LED packaging structure, LED module and electronic equipment

Abstract

The utility model relates to the technical field of LEDs, in particular to an LED packaging structure, an LED module and electronic equipment, the LED packaging structure comprises a substrate, an LED chip, a fence and a reflecting piece, the LED chip is arranged on the substrate, the reflecting piece is arranged on one side, far away from the substrate, of the LED chip, and the fence is arranged around three side surfaces of the LED chip. The LED packaging structure provided by the utility model directly emits light from the unsealed side surface of the LED chip so as to realize side light emitting, and the light emitting does not need to be performed by arranging a front surface or side surface light guide structure, so that the structure size is reduced, the size of the LED packaging structure is narrow and thin, and the corresponding size index requirements of lightening and thinning of electronic equipment are fully met.

Description

[Technical field]

[0001] The utility model relates to the technical field of LEDs, and in particular to an LED packaging structure, an LED module and an electronic device. [Background technology]

[0002] At present, electronic products are developing towards thinness and lightness in terms of size, and the pursuit of extreme ultra-thinness has become a technological trend. In response to the demand for thinness and lightness of electronic products, the decorative atmosphere lights on electronic products also need to be reduced in size accordingly. The size of traditional front-emitting RGB lamp beads is about 3.5×3.5×0.65mm. Even if the side-emitting method is adopted, the size of traditional side-emitting RGB lamp beads is about 3.8×1×0.6mm, and a large space is required for installation. Therefore, whether it is a traditional front-emitting RGB lamp bead with a front light guide structure or a traditional side-emitting RGB lamp bead with a side light guide structure, due to their large size, they can no longer meet the ultra-thin size index requirements of electronic products. [Contents of the utility model]

[0003] In order to solve the above problems, the utility model provides an LED packaging structure, an LED module and an electronic device.

[0004] In order to solve the above technical problems, the utility model provides an LED packaging structure in one embodiment, wherein the LED packaging structure includes a substrate, an LED chip, a fence and a reflector, the LED chip is arranged on the substrate, the reflector is arranged on a side of the LED chip away from the substrate, and the fence is arranged around three sides of the LED chip.

[0005] Preferably, the LED chip is an RGB Mini LED.

[0006] Preferably, the reflective element is an opaque reflective film.

[0007] Preferably, the LED packaging structure has a length less than or equal to 1.5 mm and / or a width less than or equal to 0.5 mm and / or a height less than or equal to 0.3 mm.

[0008] Preferably, the distance between the reflector and the substrate is greater than or equal to the thickness of the LED chip.

[0009] In order to solve the above technical problem, the utility model provides an LED module in another embodiment, wherein the LED module includes a carrier board and the LED packaging structure described above, wherein the carrier board is provided with a plurality of mounting positions, a mixed light area is defined between the plurality of mounting positions, the LED packaging structure is arranged on the mounting positions, and the side of the LED packaging structure not enclosed by the fence is defined as a light-transmitting side, and the light-transmitting side faces the mixed light area.

[0010] Preferably, the light mixing area is circular, and the plurality of LED packaging structures are arranged on the boundary of the light mixing area; or the light mixing area is rectangular, and the plurality of LED packaging structures are arranged on two relatively long sides of the light mixing area.

[0011] Preferably, the LED module is provided with a control element, and a plurality of the LED packaging structures constitute a lamp bead array module of three colors: red, green and blue, and the control element is electrically connected to the lamp bead array module of three colors: red, green and blue.

[0012] In order to solve the above technical problem, the present utility model provides an electronic device in another embodiment. The electronic device includes a main body and the above LED module arranged on the main body.

[0013] Preferably, the main body further comprises a light-conducting member, and the light-conducting member is arranged outside the LED module.

