Flash chip structure easy to weld

Abstract

The utility model discloses a Flash chip structure easy to weld, which comprises a chip body and a bonding pad structure, the chip body comprises a connecting surface, a left side wall and a right side wall, and the left side wall and the right side wall are positioned on two sides of the connecting surface; the bonding pad structure comprises a left bonding pad and a right bonding pad, the left bonding pad and the right bonding pad are oppositely arranged on the connecting face, one end of the left bonding pad extends to the left side wall, and one end of the right bonding pad extends to the right side wall. Therefore, the left side bonding pad and the right side bonding pad are exposed, so that the left side bonding pad and the right side bonding pad extending to the left side wall and the right side wall can be directly contacted with soldering tin of a soldering pen to be successfully welded in the welding process, and meanwhile, the left side bonding pad and the right side bonding pad on the left side wall and the right side wall are heated; the heat can be driven to the left bonding pad and the right bonding pad on the connecting surface, so that the left bonding pad and the right bonding pad on the connecting surface are easily and successfully welded, and the welding efficiency and the welding success rate of the Flash chip are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production and manufacturing, in particular to a Flash chip structure which is easy to weld. Background Art

[0002] With the rapid development of information technology, Flash chips (flash memory chips) are widely used in various electronic products. At the same time, with the lightweight design of electronic products, the size of Flash chips is getting smaller and smaller. For example, a 1.2mmX0.7mm Flash chip with a capacitor package usually has a pad for connection, such as Figure 1 As shown, the pads on the traditional small Flash chip are arranged on one side of the Flash chip, and the arrangement positions of the pads are all far away from the edges of the Flash chip, that is, the pads are all inwardly designed. This pad design structure, when performing manual soldering, is likely to increase the difficulty of soldering and reduce the soldering efficiency because the soldering head cannot directly touch the pad.

[0003] In view of the above, a Flash chip structure that is easy to weld is proposed. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide a Flash chip structure that is easy to weld, thereby improving the welding efficiency and welding success rate of small Flash chips.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A Flash chip structure that is easy to weld comprises: a chip body and a pad structure, wherein the chip body comprises a connection surface, a left side wall and a right side wall, the left side wall and the right side wall are arranged opposite to each other, and the left side wall and the right side wall are located on both sides of the connection surface; the pad structure comprises a left side pad and a right side pad, the left side pad and the right side pad are arranged opposite to each other on the connection surface, and one end of the left side pad extends to the left side wall, and one end of the right side pad extends to the right side wall.

[0007] In one embodiment, the left pad is made of copper or copper-nickel-gold.

[0008] In one embodiment, the right pad is made of copper or copper-nickel-gold.

[0009] In one of the embodiments, the depth of one end of the left pad extending to the left side wall is less than or equal to one quarter of the thickness of the chip body.

[0010] In one of the embodiments, the depth of one end of the right solder pad extending to the right side wall is less than or equal to one quarter of the thickness of the chip body.

[0011] In one embodiment, the left pad is in a rectangular structure on the connection surface, and the right pad is in a rectangular structure on the connection surface.

[0012] In one of the embodiments, three left-side pads are provided.

[0013] In one embodiment, three right-side pads are provided, and each left-side pad is respectively arranged opposite to each right-side pad.

[0014] In one embodiment, the spacing distance between the left pad and the right pad is 0.15 mm.

[0015] In one embodiment, the spacing distance between two adjacent left pads is 0.20 mm.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The Flash chip structure which is easy to weld of the utility model is provided with a chip body and a welding pad structure, and one end of the left welding pad is extended to the left wall, and one end of the right welding pad is extended to the right wall. Compared with the existing retracted welding pad structure, the left welding pad and the right welding pad are partially exposed. In this way, during the welding process, the partial left welding pad and the partial right welding pad extending to the left and right side walls can directly contact the solder of the welding pen and be welded successfully. At the same time, the partial left welding pad and the partial right welding pad on the left and right side walls are heated, which can drive the heat to the left welding pad and the right welding pad on the connection surface, so that the left welding pad and the right welding pad on the connection surface are also easy to be welded successfully, thereby improving the welding efficiency and welding success rate of the Flash chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 It is a structural diagram of an existing Flash chip structure;

[0020] Figure 2 This is a schematic diagram of a Flash chip structure that is easy to weld in one embodiment of the utility model;

[0021] Figure 3 This is a schematic diagram of a top view of a Flash chip structure that is easy to weld in one embodiment of the utility model; DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0023] See also Figure 2 and Figure 3 As shown, a Flash chip structure 10 that is easy to weld includes: a chip body 100 and a pad structure 200, the chip body 100 includes a connecting surface 110, a left side wall 120 and a right side wall 130, the left side wall 120 and the right side wall 130 are arranged opposite to each other, and the left side wall 120 and the right side wall 130 are located on both sides of the connecting surface 110; the pad structure 200 includes a left side pad 210 and a right side pad 220, the left side pad 210 and the right side pad 220 are arranged opposite to each other on the connecting surface 110, and one end of the left side pad 210 extends to the left side wall 120, and one end of the right side pad 220 extends to the right side wall 130.

