Transfer equipment and bearing bracket thereof

Abstract

The utility model provides transfer equipment and a bearing bracket thereof, the bearing bracket is used for bearing and moving a loading mechanism, the bearing bracket is used for bearing the loading mechanism and comprises baffles and at least two supporting parts located between the baffles, all the supporting parts are arranged in the first direction, and the first direction is perpendicular to the extending direction of the supporting parts; every two adjacent supporting parts form a bearing position for supporting a loading mechanism; the baffle is provided with a through vent hole used for allowing process gas to enter the bearing position. The baffles at the two ends of the bearing bracket are provided with the vent holes, process gas can penetrate through the vent holes to enter the bearing positions, blocking of the baffles to process gas flowing is reduced, the uniformity of process gas distribution in the semiconductor processing equipment is improved, and reaction by-products and unreacted process gas can be conveniently discharged. The bearing position is used for supporting the loading mechanism, and the process gas is uniform at the bearing position, so that the wafer processing uniformity can be improved, and the product quality is further improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a transfer device and a carrying bracket thereof. Background Art

[0002] Semiconductor materials are widely used in integrated circuits, electronics, new energy and other fields. Semiconductor materials usually need to undergo physical or chemical treatment before they can be applied to products. The heating furnace is one of the many heat treatment equipment for processing semiconductor materials in the integrated circuit, electronics, new energy and other industries. It is mainly used for oxidation, diffusion, annealing, coating and other process treatments on semiconductor materials.

[0003] Semiconductor materials to be processed, being processed or processed need to be loaded and moved by a loading mechanism. During the process, quartz boats, silicon carbide boats, etc. are usually used as loading mechanisms for wafers. Wafers are placed on quartz boats and silicon carbide boats, and the push-pull mechanism sends the quartz boats and silicon carbide boats carrying the wafers into the reaction chamber of the heating furnace for processing. After the process is completed, the wafers are transported back to their original positions.

[0004] In the related art, process gas is used to process wafers in a heating furnace, and the uniformity of the process gas in the heating furnace directly affects the processing quality of the wafers.

[0005] Therefore, how to improve the uniformity of process gas distribution in the heating furnace is a technical problem that technical personnel in this field urgently need to solve. Utility Model Content

[0006] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a transfer device and a supporting bracket thereof, wherein a baffle is provided with vents, and process gas can enter the supporting position through the vents, thereby improving the uniformity of process gas distribution in the semiconductor processing equipment.

[0007] To achieve the purpose of the present application, a bearing bracket is provided for bearing a loading mechanism, the bearing bracket comprising a baffle and at least two supporting portions located between the baffles, each of the supporting portions being arranged along a first direction, the first direction being perpendicular to an extension direction of the supporting portion, and two adjacent supporting portions forming a bearing position for supporting the loading mechanism;

[0008] The baffle has a through vent hole for allowing process gas to enter the bearing position.

[0009] In some embodiments, there are multiple vent holes, and at least some of the vent holes are distributed in a preset area, and the preset area corresponds to the orthographic projection of the wafer loaded by the loading mechanism on the baffle.

[0010] In some embodiments, the upper portion of the baffle is arc-shaped, and the lower portion of the baffle is rectangular, and the length side of the rectangular portion coincides with the straight side of the arc-shaped portion.

[0011] In some embodiments, the support portion includes at least two connecting rods and a support rod located between the two connecting rods, the two ends of the connecting rod are respectively connected to the two baffles, the two connecting rods are distributed along a second direction, the second direction is perpendicular to the first direction and the extension direction of the support portion, the support rod extends along the second direction, and the two ends are respectively connected to the two connecting rods.

[0012] In some embodiments, the carrying bracket further includes a clamping portion, which is located on a side of the baffle away from the carrying position and is used to cooperate with the robot arm for movement.

[0013] In some embodiments, a limiting groove is provided at the bottom of the baffle, and the limiting groove is used to cooperate with a push-pull device to limit the bearing bracket.

