Circuit board temperature control device

Abstract

The utility model belongs to the technical field of circuit board temperature control, and discloses a circuit board temperature control device. The circuit board temperature control device comprises a heat dissipation piece, a heat conduction piece and a semiconductor refrigerator. The heat conduction piece is arranged above the heat dissipation piece, a first avoiding groove is formed in the heat conduction piece, the circuit board is arranged on the heat conduction piece in a covering mode, electronic components on the circuit board can be arranged in the first avoiding groove, meanwhile, the space between the first avoiding groove and the circuit board is filled with heat conduction mud, and the heat conduction mud wraps the electronic components on the circuit board. The semiconductor cooler is arranged between the heat dissipation piece and the heat conduction piece, a temperature sensor is arranged in the heat conduction piece, the temperature sensor is used for detecting the temperature of the heat conduction piece, and the temperature sensor is in communication connection with the semiconductor cooler. According to the utility model, accurate temperature control of the circuit board can be realized, the temperature control efficiency of electronic components on the circuit board is improved, and the electronic components on the circuit board are uniformly heated.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board temperature control, in particular to a circuit board temperature control device. Background Art

[0002] When controlling external parts, the control program in the circuit board is usually used for control. The circuit board is equipped with electronic components to realize the electrical functions of the circuit board. However, the excessively high or low ambient temperature and the heating of the electronic components themselves will cause the electronic components on the circuit board to send out error signals, reducing the stability of the electronic components during use. Especially when using a temperature-controlled circuit board to control the temperature of external parts, the excessively high or low ambient temperature and the heating of the electronic components themselves will cause the electronic components in the temperature-controlled circuit board to send out error signals. The issuance of the error signal causes a large deviation between the temperature controlled by the temperature-controlled circuit board and the temperature of the external parts actually controlled, affecting the temperature control accuracy.

[0003] In the prior art, the temperature control accuracy of the circuit board is low, and it is difficult to accurately control the temperature; at the same time, the electronic components on the circuit board are small in size and have poor external thermal conductivity, so the temperature control efficiency of the electronic components is low. The spatial structure of the electronic components is also different, and it is difficult to ensure that the electronic components are heated evenly during temperature control. Utility Model Content

[0004] The utility model provides a circuit board temperature control device, which is used to realize accurate temperature control of the circuit board and improve the temperature control efficiency of electronic components on the circuit board, while making the electronic components on the circuit board receive temperature uniformly.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A circuit board temperature control device, comprising:

[0007] Heat sink;

[0008] A heat conducting member, the heat conducting member is arranged on the heat dissipating member, a first avoidance groove is arranged on the heat conducting member, a circuit board can be covered on the heat conducting member, and the electronic components on the circuit board are placed in the first avoidance groove, a heat conducting mud layer is arranged in the first avoidance groove, and the electronic components can be embedded in the heat conducting mud layer;

[0009] A semiconductor refrigerator is arranged between the heat sink and the heat conductor. A temperature sensor is arranged in the heat conductor. The temperature sensor is used to detect the temperature of the heat conductor, and the temperature sensor is communicatively connected with the semiconductor refrigerator.

[0010] Preferably, a semiconductor refrigerator installation groove is provided on the heat sink, and at least one semiconductor refrigerator is installed in the semiconductor refrigerator installation groove.

[0011] Preferably, a temperature sensor installation groove is provided on a side of the heat conducting element close to the heat dissipating element, and the temperature sensor is arranged in the temperature sensor installation groove.

[0012] Preferably, the temperature sensor installation groove is arranged at the bottom of the first avoidance groove.

[0013] Preferably, a gap is left between the joint surfaces of the heat conducting element and the heat dissipating element, and the gap is used for allowing a line connected to the temperature sensor and the semiconductor refrigerator to pass through.

[0014] Preferably, heat dissipation fins are provided at the bottom of the heat dissipation element.

[0015] Preferably, the heat sink and the heat conductor are both made of aluminum alloy.

[0016] Preferably, heat conducting layers are provided on the upper and lower surfaces of the semiconductor refrigerator.

[0017] Preferably, a side of the circuit board away from the first avoidance groove is covered with a thermal insulation layer.

[0018] Preferably, a second avoidance groove is further provided on the heat conducting member, the second avoidance groove is connected to the first avoidance groove, and one end of the second avoidance groove away from the first avoidance groove is connected to the end surface of the heat conducting member, and an external interface is also provided on the side of the circuit board where the electronic components are located, and the external interface is placed in the second avoidance groove.

