Cleaning system for electroplating equipment
By designing the electroplating equipment cleaning system and using circulation pipelines and filter tanks to automatically process the electroplating liquid, the risks and low efficiency of manual operations in traditional electroplating operations have been solved, and a more efficient and safer cleaning process has been achieved.
Patent Information
- Application Number
- CN202420214196.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-29
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-01-29
AI Technical Summary
In traditional electroplating operations, there is a risk of corrosion and accidental contact in manual extraction of electroplating liquid, and the cleaning efficiency is low, resulting in an increase in wastewater treatment costs.
Design a cleaning system for electroplating equipment. The first circulation pipeline cooperates with the filter tank and the second circulation pipeline cooperates with the flushing device to realize automatic extraction, filtration and flushing of the electroplating liquid and reduce manual intervention.
It improves the cleaning efficiency of electroplating equipment, reduces cleaning costs, reduces the risk and time of manual operations, and improves the safety and efficiency of electroplating operations.
Smart Images
Figure CN222374826U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating, in particular to an electroplating equipment cleaning system. Background Art
[0002] Electroplating technology can be applied in the production process of semiconductor chips, specifically by attaching a metal layer to the surface of the product's heat sink and pins to increase the solderability of the product and the circuit board. Traditional electroplating operations require manual extraction of the electroplating solution to absorb the deposited anode mud, and then pour the electroplating solution back after cleaning the anode basket and the electroplating sub-tank. On the one hand, manual extraction of electroplating solution is prone to corrosion and has a certain risk of accidental touch. On the other hand, the manual extraction of electroplating solution for cleaning is too inefficient, resulting in increased wastewater treatment costs. In addition, when the anode basket is manually removed for cleaning, the anode ball needs to be poured into the sink for cleaning, further wasting time and manpower. Utility Model Content
[0003] In view of this, the purpose of the utility model is to provide an electroplating equipment cleaning system, which realizes cleaning operation through a first circulation pipeline in combination with a filter tank and through a second circulation pipeline in combination with a flushing device, so as to improve cleaning efficiency and reduce cleaning costs.
[0004] The utility model provides an electroplating equipment cleaning system, the electroplating equipment cleaning system comprising: a chemical water tank, the chemical water tank is provided with a drainage channel, the chemical water tank is configured to hold electroplating solution; a filter tank, the filter tank is provided with a filter assembly to separate a first tank body and a second tank body; a plating tank, the plating tank is provided with an anode basket, the anode basket is provided with an anode ball; a flushing device, the flushing device is configured to flush the anode basket and the anode ball; a first circulation pipeline, the first circulation pipeline is connected to the chemical water tank and the filter tank, and is configured to extract the plating solution from the chemical water tank to the first tank body, and extract the filtered plating solution from the second tank body to the chemical water tank; and a second circulation pipeline, the second circulation pipeline is connected to the chemical water tank and the electroplating tank, and is configured to extract the plating solution from the chemical water tank to the electroplating tank, and extract the waste liquid flushed by the flushing device from the electroplating tank to the chemical water tank so that the waste liquid is discharged through the drainage channel.
[0005] In some embodiments, the first circulation pipeline includes: a first channel, the first channel connects the chemical water tank and the first tank body, and is configured to extract the plating solution from the chemical water tank to the first tank body; and a second channel, the second channel connects the second tank body and the chemical water tank, and is configured to extract the filtered plating solution from the second tank body to the chemical water tank.
[0006] In some embodiments, the first end of the first channel extends into the bottom of the medicine tank, and the second end of the first channel extends to the opening of the first tank body.
[0007] In some embodiments, the first end of the second channel extends into the bottom of the second trough body, and the second end of the second channel extends to the opening of the medicine tank.
[0008] In some embodiments, the first circulation pipeline further includes: a first liquid pump disposed at the first channel; and a second liquid pump disposed at the second channel.
