Wafer bearing device and wafer testing equipment

Abstract

The utility model belongs to the technical field of semiconductors, and discloses a wafer bearing device and wafer testing equipment. The wafer bearing device comprises a bearing disc, a cooling member and a heating member. One side of the bearing disc is used for bearing wafers, and the bearing disc is provided with a plurality of adsorption holes used for adsorbing and fixing the wafers; the cooling piece is fixedly arranged on the other side of the bearing disc, and a cooling flow channel allowing cooling liquid to circularly flow is defined between the cooling piece and the bearing disc; the heating member is arranged on one side, far away from the bearing disc, of the cooling member and is used for heating the wafer. When the bearing device is used, heat generated by the heating piece can be transmitted into the bearing disc only through the one-layer structure of the cooling piece during transmission, so that the temperature control precision of the bearing disc is effectively improved, and when automatic control is carried out according to an actual control program, the temperature difference amplitude of the bearing disc can be kept at + / -0.5 DEG C or even lower; therefore, the bearing disc can keep good temperature uniformity in the wafer testing process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer carrying device and a wafer testing device. Background Art

[0002] Wafer testing equipment refers to a device that uses a suction cup to fix the wafer, heats the wafer, and then uses the testing equipment to test it to verify whether the various performance characteristics of the wafer meet the requirements.

[0003] In the prior art, a cooling structure is provided under the suction cup, and a flow channel is provided inside the cooling structure for circulating coolant. A heating structure is provided under the cooling structure, and the heat generated by the heating structure is transferred to the cooling structure and then to the suction cup, so that the wafer fixed on the suction cup can be heated.

[0004] However, since heat can only cause temperature changes when it accumulates to a certain level, and during the above-mentioned heat transfer process, the heat needs to pass through multiple layers of structure in sequence before it can be transferred to the suction cup and the wafer, resulting in poor control of the temperature uniformity of the suction cup during the heating process, resulting in low accuracy of the test results. Utility Model Content

[0005] The utility model aims to provide a wafer carrying device and a wafer testing device, which solves the problem that the temperature uniformity of the suction cup is poor, resulting in low accuracy of the test result.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] In a first aspect, the utility model provides a wafer carrying device, which comprises:

[0008] A carrier plate, one side of which is used to carry wafers, and the carrier plate has a plurality of adsorption holes for adsorbing and fixing the wafers;

[0009] A cooling element is fixedly disposed on the other side of the carrier plate, and the cooling element and the carrier plate enclose a cooling channel for circulating coolant; and

[0010] The heating element is arranged on a side of the cooling element away from the carrier plate and is used for heating the wafer.

[0011] Optionally, the cooling element comprises:

[0012] A cooling plate is fixedly connected to the supporting plate. A cooling ring groove is provided on a side of the cooling plate close to the supporting plate. The supporting plate can close the cooling ring groove to form the cooling channel.

[0013] Optionally, the cooling element comprises:

[0014] The heat exchange plate is arranged in the cooling channel.

[0015] Optionally, the cooling channel includes an injection channel and an outflow channel that are interconnected, the injection channel bends and extends from an edge position of the cooling member to a middle position of the cooling member, and the outflow channel extends from the middle position of the cooling member to an edge position of the cooling member.

[0016] Optionally, the wafer carrying device further includes:

[0017] a first temperature detection member disposed at a middle position of the cooling member; and

[0018] A plurality of second temperature detection members are distributed at intervals at the edge of the cooling member.

[0019] Optionally, a side of the cooling element away from the supporting plate has a heating space, and the heating element is filled in the heating space.

[0020] Optionally, the wafer carrying device further includes:

[0021] The heat insulating member is arranged on a side of the heating member away from the cooling member, and a plurality of heat insulating protrusions are distributed at intervals on a side of the heat insulating member close to the heating member to separate the heating member from the heat insulating member to form a heat insulating space.

[0022] Optionally, the wafer carrying device further includes:

[0023] The heat insulation plate is arranged on a side of the heating element away from the cooling element and can cover the heating element.

[0024] Optionally, the wafer carrying device further includes:

[0025] The heat-insulating ring plate is arranged around the periphery of the cooling element.

