Sensor chip electrostatic sealing glass grooving structure

Abstract

The utility model relates to the technical field of electrostatic sealing of sensor chips, in particular to a sensor chip electrostatic sealing glass grooving structure which comprises a bearing table, and a grooving mechanism is mounted on the table wall of the bearing table. The grooving mechanism is composed of an electric guide rail, a packaging mold, a laser engraving machine body, a laser emitting head, an L-shaped frame and a sliding block in a combined mode, the electric guide rail is installed on the table wall of the bearing table through bolts, the sliding block is installed at the moving end of the electric guide rail, and the packaging mold for containing a glass plate is installed at the top of the sliding block; an L-shaped frame is installed on the table wall of the bearing table through a bolt, the chip area covered in the sealing process is effectively reduced by arranging a digging groove in the electrostatic sealing glass, the problems of thermal resistance, mechanical stress concentration and the like caused by electrostatic sealing are reduced, the stability of the sealing structure is improved, meanwhile, the structure is simple, the production cost is low, and the production efficiency is improved. And the overload capacity of the sensor chip is indirectly improved through glass grooving.

Description

Technical Field

[0001] The utility model relates to the technical field of electrostatic sealing of sensor chips, in particular to a sensor chip electrostatic sealing glass groove structure. Background Art

[0002] The current chip packaging technology is to attach the sensor chip to the surface of the substrate to complete the packaging. However, the method of packaging on the substrate using patch technology will lead to the problem of excessive thickness of the packaged product size, insufficient sealing strength, and excessive sealing area, which will affect the chip performance. To this end, we propose a sensor chip electrostatic sealing glass groove structure. Utility Model Content

[0003] In view of the problems in the prior art, the utility model provides a sensor chip electrostatic sealing glass groove structure.

[0004] The utility model solves the technical problem by adopting a technical solution to a sensor chip electrostatically sealed glass grooving structure, comprising a bearing platform, a grooving mechanism installed at the wall of the bearing platform, the grooving mechanism is composed of an electric guide rail, a packaging mold, a laser engraving machine body, a laser transmitter head, an L-shaped frame and a slider combination, an electric guide rail is installed at the wall of the bearing platform by bolts, a slider is installed at the moving end of the electric guide rail, a packaging mold for placing a glass plate is installed on the top of the slider, an L-shaped frame is installed at the wall of the bearing platform by bolts, a laser engraving machine body is installed at the top of the L-shaped frame, a laser transmitter head is installed at the wall of the L-shaped frame, and an input end of the laser transmitter head is electrically connected to an output end of the laser engraving machine body.

[0005] By adopting the above technical scheme, when digging grooves on the glass substrate, since a grooving mechanism is installed on the wall of the supporting platform, the grooving mechanism is composed of an electric guide rail, a packaging mold, a laser engraving machine body, a laser transmitter head, an L-shaped frame and a slider. After the personnel places the glass substrate on the packaging mold, the electric guide rail is controlled by the controller so that the electric guide rail drives the slider, and the slider drives the packaging mold to move to the bottom of the laser transmitter head. Then, the laser transmitter head is controlled by the laser engraving machine body, and the laser transmitter head emits a laser to dig a groove on the glass substrate, digs a groove on the glass substrate with the same size as the silicon cup etched on the back of the chip, aligns the etching cup mouth on the back of the sensor chip with the glass groove, and sets a groove on the electrostatic sealing glass, effectively reducing the chip area covered during sealing, thereby reducing the thermal resistance and mechanical stress concentration caused by electrostatic sealing, and improving the stability of the sealing structure. At the same time, the overload capacity of the sensor chip is indirectly improved by grooving the glass.

[0006] Specifically, it also includes a sealing mechanism, and the sealing mechanism is installed on the frame wall of the L-shaped frame.

[0007] By adopting the above technical solution, the chip and the glass substrate can be packaged through a packaging mechanism.

[0008] Specifically, the sealing mechanism is composed of an electric hydraulic rod, a top plate, a fixed plate, an ultrasonic welding head, a threaded rod, a spring sleeve and a threaded sleeve. The electric hydraulic rod is installed on the frame wall of the L-shaped frame by bolts, and the top plate is installed on the output end of the electric hydraulic rod. Two groups of symmetrical threaded rods are welded at the top of the fixed plate. The two groups of threaded rods pass through the spring sleeve, and the two groups of threaded rods pass through the top plate. The rod walls of the two groups of threaded rods are threadedly connected with threaded sleeves, and the threaded sleeves are located on the top of the top plate.

