED light is disposed on the FPC.

[0011] In one embodiment, the backlight structure further includes a light guide plate and an optical film, wherein the optical film is disposed on a side surface of the light guide plate, and the light guide plate and the optical film are respectively accommodated in the accommodating cavity, and the LED light strip is arranged toward the light guide plate.

[0012] In one embodiment, the optical film includes an upper brightness enhancement film, a lower brightness enhancement film and a diffusion film, and the upper brightness enhancement film, the lower brightness enhancement film and the diffusion film are stacked in sequence.

[0013] In one embodiment, the backlight structure further includes a reflective film, and the reflective film is located between the light guide plate and the bottom surface of the accommodating cavity.

[0014] In one embodiment, the backlight bracket is a metal frame.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The display module of the utility model which can solve the heating problem at the TFT IC chip position is provided with heat-insulating graphite foam on the side surface of the lower glass away from the upper glass, and the heat-insulating graphite foam is located at the binding protrusion. In this way, the heat-insulating graphite foam can play the role of heat insulation and heat dissipation, thereby not only preventing the heat conduction of the LED light bar to the IC chip position, but also diffusing the heat concentrated at the IC chip position to solve the heating problem at the TFT IC chip position, thereby avoiding the problem of a black screen due to excessive temperature at the IC chip position. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0018] Figure 1 It is a front view structural schematic diagram of a display module capable of solving the problem of heat generation at the position of a TFT IC chip in one embodiment of the utility model;

[0019] Figure 2 for Figure 1 A schematic diagram of a stacking structure of a display module capable of solving the problem of heating at a TFT IC chip position;

[0020] Figure 3 for Figure 2 Schematic diagram of the structure of the heat-insulating graphite foam of the display module that can solve the heat generation at the TFT IC chip position. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0022] See also Figure 1 , Figure 2 and Figure 3 As shown, a display module 10 capable of solving the heating problem at the position of a TFT IC chip comprises: a TFT display screen 100, a backlight structure 200 and a heat-insulating graphite foam 300. The TFT display screen 100 comprises an upper glass 110 and a lower glass 120. One side of the lower glass 120 extends in a direction away from the upper glass 110 to form a binding protrusion, and an IC chip 130 is bound to the binding protrusion; the backlight structure 200 is arranged on a side surface of the TFT display screen 100 close to the lower glass 110, the backlight structure 200 comprises a backlight bracket 210 and an LED light bar 220, a receiving cavity is opened on the backlight bracket 210, and the LED light bar 220 is arranged on a side wall of the receiving cavity close to the IC chip 130; the heat-insulating graphite foam 300 is arranged on a side surface of the lower glass 120 away from the upper glass 110, and the heat-insulating graphite foam 300 is located at the binding protrusion.

[0023] It should be noted that when the display module has a narrow frame requirement, the side of the display module bound with the IC chip will be wider than the other three sides, and the LED light bar needs to be placed on the side, so the LED light bar also needs to be set at the wider side, so that the LED light bar and the IC chip will be located on the same side, and the two heat sources are just overlapped, so the temperature of the IC chip position will be higher than other positions. Therefore, in the present utility model, by setting the heat-insulating graphite foam 300 between the IC chip and the LED light bar 220, the heat-insulating graphite foam plays a role in heat insulation and heat dissipation. Specifically, the heat-insulating graphite foam 300 is set on the side surface of the lower glass away from the upper glass, and the heat-insulating graphite foam is located at the binding protrusion. In this way, the heat-insulating graphite foam can play a role in heat insulation and heat dissipation, so that it can not only block the heat conduction of the LED light bar to the IC chip position, but also diffuse the heat concentrated at the IC chip position to solve the heat generation at the TFT IC chip position, thereby avoiding the problem of black screen due to excessive temperature at the IC chip position. The LED light bar 220 includes an LED light and an FPC (flexible printed circuit), and the LED light is disposed on the FPC.

[0024] In one embodiment, the insulating graphite foam 300 includes an insulating foam 310, an adhesive layer 320 and a graphite sheet 330. The insulating foam 310, the adhesive layer 320 and the graphite sheet 330 are stacked in sequence, respectively. The graphite sheet 330 is located on a side close to the IC chip 130, and the insulating foam 310 is located on a side close to the LED light strip 220.

[0025] It should be noted that the graphite sheet 330 faces the IC chip 130. The graphite sheet has good thermal conductivity in the XY direction, especially graphene. Therefore, the graphite sheet can diffuse the heat concentrated at the IC chip position, thereby achieving a better heat dissipation effect. At the same time, in order to prevent the heat source at the LED light bar 220 from being conducted to the IC chip position, the heat insulation foam 310 is set on the side close to the LED light bar 220 to block the heat conduction of the LED light bar 220 to the IC chip position. In this way, the heating problem at the TFT IC chip position can be effectively solved, which causes the black screen phenomenon of the display module.