[0026] In a second aspect, the utility model also provides a wafer testing device, including a loading and positioning module, a base, a testing module and a material unloading and classification module, wherein the loading and positioning module is used for loading and positioning the wafer, the testing module is used for testing the wafer, and the unloading and classification module is used for classifying and storing the wafers that have completed the test, and the wafer testing device also includes:

[0027] The wafer supporting device as described in any one of the first aspects is arranged on the base.

[0028] Beneficial effects of the utility model:

[0029] First, by fixing the carrier plate and the cooling element together to form an assembly, and enclosing a cooling channel for the circulation of the coolant, when the heating element is heated, the heat is transferred to the cooling element, and as the coolant circulates, the heat is transferred to the coolant, and because the carrier plate and the cooling element are fixed together, the heat exchange efficiency is accelerated as the coolant flows, so that the overall temperature uniformity and temperature control speed of the cooling element can be more easily controlled, and the temperature control speed and uniformity of the carrier plate can be precisely controlled. In this way, when the carrier device is in use, the heat generated by the heating element only needs to pass through a layer of the cooling element structure to be transferred to the carrier plate, and when controlling the temperature of the carrier plate, it is only necessary to change the power of the heating element or the flow state of the coolant to change the heat transferred to the carrier plate, so that the temperature control accuracy of the carrier plate is effectively improved, and when automatically controlled according to the actual control program, it can ensure that the temperature difference of the carrier plate is maintained at ±0.5°C or even lower, so that the carrier plate maintains good temperature uniformity during the wafer test.

[0030] Secondly, when the wafer testing equipment is in use, the loading and positioning module is used to transport the wafer to the carrier plate of the wafer carrier and position it. The positioned wafer is fixed by the adsorption holes on the carrier plate, and the wafer is tested by the test module. During the test, the wafer carrier is heated according to the test requirements and the temperature is controlled by the host computer. The test module has a probe and a corresponding drive structure to perform the corresponding test process. The wafer that has completed the test is removed by the unloading and positioning module, and the wafer is classified and stored according to the test data. In this way, the wafer testing equipment can complete the test operation fully automatically, and the wafer carrier can achieve high-precision temperature control during the test, effectively improving the accuracy of the wafer test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of a wafer carrying device in an embodiment of the utility model;

[0032] Figure 2 It is a schematic diagram of the structure of the cooling plate of the wafer carrying device in the embodiment of the utility model;

[0033] Figure 3 It is a schematic diagram of the distribution structure of the first temperature detection element and the second temperature detection element on the cooling plate of the wafer carrier device in the embodiment of the utility model;

[0034] Figure 4 It is a structural cross-sectional view of the wafer carrying device of the utility model;

[0035] Figure 5 yes Figure 4 An enlarged view of part A in the implementation shown;

[0036] Figure 6 This is a schematic diagram of the exploded structure of the wafer carrying device of the utility model from the first perspective;

[0037] Figure 7 It is a schematic diagram of the exploded structure of the wafer carrying device of the utility model from a second viewing angle.

[0038] In the figure:

[0039] 1. Carrying plate; 11. Adsorption hole; 2. Cooling element; 21. Cooling channel; 211. Injection channel; 212. Outflow channel; 22. Cooling plate; 23. Heat exchange plate; 3. Heating element; 4. First temperature detection element; 5. Second temperature detection element; 6. Thermal insulation element; 61. Thermal insulation protrusion; 62. Thermal insulation space; 7. Thermal insulation board; 8. Thermal insulation ring plate. DETAILED DESCRIPTION

[0040] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0041] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0043] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0044] The utility model discloses a wafer carrying device and wafer testing equipment.

[0045] Reference Figure 1 and Figure 2 The wafer carrying device comprises a carrying plate 1, a cooling element 2 and a heating element 3. One side of the carrying plate 1 is used to carry the wafer, and the carrying plate 1 has a plurality of adsorption holes 11 for adsorbing and fixing the wafer; the cooling element 2 is fixedly arranged on the other side of the carrying plate 1, and the cooling element 2 and the carrying plate 1 enclose a cooling channel 21 for circulating the coolant. The heating element 3 is arranged on the side of the cooling element 2 away from the carrying plate 1 to heat the wafer.