[0014] Compared with the prior art, the LED packaging structure, LED module and electronic device of the present invention have the following advantages:

[0015] 1. An LED packaging structure provided in one embodiment of the utility model includes a substrate, an LED chip, a fence and a reflector, wherein the LED chip is arranged on the substrate, the reflector is arranged on the side of the LED chip away from the substrate, and the fence is arranged around the three sides of the LED chip. By arranging the LED chip on the substrate, the reflector is arranged on the side of the LED chip away from the substrate to enclose the LED chip, and the fence is arranged around the three sides of the LED chip, and then enclosing the LED chip from the three sides, the substrate, the reflector and the fence enclose a semi-enclosed structure of the LED packaging structure, leaving only one side of the LED chip unenclosed for the light emitted by the LED chip to be emitted. The above-mentioned LED packaging structure directly emits light from the unenclosed side of the LED chip to realize side emission, without the need to emit light by setting a front or side light guide structure, thereby reducing the structural size, realizing that the LED packaging structure is both narrow and thin, and the thickness can be comparable to the thickness of a business card, reaching a sub-millimeter thickness, which fully meets the dimensional index requirements corresponding to the thinness of electronic devices.

[0016] 2. The LED chip in one embodiment of the utility model is RGB Mini LED. The size of the LED chip used in RGB Mini LED is usually between 50 and 200 microns, which is much smaller than the size of traditional LED chips. The reduction in the size of LED chips drives the size of LED packaging structures to be further reduced, thereby better meeting the size restrictions of electronic products; the reduction in the size of LED chips can achieve more precise control of backlight, providing light sources only where needed, and can effectively improve energy efficiency compared to traditional RGB LED lamp beads with large power consumption and heat dissipation. In addition, RGB Mini LED is easy to cut into various shapes, and the high yield rate is conducive to cost reduction and efficiency improvement.

[0017] 3. The reflector in one embodiment of the utility model is an opaque reflective film. The opaque reflective film is used as a reflector and is arranged on the side of the LED chip away from the substrate. The opaque reflective film has the advantages of opacity and high reflectivity, and can refract the light emitted by the LED chip from the side of the LED chip as much as possible, thereby reducing light loss and improving the luminous efficiency of the LED packaging structure.

[0018] 4. The length of the LED packaging structure in one embodiment of the utility model is less than or equal to 1.5mm and / or the width is less than or equal to 0.5mm and / or the height is less than or equal to 0.3mm. By limiting the size of the LED packaging structure, the length of the LED packaging structure is less than or equal to 1.5mm, which is much smaller than the length of the traditional front-emitting RGB lamp beads of about 3.5mm and the length of the traditional side-emitting RGB lamp beads of about 3.8mm, which can further meet the size index requirements corresponding to the thinness of electronic equipment; the width of the LED packaging structure is less than or equal to 0.5mm, which is much smaller than the width of the traditional front-emitting RGB lamp beads of about 3.5mm and the width of the traditional side-emitting RGB lamp beads of about 1mm, so that the LED packaging structure remains narrow enough in width; the height of the LED packaging structure is less than or equal to 0.3mm, so that the thickness of the LED packaging structure is equivalent to the thickness of a business card, which fully meets the ultra-thin size requirements.

[0019] 5. In one embodiment of the present invention, the distance between the reflector and the substrate is greater than or equal to the thickness of the LED chip. When the distance between the reflector and the substrate is greater than the thickness of the LED chip, the LED chip is only arranged on the substrate and does not contact the reflector; when the distance between the reflector and the substrate is equal to the thickness of the LED chip, the LED chip fits the reflector. Both arrangements can directly emit light from the unenclosed side of the LED chip to achieve side emission.

[0020] 6. An LED module in one embodiment of the utility model includes a carrier board and the above-mentioned LED packaging structure, the carrier board is provided with a plurality of mounting positions, a light mixing area is defined between the plurality of mounting positions, the LED packaging structure is provided on the mounting positions, and the side of the LED packaging structure not surrounded by the fence is defined as the light-transmitting side, and the light-transmitting side faces the light mixing area. The LED module can achieve the same beneficial effects as the LED packaging structure.

[0021] 7. In one embodiment of the present invention, the light-mixing area is circular, and multiple LED packaging structures are arranged on the border of the light-mixing area, or the light-mixing area is rectangular, and multiple LED packaging structures are arranged on two relatively long sides of the light-mixing area. By setting the light-mixing area to be circular, and setting multiple LED packaging structures on the border of the light-mixing area, multiple LED packaging structures can emit light from the side of the light-mixing area, or by setting the light-mixing area to be rectangular, and setting multiple LED packaging structures on two relatively long sides of the light-mixing area, multiple LED packaging structures can emit light from the side of the light-mixing area, thereby achieving a colorful effect of a circular or rectangular gradient light-mixing area.