[0014] The present application also provides a transfer device, a loading and unloading device, a push-pull device, and a manipulator, wherein:

[0015] The manipulator is connected to the loading and unloading device and is used to support any one of the above-mentioned bearing brackets;

[0016] The loading and unloading device is used to drive the manipulator to move so as to place the load-bearing bracket on the push-pull device or remove the load-bearing bracket from the push-pull device;

[0017] The push-pull device is used to move the carrying bracket into the semiconductor process equipment, or to move the carrying bracket out of the semiconductor process equipment.

[0018] In some embodiments, the manipulator includes a connecting portion and an overlapping portion, and the carrying bracket includes a clamping portion disposed on the baffle;

[0019] The connecting portion is used to connect the overlapping portion with the loading and unloading device, and the overlapping portion of the manipulator is overlapped and matched with the clamping portion on the baffle to support the carrying bracket.

[0020] In some embodiments, the overlapping portion is provided with a receiving groove for accommodating the clamping portion, and the receiving groove is provided with a support pad for supporting the clamping portion.

[0021] In some embodiments, the support pad includes a bottom support pad, a side support pad, and an end support pad, wherein:

[0022] The bottom support pad is arranged at the bottom of the receiving groove, and is used to support the clamping part from below;

[0023] The side support pad is arranged on the side wall of the accommodating groove and the side of the clamping portion, and is used to support the clamping portion from the side;

[0024] The end support pad is arranged on the side walls of the accommodating groove and the end of the clamping portion, and is used to support the clamping portion from an end away from the baffle.

[0025] In some embodiments, the manipulator further includes a detection component, the detection component being used to detect whether the overlapping portion holds up the clamping portion;

[0026] The detection assembly includes a sensor pressure plate and a pressure sensor. The sensor pressure plate is arranged on the bottom side of the overlapping portion. One end of the sensor pressure plate is connected to the bottom support pad, and the other end is connected to the pressure sensor for transmitting the pressure of the clamping portion to the pressure sensor.

[0027] This application has the following beneficial effects:

[0028] The support bracket provided in the present application is used to support a loading mechanism, and includes a baffle and at least two supporting parts located between the baffles, each supporting part is arranged along a first direction, the first direction is perpendicular to the extension direction of the supporting part, and two adjacent supporting parts form a supporting position for supporting the loading mechanism; the baffle has a through vent hole for allowing process gas to enter the supporting position.

[0029] The baffles at both ends of the carrier bracket are provided with vents, through which the process gas can enter the carrier position, reducing the obstruction of the baffle to the flow of process gas, improving the uniformity of process gas distribution in semiconductor processing equipment, and facilitating the discharge of reaction byproducts and unreacted process gas. The carrier position is used to support the loading mechanism, and the process gas is evenly distributed in the carrier position, which can improve the uniformity of the process results and thus improve product quality.

[0030] The present application also provides a transfer device including the above-mentioned carrying bracket and having the above-mentioned advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of the structure of a bearing bracket provided for a specific implementation of the present application;

[0032] Figure 2 for Figure 1 Side view of the middle load-bearing bracket;

[0033] Figure 3 for Figure 1 The front view of the middle load-bearing bracket;

[0034] Figure 4 for Figure 1 A top view of the middle load-bearing bracket;

[0035] Figure 5 A schematic structural diagram of a support bracket provided for another specific implementation of the present application;

[0036] Figure 6 for Figure 1 A schematic diagram of the structure of the loading mechanism of the middle load-bearing bracket;

[0037] Figure 7 for Figure 1 A front view of the middle load-bearing bracket carrying the loading mechanism;

[0038] Figure 8 for Figure 1 A top view of the middle load-bearing bracket carrying the loading mechanism;

[0039] Fig. 9 A schematic diagram of the structure of a transfer device mobile loading mechanism provided in a specific embodiment of the present application;

[0040] Fig.10 for Fig. 9 A schematic diagram of the structure in which the transfer equipment moves the carrier into the semiconductor process equipment;

[0041] Fig.11 for Fig.10 Schematic diagram of the structure of the robot;

[0042] Fig.12 for Fig.11 A partial enlarged view of the robot in the figure;

[0043] Fig.13 for Fig.11 Schematic diagram of the structure of the bottom side of the middle manipulator;

[0044] Fig.14 It is a schematic diagram of the structure of the support frame supporting the bearing bracket;

[0045] Fig.15 Schematic diagram of the cross section of the support groove.

