Testing device for camera module with LED

Abstract

The utility model discloses a testing device for a camera module with an LED, which is characterized in that the testing device comprises a testing support plate, a bonding positioning pad, a photoresistor and a testing connector, and the testing support plate is provided with a limiting groove; the bonding positioning pad is arranged in the limiting groove; the photoresistor is arranged on the test supporting plate, and the photoresistor is located on one side of the limiting groove; the test connector is arranged on the test support plate; when the camera module is placed in the limiting groove, the bonding positioning pad is used for positioning the camera module, and the connecting end on the camera module is connected with the test connector. Thus, the camera module is positioned by adopting the limiting groove and the bonding positioning pad, so that an existing mode of clamping and fixing the camera module through a clamping structure is replaced, damage to the outer surface of the camera module can be avoided, and the yield of the camera module can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of camera module production and manufacturing, in particular to a testing device for a camera module with an LED. Background Art

[0002] As the application of camera modules becomes more and more extensive, the functional requirements for camera modules are also increasing. For camera modules that need to work in dark environments or at night, adding LED lights is essential. In environments with different light and dark levels, LED lights can adaptively adjust different brightness to meet the working needs of camera modules.

[0003] In the manufacturing process of the camera module with LED, it is usually necessary to test whether the camera module and the LED light thereon can work normally, etc., so it is necessary to set up a corresponding testing device for testing the camera module with LED light. However, the existing testing device usually needs to set up a corresponding clamping structure to clamp and fix the camera module. This structure is not only complicated, but also easy to cause scratches or pinching on the outer surface of the camera module.

[0004] In view of the above, a testing device for a camera module with an LED is proposed, which can avoid problems such as scratches or pinching on the outer surface of the camera module during the test process. Utility Model Content

[0005] The purpose of the utility model is to overcome the deficiencies in the prior art and to provide a testing device for a camera module with an LED, which can prevent the outer surface of the camera module from being pinched or scratched.

[0006] The purpose of this utility model is achieved through the following technical solutions:

[0007] A test device for a camera module with an LED, characterized in that it comprises: a test support plate, an adhesive positioning pad, a photoresistor and a test connector, wherein a limiting groove is provided on the test support plate; the adhesive positioning pad is arranged in the limiting groove; the photoresistor is arranged on the test support plate, and the photoresistor is located on one side of the limiting groove; the test connector is arranged on the test support plate; when the camera module is placed in the limiting groove, the adhesive positioning pad is used to perform a positioning operation on the camera module, and the connecting end on the camera module is connected to the test connector.

[0008] In one embodiment, the adhesive positioning pad is a high-temperature double-sided adhesive.

[0009] In one of the embodiments, the high-temperature double-sided adhesive comprises an adsorption layer, a foaming layer and an adhesive layer stacked in sequence, and the adhesive layer adheres to the limiting groove.

[0010] In one embodiment, the adsorption layer is a fluorine-containing polyurethane porous membrane adsorption layer, and the foaming layer is a foam layer.

[0011] In one embodiment, the thickness of the high-temperature double-sided adhesive is greater than or equal to 1.1 mm.

[0012] In one embodiment, the depth of the limiting groove is the sum of the thickness of the bonding positioning pad and the thickness of the circuit board on the camera module.

[0013] In one embodiment, the type of the test connector is one of a BTB interface connector, a ZIF interface connector or a gold finger interface connector.

[0014] In one embodiment, two photoresistors are provided, and the photoresistors are respectively provided on the test support plate, and the photoresistors are respectively located on both sides of the limiting groove.

[0015] In one of the embodiments, when the camera module is placed in the limiting groove, the distance between the photoresistor and the LED light on the camera module is 5 to 10 mm.

[0016] In one of the embodiments, a connection strip is also provided on the test support board.