[0026] In one embodiment, the IC chip 130 is covered with an IC protective adhesive 131. The IC protective adhesive 131 can not only isolate and protect the IC chip 130, but also fill the vacant area of ​​the upper glass corresponding to the binding protrusion, thereby preventing the protruding binding protrusion from being squeezed and damaged. Preferably, the IC protective adhesive 131 is silicone adhesive, which has the characteristics of high elasticity, high temperature resistance and good weather resistance, so it can ensure the protection of the IC chip 130.

[0027] In one embodiment, the TFT display screen 100 further includes an upper polarizer 140 and a lower polarizer 150 , and the upper polarizer 140 , the upper glass 110 , the lower glass 120 and the lower polarizer 150 are stacked in sequence.

[0028] In one embodiment, the backlight structure 200 further includes a light guide plate 230 and an optical film 240. The optical film 240 is disposed on one side of the light guide plate 230. The light guide plate 230 and the optical film 240 are respectively contained in the containing cavity, and the LED light bar is disposed toward the light guide plate 230. The light guide plate 230 plays a role of guiding light, and the light guide plate 230 and the optical film 240 are used to improve the brightness of light and the uniformity of light, thereby ensuring the display effect.

[0029] For example, the optical film 240 includes an upper brightness enhancement film, a lower brightness enhancement film and a diffusion film, which are stacked in sequence. The diffusion film diffuses the light evenly, and the upper brightness enhancement film and the lower brightness enhancement film can achieve brightness enhancement and further even diffusion of the light to ensure the display effect.

[0030] Furthermore, the backlight structure further includes a reflective film, which is located between the light guide plate and the bottom surface of the accommodating cavity. The reflective film reflects the light back to the light guide plate 230 to reduce the loss of light.

[0031] In one embodiment, the backlight bracket is a metal frame. For example, the backlight bracket is made of aluminum alloy. In this case, the thermal conductivity of aluminum alloy is high, so the backlight bracket can improve the thermal conductivity by using aluminum alloy. In another embodiment, the backlight bracket can also be a plastic iron frame, that is, the LED light bar is fixed with a metal frame, such as aluminum alloy, to conduct the heat of the LED light bar away, and the display screen and the optical film and light guide plate are supported by the middle frame, which can be a plastic frame.

[0032] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A display module capable of solving the heating problem at the TFT IC chip position, characterized in that: include: A TFT display screen, the TFT display screen comprising an upper glass and a lower glass, one side of the lower glass extending in a direction away from the upper glass to form a binding protrusion, an IC chip being bound to the binding protrusion; A backlight structure, wherein the backlight structure is arranged on a side surface of the TFT display screen close to the lower glass, the backlight structure comprises a backlight bracket and an LED light bar, the backlight bracket is provided with a receiving cavity, and the LED light bar is arranged on a side wall of the receiving cavity close to the IC chip; and The heat-insulating graphite foam is arranged on a side surface of the lower glass away from the upper glass, and the heat-insulating graphite foam is located at the binding protrusion.

2. The display module capable of solving the heating problem at the TFT IC chip position according to claim 1, characterized in that: The thermal insulation graphite foam includes thermal insulation foam, an adhesive layer and a graphite sheet. The thermal insulation foam, the adhesive layer and the graphite sheet are stacked in sequence. The graphite sheet is located on a side close to the IC chip, and the thermal insulation foam is located on a side close to the LED light strip.

3. The display module capable of solving the heating problem at the position of the TFT IC chip according to claim 1, characterized in that: The IC chip is covered with IC protection glue.

4. The display module capable of solving the heating problem at the position of the TFT IC chip according to claim 3, characterized in that: The IC protective adhesive is silicone adhesive.

5. The display module capable of solving the heating problem at the position of the TFT IC chip according to claim 1, characterized in that: The TFT display screen further comprises an upper polarizer and a lower polarizer, and the upper polarizer, the upper glass, the lower glass and the lower polarizer are stacked in sequence.

6. The display module capable of solving the heating problem at the position of the TFT IC chip according to claim 1, characterized in that: The LED light bar comprises an LED light and an FPC, and the LED light is arranged on the FPC.

7. The display module capable of solving the problem of heating at the position of the TFT IC chip according to claim 1, characterized in that: The backlight structure further includes a light guide plate and an optical film. The optical film is arranged on one side surface of the light guide plate, and the light guide plate and the optical film are respectively accommodated in the accommodating cavity. The LED light bar is arranged toward the light guide plate.

8. The display module capable of solving the problem of heating at the position of the TFT IC chip according to claim 7, characterized in that: The optical film comprises an upper brightness enhancement film, a lower brightness enhancement film and a diffusion film, and the upper brightness enhancement film, the lower brightness enhancement film and the diffusion film are stacked in sequence.

9. The display module capable of solving the heating problem at the position of the TFT IC chip according to claim 8, characterized in that: The backlight structure further includes a reflective film, and the reflective film is located between the light guide plate and the bottom surface of the accommodating cavity.

10. The display module capable of solving the heating problem at the position of the TFT IC chip according to claim 1, characterized in that: The backlight bracket is a metal frame.

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