[0046] in, Figures 1 to 15 The reference numerals in the drawings are:

[0047] 100, bearing bracket; 110, supporting part; 111, connecting rod; 112, supporting rod; 120, baffle; 121, vent; 122, limiting groove; 123, supporting leg; 130, clamping part; 200, loading and unloading device; 210, lifting module; 220, vertical moving robot arm; 230, translational robot arm; 300, pushing and pulling device; 310, device body; 320, moving frame; 330, supporting frame; 331, supporting groove; 400, robot; 410, connecting part; 420, overlapping part; 421, accommodating groove; 422, bottom supporting pad; 423, side supporting pad; 424, end supporting pad; 430, connecting bolt; 440, sensor pressure plate; 450, pressure sensor; 500, loading mechanism; 600, horizontal furnace tube; 610, furnace door assembly; 700, wafer. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the technical solution of the present application, the transfer device and the supporting bracket thereof provided by the present application are described in detail below in conjunction with the accompanying drawings.

[0049] The carrier bracket 100 provided in the present application is used to carry a loading mechanism 500. The loading mechanism 500 may include a graphite boat, a quartz boat, etc. The loading mechanism 500 may be used to load a wafer 700. The loading mechanism 500 can be placed in the carrier bracket 100. The carrier bracket 100 may be used to move the loading mechanism 500 into a semiconductor process device, or to move the loading mechanism 500 out of a semiconductor process device.

[0050] like Figure 1 As shown, the bearing bracket 100 includes a baffle 120 and at least two supporting parts 110 located between the baffles 120. Among them, each supporting part 110 is arranged along a first direction, and the first direction is perpendicular to the extension direction of the supporting part 110. Two adjacent supporting parts 110 form a bearing position. The loading mechanism 500 can be placed in the bearing position, and multiple loading mechanisms 500 are arranged along the length direction of the supporting part 110. The loading mechanism 500 has a carrying part, and the supporting part 110 of the bearing position can support the loading mechanism 500 through the carrying part. At least one loading mechanism 500 can be carried in one bearing position, and at least one loading mechanism 500 is distributed along the length direction of the supporting part 110. The baffle 120 is connected to the end of the supporting part 110, and is used to limit the loading mechanism 500 placed on the bearing position.

[0051] like Figure 1 As shown, the baffle 120 has a through vent hole 121. During the process, process gas is introduced into the semiconductor process equipment to process the wafer 700. The process gas can pass through the vent hole 121 into the carrier position to process the wafer 700 on the loading mechanism 500 in the carrier position.

[0052] In this embodiment, the baffles 120 at both ends of the support bracket 100 are provided with vents 121. During the process, the process gas can pass through the vents 121 to enter the support position. After the wafer 700 is processed, the reaction product and the process gas remaining after the processing can pass through the vents 121 to discharge the support position. The vents 121 can reduce the resistance of the baffle 120 to the process gas and the reaction product, making the gas flow smoother, improving the uniformity of the process gas distribution, and improving the uniformity of the process. In addition, since the resistance of the process gas entering the support position is reduced, a lower amount of process gas can make the concentration of the process gas in the support position meet the process requirements, thereby reducing the amount of process gas.

[0053] In some embodiments, the number of vent holes 121 is multiple. Figure 1 and Figure 2 As shown, the baffle 120 can be arranged vertically on the support part 110, and when the loading mechanism 500 is placed in the carrying position, the wafer 700 in the loading mechanism 500 is parallel to the baffle 120. The vents 121 are used to allow process gas to flow to the wafer 700 in the loading mechanism 500, and at least part of the vents 121 are distributed within the orthographic projection of the wafer 700 carried by the loading mechanism 500 on the baffle 120. The vents 121 can be distributed in a preset area, and the preset area corresponds to the orthographic projection position of the wafer 700 on the baffle 120. The vents 121 are arranged in the preset area, and also correspond to the orthographic projection position of the wafer 700 on the baffle 120, so that the process gas can be distributed more evenly on the surface of the wafer 700.