[0024] It should be noted that, by extending one end of the left solder pad 210 to the left side wall 120 and extending one end of the right solder pad 220 to the right side wall 130, relative to the existing retracted solder pad structure, by making the left solder pad 210 and the right solder pad 220 partially exposed, then, during the welding process, the partial left solder pad 210 and the partial right solder pad 220 extending to the left and right side walls can directly contact the solder of the soldering pen and be welded successfully. At the same time, the partial left solder pad 210 and the partial right solder pad 220 on the left and right side walls are heated, which can drive the heat to the left solder pad 210 and the right solder pad 220 located on the connecting surface 110, so that the left solder pad 210 and the right solder pad 220 located on the connecting surface 110 are also easily welded successfully, thereby improving the welding efficiency and welding success rate of the Flash chip.

[0025] Preferably, the left pad 210 is made of copper or copper-nickel-gold.

[0026] Preferably, the right pad 220 is made of copper or copper-nickel-gold.

[0027] In one implementation, the depth of one end of the left pad 210 extending to the left side wall 120 is less than or equal to one quarter of the thickness of the chip body 100 .

[0028] It should be noted that, in this embodiment, taking a 1.2mmX0.7mmX0.4mm Flash chip of a commonly used capacitor-like package as an example, the thickness of the Flash chip is 0.4mm, then the depth of one end of the left solder pad 210 extending to the left side wall 120 is less than or equal to 0.1mm of the thickness of the chip body, preferably 0.1mm, thereby ensuring sufficient solder space, thereby improving soldering efficiency and soldering success rate.

[0029] Similarly, the depth from one end of the right solder pad 220 to the right side wall 130 is less than or equal to one quarter of the thickness of the chip body. That is, the depth from one end of the left solder pad 210 to the right side wall 130 is less than or equal to 0.1 mm, preferably 0.1 mm, of the thickness of the chip body, thereby ensuring sufficient soldering space and improving soldering efficiency and soldering success rate.

[0030] Preferably, the left pad 210 is in a rectangular structure on the connection surface 110, and the right pad 220 is in a rectangular structure on the connection surface 110. The rectangular structure can maximize the area of ​​the pad to improve welding efficiency.

[0031] Preferably, three left solder pads 210 are provided, and the interval between two adjacent left solder pads 210 is 0.20 mm.

[0032] Preferably, three right solder pads 220 are provided, and each left solder pad 210 is respectively provided opposite to each right solder pad 220. The interval between two adjacent left solder pads 210 is 0.2 mm.

[0033] Preferably, the spacing distance between the left pad 210 and the right pad 220 is 0.15 mm. Under the condition of ensuring the packaging effect, the area of ​​the left pad 210 and the right pad 220 is increased as much as possible to ensure the welding effect.

[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A Flash chip structure that is easy to weld, characterized in that: include: A chip body, the chip body comprising a connection surface, a left side wall and a right side wall, the left side wall and the right side wall are arranged opposite to each other, and the left side wall and the right side wall are located on both sides of the connection surface; and A pad structure, the pad structure includes a left pad and a right pad, the left pad and the right pad are relatively arranged on the connecting surface, and one end of the left pad extends to the left side wall, and one end of the right pad extends to the right side wall.

2. The easy-to-weld Flash chip structure according to claim 1, characterized in that: The left soldering pad is made of copper or copper-nickel-gold.

3. The Flash chip structure that is easy to weld according to claim 1, characterized in that: The right soldering pad is made of copper or copper-nickel-gold.

4. The easy-to-weld Flash chip structure according to claim 1, characterized in that: The depth of one end of the left pad extending to the left side wall is less than or equal to one quarter of the thickness of the chip body.

5. The Flash chip structure that is easy to weld according to claim 1, characterized in that: The depth of one end of the right solder pad extending to the right side wall is less than or equal to one quarter of the thickness of the chip body.

6. The easy-to-weld Flash chip structure according to claim 1, characterized in that: The left pad has a rectangular structure on the connection surface, and the right pad has a rectangular structure on the connection surface.

7. The easy-to-weld Flash chip structure according to claim 1, characterized in that: There are three left-side pads.

8. The Flash chip structure that is easy to weld according to claim 7, characterized in that: There are three right-side pads, and each of the left-side pads is arranged opposite to each of the right-side pads.

9. The Flash chip structure that is easy to weld according to claim 8, characterized in that: The spacing distance between the left pad and the right pad is 0.15 mm.

10. The easy-to-weld Flash chip structure according to claim 9, characterized in that: The spacing between two adjacent left pads is 0.20 mm.

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