[0022] 8. The LED module in one embodiment of the utility model is provided with a control element, and a plurality of LED packaging structures constitute a lamp bead array module of three colors: red, green, and blue. The control element is electrically connected to the lamp bead array module of three colors: red, green, and blue. By electrically connecting the control element to the lamp bead array module of three colors, the control element can change the brightness of the light emitted by the lamp bead array of the three colors through three-way control signals, and can adjust the intensity of light of different colors, and superimpose the proportion of mixed colors, so as to present different RGB colorful colors and gradient color area shapes, so as to achieve the effect of colorful display, and has the advantages of wide color gamut, high color accuracy, and low cost.

[0023] 9. An electronic device in one embodiment of the present invention comprises a main body and the above-mentioned LED module arranged on the main body. The electronic device can achieve the same beneficial effects as the above-mentioned LED module, which will not be described in detail here.

[0024] 10. In one embodiment of the present invention, the main body further comprises a light-transmitting member, which is arranged outside the LED module. The light-transmitting member can expand and transmit the light emitted by the LED module to a wider range, thereby achieving an atmosphere display rendering effect.

Brief Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 It is a three-dimensional structural schematic diagram of the LED packaging structure provided by the first embodiment of the utility model.

[0027] Figure 2 It is a schematic diagram of the exploded structure of the LED module provided in the second embodiment of the present utility model.

[0028] Figure 3 This is the front side of the LED module provided by the second embodiment of the utility model Figure 1 .

[0029] Figure 4 This is the front side of the LED module provided by the second embodiment of the utility model Figure 2 .

[0030] Figure 5 It is a block diagram of an LED module provided by the second embodiment of the present utility model.

[0031] Figure 6 The frame of the electronic device provided by the third embodiment of the utility model Figure 1 .

[0032] Figure 7 The frame of the electronic device provided by the third embodiment of the utility model Figure 2 .

[0033] Description of the accompanying drawings:

[0034] 1. LED packaging structure; 20. substrate; 30. LED chip; 40. fence; 50. reflector; 60. light-transmitting side; 100. LED module; 110. carrier board; 111. mounting position; 112. light-mixing area; 120. control element; 130. lamp bead array module; 131. red lamp bead array module; 132. green lamp bead array module; 133. blue lamp bead array module; 200. electronic device; 201. main body; 202. light-transmitting component. [Specific implementation method]

[0035] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0036] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0037] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0038] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0039] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0040] See also Figure 1 The first embodiment of the utility model provides an LED packaging structure 1, which includes a substrate 20, an LED chip 30, a fence 40 and a reflector 50. The LED chip 30 is arranged on the substrate 20, the reflector 50 is arranged on a side of the LED chip 30 away from the substrate 20, and the fence 40 is arranged around the three sides of the LED chip 30.

[0041] It can be understood that by arranging the LED chip 30 on the substrate 20, the reflector 50 is arranged on the side of the LED chip 30 away from the substrate 20 to enclose the LED chip 30, and the fence 40 is arranged around the three sides of the LED chip 30, thereby enclosing the LED chip 30 from the three sides, the substrate 20, the reflector 50 and the fence 40 enclose a semi-enclosed structure of the LED packaging structure 1. Since the substrate 20, the reflector 50 and the fence 40 on the three sides form a five-sided enclosed structure, only one side of the LED chip 30 is left unenclosed, and the reflector 50 can reflect the light emitted by the LED chip 30, so the light emitted by the LED chip 30 can only be emitted from the side of the LED chip 30. The above-mentioned LED packaging structure 1 directly emits light from the unsealed side of the LED chip 30 to achieve side emission, and there is no need to set up a front or side light-guiding structure to emit light, thereby reducing the structural size and achieving the effect that the LED packaging structure 1 is both narrow and thin. The thickness of the LED packaging structure 1 can be comparable to the thickness of a business card, reaching a sub-millimeter thickness. The sub-millimeter thickness refers to a thickness level of less than 1mm, so it can fully meet the dimensional index requirements corresponding to the thinness of electronic equipment.