[0054] Optional, Figure 2 In the specific embodiment shown, the upper part of the baffle 120 is arc-shaped, preferably, it can be semicircular, and the radius of the semicircle can be 80mm-90mm. The lower part of the baffle 120 can be rectangular, and the height of the rectangle can be 80mm-90mm. The straight side of the arc portion coincides with the length side of the rectangular portion, and the two width sides of the rectangle are tangent to the semicircle at the top. Of course, the lower part of the baffle can also be set to other shapes, such as a trapezoid, etc., which are not limited here. In this specific embodiment, the preset area is circular, and the diameter of the preset area is greater than or equal to the diameter of the wafer 700. The preset area is located in the area formed by the semicircle and rectangle of the baffle 120. The upper part of the baffle 120 is semicircular, which can limit the flow of process gas. A vent 121 is set in the semicircular area, and the process gas passes through the vent 121 to contact the wafer 700 in the carrier position. Therefore, the baffle can play a role in uniform flow, ensure that the process gas is more evenly distributed, and prevent the concentration of the process gas from being too high or too low. Of course, the user can also set the shape and size of the baffle 120 as needed, which is not limited here.

[0055] Optionally, the bottom of the baffle 120 has a limiting groove 122, and the limiting groove 122 penetrates the bottom plate in a direction perpendicular to the baffle 120. The bottom of the baffle 120 forms support legs 123 on both sides of the limiting groove 122. The carrying bracket 100 can be placed on the push-pull device 300 of the transfer equipment, and the push-pull device 300 is used to send the carrying bracket 100 and the loading mechanism 500 placed thereon into or out of the semiconductor process equipment. The limiting groove 122 can be used to cooperate with the push-pull device 300 to limit the carrying bracket 100.

[0056] Optionally, the limiting groove 122 may be trapezoidal. Figure 2 As shown, the bottom of the trapezoid is located at the bottom of the baffle 120, the angle between the side of the trapezoid and the bottom is 0° to 60°, and the distance between the two sides of the trapezoid gradually decreases from bottom to top. Of course, the limiting groove 122 can also adopt other shapes, such as rectangle, triangle, etc., which are not limited here.

[0057] Optional, Figure 2 In the specific embodiment shown, 60 to 100 vents 121 are evenly distributed on the baffle 120, and the diameter of the vents 121 can be 4 mm to 10 mm. One of the vents 121 is a central circular hole, and the central circular hole is located at the center of the preset area. The remaining vents 121 can be distributed along a plurality of layout circles concentric with the preset area, and the radius difference between two adjacent layout circles can be 5 mm to 15 mm. Of course, the number and distribution of the vents 121 can also be set according to the needs of the user. For example, the vents 121 can be distributed in a matrix, which is not limited here.

[0058] In this embodiment, the vents 121 are distributed in a preset area of ​​the baffle 120, and the preset area corresponds to the orthographic projection of the wafer 700 on the loading mechanism 500 on the baffle 120. The process gas can flow toward the wafer 700 more accurately through the vents 121, so that the concentration of the process gas around the wafer 700 is within a suitable range.

[0059] In some embodiments, the support portion 110 includes at least two connecting rods 111 and a supporting rod 112 located between the two connecting rods 111, and the two connecting rods 111 are distributed along the second direction. The second direction is perpendicular to the first direction and the extension direction of the support portion. The two ends of the connecting rod 111 are respectively connected to the two baffles 120. The supporting rod 112 extends along the second direction, and the two ends are respectively connected to the two connecting rods 111. The support portion 110 is used to support the loading portion of the loading mechanism 500. The two connecting rods 111 are distributed along the second direction, and the two connecting rods 111 are supported by the supporting rod 112. The two connecting rods 111 and the supporting rod 112 form an "I"-shaped rectangular structure, which improves the shear strength of the support portion 110, reduces the deformation of the support portion 110 due to load, and increases the number of loading mechanisms 500 that the load-bearing bracket 100 can carry.