[0046] Specifically, the top wall of the carrier plate 1 is used to carry the wafers, and a plurality of adsorption holes 11 are provided at intervals on the top wall of the carrier plate 1 to adsorb and fix the wafers by vacuum adsorption. A cooling member 2 is provided on the other side of the carrier plate 1, and slots and other structures are directly provided on the surface of the cooling member 2, and the bottom wall of the carrier plate 1 is attached to the top wall of the cooling member 2 to close the slots and other structures to form a cooling channel 21. A sealing structure can be provided separately between the carrier plate 1 and the cooling member 2 to ensure the sealing of the cooling channel 21, or the carrier plate 1 and the cooling member 2 can be directly welded to form an integrated structure. The heating member 3 is provided on the bottom wall of the cooling member 2, and the two achieve rapid heat transfer by surface contact.

[0047] By fixing the carrier plate 1 and the cooling element 2 together to form an assembly, and enclosing a cooling channel 21 for the circulation of the coolant, when the heating element 3 is heated, the heat is transferred to the cooling element 2, and as the coolant circulates, the heat will be transferred to the coolant. Since the carrier plate 1 and the cooling element 2 are fixed together, the heat exchange efficiency is accelerated as the coolant flows, so that the overall temperature uniformity and temperature control speed of the cooling element 2 can be more easily controlled, and the temperature control speed and uniformity of the carrier plate 1 can be precisely controlled. In this way, when the carrier device is in use, the heat generated by the heating element 3 only needs to pass through a layer of the cooling element 2 structure to be transferred to the carrier plate 1. When controlling the temperature of the carrier plate 1, it is only necessary to change the power of the heating element 3 or the flow state of the coolant to change the heat transferred to the carrier plate 1, so that the temperature control accuracy of the carrier plate 1 is effectively improved, and when automatically controlled according to the actual control program, it can ensure that the temperature difference of the carrier plate 1 is maintained at ±0.5°C or even lower, so that the carrier plate 1 maintains a good temperature uniformity during the wafer test process.

[0048] Optionally, the cooling member 2 includes a cooling plate 22 . The cooling plate 22 is fixedly connected to the carrier plate 1 , and a cooling ring groove is provided on one side of the cooling plate 22 close to the carrier plate 1 . The carrier plate 1 can close the cooling ring groove to form a cooling channel 21 .

[0049] Specifically, the cooling plate 22 is attached to the bottom wall of the carrier plate 1, and the two are welded to form an integrated structure. A cooling ring groove is provided on the top wall of the cooling plate 22, and a liquid injection port and a liquid discharge port connected to the cooling ring groove are provided on the side of the cooling plate 22. The cooling ring groove can be bent and extended to cover the entire cooling plate 22, and the specific bending and extending direction can be designed according to the shape and size of the cooling plate 22.

[0050] By welding the cooling plate 22 and the carrier plate 1 to form an integrated assembly, the cooling ring groove is closed to form the cooling channel 21, and there is no need to separately set a cover plate or other structures for the cooling plate 22 to separate the cooling plate 22 from the carrier plate 1, so that the heat of the heating element 3 is transferred to the cooling plate 22 and then quickly and evenly transferred to the carrier plate 1 after being temperature-adjusted by the coolant circulating in the cooling channel 21, so as to effectively improve the speed and uniformity of the temperature regulation of the carrier plate 1. It should be understood that the fixing of the cooling plate 22 and the carrier plate 1 can also be achieved by bonding, clamping, or bolting, so that the sides of the two can be sealed and fit.

[0051] Optionally, the cooling element 2 includes a heat exchange plate 23 . The heat exchange plate 23 is disposed in the cooling channel 21 .

[0052] Specifically, a heat exchange plate 23 is provided in the cooling channel 21. The heat exchange plate 23 can be erected in the middle of the width direction of the cooling channel 21, and the heat exchange plate 23 extends along the extension direction of the cooling channel 21 to separate the cooling channel 21 into two channels. The heat exchange plate 23 can be directly fixed in the cooling channel 21 by welding, or it can be formed by protruding on the bottom wall of the cooling ring groove. The specific design can be based on the actual processing difficulty and cooling requirements.