[0019] Beneficial effects of the utility model:

[0020] The utility model is provided with a heat sink, a semiconductor refrigerator, a heat conducting member and a circuit board, wherein the semiconductor refrigerator is provided between the heat sink and the heat conducting member, and the circuit board cover is provided on the heat conducting member. A temperature sensor is also provided in the heat conducting member, and the temperature sensor is used to detect the temperature of the heat conducting member, and the temperature sensor is communicatively connected with the semiconductor refrigerator, so that the semiconductor refrigerator can raise and lower the temperature of the circuit board through the heat conducting member according to the temperature detected by the temperature sensor; at the same time, a first avoidance groove is provided on the heat conducting member, and the electronic components on the circuit board are placed in the first avoidance groove on the heat conducting member, and at the same time, the space between the first avoidance groove and the circuit board is filled with heat conducting mud, and the heat conducting mud fully wraps the electronic components to accelerate heat exchange, improve the temperature control efficiency of the circuit board, and achieve full temperature control of the electronic components; the wrapping of the heat conducting mud can also make the temperature of the heat conducting mud be uniformly transmitted to each electronic component when the circuit board temperature control device heats or dissipates the heat of the electronic components, so that the temperature of the electronic components is uniform, and the stability of the electronic components is avoided to be affected by excessively high or low temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the circuit board temperature control device provided by the utility model;

[0022] Figure 2 It is a structural schematic diagram of a heat sink of a circuit board temperature control device provided by the utility model;

[0023] Figure 3 It is a structural schematic diagram of a heat-conducting member of a circuit board temperature control device provided by the utility model;

[0024] Figure 4 It is a structural schematic diagram of a circuit board of the circuit board temperature control device provided by the utility model;

[0025] Figure 5 It is a structural schematic diagram of a semiconductor refrigerator of a circuit board temperature control device provided by the utility model;

[0026] Figure 6 It is a structural schematic diagram of the thermal insulation layer of the circuit board temperature control device provided by the utility model;

[0027] Figure 7 It is a structural schematic diagram of a semiconductor refrigerator of a circuit board temperature control device provided by the utility model when it is arranged on a heat sink;

[0028] Figure 8 It is a structural schematic diagram of the circuit board temperature control device provided by the utility model when the heat conducting member is fixed to the heat dissipating member;

[0029] Fig. 9 It is a structural schematic diagram of the oblique lower side of the circuit board temperature control device provided by the utility model.

[0030] In the figure:

[0031] 1- heat sink; 11- semiconductor refrigerator mounting slot; 12- heat sink fins; 13- first threaded connection hole;

[0032] 2-heat conducting member; 21-first avoidance groove; 22-temperature sensor mounting groove; 23-second threaded connection hole; 24-second avoidance groove;

[0033] 3-circuit board; 31-external interface; 32-electronic components;

[0034] 4- Semiconductor refrigerator;