[0060] Optionally, the number of the support rods 112 is more than two, such as Figure 3 As shown, each support rod 112 is distributed along the length direction of the connecting rod 111. The loading mechanism 500 is usually placed at equal intervals along the length direction of the connecting rod 111, and the support rods 112 can also be distributed at equal intervals along the length direction of the connecting rod 111. The support rods 112 on both sides of the midpoint of the two connecting rods 111 are symmetrically distributed, so that multiple rectangular structures are formed between the two connecting rods 111, ensuring the shear strength of the support part 110. Of course, the user can also set the distribution mode of the support rods 112 as needed, and there is no limitation here.

[0061] Optional, such as Figure 4 As shown, there are two support parts 110, and the space between the two support parts 110 is a bearing position. The two baffles 120 are respectively connected to the two ends of the connecting rod 111. Of course, the user can set the number of support parts 110 as needed, and there is no limitation here.

[0062] A specific implementation of the present application is as follows: Figure 1 As shown, there are three support rods 112. One of the support rods 112 is a middle support rod 112, and both ends of the middle support rod 112 are respectively connected to the midpoints of the two connecting rods 111, and the other two support rods 112 are symmetrically distributed on both sides of the middle support rod 112. The load-bearing bracket 100 provided in this specific embodiment needs to carry fewer loading mechanisms 500, so the strength requirement for the connecting rod 111 is relatively low. The connecting rod 111 can be selected with a smaller diameter under the premise of meeting the load-bearing requirements, thereby reducing the weight of the load-bearing bracket 100.

[0063] Another specific implementation of the present application is as follows: Figure 5 As shown, the number of support rods 112 is 5. One of the support rods 112 is an intermediate support rod 112, and the two ends of the intermediate support rod 112 are respectively connected to the midpoints of the two connecting rods 111, and the other four support rods 112 are symmetrically distributed on both sides of the intermediate support rod 112. The spacing between the support rods 112 can be set according to user needs and is not limited here. In this specific embodiment, the connecting rod 111 can be longer in length, and the support portion 110 has a higher shear strength, so that the load-bearing bracket 100 can carry more loading mechanisms 500.

[0064] Optionally, the carrier bracket 100 further includes a clamping portion 130. Figure 4As shown, the clamping portion 130 is located on the side of the baffle 120 away from the bearing position, and the two baffles 120 are provided with the clamping portion 130. The manipulator 400 overlaps with the clamping portions 130 of the two baffles 120, and lifts the bearing bracket 100 through the clamping portion 130, thereby moving the loading mechanism 500 in the bearing bracket 100. The number of clamping portions 130 on the same baffle 120 can be two, and the connecting line of the two clamping portions 130 can be parallel to the plane where the top of each support portion 110 is located. Figure 4 The middle clamping portion 130 is cylindrical, and the user can also set the clamping portion 130 to other shapes, such as a cuboid, etc., as needed, which is not limited here.

[0065] Optionally, the connecting rod 111, the supporting rod 112, the baffle 120 and the clamping part 130 of the bearing bracket 100 can be made of quartz material, which has the advantages of high temperature resistance, high structural strength, and not easy to react with other substances. Of course, users can also choose other materials as needed, which is not limited here.

[0066] Optionally, the connecting rod 111, the supporting rod 112, the baffle 120 and the clamping portion 130 can be welded by a quartz welding process to form an integrated structure. After welding, the structural strength of the bearing bracket 100 is higher and it can carry more loading mechanisms 500.

[0067] like Figures 6 to 8 As shown, the loading mechanism 500 carrying the wafer 700 is placed in the loading position of the carrier 100 by a robot or other device, and the loading part of the loading mechanism 500 is overlapped on the supporting part 110 of the carrier 100. The carrier 100 can be placed on the push-pull device 300, and the limiting groove 122 of the carrier 100 cooperates with the push-pull device 300 to limit the position. The push-pull device 300 can push or pull the carrier 100 along the length direction of the carrier 100, so as to move the carrier 100 into or out of the semiconductor process equipment. The semiconductor process equipment can be a horizontal furnace, etc. The loading and unloading device 200 cooperates with the clamping part 130 of the carrier 100 through the robot 400, clamps the carrier 100 from both ends, and moves the carrier 100 and the loading mechanism 500 therein to or from the push-pull device 300.