[0042] Preferably, as a specific implementation, the substrate 20 is an FPC substrate. The FPC substrate has the advantages of being light, thin, bendable and foldable, and can effectively reduce the structural size of the LED packaging structure 1 .

[0043] Preferably, as a specific implementation, the side of the fence 40 facing the LED chip 30 is filled with a transparent colloid, which can improve the luminous efficiency of the LED packaging structure 1.

[0044] Please continue reading Figure 1 , further, the LED chip 30 is an RGB Mini LED.

[0045] It should be noted that RGB Mini LED is a display technology that uses miniature red, green and blue LEDs as backlights or self-luminous display pixels. It combines the characteristics of traditional LED backlight and Micro LED technology, and its size is between small-pitch LED and Micro LED, usually around 100 microns. Mini LED technology has significant advantages and application potential in the display field.

[0046] Understandably, the size of the LED chip 30 used in RGB Mini LED is usually between 50 and 200 microns, which is much smaller than the size of traditional chips. The reduction in the size of the LED chip 30 drives the size of the LED package structure 1 to be further reduced, which can reach the thickness of a business card, thereby better meeting the size restriction requirements of electronic products; the reduction in the size of the LED chip 30 can achieve more precise control of the backlight, providing light sources only where needed, which can effectively improve energy efficiency compared to the large power consumption and heat dissipation of traditional RGB LED lamp beads. In addition, RGB Mini LED is easy to cut into various shapes, and the high yield rate is conducive to cost reduction and efficiency improvement.

[0047] Please continue reading Figure 1 Furthermore, the reflector 50 is an opaque reflective film.

[0048] It can be understood that the opaque reflective film is used as a reflective member 50 and is arranged on the side of the LED chip 30 away from the substrate 20. The opaque reflective film has the advantages of opacity and high reflectivity, and refracts the light emitted by the LED chip 30 from the side of the LED chip 30 as much as possible, thereby reducing light loss and improving the luminous efficiency of the LED packaging structure 1.

[0049] Preferably, metal reflective film, dielectric high reflective film or multi-layer dielectric HR coating can be used as opaque reflective film due to its opacity and high reflectivity. It should be noted that the above are only preferred types of opaque reflective film, and other types of opaque reflective film are not limited here.

[0050] Please continue reading Figure 1 Furthermore, the length of the LED packaging structure 1 is less than or equal to 1.5 mm and / or the width is less than or equal to 0.5 mm and / or the height is less than or equal to 0.3 mm.

[0051] It can be understood that by limiting the size of the LED packaging structure 1, the length of the LED packaging structure 1 is less than or equal to 1.5mm, which is much smaller than the length of the traditional front-emitting RGB lamp beads of about 3.5mm, and the length of the traditional side-emitting RGB lamp beads of about 3.8mm, which can further meet the size index requirements corresponding to the thinness of electronic equipment; the width of the LED packaging structure 1 is less than or equal to 0.5mm, which is much smaller than the width of the traditional front-emitting RGB lamp beads of about 3.5mm, and the width of the traditional side-emitting RGB lamp beads of about 1mm, so that the LED packaging structure 1 remains narrow enough in width; the height of the LED packaging structure 1 is less than or equal to 0.3mm, so that the thickness of the LED packaging structure 1 is equivalent to the thickness of a business card, which fully meets the ultra-thin size requirements.

[0052] Please continue reading Figure 1Furthermore, the distance between the reflector 50 and the substrate 20 is greater than or equal to the thickness of the LED chip 30 .

[0053] It can be understood that when the distance between the reflector 50 and the substrate 20 is greater than the thickness of the LED chip 30, the LED chip 30 is only arranged on the substrate 20 and does not contact the reflector 50; when the distance between the reflector 50 and the substrate 20 is equal to the thickness of the LED chip 30, the LED chip 30 is fitted with the reflector 50. Both settings can directly emit light from the unenclosed side of the LED chip 30 to achieve side emission.

[0054] Please combine Figure 1 and Figure 2 The second embodiment of the utility model provides an LED module 100, which includes a carrier board 110 and an LED packaging structure 1. The carrier board 110 is provided with a plurality of mounting positions 111, and a light mixing area 112 is defined between the plurality of mounting positions 111. The LED packaging structure 1 is set on the mounting positions 111, and the side of the LED packaging structure 1 that is not enclosed by the fence 40 is defined as a light-transmitting side 60, and the light-transmitting side 60 faces the light-mixing area 112.