[0035] 5-Insulation layer. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] like Figure 1-Figure 5As shown, the utility model provides a circuit board temperature control device, which includes a heat sink 1, a heat conductor 2 and a semiconductor refrigerator 4. The heat sink 1 is made of a high thermal conductivity material, which is convenient for the heat sink 1 to conduct and dissipate heat. The heat conductor 2 is arranged on the heat sink 1, and the heat conductor 2 is also made of a high thermal conductivity material. Specifically, the four corners of the heat conductor 2 are provided with second threaded connection holes 23, and the corresponding positions of the heat sink 1 are provided with first threaded connection holes 13, and screws are screwed with the first threaded connection holes 13 and the second threaded connection holes 23 to fix the heat conductor 2 on the heat sink 1. A first avoidance groove 21 is provided on the heat conductor 2, and the circuit board 3 can be covered on the heat conductor 2, and the electronic components 32 on the circuit board 3 can be placed in the first avoidance groove 21. Specifically, the four corners of the circuit board 3 are provided with mounting holes. When the circuit board 3 is installed and fixed, the position of the mounting hole corresponds to the second threaded connection hole 23 on the heat conductor 2. After the screw passes through the mounting hole, it is screwed with the first threaded connection hole 13 and the second threaded connection hole 23 to fix the circuit board 3 on the heat conductor 2 and fix the heat conductor 2 on the heat sink 1. After fixing, the boundary line of the circuit board 3 coincides with the boundary line of the heat conductor 2. A thermal conductive mud layer is provided in the first avoidance groove 21, and the electronic components 32 can be embedded in the thermal conductive mud layer. The thermal conductive mud and the electronic components 32 are fully in contact, which can accelerate the heat conduction between the electronic components 32 and the outside world and improve the temperature control efficiency of the electronic components 32. The wrapping of the thermal conductive mud can also make the temperature of the thermal conductive mud be evenly transmitted to each electronic component 32 when the circuit board temperature control device heats or dissipates the electronic components 32, so that the temperature of the electronic components 32 is uniform, avoiding local overheating or underheating, and improving the stability of the electronic components 32. The semiconductor refrigerator 4 is arranged between the heat sink 1 and the heat conductor 2. A temperature sensor is arranged in the heat conductor 2. The temperature sensor is used to detect the temperature of the heat conductor 2. The temperature sensor is connected to the semiconductor refrigerator 4. Specifically, the upper surface of the semiconductor refrigerator 4 is in contact with the heat conductor 2, and the lower surface of the semiconductor refrigerator 4 is in contact with the heat sink 1. According to the temperature of the heat conductor 2 detected by the temperature sensor, the semiconductor refrigerator 4 can increase or decrease the temperature of the circuit board 3 through the heat conductor 2. The temperature sensor detects and transmits the detected temperature to the control unit outside the circuit board temperature control device. The control unit controls the working state of the semiconductor refrigerator 4 based on the received detected temperature value and compares this value with the optimal working temperature of the circuit board.Furthermore, when the temperature detected by the temperature sensor is higher than the optimal operating temperature of the circuit board, the control unit controls the semiconductor refrigerator 4 to enter a cooling mode, the upper surface of the semiconductor refrigerator 4 is the cold end, and the lower surface of the semiconductor refrigerator 4 is the hot end, thereby cooling the circuit board 3 above the semiconductor refrigerator 4; when the temperature detected by the temperature sensor is lower than the optimal operating temperature of the circuit board, the control unit controls the semiconductor refrigerator 4 to enter a heating mode, the upper surface of the semiconductor refrigerator 4 is the hot end, and the lower surface of the semiconductor refrigerator 4 is the cold end, thereby heating the circuit board 3 above the semiconductor refrigerator 4.

[0041] like Figure 2 , Figure 5 and Figure 7 As shown, a semiconductor cooler installation groove 11 is provided on the upper surface of the heat sink 1, and at least one semiconductor cooler is installed in the semiconductor cooler installation groove 11. Specifically, two semiconductor coolers 4 are installed side by side in the semiconductor cooler installation groove 11, and the two semiconductor coolers 4 cool or heat together to increase or decrease the temperature of the circuit board 3 through the heat conducting member 2. Furthermore, the semiconductor cooler 4, namely TEC, is a common temperature control device in the prior art, and the temperature control accuracy can reach 0.01 degrees. The specific model of the semiconductor cooler 4 is not limited here.

[0042] like Figure 3 As shown, a temperature sensor mounting groove 22 is provided on one side of the heat conducting member 2 close to the heat dissipating member 1, and a temperature sensor is provided in the temperature sensor mounting groove 22. Specifically, the temperature sensor is a high-precision temperature sensor, which can accurately detect the real-time temperature of the heat conducting member 2, and the semiconductor refrigerator 4 raises and lowers the temperature of the circuit board 3 through the heat conducting member 2 according to the temperature detected by the high-precision temperature sensor.

[0043] like Fig. 9 As shown, there is a gap between the lower surface of the heat conductor 2 and the joint surface of the heat sink 1, and the gap is used for the circuit connected to the temperature sensor and the semiconductor refrigerator 4 to pass through. Specifically, the temperature sensor and the semiconductor refrigerator 4 are both provided with corresponding control circuits and power supply circuits. The power supply circuit corresponding to the temperature sensor ensures the normal operation of the temperature sensor, and the control circuit corresponding to the temperature sensor transmits the temperature information obtained by the temperature sensor to the control unit; the power supply circuit corresponding to the semiconductor refrigerator 4 ensures the normal operation of the semiconductor refrigerator 4, and the control unit compares the received temperature information with the optimal operating temperature of the circuit board and generates a control signal for the semiconductor refrigerator 4, and the control signal for the semiconductor refrigerator 4 is transmitted through the control circuit corresponding to the semiconductor refrigerator 4.