[0068] The present application also provides a transfer device. Fig. 9As shown, the transfer device includes a loading and unloading device 200, a push-pull device 300 and a manipulator 400. The manipulator is connected to the loading and unloading device and is used to support the carrier 100 in any of the above embodiments. The carrier 100 is used to place the loading mechanism 500, and the two ends of the carrier 100 are provided with clamping parts 130. The manipulator 400 is connected to the loading and unloading device 200, and the manipulator 400 is used to cooperate with the clamping parts 130 at both ends of the carrier 100 to clamp the carrier 100 from both ends of the carrier 100. The loading and unloading device 200 drives the carrier 100 to move through the manipulator 400, and places the carrier 100 on the push-pull device 300, or removes the carrier 100 from the push-pull device 300. The push-pull device 300 can drive the carrier 100 to move, and is used to move the carrier 100 into the semiconductor process equipment, or move the carrier 100 out of the semiconductor process equipment.

[0069] Optionally, the push-pull device 300 includes a device body 310, a moving frame 320 and a support frame 330. The support frame 330 is used to support the bearing bracket 100. Fig.14 and Fig.15 As shown, the support frame 330 includes a support groove 331, and the bearing bracket 100 is placed on the support groove 331, and the support groove enters the limiting groove 122 of the bearing bracket 100. The support legs 123 on both sides of the limiting groove 122 cooperate with the support groove to horizontally limit the bearing bracket 100 to prevent the bearing bracket 100 from sliding off.

[0070] Optionally, the transfer device further includes an external box (not shown in the figure), and the device body 310 of the push-pull device 300 is fixed on the frame of the external box. Fig. 9 and Fig.10 As shown, the support frame 330 is connected to the device body 310 through the moving frame 320 , and the device body 310 drives the support frame 330 to move horizontally, so as to send the carrying bracket 100 into the horizontal furnace tube 600 or take it out of the horizontal furnace tube 600 .

[0071] Optionally, the support frame 330 is fixedly connected to the furnace door assembly 610 through a clamping mechanism on the furnace door assembly 610, and the device body 310 drives the furnace door to move through the movable frame 320 and the support frame 330, so that the furnace door assembly 610 fits with the horizontal furnace tube 600, thereby reducing heat loss and process gas leakage in the reaction chamber during the process.

[0072] In some embodiments, the loading and unloading device 200 includes a lifting module 210, a vertical movement robot arm 220, and a translation robot arm 230. Fig. 9 and Fig.10As shown, the vertical robot arm 220 is connected to the lifting module 210, and the lifting module 210 can drive the vertical robot arm 220 to move up and down. The translation robot arm 230 is connected to the vertical robot arm 220, and the vertical robot arm 220 is used to drive the translation robot arm 230 to move horizontally in the direction close to the lifting module 210 and away from the lifting module 210. The robot arm 400 is connected to the translation robot arm 230. The loading and unloading device 200 drives the robot arm 400 to move to a suitable position, and then lifts the carrying bracket 100.

[0073] Optionally, the number of manipulators 400 may be two. Accordingly, the lifting module 210, the vertical movement manipulator arm 220 and the translation manipulator arm 230 in the loading and unloading device 200 may all be two, and the two manipulators 400 are respectively installed on the two translation manipulator arms 230. The load-bearing bracket 100 includes a clamping portion 130 provided on two baffles 120, and the two manipulators 400 respectively cooperate with the clamping portions 130 at both ends of the load-bearing bracket 100 to clamp the load-bearing bracket 100 from both ends to achieve the movement of the load-bearing bracket 100. Of course, the user can also determine the number of manipulators 400 as needed. For example, if the width of the baffle 120 is wider, the user can increase the width of the manipulator 400, or set a plurality of manipulators 400 to cooperate with the clamping portions 130 on the baffle 120, which is not limited here.

