Electroplated diamond fretsaw with controllable spiral distribution of diamond particles

Abstract

The utility model discloses an electroplated diamond fretsaw with controllable spiral distribution of diamond particles, and relates to the field of diamond fretsaws, the electroplated diamond fretsaw comprises a diamond fretsaw body, the outer wall of the diamond fretsaw body is fixedly connected with a cutting assembly and a chip discharging assembly, the outer wall of the diamond fretsaw body is an annular line generatrix, and the annular line generatrix is fixedly connected with the cutting assembly. The annular wire bus comprises one of a diamond wire and a tungsten wire, the insulating layer is wound on the outer wall of the annular wire bus, the cutting assembly is diamond particles, and the diamond particles are spirally wound on the outer wall of the insulating layer. According to the electroplated diamond fretsaw with the controllable and spirally distributed diamond particles, cuttings at the position of the cutting discharging assembly can be rapidly discharged through the spirally distributed diamond particles, meanwhile, more cutting fluid can be allowed to enter the position of the cutting discharging assembly, and therefore the possibility of cutting friction and the possibility of the phenomenon that the cuttings are clamped can be obviously reduced; in addition, power consumption, torque load and cutting impact during machining can be reduced.

Description

Technical Field

[0001] The utility model relates to the field of diamond wire saws, in particular to an electroplated diamond wire saw with controllable spiral distribution of diamond particles. Background Art

[0002] There are two types of electroplated wire saws on the market. The first type has diamond particles on the surface of conventional diamond wire randomly distributed on the surface of the diamond wire or tungsten wire, but within the range of naked eye observation, the diamond particles basically continuously cover the surface of the diamond wire or tungsten wire. The debris generated during cutting can only be accommodated in the gap area between the diamond particles, and no large chip removal space is specially set. Therefore, its ability to carry coolant and hold chips is relatively limited; the second type is an electroplated diamond wire saw with controllable distribution of diamond particles. The electroplated diamond wire saw includes a mother wire and two sawtooth particle areas. An abrasive-free area is formed between the two adjacent sawtooth particle areas. Although there is a chip removal space between the two sawtooth particle areas during cutting, the sawtooth particle area itself has no discharge space, which is easy to get stuck and break the wire.

[0003] Therefore, it is necessary to propose an electroplated diamond wire saw with controllable spiral distribution of diamond particles to solve the above problems. Utility Model Content

[0004] The main purpose of the utility model is to provide an electroplated diamond wire saw with controllable spiral distribution of diamond particles, which can effectively solve the problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] An electroplated diamond wire saw with controllable spiral distribution of diamond particles comprises a diamond wire saw body, the outer wall of which is fixedly connected with a cutting assembly and a cutting removal assembly.

[0007] Preferably, it further includes an insulating layer, the outer wall of the diamond wire saw body is an annular wire busbar, the annular wire busbar includes one of a diamond wire and a tungsten wire, and the insulating layer is wound around the outer wall of the annular wire busbar.

[0008] Preferably, the cutting assembly is a ring-shaped wire busbar wrapped by an insulating layer, the cutting assembly is a cutting edge, the cutting edge is diamond particles, the diamond particles are spirally wound on the outer wall of the diamond wire saw body, and the insulating layer is used to prevent conductivity and avoid electroplating of diamond particles to the insulating layer.

[0009] A method for preparing an electroplated diamond wire saw with controllable spiral distribution of diamond particles comprises the following steps:

[0010] S1: Prepare the materials for preparation: including a diamond wire saw body, a cutting assembly and a cutting assembly, wherein the cutting assembly is diamond particles, the cutting assembly is an insulating layer and a ring wire busbar, wherein the ring wire busbar is a diamond wire, the ring wire busbar is in a first-connected state, and the insulating layer is an insulating glue;

[0011] S2: Prepare equipment for preparation: including: electrolytic cell, alkaline cleaning equipment, ultrasonic cleaning machine, drying equipment, insulating glue and glue spraying equipment;

[0012] S3: Pretreatment: Place the diamond wire saw body into an electrolytic cell for electrolysis, and then place it into an alkali cleaning device for alkali cleaning. After the alkali cleaning is completed, place the diamond wire saw body into an ultrasonic cleaning machine for ultrasonic cleaning using hot water, and then dry it through a drying device to remove excess water.

[0013] S4: Glue spraying: Place the diamond wire saw body on the platform, straighten the end that needs to be glued, and use glue spraying equipment to spray glue on the straightened diamond wire saw body to form an insulating layer, wherein the insulating layer is used to insulate the area of ​​the diamond wire saw body that does not need to be electroplated with diamond particles, wherein the insulating layer is sprayed on the outer wall of the diamond wire saw body in a spirally wound state, and after the insulating layer is set, the entire diamond wire saw body is dried;

[0014] S5: Diamond electroplating work: After drying, diamond particles are electroplated on the outer wall of the ring wire busbar by spiral winding to form spiral diamond particles. After the diamond particles are electroplated, the diamond wire saw body is placed in an ultrasonic cleaning machine and cleaned with hot water to clean the electroplating liquid carried by it. After cleaning, the diamond wire saw body is taken out and placed in a drying device for drying. After drying, it is taken out to complete the preparation of the electroplated diamond wire saw with controllable spiral distribution of diamond particles. Beneficial Effects

[0015] Compared with the prior art, the utility model provides an electroplated diamond wire saw with controllable spiral distribution of diamond particles, which has the following beneficial effects:

[0016] The electroplated diamond wire saw with controllable spiral distribution of diamond particles can quickly discharge chips from the chip discharge component through the spirally distributed diamond particles, and at the same time allow more cutting fluid to enter the chip discharge component, thereby significantly reducing cutting friction and the possibility of chip clamping. In addition, it can also reduce power consumption, torque load and cutting impact during processing. The diamond wire saw is woven and formed by diamond particles. At the same time, the diamond particles are added to the outer wall of the diamond wire saw body in a spiral winding manner, and the ends are connected. When the glue spraying work is performed later, one end of the wire can be straightened to facilitate the glue spraying work. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of the diamond wire saw body of the utility model;

[0018] Figure 2 It is a cross-sectional view of the diamond wire saw body of the utility model;

[0019] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle.