[0044] like Figure 2 , Figure 7 and Fig. 9As shown, the bottom of the heat sink 1 in this embodiment is provided with cooling fins 12. When the semiconductor refrigerator 4 is in cooling, the upper surface of the semiconductor refrigerator 4 is the cold end and the lower surface is the hot end. At this time, the heat sink 1 contacts the hot end of the semiconductor refrigerator 4 and performs heat exchange. The cooling fins 12 can help the heat sink 1 to dissipate heat and then dissipate the hot end of the semiconductor refrigerator 4, thereby improving the working efficiency of the semiconductor refrigerator 4 to help the circuit board temperature control device to dissipate heat as a whole.

[0045] In this embodiment, both the heat sink 1 and the heat conductor 2 are made of aluminum alloy. The heat sink 1 and the heat conductor 2 made of aluminum alloy have high thermal conductivity.

[0046] In this embodiment, the upper and lower surfaces of the semiconductor refrigerator 4 are both provided with heat-conducting layers, the heat-conducting layer on the upper surface of the semiconductor refrigerator 4 can improve the heat transfer efficiency between the heat-conducting element 2 and the semiconductor refrigerator 4, and the heat-conducting layer on the lower surface of the semiconductor refrigerator 4 can improve the heat transfer efficiency between the semiconductor refrigerator 4 and the heat sink 1. Specifically, the heat-conducting layer is a heat-conducting silicone grease-type heat-conducting material with high thermal conductivity applied to the upper and lower surfaces of the semiconductor refrigerator.

[0047] like Figure 1 and Figure 6 As shown, in this embodiment, the side of the circuit board 3 away from the first avoidance groove 21 is covered with a thermal insulation layer 5, which can reduce the heat transfer between the circuit board 3 and the external environment, and reduce the impact of the ambient temperature on the circuit board 3. Specifically, the thermal insulation layer 5 is a thermal insulation material with a sticky side. When setting the thermal insulation layer 5, it is only necessary to fit the sticky side to the side of the circuit board 3 where the electronic components 32 are not provided, and after the bonding is completed, the boundary line of the thermal insulation layer 5 coincides with the boundary line of the circuit board 3. Furthermore, the thermal insulation layer 5 can be a self-adhesive thermal insulation layer made of thermal insulation materials such as glass fiber and rock wool, with a sticky thermal insulation material on one side.

[0048] like Figure 3 , Figure 4 and Fig. 9 As shown, a second avoidance groove 24 is further provided on the heat conducting member 2, and the second avoidance groove 24 is connected to the first avoidance groove 21, and one end of the second avoidance groove 24 away from the first avoidance groove 21 is connected to the end surface of the heat conducting member 2, and an external interface 31 is also provided on the side where the electronic components 32 on the circuit board 3 are located, and the external interface 31 is placed in the second avoidance groove 24, so that the external interface 31 in the circuit board 3 is exposed, so that the circuit board 3 is convenient to be connected with external parts through the external interface 31.

[0049] In this embodiment, the circuit board 3 is a temperature control circuit board, which is used to control the temperature of external parts. Specifically, the temperature control circuit board is a PCB board (printed circuit board).

[0050] like Figure 2 and Figure 7-Figure 9 As shown, the circuit board temperature control device in this embodiment needs to be installed step by step. Specifically, in the first step, two semiconductor refrigerators 4 are placed side by side in the semiconductor refrigerator installation slot 11 of the heat sink 1, and the contact surface of the semiconductor refrigerator 4 and the heat sink 1 is coated with thermal conductive silicone grease. The power supply line and control line of the semiconductor refrigerator 4 extend from the semiconductor refrigerator installation slot 11 and are connected to the control unit; in the second step, a high-precision temperature sensor is pre-installed in the temperature sensor installation slot 22 of the heat conductive member 2, and the power supply line and control line required by the high-precision temperature sensor extend from the temperature sensor installation slot 22 and are connected to the control unit. The lower surface of the heat conductive member 2 is in contact with the semiconductor system. The upper surface of the cooler 4 is in contact, and the contact surfaces of the two are coated with thermal conductive silicone grease and other thermal conductive materials. At the same time, there is a gap between the lower surface of the thermal conductor 2 and the upper surface of the heat sink 1 that is sufficient for the power supply line and the control line to pass through; the third step is to fill the first avoidance groove 21 of the thermal conductor 2 with thermal conductive mud, and then invert the temperature control circuit board and press it on the thermal conductor 2. At this time, the thermal conductive mud fully wraps the electronic components 32 on the temperature control circuit board, and then the temperature control circuit board is fixed to the thermal conductor 2 at the four corners of the temperature control circuit board with screws, and the thermal conductor 2 is fixed to the heat sink 1 at the same time; the fourth step is to stick a thermal insulation layer 5 on the temperature control circuit board.