[0074] like Fig. 9 As shown, the loading and unloading device 200 is in a grasping state, and it grasps the carrying bracket 100 from both ends through the robot 400. Fig.10 As shown, the loading and unloading device 200 is in an idle state. At this time, the carrying bracket 100 is sent into the horizontal furnace tube 600. In addition, the loading and unloading device 200 also includes a moving state, a material taking and placing state, etc.

[0075] Optionally, the robot 400 includes a connecting portion 410 and a lap portion 420. Fig.11 and 13 As shown, two translational mechanical arms 230 are arranged in parallel. Two connecting parts 410 are respectively connected to the two translational mechanical arms 230 by connecting bolts 430, and the two connecting parts 410 extend toward each other. Two overlapping parts 420 are respectively connected to the two connecting parts 410 by connecting bolts 430, and the two overlapping parts 420 extend toward each other. The overlapping parts 420 of the two manipulators 400 overlap and cooperate with the clamping parts 130 on the two baffles 120, respectively, to support the carrying bracket 100.

[0076] Optionally, the overlapping portion 420 is provided with a receiving groove 421. When the overlapping portion 420 lifts the clamping portion 130, the clamping portion 130 enters the receiving groove 421, and the side wall of the receiving groove 421 limits the clamping portion 130. Fig.12As shown, the upper surface of the lap joint 420 and the surfaces opposite to the two lap joints 420 of the receiving groove 421 form openings, and the clamping portion 130 enters the receiving groove 421 and fits with the bottom of the receiving groove 421. A support pad may be provided in the receiving groove 421, and the support pad is used to support the clamping portion 130, reduce the friction between the clamping portion 130 and the receiving groove 421, and thus extend the service life of the clamping portion 130. The support pad can be made of ceramic material, which has the advantages of high hardness, stable properties, and wear resistance. The support pad can be connected to the lap joint 420 by fixing bolts. Of course, the user can also select the material of the support pad according to needs, which is not limited here.

[0077] Optional, such as Fig.12 As shown, the receiving groove 421 includes a bottom surface, a side wall corresponding to the end surface of the clamping portion 130 away from the baffle 120, and a side wall corresponding to the side surface of the clamping portion 130. The support pad includes a bottom support pad 422, a side support pad 423, and an end support pad 424. The bottom support pad 422 is arranged on the bottom surface of the receiving groove 421, and is used to support the overlapping portion 420 from below. The side support pad 423 is arranged on the side wall of the receiving groove 421 and the side of the overlapping portion 420, and is used to support the overlapping portion 420 from the side. The end support pad 424 is arranged on the side wall of the receiving groove 421 and the end of the overlapping portion 420, and is used to support the overlapping portion 420 from the end away from the baffle 120. The number of the bottom support pad 422 and the end support pad 424 can be equal to the number of the clamping portions 130, and respectively correspond to the position of each clamping portion 130.

[0078] Optionally, the manipulator 400 further includes a detection component, which is used to detect whether the manipulator lifts the clamping portion 130. The detection component includes a pressure sensor 450 and a sensor pressure plate 440. The sensor pressure plate 440 is arranged on the bottom side of the overlap portion. One end of the sensor pressure plate 440 is connected to the pressure sensor 450, and the other end is connected to the bottom support pad 422. Optionally, the overlap portion 420 has a through hole, and the fixing bolt passes through the through hole to connect the bottom support pad 422 to the sensor pressure plate 440. When the overlap portion 420 lifts the clamping portion 130, the clamping portion 130 applies pressure to the bottom support pad 422, and the pressure is transmitted to the pressure sensor 450 through the fixing bolt and the sensor pressure plate 440. The controller of the transfer device can determine whether the manipulator 400 lifts the carrying bracket 100 through the pressure, and control the movement of the loading and unloading device 200 accordingly. The number of pressure sensors 450 and sensor pressure plates 440 may be equal to the number of bottom support pads 422, and each bottom support pad 422 is connected respectively. The controller determines whether each overlap portion 420 lifts its corresponding clamping portion 130 according to the detection results of each pressure sensor 450. The detection assembly can improve the reliability of the cooperation between the manipulator 400 and the load-bearing bracket 100, and avoid accidents such as the load-bearing bracket 100 tipping over or falling.