[0055] It can be understood that the LED module 100 can achieve the same beneficial effects as the LED packaging structure 1. The LED module 100 is provided with multiple mounting positions 111 on the carrier 110, and a mixed light area 112 is defined between the multiple mounting positions 111. The LED packaging structure 1 is arranged on the mounting position 111, so that the brightness of different colors of light emitted by the side light of the LED packaging structure 1 can be adjusted to achieve a diversified mixed light effect of the mixed light area 112. The shape of the mixed light area 112 can be selected according to specific lighting requirements, for example, it can be set to a circular, rectangular or other geometric shape. The specific combination method and position of multiple LED packaging structures 1 can be selected according to lighting requirements, and are not limited here. The mixed light area 112 produces a random colorful gradient color effect through mixed light superposition.

[0056] Please combine Figure 2 and Figure 3 Furthermore, the light mixing area 112 is circular, and a plurality of LED packaging structures 1 are arranged on the boundary of the light mixing area 112 .

[0057] It can be understood that by setting the mixing area 112 to a circle and setting multiple LED packaging structures 1 on the boundary of the mixing area 112, the multiple LED packaging structures 1 can emit light from the side of the mixing area 112 to achieve a colorful effect of the circular gradient color mixing area 112.

[0058] Please combine Figure 2 and Figure 4Furthermore, the light mixing area 112 is rectangular, and the plurality of LED packaging structures 1 are arranged on two relatively long sides of the light mixing area 112 .

[0059] It can be understood that by setting the mixing area 112 to a rectangle and arranging multiple LED packaging structures 1 on two relatively long sides of the mixing area 112, the multiple LED packaging structures 1 can emit light from the side of the mixing area 112 to achieve a colorful effect of the rectangular gradient color mixing area 112.

[0060] Please combine Figure 2 and Figure 5 Furthermore, the LED module 100 is provided with a control element 120, and a plurality of LED package structures 1 constitute a lamp bead array module 130 of three colors: red, green and blue. The control element 120 is electrically connected to the lamp bead array module 130 of three colors: red, green and blue.

[0061] It can be understood that the red, green and blue LEDs of the multiple LED packaging structures 1 respectively form a red lamp bead array module 131, a green lamp bead array module 132 and a blue lamp bead array module 133. The control element 120 is electrically connected to the red lamp bead array module 131, the green lamp bead array module 132 and the blue lamp bead array module 133, so that the control element 120 can change the brightness of the light emitted by the three colors of the lamp bead array through three control signals, and can adjust the intensity of light of different colors, and superimpose the proportion of mixed colors, so as to present different RGB colorful colors and gradient color area areas and shapes, so as to achieve a colorful display effect, with the advantages of wide color gamut, high color accuracy and low cost.

[0062] Optionally, the formation of the lamp bead array module 130 can be a ring formation, a parallel lamp irregular arrangement formation, etc.

[0063] Please combine Figure 2 and Figure 6 The third embodiment of the present invention provides an electronic device 200 , which includes a main body 201 and an LED module 100 disposed on the main body 201 .

[0064] Preferably, as a specific implementation, the electronic device 200 may be a smart speaker, a breathing light, an atmosphere light, etc. It should be noted that the above is only an example, and other types of electronic devices 200 are not limited here.

[0065] See also Figure 7 Furthermore, the main body 201 also includes a light-conducting component 202 , and the light-conducting component 202 is arranged outside the LED module 100 .

[0066] It can be understood that the light transmission component 202 can expand and transmit the light emitted by the LED module 100 to a wider range, thereby achieving an atmosphere display rendering effect.

[0067] It should be noted that the corresponding relationship between the light conductive component 202 and the LED module 100 can be that a single LED module 100 is arranged on one side of the light conductive component 202 and is installed and connected to the light conductive component 202, or that multiple LED modules 100 are arranged on multiple sides of the light conductive component 202 and are installed and connected. The orientation and quantity of the multiple LED modules 100 are not limited here.