[0017] Compared with the prior art, the utility model has at least the following advantages:

[0018] The utility model is used for the testing device with LED camera module, by setting the test support plate, adhesive positioning pad, photoresistor and test connector, the camera module is limited by the limit groove on the test support plate, and the camera module is fixed and positioned by the adhesive positioning pad to avoid the shaking of the camera module. In this way, the camera module is positioned by the limit groove and adhesive positioning pad, thereby replacing the existing method of clamping and fixing the camera module by the clamping structure, which can avoid damage to the outer surface of the camera module, thereby ensuring the yield rate of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0020] Figure 1 This is a structural schematic diagram of a test device with an LED camera module in one embodiment of the utility model, in which a camera module is placed;

[0021] Figure 2 This is a structural schematic diagram of removing the camera module from a testing device with an LED camera module in one embodiment of the utility model. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0023] See also Figure 1 and Figure 2 As shown, a testing device 10 for a camera module with an LED includes: a testing support plate 100, an adhesive positioning pad 200, a photoresistor 300 and a testing connector 400, wherein a limiting groove 110 is provided on the testing support plate 100; the adhesive positioning pad 200 is arranged in the limiting groove 110; the photoresistor 300 is arranged on the testing support plate 100, and the photoresistor 300 is located on one side of the limiting groove 110; the testing connector 400 is arranged on the testing support plate 100; when the camera module 500 is placed in the limiting groove 110, the adhesive positioning pad 200 is used to perform positioning operation on the camera module 500, and the connecting end on the camera module 500 is connected to the testing connector 400.

[0024] It should be noted that an LED lamp 510 is installed on the camera module 500. When testing the camera module 500, the main body of the camera module 500 is first placed in the limiting groove 110, and the camera module 500 is limited by the limiting groove 110, wherein the bottom of the camera module 500 is a circuit board 520. Depending on the type of camera module 500, the circuit board 520 on the camera module 500 may be a PCB (printed circuit board) board or an FPC (flexible circuit board) board, and the shape structure and size of the limiting groove 110 may be designed to match the shape structure and size of the PCB board or the FPC board. Furthermore, in order to further fix and position the camera module 500, an adhesive positioning pad 200 is provided on the limit groove 110, and the circuit board on the camera module 500 is adhered and fixed on the adhesive positioning pad 200. The adhesive positioning pad 200 is used to position and fix the camera module 500, thereby avoiding the camera module 500 from shaking during the test. The connection end on the camera module 500 is bound and connected to the test connector 400. After starting the test device, the camera module 500 can be turned on, so that the LED light on the camera module 500 lights up. The photoresistor 300 is used to receive the light brightness of the LED light on the camera module 500, thereby converting the light brightness into a current resistance signal. The signal is transmitted to the corresponding control software through the test device, thereby identifying whether the current resistance signal of the LED light at different brightness is compliant, thereby realizing the test of whether the camera module and the LED light thereon can work normally. In this way, the camera module is positioned by means of the limiting groove 110 and the adhesive positioning pad 200, thereby replacing the existing method of clamping and fixing the camera module by a clamping structure, which can avoid damage to the outer surface of the camera module and ensure the yield rate of the camera module.

[0025] In one embodiment, the adhesive positioning pad 200 is a high-temperature double-sided adhesive. Since the camera module 500 will generate a certain temperature during the testing process, the adhesive positioning pad 200 uses a high-temperature double-sided adhesive to improve the durability of the adhesive positioning pad 200 and prevent the sol from adhering to the camera module 500 due to high temperature.

[0026] Furthermore, the high-temperature double-sided adhesive 200 includes an adsorption layer, a foaming layer and an adhesive layer stacked in sequence, and the adhesive layer adheres to the limiting groove 110 .

[0027] It should be noted that the adsorption layer is a fluorine-containing polyurethane porous membrane adsorption layer, and the foaming layer is a foam layer, and the foam has strong elasticity and exhaust performance. At the same time, the fluorine-containing polyurethane porous membrane adsorption layer has strong bubble exhaust performance. The bonding layer can be a silicone bonding layer, and the bonding layer is adhered and fixed on the limiting groove 110. When the camera module 500 is adhered to the bonding and positioning pad 200, the circuit board on the camera module 500 contacts the adsorption layer. At this time, the foam layer and the adsorption layer are compressed, and the bubbles between the circuit board and the foam layer are discharged through the fluorine-containing polyurethane porous membrane adsorption layer, so that the circuit board on the camera module 500 is adsorbed and fixed on the foam layer. The high-temperature double-sided adhesive of this structure does not have glue on the side in contact with the camera module, but is fixed by adsorption. Therefore, after the camera module is removed after the test, it can avoid residual glue adhering to the camera module, and at the same time, it can also improve the reuse rate of the bonding and positioning pad 200.

[0028] Preferably, the thickness of the high-temperature double-sided adhesive is greater than or equal to 1.1 mm.