[0053] When the coolant flows in the cooling channel 21, compared with the traditional solution in which the coolant only contacts the sides of the cooling channel 21, by setting a heat exchange plate 23 in the cooling channel 21, the coolant can fully contact the sides of the cooling channel 21 and the sides of the heat exchange plate 23 at the same time, which can effectively increase the contact area between the coolant circulating in the cooling channel 21 and the cooling disk 22, thereby increasing the heat exchange area, so that the heat exchange efficiency of the entire cooling disk 22 is higher, and thus a faster response speed for temperature control can be achieved.

[0054] Optionally, the cooling channel 21 includes an injection channel 211 and an outflow channel 212 that are interconnected, the injection channel 211 bends and extends from the edge position of the cooling member 2 to the middle position of the cooling member 2, and the outflow channel 212 extends from the middle position of the cooling member 2 to the edge position of the cooling member 2.

[0055] Specifically, the injection channel 211 is bent and extended in a spiral shape, and the liquid inlet end of the injection channel 211 is located at the edge of the cooling disk 22 and serves as the liquid inlet of the cooling channel 21. The liquid outlet end of the injection channel 211 is located in the middle of the cooling disk 22. The outflow channel 212 is also bent and extended in a spiral shape, and the liquid inlet end of the outflow channel 212 is located in the middle of the cooling disk 22 and is connected to the liquid outlet end of the injection channel 211, and the liquid outlet end of the outflow channel 212 is located at the edge of the cooling disk 22 and serves as the liquid outlet of the cooling channel 21. The liquid outlet and liquid inlet of the cooling channel 21 can be arranged side by side and spaced apart on the same side of the cooling disk 22, or can be distributed on opposite sides of the cooling disk 22. Specifically, it can be designed according to the actual size of the cooling disk 22, and the utility model does not limit this. It should be understood that the injection channel 211 and the outflow channel 212 can also be bent and extended in other shapes as long as they can meet the requirements of efficient cooling of the cooling disk 22, and the flow direction of the coolant is not limited to the example shown in the figure. In other embodiments, the coolant can also be injected from the outflow channel 212 and flow out through the injection channel 211.

[0056] By providing a curved and extended injection channel 211 and outflow channel 212, not only can the cooling channel 21 cover the entire cooling disk 22, but the coolant can also flow in from the edge of the cooling disk 22 and gradually flow to the middle position of the cooling disk 22, and then flow out from the middle position to the edge position, so as to effectively improve the overall heat exchange efficiency of the cooling disk 22 and ensure the uniformity of the overall temperature of the cooling disk 22.

[0057] Reference Figure 3 Optionally, the wafer carrier device further comprises a first temperature detection member 4 and a plurality of second temperature detection members 5. The first temperature detection member 4 is disposed at the middle position of the cooling member 2; and the plurality of second temperature detection members 5 are distributed at the edge positions of the cooling member 2 at intervals.

[0058] Specifically, 8 second temperature detection components 5 can be arranged in a ring, and their specific arrangement positions and spacing distances can be designed according to the actual wafer test conditions. The first temperature detection component 4 and the plurality of second temperature detection components 5 can detect the temperature of each part of the cooling plate 22 and the carrier plate 1 in real time, and the host computer can communicate and connect with the first temperature detection component 4 and the plurality of second temperature detection components 5 respectively, and the host computer can generate a temperature control signal according to any one of the plurality of temperature detection data, for example, the temperature can be controlled according to the highest temperature, or according to the lowest temperature, and can be specifically designed according to the actual test requirements.

[0059] Reference Figures 4 to 7 Optionally, a side of the cooling element 2 away from the supporting plate 1 has a heating space, and the heating element 3 is filled in the heating space.