[0068] Preferably, as a specific implementation, the LED module 100 can be a single-row side-emitting Mini RGB LED module, and the light-transmitting member 202 can be an ultra-thin light-guiding material such as an optical fiber light-guiding cloth or a light-guiding film, and the optical fiber end and the lamp bead can be connected to form a through light beam, and because the surface of the optical fiber is provided with a light-transmitting point, a star-studded eye-catching visual scene can be formed, thereby achieving an atmosphere display rendering effect. It should be noted that the above is only an example, and other types of light-transmitting members 202 are not limited here.

[0069] Compared with the prior art, the LED packaging structure, LED module and electronic device of the present invention have the following advantages:

[0070] 1. An LED packaging structure provided in one embodiment of the utility model includes a substrate, an LED chip, a fence and a reflector, wherein the LED chip is arranged on the substrate, the reflector is arranged on the side of the LED chip away from the substrate, and the fence is arranged around the three sides of the LED chip. By arranging the LED chip on the substrate, the reflector is arranged on the side of the LED chip away from the substrate to enclose the LED chip, and the fence is arranged around the three sides of the LED chip, and then enclosing the LED chip from the three sides, the substrate, the reflector and the fence enclose a semi-enclosed structure of the LED packaging structure, leaving only one side of the LED chip unenclosed for the light emitted by the LED chip to be emitted. The above-mentioned LED packaging structure directly emits light from the unenclosed side of the LED chip to realize side emission, without the need to emit light by setting a front or side light guide structure, thereby reducing the structural size, realizing that the LED packaging structure is both narrow and thin, and the thickness can be comparable to the thickness of a business card, reaching a sub-millimeter thickness, which fully meets the dimensional index requirements corresponding to the thinness of electronic devices.

[0071] 2. The LED chip in one embodiment of the utility model is RGB Mini LED. The size of the LED chip used in RGB Mini LED is usually between 50 and 200 microns, which is much smaller than the size of traditional LED chips. The reduction in the size of LED chips drives the size of LED packaging structures to be further reduced, thereby better meeting the size restrictions of electronic products; the reduction in the size of LED chips can achieve more precise control of backlight, providing light sources only where needed, and can effectively improve energy efficiency compared to traditional RGB LED lamp beads with large power consumption and heat dissipation. In addition, RGB Mini LED is easy to cut into various shapes, and the high yield rate is conducive to cost reduction and efficiency improvement.

[0072] 3. The reflector in one embodiment of the utility model is an opaque reflective film. The opaque reflective film is used as a reflector and is arranged on the side of the LED chip away from the substrate. The opaque reflective film has the advantages of opacity and high reflectivity, and can refract the light emitted by the LED chip from the side of the LED chip as much as possible, thereby reducing light loss and improving the luminous efficiency of the LED packaging structure.

[0073] 4. The length of the LED packaging structure in one embodiment of the utility model is less than or equal to 1.5mm and / or the width is less than or equal to 0.5mm and / or the height is less than or equal to 0.3mm. By limiting the size of the LED packaging structure, the length of the LED packaging structure is less than or equal to 1.5mm, which is much smaller than the length of the traditional front-emitting RGB lamp beads of about 3.5mm and the length of the traditional side-emitting RGB lamp beads of about 3.8mm, which can further meet the size index requirements corresponding to the thinness of electronic equipment; the width of the LED packaging structure is less than or equal to 0.5mm, which is much smaller than the width of the traditional front-emitting RGB lamp beads of about 3.5mm and the width of the traditional side-emitting RGB lamp beads of about 1mm, so that the LED packaging structure remains narrow enough in width; the height of the LED packaging structure is less than or equal to 0.3mm, so that the thickness of the LED packaging structure is equivalent to the thickness of a business card, which fully meets the ultra-thin size requirements.

[0074] 5. In one embodiment of the present invention, the distance between the reflector and the substrate is greater than or equal to the thickness of the LED chip. When the distance between the reflector and the substrate is greater than the thickness of the LED chip, the LED chip is only arranged on the substrate and does not contact the reflector; when the distance between the reflector and the substrate is equal to the thickness of the LED chip, the LED chip fits the reflector. Both arrangements can directly emit light from the unenclosed side of the LED chip to achieve side emission.