[0020] In the figure: 1. Diamond wire saw body; 2. Cutting assembly; 3. Cutting assembly; 4. Ring wire busbar; 5. Diamond particles; 6. Insulation layer. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] like Figure 1-Figure 3 As shown, an electroplated diamond wire saw with controllable spiral distribution of diamond particles comprises a diamond wire saw body 1, an outer wall of the diamond wire saw body 1 is fixedly connected with a cutting assembly 2 and a cutting removal assembly 3, the outer wall of the diamond wire saw body 1 is a ring-shaped wire busbar 4, the ring-shaped wire busbar 4 comprises one of a diamond wire and a tungsten wire, an insulating layer 6 is wound around the outer wall of the ring-shaped wire busbar 4, the cutting removal assembly 3 is a ring-shaped wire busbar 4 wrapped by the insulating layer 6, the cutting assembly 2 is a cutting edge, the cutting edge is diamond particles 5, the diamond particles 5 are spirally wound around the outer wall of the diamond wire saw body 1, and the insulating layer 6 is used to prevent conduction to prevent the diamond particles 5 from being electroplated to the insulating layer 6.

[0023] The spirally distributed diamond particles 5 can quickly discharge the chips at the chip discharge component 3, and at the same time allow more cutting fluid to enter the chip discharge component 3, thereby significantly reducing cutting friction and the possibility of chip clamping. In addition, it can also reduce power consumption, torque load and cutting impact during processing. The diamond wire saw is woven with diamond particles, and the diamond particles are added to the outer wall of the diamond wire saw body 1 in a spiral winding manner, and the ends are connected. When the glue spraying work is performed later, one end can be straightened to facilitate the glue spraying work.

[0024] The preparation method of the electroplated diamond wire saw with controllable spiral distribution of diamond particles comprises the following steps:

[0025] S1: Prepare the materials for preparation: including a diamond wire saw body 1, a cutting assembly 2 and a cutting assembly 3, wherein the cutting assembly 2 is diamond particles 5, the cutting assembly 3 is an insulating layer 6 and a ring wire busbar 4, wherein the ring wire busbar 4 is made of diamond wire, the ring wire busbar 4 is in a first-connected state, and the insulating layer 6 is an insulating glue;

[0026] S2: Prepare equipment for preparation: including: electrolytic cell, alkaline cleaning equipment, ultrasonic cleaning machine, drying equipment, insulating glue and glue spraying equipment;

[0027] S3: Pretreatment: placing the diamond wire saw body 1 into an electrolytic cell for electrolysis, placing it into an alkali washing device for alkali washing after the electrolysis is completed, placing the diamond wire saw body 1 into an ultrasonic cleaning machine for ultrasonic cleaning using hot water, and drying it through a drying device after the treatment is completed to remove excess water;

[0028] S4: Glue spraying: placing the diamond wire saw body 1 on the platform, straightening the end to be glued, and performing glue spraying on the straightened diamond wire saw body 1 through glue spraying equipment to form an insulating layer 6, wherein the insulating layer 6 is used to insulate the area of ​​the diamond wire saw body 1 where the diamond particles 5 do not need to be electroplated, wherein the insulating layer 6 is sprayed on the outer wall of the diamond wire saw body 1 in a spirally wound state, and after the insulating layer 6 is set, the entire diamond wire saw body 1 is dried;

[0029] S5: Diamond electroplating work: After drying, the diamond particles 5 are electroplated on the outer wall of the annular wire busbar 4 in a spiral winding manner to form spiral diamond particles 5. After the electroplating of the diamond particles 5 is completed, the diamond wire saw body 1 is placed in an ultrasonic cleaning machine and cleaned with hot water to clean the electroplating liquid carried by it. After cleaning, the diamond wire saw body 1 is taken out and placed in a drying device for drying. After drying, it is taken out to complete the preparation of the electroplated diamond wire saw with controllable spiral distribution of diamond particles.

[0030] When using the electroplated diamond wire saw with controllable spiral distribution of diamond particles, the diamond wire saw body 1 is placed on the material to be cut, and the saw can be cut by moving it back and forth using a driving assembly. The cutting fluid during cutting will enter the chip discharge assembly 3, thereby reducing cutting friction and the possibility of chip clamping.

[0031] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. An electroplated diamond wire saw with controllable spiral distribution of diamond particles, comprising a diamond wire saw body (1), characterized in that: The outer wall of the diamond wire saw body (1) is fixedly connected with a cutting assembly (2) and a cutting removal assembly (3); It also includes an insulating layer (6), the outer wall of the diamond wire saw body (1) is a ring-shaped wire busbar (4), the ring-shaped wire busbar (4) includes one of a diamond wire and a tungsten wire, and the insulating layer (6) is wound around the outer wall of the ring-shaped wire busbar (4); The cutting assembly (3) is a ring-shaped wire busbar (4) wrapped by an insulating layer (6); the cutting assembly (2) is a cutting edge; the cutting edge is a diamond particle (5); the diamond particle (5) is spirally wound on the outer wall of the diamond wire saw body (1); and the insulating layer (6) is used to prevent electrical conduction and to prevent the diamond particles (5) from being electroplated onto the insulating layer (6).

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