[0009] By adopting the above technical solution, when the glass substrate and the chip are packaged, since a sealing mechanism is installed at the wall of the L-shaped frame, the sealing mechanism is composed of an electric hydraulic rod, a top plate, a fixed plate, an ultrasonic welding head, a threaded rod, a spring sleeve and a threaded sleeve. After the electric guide rail moves the packaging mold to the bottom of the ultrasonic welding head, the electric hydraulic rod is controlled by the controller so that the electric hydraulic rod drives the top plate to move downward. After the ultrasonic welding head is attached to the chip, the ultrasonic welding head emits ultrasonic waves to connect the chip to the glass substrate, thereby reducing the thermal resistance and mechanical stress concentration caused by electrostatic sealing, and improving the stability of the sealing structure.

[0010] Specifically, a controller for controlling the electric hydraulic rod and the electric guide rail is installed on the wall of the support platform.

[0011] By adopting the above technical solution, the electric hydraulic rod and the electric guide rail are controlled by a controller.

[0012] Specifically, a bracket is installed at the bottom of the supporting platform.

[0013] By adopting the above technical solution, the supporting platform can be supported by the bracket.

[0014] Beneficial effects of the utility model:

[0015] (1) The utility model discloses a sensor chip electrostatically sealed glass grooving structure. When grooving on a glass substrate, a grooving mechanism is installed on the wall of the support platform. The grooving mechanism is composed of an electric guide rail, a packaging mold, a laser engraving machine body, a laser transmitter head, an L-shaped frame and a slider. After placing the glass substrate on the packaging mold, the personnel controls the electric guide rail through a controller so that the electric guide rail drives the slider, and the slider drives the packaging mold to move to the bottom of the laser transmitter head. Then, the laser transmitter head is controlled by the laser engraving machine body, and the laser transmitter head emits a laser to grooving the glass substrate. A groove of the same size as the silicon cup etched on the back of the chip is grooved on the glass substrate. The mouth of the etched cup on the back of the sensor chip is aligned with the glass grooving. By setting the grooving on the electrostatic sealing glass, the chip area covered during sealing is effectively reduced, thereby reducing the problems of thermal resistance and mechanical stress concentration caused by electrostatic sealing, and improving the stability of the sealing structure. At the same time, the overload capacity of the sensor chip is indirectly improved by grooving the glass.

[0016] (2) The utility model discloses a sensor chip electrostatically sealed glass groove structure. When the glass substrate and the chip are packaged, a sealing mechanism is installed on the wall of the L-shaped frame. The sealing mechanism is composed of an electric hydraulic rod, a top plate, a fixed plate, an ultrasonic welding head, a threaded rod, a spring sleeve and a threaded sleeve. After the electric guide rail moves the packaging mold to the bottom of the ultrasonic welding head, the controller controls the electric hydraulic rod to drive the top plate downward. After the ultrasonic welding head is attached to the chip, the ultrasonic welding head emits ultrasonic waves to connect the chip to the glass substrate, thereby reducing the thermal resistance and mechanical stress concentration caused by electrostatic sealing, and improving the stability of the sealing structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0018] Figure 1 It is the main figure of the utility model;

[0019] Figure 2 This is a schematic diagram of the sealing mechanism structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the grooving mechanism of the utility model;

[0021] In the figure: 1. supporting platform; 2. grooving mechanism; 201. electric guide rail; 202. packaging mold; 203. laser engraving machine body; 204. laser transmitting head; 205. L-shaped frame; 206. slider; 3. controller; 4. bracket; 5. sealing mechanism; 501. electric hydraulic rod; 502. top plate; 503. fixing plate; 504. ultrasonic welding head; 505. threaded rod; 506. spring sleeve; 507. threaded sleeve. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] As an embodiment of the present utility model, Figure 1 , Figure 2 and Figure 3 As shown, a sensor chip electrostatically sealed glass grooving structure described in the utility model includes a carrier platform 1, a grooving mechanism 2 is installed at the platform wall of the carrier platform 1, and the grooving mechanism 2 is composed of an electric guide rail 201, a packaging mold 202, a laser engraving machine body 203, a laser transmitter head 204, an L-shaped frame 205 and a slider 206. The electric guide rail 201 is installed at the platform wall of the carrier platform 1 by bolts, and a slider 206 is installed at the moving end of the electric guide rail 201. The top of the slider 206 is installed with a packaging mold 202 for placing a glass plate, and an L-shaped frame 205 is installed at the platform wall of the carrier platform 1 by bolts, and the laser engraving machine body 203 is installed at the top of the L-shaped frame 205. The laser transmitter head 204 is installed at the wall of the L-shaped frame 205, and the input end of the laser transmitter head 204 is electrically connected to the output end of the laser engraving machine body 203.