[0029] In one embodiment, in order to prevent the limiting groove 110 from being too deep and blocking the LED light, thus affecting the transmission of the LED light source, the depth of the limiting groove 110 is the sum of the thickness of the adhesive positioning pad 200 and the thickness of the circuit board on the camera module 500. In this embodiment, the thickness of the adhesive positioning pad 200 is 1.1 mm. When the circuit board on the camera module is a PCB board, the corresponding thickness of the PCB board is 1 mm, and the depth of the limiting groove 110 is 2.1 mm; when the circuit board on the camera module is an FPC board, the corresponding thickness of the FPC board is 0.15 mm, and the depth of the limiting groove 110 is 1.25 mm.

[0030] Furthermore, the type of the test connector 400 is one of a BTB interface connector (board-to-board connector), a ZIF interface connector (zero insertion force socket connector) or a gold finger interface connector. The type of the test connector 400 can be selected according to the type of the connection end on the camera module.

[0031] In one embodiment, two photoresistors 300 are provided, and the photoresistors 300 are respectively provided on the test support plate 100, and the photoresistors 300 are respectively located on both sides of the limit groove 110. Since the LED lights on the camera module in this embodiment are provided in two rows, two corresponding photoresistors 300 are selected, and the two photoresistors 300 are respectively located on both sides of the camera module, and the brightness of the LED lights is received by the photoresistors, thereby converting the brightness of the LED lights into current resistance signals. It should also be noted that the number of photoresistors 300 can be adaptively set according to the number and position of LEDs.

[0032] Preferably, when the camera module 500 is placed in the limiting groove 110, the distance between the photoresistor 300 and the LED lamp 510 on the camera module 500 is 5 to 10 mm. In order to ensure that the photoresistor 300 is in the best position, thereby ensuring the accuracy of the photoresistor's sensing of light brightness, the distance between the photoresistor 300 on the side corresponding to the LED lamp 510 and the LED lamp 510 is 5 to 10 mm; at the same time, the LED lamp and the photoresistor 300 need to be in the same horizontal state.

[0033] Furthermore, a connection strip 600 is also provided on the test support board 100. The test device also includes a test fixture 700 for providing power; and the connection strip 600 is used to connect the test support board 100 with the test fixture 700, and the test fixture 700 provides power, electrical signals, control signals, etc. to the camera module through the test support board 100.

[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A testing device for an LED camera module, characterized in that: include: A test support plate, wherein a limiting groove is provided on the test support plate; An adhesive positioning pad, the adhesive positioning pad is arranged in the limiting groove; A photoresistor, wherein the photoresistor is disposed on the test support plate and is located at one side of the limiting groove; A test connector, the test connector is arranged on the test support plate; When the camera module is placed in the limiting groove, the adhesive positioning pad is used to position the camera module, and the connecting end on the camera module is connected to the test connector.

2. The testing device for an LED camera module according to claim 1, characterized in that: The bonding and positioning pad is a high-temperature double-sided adhesive.

3. The testing device for an LED camera module according to claim 2, characterized in that: The high-temperature double-sided adhesive comprises an adsorption layer, a foaming layer and an adhesive layer stacked in sequence, and the adhesive layer is adhered to the limiting groove.

4. The testing device for an LED camera module according to claim 3, characterized in that: The adsorption layer is a fluorine-containing polyurethane porous membrane adsorption layer, and the foaming layer is a foam layer.

5. The testing device for an LED camera module according to claim 2, characterized in that: The thickness of the high-temperature double-sided adhesive is greater than or equal to 1.1 mm.

6. The testing device for an LED camera module according to claim 1, characterized in that: The depth of the limiting groove is the sum of the thickness of the bonding positioning pad and the thickness of the circuit board on the camera module.

7. The testing device for an LED camera module according to claim 1, characterized in that: The type of the test connector is one of a BTB interface connector, a ZIF interface connector or a gold finger interface connector.

8. The testing device for an LED camera module according to claim 1, characterized in that: Two photoresistors are provided, and the photoresistors are respectively arranged on the test support plate, and the photoresistors are respectively located at two sides of the limiting groove.

9. The testing device for an LED camera module according to claim 8, characterized in that: When the camera module is placed in the limiting groove, the distance between the photoresistor and the LED light on the camera module is 5 to 10 mm.

10. The testing device for an LED camera module according to claim 1, characterized in that: The test support plate is also provided with a connection strip.

Images