[0051] After installation, the optimal operating temperature of the temperature control circuit board is preset in the control unit. When the detected temperature of the temperature sensor is higher than the optimal operating temperature of the temperature control circuit board, the semiconductor refrigerator 43 enters the cooling mode, and the control unit controls the direction of the internal current of the semiconductor refrigerator 4 so that its upper surface is the cold end and the lower surface is the hot end, and then cools the temperature control circuit board by lowering the temperature of the heat conductor 2. At this time, the heat sink 1 in contact with the semiconductor refrigerator 4 cools the hot end of the semiconductor refrigerator 4 and thus improves the cooling effect of the semiconductor refrigerator 4, so as to improve the cooling efficiency of the temperature control circuit board; when the detected temperature of the temperature sensor is lower than the optimal operating temperature of the temperature control circuit board, the semiconductor refrigerator 4 enters the heating mode, and controls the direction of the internal current of the semiconductor refrigerator 4 so that its upper surface is the hot end and the lower surface is the cold end, and then heats the temperature control circuit board by increasing the temperature of the heat conductor 2. Precise temperature control of the temperature-controlled circuit board can also solve the problems that when the electronic components 32 of the temperature-controlled circuit board need to accurately control the temperature of a certain external part, the ambient temperature is too high or too low and the heating of the electronic components 32 themselves causes the electronic components 32 to send out error signals, and the ambient temperature is too high or too low and the heating of the electronic components 32 themselves causes the performance of the electronic components 32 to decrease, affecting product stability.

[0052] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A circuit board temperature control device, characterized in that: include: Heat sink (1); A heat conducting member (2), the heat conducting member (2) being arranged on the heat dissipating member (1), the heat conducting member (2) being provided with a first avoidance groove (21), the circuit board (3) being able to cover the heat conducting member (2), and the electronic components (32) on the circuit board (3) being placed in the first avoidance groove (21), a heat conducting mud layer being arranged in the first avoidance groove (21), and the electronic components (32) being able to be embedded in the heat conducting mud layer; A semiconductor refrigerator (4), wherein the semiconductor refrigerator (4) is arranged between the heat sink (1) and the heat conductor (2), wherein a temperature sensor is arranged in the heat conductor (2), wherein the temperature sensor is used to detect the temperature of the heat conductor (2), and the temperature sensor is communicatively connected to the semiconductor refrigerator (4).

2. The circuit board temperature control device according to claim 1, characterized in that: The heat sink (1) is provided with a semiconductor refrigerator installation groove (11), and at least one semiconductor refrigerator (4) is installed in the semiconductor refrigerator installation groove (11).

3. The circuit board temperature control device according to claim 1, characterized in that: A temperature sensor installation groove (22) is provided on one side of the heat conducting element (2) close to the heat dissipating element (1), and the temperature sensor is arranged in the temperature sensor installation groove (22).

4. The circuit board temperature control device according to claim 3, characterized in that: The temperature sensor installation groove (22) is arranged at the bottom of the first avoidance groove (21).

5. The circuit board temperature control device according to any one of claims 1 to 4, characterized in that: A gap is left between the joint surfaces of the heat conducting element (2) and the heat dissipating element (1), and the gap is used for allowing a line connected to the temperature sensor and the semiconductor refrigerator (4) to pass through.

6. The circuit board temperature control device according to any one of claims 1 to 4, characterized in that: The bottom of the heat sink (1) is provided with heat sink fins (12).

7. The circuit board temperature control device according to any one of claims 1 to 4, characterized in that: The heat sink (1) and the heat conductor (2) are both made of aluminum alloy.

8. The circuit board temperature control device according to any one of claims 1 to 4, characterized in that: The upper and lower surfaces of the semiconductor refrigerator (4) are both provided with heat-conducting layers.

9. The circuit board temperature control device according to any one of claims 1 to 4, characterized in that: A side of the circuit board (3) away from the first avoidance groove (21) is covered with a heat preservation layer (5).

10. The circuit board temperature control device according to any one of claims 1 to 4, characterized in that: The heat conducting member (2) is also provided with a second avoidance groove (24), the second avoidance groove (24) being connected to the first avoidance groove (21), and one end of the second avoidance groove (24) away from the first avoidance groove (21) is connected to the end surface of the heat conducting member (2), and an external interface (31) is also provided on the side of the circuit board (3) where the electronic component (32) is located, and the external interface (31) is placed in the second avoidance groove (24).

Images