[0024] When in use, since a groove digging mechanism 2 is installed on the wall of the carrier 1, and the groove digging mechanism 2 is composed of an electric guide rail 201, a packaging mold 202, a laser engraving machine body 203, a laser transmitter head 204, an L-shaped frame 205 and a slider 206, after a person places a glass substrate on the packaging mold, the controller 3 controls the electric guide rail 201, so that the electric guide rail 201 drives the slider 206, and the slider 206 drives the packaging mold 202 to move to the bottom of the laser transmitter head 204, and then the laser engraving machine body 203 controls the glass substrate. The laser transmitting head 204 is controlled to emit laser to dig grooves on the glass substrate, and a groove with the same size as the silicon cup etched on the back of the chip is dug on the glass substrate, and the mouth of the etching cup on the back of the sensor chip is aligned with the glass groove. By setting the groove on the electrostatic sealing glass, the chip area covered during sealing is effectively reduced, thereby reducing the thermal resistance and mechanical stress concentration caused by electrostatic sealing, and improving the stability of the sealing structure. At the same time, the overload capacity of the sensor chip is also indirectly improved by digging grooves in the glass.

[0025] like Figure 1 As shown, it also includes a sealing mechanism 5, and the sealing mechanism 5 is installed on the frame wall of the L-shaped frame 205.

[0026] When in use, the chip and the glass substrate can be packaged through a packaging mechanism.

[0027] like Figure 1 and Figure 2 As shown, the sealing mechanism 5 is composed of an electric hydraulic rod 501, a top plate 502, a fixed plate 503, an ultrasonic welding head 504, a threaded rod 505, a spring sleeve 506 and a threaded sleeve 507. The electric hydraulic rod 501 is installed on the frame wall of the L-shaped frame 205 by bolts, and the top plate 502 is installed on the output end of the electric hydraulic rod 501. Two groups of symmetrical threaded rods 505 are welded at the top of the fixed plate 503. The two groups of threaded rods 505 pass through the spring sleeve 506, and the two groups of threaded rods 505 pass through the top plate 502. The rod walls of the two groups of threaded rods 505 are threadedly connected with threaded sleeves 507, and the threaded sleeves 507 are located at the top of the top plate 502.

[0028] When in use, since a sealing mechanism 5 is installed on the wall of the L-shaped frame 205, the sealing mechanism 5 is composed of an electric hydraulic rod 501, a top plate 502, a fixed plate 503, an ultrasonic welding head 504, a threaded rod 505, a spring sleeve 506 and a threaded sleeve 507. After the electric guide rail 201 moves the packaging mold to the bottom of the ultrasonic welding head 504, the electric hydraulic rod 501 is controlled by the controller 3, so that the electric hydraulic rod 501 drives the top plate 502 to move downward, so that after the ultrasonic welding head 504 is attached to the chip, the ultrasonic welding head 504 emits ultrasonic waves to connect the chip to the glass substrate, thereby reducing the thermal resistance and mechanical stress concentration caused by electrostatic sealing, and improving the stability of the sealing structure.

[0029] like Figure 1 As shown, a controller 3 for controlling the electric hydraulic rod 501 and the electric guide rail 201 is installed on the wall of the support platform 1 .

[0030] When in use, the electric hydraulic rod 501 and the electric guide rail 201 are controlled by the controller 3 .

[0031] like Figure 1 As shown, a bracket 4 is installed at the bottom of the supporting platform 1.

[0032] When in use, the support platform 1 can be supported by the bracket 4 .