[0060] Specifically, the heating element 3 adopts a heating sheet, and the bottom wall of the cooling plate 22 is concave to form a heating space, the depth of the heating space is greater than or equal to the thickness of the heating sheet, so that the entire heating sheet is embedded in the heating space, and the heating sheet can also be coated with a thermal conductive coating or a thermal conductive adhesive and other structures to improve the heat exchange efficiency between the heating sheet and the cooling plate 22. It should be understood that the heating element 3 can be a complete sheet structure, and can also be a heating sheet with a hollow structure. When a heating sheet with a hollow structure is used, the hollow structure of the heating sheet can be designed according to the heating requirements to adjust the heating power at various positions of the heating sheet, so as to meet the corresponding test requirements.

[0061] Optionally, the wafer carrying device further comprises a heat insulating plate 7. The heat insulating plate 7 is arranged on a side of the heating element 3 away from the cooling element 2 and can cover the heating element 3.

[0062] Specifically, a heat insulation board 7 is arranged on the bottom wall of the cooling plate 22, and the heat insulation board 7 and the cooling plate 22 are fixedly connected by bonding, clamping or bolting. In order to further improve the heat insulation efficiency, the depth of the heating space is greater than the thickness of the heating plate, so that when the heating plate is built into the heating space, the heating plate will form a certain distance with the heat insulation board 7. The material of the heat insulation board 7 can be selected according to the actual installation environment and heat insulation requirements, and the utility model does not limit this.

[0063] By providing the heat insulation plate 7, the heat generated by the heating element 3 can be mainly transferred to the cooling disk 22, thereby reducing the efficiency of heat transfer to the outside of the cooling disk 22, improving the heating efficiency, and reducing the loss of heat energy.

[0064] Optionally, the wafer carrying device further comprises a heat-insulating ring plate 8. The heat-insulating ring plate 8 is arranged around the periphery of the cooling element 2.

[0065] Specifically, the heat preservation ring plate 8 is arranged around the periphery of the cooling member 2, and the height of the heat preservation ring plate is equal to the thickness of the cooling plate 22 and the carrier plate 1, so that the cooling plate 22 and the carrier plate 1 can be completely inside the heat preservation ring plate 8. The heat preservation ring plate 8 maintains a certain distance from the cooling plate 22 and the carrier plate 1 to reduce the efficiency of heat transfer, so as to reduce the efficiency of heat transfer from the cooling plate 22 and the carrier plate 1 to the outside, and effectively maintain the temperature of the cooling plate 22 and the carrier plate 1.

[0066] Optionally, the wafer carrier further comprises a heat insulating member 6. The heat insulating member 6 is arranged on a side of the heating member 3 away from the cooling member 2, and a plurality of heat insulating protrusions 61 are spaced apart on a side of the heat insulating member 6 close to the heating member 3 to separate the heating member 3 from the heat insulating member 6 to form a heat insulating space 62.

[0067] Specifically, a heat insulating member 6 is arranged on the lower side of the heat insulating plate 7. The heat insulating member 6 can be a ceramic disk. A plurality of heat insulating protrusions 61 are distributed around the top wall of the ceramic disk. The heat insulating protrusions 61 abut against the bottom wall of the heat insulating plate 7, thereby forming a heat insulating space 62 between the heat insulating disk and the heating element 3.

[0068] By providing the heat insulating member 6, the heating member 3, the cooling plate 22 and the supporting plate 1 can be entirely lifted up to reduce the efficiency of heat transfer to other structures. By forming the heat insulating space 62, the contact area between the heat insulating plate 7 and the heat insulating member 6 can be effectively reduced, thereby further reducing the heat exchange efficiency and reducing the heat transfer to the ceramic plate, which can further reduce the efficiency of heat transfer through the ceramic plate. When the wafer carrier is tested at 150°C, the traditional heat insulating structure can reach 130°C when it plays a heat insulating role. In this embodiment, the ceramic plate forming the heat insulating space 62 can be stably maintained at 83°C-93°C, which is significantly lower than the traditional heat insulating structure, thereby reducing the possibility of deformation of the related structure due to continuous heating, causing the wafer carrier to tilt.