[0075] 6. An LED module in one embodiment of the utility model includes a carrier board and the above-mentioned LED packaging structure, the carrier board is provided with a plurality of mounting positions, a light mixing area is defined between the plurality of mounting positions, the LED packaging structure is provided on the mounting positions, and the side of the LED packaging structure not surrounded by the fence is defined as the light-transmitting side, and the light-transmitting side faces the light mixing area. The LED module can achieve the same beneficial effects as the LED packaging structure.

[0076] 7. In one embodiment of the present invention, the light-mixing area is circular, and multiple LED packaging structures are arranged on the border of the light-mixing area, or the light-mixing area is rectangular, and multiple LED packaging structures are arranged on two relatively long sides of the light-mixing area. By setting the light-mixing area to be circular, and setting multiple LED packaging structures on the border of the light-mixing area, multiple LED packaging structures can emit light from the side of the light-mixing area, or by setting the light-mixing area to be rectangular, and setting multiple LED packaging structures on two relatively long sides of the light-mixing area, multiple LED packaging structures can emit light from the side of the light-mixing area, thereby achieving a colorful effect of a circular or rectangular gradient light-mixing area.

[0077] 8. The LED module in one embodiment of the utility model is provided with a control element, and a plurality of LED packaging structures constitute a lamp bead array module of three colors: red, green, and blue. The control element is electrically connected to the lamp bead array module of three colors: red, green, and blue. By electrically connecting the control element to the lamp bead array module of three colors, the control element can change the brightness of the light emitted by the lamp bead array of the three colors through three-way control signals, and can adjust the intensity of light of different colors, and superimpose the proportion of mixed colors, so as to present different RGB colorful colors and gradient color area shapes, so as to achieve the effect of colorful display, and has the advantages of wide color gamut, high color accuracy, and low cost.

[0078] 9. An electronic device in one embodiment of the present invention comprises a main body and the above-mentioned LED module arranged on the main body. The electronic device can achieve the same beneficial effects as the above-mentioned LED module, which will not be described in detail here.

[0079] 10. In one embodiment of the present invention, the main body further comprises a light-transmitting member, which is arranged outside the LED module. The light-transmitting member can expand and transmit the light emitted by the LED module to a wider range, thereby achieving an atmosphere display rendering effect.

[0080] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED packaging structure, characterized in that: The LED packaging structure includes a substrate, an LED chip, a fence and a reflector. The LED chip is arranged on the substrate, the reflector is arranged on a side of the LED chip away from the substrate, and the fence is arranged around three sides of the LED chip.

2. The LED packaging structure according to claim 1, wherein: The LED chip is RGBMiniLED.

3. The LED packaging structure according to claim 1, wherein: The reflective element is an opaque reflective film.

4. The LED packaging structure according to claim 2, wherein: The LED packaging structure has a length less than or equal to 1.5 mm, a width less than or equal to 0.5 mm, and / or a height less than or equal to 0.3 mm.

5. The LED packaging structure according to claim 1, wherein: The distance between the reflector and the substrate is greater than or equal to the thickness of the LED chip.

6. An LED module, characterized in that: The LED module includes a carrier board and an LED packaging structure as described in any one of claims 1 to 5, wherein the carrier board is provided with a plurality of mounting positions, a light mixing area is defined between the plurality of mounting positions, the LED packaging structure is arranged on the mounting positions, and a side of the LED packaging structure not enclosed by the fence is defined as a light-transmitting side, and the light-transmitting side faces the light-mixing area.

7. The LED module according to claim 6, wherein: The light mixing area is circular, and the plurality of LED packaging structures are arranged on the boundary of the light mixing area; or the light mixing area is rectangular, and the plurality of LED packaging structures are arranged on two relatively long sides of the light mixing area.

8. The LED module according to claim 6, wherein: The LED module is provided with a control element, and a plurality of the LED packaging structures constitute a lamp bead array module of three colors: red, green and blue. The control element is electrically connected to the lamp bead array module of three colors: red, green and blue.

9. An electronic device, characterized in that: The electronic device comprises a main body and an LED module as claimed in any one of claims 6 to 8 arranged on the main body.

10. The electronic device according to claim 9, characterized in that: The main body further comprises a light-conducting component, and the light-conducting component is arranged outside the LED module.

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