[0033] When the utility model is in use, when digging grooves on the glass substrate, since a groove digging mechanism 2 is installed on the wall of the carrier 1, and the groove digging mechanism 2 is composed of an electric guide rail 201, a packaging mold 202, a laser engraving machine body 203, a laser transmitting head 204, an L-shaped frame 205 and a slider 206, after the personnel places the glass substrate on the packaging mold, the electric guide rail 201 is controlled by the controller 3, so that the electric guide rail 201 drives the slider 206, and the slider 206 drives the packaging mold 202 to move to the bottom of the laser transmitting head 204, and then the laser transmitting head 204 is controlled by the laser engraving machine body 203, and the laser transmitting head 204 emits a laser to dig a groove on the glass substrate, dig a groove on the glass substrate that is the same size as the silicon cup etched on the back of the chip, align the etching cup mouth on the back of the sensor chip with the glass groove, and by arranging the groove on the electrostatic sealing glass, the chip area covered during sealing is effectively reduced, thereby reducing The thermal resistance and mechanical stress concentration caused by electrostatic sealing are solved, and the stability of the sealing structure is improved. At the same time, the overload capacity of the sensor chip is indirectly improved by digging grooves in the glass. When the glass substrate and the chip are packaged, a sealing mechanism 5 is installed on the wall of the L-shaped frame 205. The sealing mechanism 5 is composed of an electric hydraulic rod 501, a top plate 502, a fixed plate 503, an ultrasonic welding head 504, a threaded rod 505, a spring sleeve 506 and a threaded sleeve 507. After the electric guide rail 201 moves the packaging mold to the bottom of the ultrasonic welding head 504, the controller 3 controls the electric hydraulic rod 501 so that the electric hydraulic rod 501 drives the top plate 502 to move downward, so that after the ultrasonic welding head 504 is attached to the chip, the ultrasonic welding head 504 emits ultrasonic waves to connect the chip to the glass substrate, thereby reducing the thermal resistance and mechanical stress concentration caused by electrostatic sealing and improving the stability of the sealing structure.

[0034] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the protection required by the utility model. The scope of protection required by the utility model is defined by the attached claims and their equivalents.

Claims

1. A sensor chip electrostatic sealing glass groove structure, characterized in that: The invention comprises a bearing platform (1), a groove digging mechanism (2) being installed on the wall of the bearing platform (1), the groove digging mechanism (2) being composed of an electric guide rail (201), a packaging mold (202), a laser engraving machine body (203), a laser transmitting head (204), an L-shaped frame (205) and a slider (206), the electric guide rail (201) being installed on the wall of the bearing platform (1) by bolts, and a slider (206) being installed on the movable end of the electric guide rail (201). 06), a packaging mold (202) for placing a glass plate is installed on the top of the slider (206), an L-shaped frame (205) is installed on the wall of the support platform (1) through bolts, a laser engraving machine body (203) is installed on the top of the L-shaped frame (205), a laser transmitter (204) is installed on the wall of the L-shaped frame (205), and the input end of the laser transmitter (204) is electrically connected to the output end of the laser engraving machine body (203).

2. The sensor chip electrostatic sealing glass groove structure according to claim 1, characterized in that: It also comprises a sealing mechanism (5), and the sealing mechanism (5) is installed on the frame wall of the L-shaped frame (205).

3. The sensor chip electrostatic sealing glass groove structure according to claim 2, characterized in that: The sealing mechanism (5) is composed of an electric hydraulic rod (501), a top plate (502), a fixed plate (503), an ultrasonic welding head (504), a threaded rod (505), a spring sleeve (506) and a threaded sleeve (507). The electric hydraulic rod (501) is installed at the frame wall of the L-shaped frame (205) by bolts, the top plate (502) is installed at the output end of the electric hydraulic rod (501), two groups of symmetrical threaded rods (505) are welded at the top of the fixed plate (503), the two groups of threaded rods (505) penetrate the spring sleeve (506), the two groups of threaded rods (505) penetrate the top plate (502), the rod walls of the two groups of threaded rods (505) are threadedly connected with threaded sleeves (507), and the threaded sleeves (507) are located at the top of the top plate (502).

4. The sensor chip electrostatic sealing glass groove structure according to claim 1, characterized in that: A controller (3) for controlling the electric hydraulic rod (501) and the electric guide rail (201) is installed on the wall of the support platform (1).

5. The sensor chip electrostatic sealing glass groove structure according to claim 1, characterized in that: A bracket (4) is installed at the bottom of the supporting platform (1).

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