[0069] The wafer testing equipment includes a loading and positioning module, a base, a testing module and a unloading and sorting module. The loading and positioning module is used for loading and positioning wafers, the testing module is used for testing wafers, and the unloading and sorting module is used for classifying and storing wafers that have completed the test. The wafer testing equipment also includes the wafer supporting device in the above embodiment, which is arranged on the base.

[0070] When the wafer testing equipment is in use, the loading and positioning module is used to transport the wafer to the carrier plate 1 of the wafer carrying device and position it. The positioned wafer is fixed by the adsorption hole 11 on the carrier plate 1, and the test module is used to test the wafer. During the test, the wafer carrying device is heated according to the test requirements and the temperature is controlled by the host computer. The test module has a probe and a corresponding drive structure to perform the corresponding test process. The wafer that has completed the test is removed by the unloading and positioning module, and the wafer is classified and stored according to the test data. In this way, the wafer testing equipment can complete the test operation fully automatically, and the wafer carrying device can achieve high-precision temperature control during the test, effectively improving the accuracy of the wafer test results.

[0071] The wafer testing equipment may be a three-temperature probe station or other equipment. The utility model does not limit the specific type of the wafer testing equipment.

[0072] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer carrier, characterized in that: include: A carrier plate (1), one side of the carrier plate (1) being used for carrying wafers, and the carrier plate (1) being provided with a plurality of adsorption holes (11) for adsorbing and fixing the wafers; A cooling element (2) is fixedly arranged on the other side of the carrier plate (1), and a cooling channel (21) is formed between the cooling element (2) and the carrier plate (1) for circulating a cooling liquid; and A heating element (3) is arranged on a side of the cooling element (2) away from the carrier plate (1) and is used for heating the wafer.

2. The wafer carrier device according to claim 1, characterized in that: The cooling element (2) comprises: A cooling plate (22) is fixedly connected to the carrier plate (1); a cooling ring groove is provided on a side of the cooling plate (22) close to the carrier plate (1); and the carrier plate (1) can close the cooling ring groove to form the cooling flow channel (21).

3. The wafer carrier device according to claim 1, characterized in that: The cooling element (2) comprises: The heat exchange plate (23) is arranged in the cooling channel (21).

4. The wafer carrier device according to claim 1, characterized in that: The cooling channel (21) comprises an injection channel (211) and an outflow channel (212) which are interconnected, wherein the injection channel (211) bends and extends from an edge position of the cooling member (2) to a middle position of the cooling member (2), and the outflow channel (212) extends from the middle position of the cooling member (2) to an edge position of the cooling member (2).

5. The wafer carrier device according to claim 1, characterized in that: The wafer carrying device also includes: A first temperature detection element (4) is arranged at a middle position of the cooling element (2); and A plurality of second temperature detection components (5) are distributed at intervals at the edge of the cooling component (2).

6. The wafer carrying device according to claim 1, characterized in that: The cooling element (2) has a heating space on a side away from the supporting plate (1), and the heating element (3) is filled in the heating space.

7. The wafer carrier device according to any one of claims 1 to 6, characterized in that: The wafer carrying device also includes: A heat insulating member (6) is arranged on a side of the heating member (3) away from the cooling member (2), and a plurality of heat insulating protrusions (61) are spaced apart on a side of the heat insulating member (6) close to the heating member (3) to separate the heating member (3) from the heat insulating member (6) to form a heat insulating space (62).

8. The wafer carrier device according to any one of claims 1 to 6, characterized in that: The wafer carrying device also includes: A heat insulation plate (7) is arranged on a side of the heating element (3) away from the cooling element (2) and can cover the heating element (3).

9. The wafer carrier device according to any one of claims 1 to 6, characterized in that: The wafer carrying device also includes: A heat-insulating ring plate (8) is arranged around the periphery of the cooling element (2).

10. Wafer testing equipment, comprising a loading and positioning module, a base, a testing module and a material unloading and classification module, wherein the loading and positioning module is used for loading and positioning wafers, the testing module is used for testing the wafers, and the material unloading and classification module is used for classifying and storing wafers that have completed the test, characterized in that: The wafer testing equipment also includes: The wafer carrier device as described in any one of claims 1 to 9 is arranged on the base.

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