[0079] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present application, but the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of the present application, and these modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A bearing bracket, used for bearing a loading mechanism, characterized in that: The bearing bracket comprises a baffle and at least two supporting parts located between the baffles, each of the supporting parts is arranged along a first direction, the first direction is perpendicular to the extension direction of the supporting parts, and two adjacent supporting parts form a bearing position for supporting the loading mechanism; The baffle has a through vent hole for allowing process gas to enter the bearing position.

2. The carrying bracket according to claim 1, characterized in that: The number of the vent holes is multiple, and at least some of the vent holes are distributed in a preset area, and the preset area corresponds to the orthographic projection of the wafer loaded by the loading mechanism on the baffle.

3. The load-bearing bracket according to claim 1, characterized in that: The upper part of the baffle is arc-shaped, and the lower part of the baffle is rectangular, and the length side of the rectangular part coincides with the straight side of the arc-shaped part.

4. The load-bearing bracket according to claim 1, characterized in that: The support portion includes at least two connecting rods and a support rod located between the two connecting rods, the two ends of the connecting rod are respectively connected to the two baffles, the two connecting rods are distributed along a second direction, the second direction is perpendicular to the first direction and the extension direction of the support portion, the support rod extends along the second direction, and the two ends are respectively connected to the two connecting rods.

5. The load-bearing bracket according to claim 1, characterized in that: The bearing bracket further comprises a clamping portion, which is located at a side of the baffle away from the bearing position and is used for cooperating with the robot to move.

6. The carrying bracket according to any one of claims 1 to 5, characterized in that: A limiting groove is provided at the bottom of the baffle, and the limiting groove is used to cooperate with the push-pull device to limit the bearing bracket.

7. A transfer device, characterized in that: It includes loading and unloading devices, push-pull devices, and manipulators, among which: The manipulator is connected to the loading and unloading device and is used to support the carrying bracket according to any one of claims 1 to 6; The loading and unloading device is used to drive the manipulator to move so as to place the load-bearing bracket on the push-pull device or remove the load-bearing bracket from the push-pull device; The push-pull device is used to move the carrying bracket into the semiconductor process equipment, or to move the carrying bracket out of the semiconductor process equipment.

8. The transfer device according to claim 7, characterized in that The manipulator comprises a connecting portion and an overlapping portion, and the bearing bracket comprises a clamping portion arranged on the baffle; The connecting portion is used to connect the overlapping portion with the loading and unloading device, and the overlapping portion of the manipulator is overlapped and matched with the clamping portion on the baffle to support the carrying bracket.

9. The transfer device according to claim 8, characterized in that The overlapping portion is provided with a receiving groove for receiving the clamping portion, and the receiving groove is provided with a supporting pad for supporting the clamping portion.

10. The transfer device according to claim 9, characterized in that The support pad includes a bottom support pad, a side support pad and an end support pad, wherein: The bottom support pad is arranged at the bottom of the receiving groove, and is used to support the clamping part from below; The side support pad is arranged on the side wall of the accommodating groove and the side of the clamping portion, and is used to support the clamping portion from the side; The end support pad is arranged on the side walls of the accommodating groove and the end of the clamping portion, and is used to support the clamping portion from an end away from the baffle.

11. The transfer device according to claim 10, characterized in that The manipulator further comprises a detection component, and the detection component is used to detect whether the overlapping portion holds up the clamping portion; The detection assembly includes a sensor pressure plate and a pressure sensor. The sensor pressure plate is arranged on the bottom side of the overlapping portion. One end of the sensor pressure plate is connected to the bottom support pad, and the other end is connected to the pressure sensor for transmitting the pressure of the clamping portion to the pressure sensor.

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