[0009] In some embodiments, the second circulation pipeline includes: a third channel, which connects the chemical water tank and the electroplating tank and is configured to draw the electroplating solution from the chemical water tank to the electroplating tank; and a fourth channel, which connects the electroplating tank and the chemical water tank and is configured to draw the electroplating solution or the waste liquid from the electroplating tank to the chemical water tank.
[0010] In some embodiments, the filter assembly includes at least two layers of filter screens.
[0011] In some embodiments, the filter assembly includes a first filter screen and a second filter screen, wherein the second filter screen is located on a side close to the second trough body, and a pore size of the second filter screen is smaller than that of the first filter screen.
[0012] In some embodiments, the electroplating equipment cleaning system further includes: a liquid level sensor, wherein the liquid level sensor is disposed in the filter tank and is located at a predetermined height.
[0013] In some embodiments, the flushing device comprises a high-pressure nozzle, and the high-pressure nozzle is located on a side of the anode basket.
[0014] The embodiment of the utility model provides a cleaning system for electroplating equipment, which includes a medicine water tank, a filter tank, an electroplating tank, a flushing device, a first circulation pipeline and a second circulation pipeline. The medicine water tank is used to hold the electroplating solution and is provided with a drainage channel. The filter tank is separated by a filter assembly to form a first tank body and a second tank body. An anode basket is provided in the electroplating tank, and an anode ball is provided in the anode basket. The flushing device is used to flush the anode basket and the anode ball. The first circulation pipeline is used to extract the electroplating solution from the medicine water tank to the first tank body, and to extract the filtered electroplating solution from the second tank body to the medicine water tank. The second circulation pipeline is used to extract the electroplating solution from the medicine water tank to the electroplating tank, and to extract the waste liquid flushed by the flushing device from the electroplating tank to the medicine water tank so that the waste liquid is discharged from the drainage channel. As a result, the electroplating equipment cleaning system achieves improved cleaning efficiency and reduced cleaning costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The above and other purposes, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
[0016] Figure 1 It is a schematic diagram of the structure of the electroplating equipment cleaning system provided by an embodiment of the utility model;
[0017] Figure 2 It is a schematic diagram of the working state of the filter tank provided by the embodiment of the utility model;
[0018] Figure 3 It is a schematic diagram of the working state of the electroplating tank provided by the embodiment of the utility model;
[0019] Figure 4 It is a schematic diagram of the working state of the flushing device provided in the embodiment of the utility model.
[0020] Description of reference numerals:
[0021] 1-chemical solution tank; 11-drainage channel; 12-second valve; 2-filter tank; 21-filter assembly; 211-first filter screen; 212-second filter screen; 22-first tank body; 23-second tank body; 3-electroplating tank; 31-anode basket; 32-anode ball; 4-flushing device; 41-high-pressure nozzle; 5-first circulation pipeline; 51-first channel; 52-second channel; 53-first liquid pump; 54-second liquid pump; 6-second circulation pipeline; 61-third channel; 62-fourth channel; 63-third liquid pump; 64-first valve; 7-liquid level sensor; a-electroplating solution; b-waste liquid. DETAILED DESCRIPTION
[0022] The present application is described below based on embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, some specific details are described in detail. It is possible for those skilled in the art to fully understand the present application without the description of these details. In order to avoid confusing the essence of the present application, known methods, processes, flows, components and circuits are not described in detail.
[0023] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.
[0024] Unless otherwise clearly defined and specified, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0025] For ease of explanation, spatially relative terms such as "inside", "outside", "below", "below", "lower", "above", "upper", etc. are used herein to describe the relationship of one element or feature illustrated in the figures to another element or feature. It will be understood that spatially relative terms may be intended to include different orientations of the device in use or operation other than the orientation depicted in the figures. For example, if the device in the figure is turned over, an element described as being "below" or "below" other elements or features will then be positioned as being "above" the other elements or features. Thus, the example term "below" can include both the orientations of above and below. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.
[0026] Unless the context clearly requires otherwise, the words "include", "comprising" and similar words throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is "including but not limited to".
[0027] In the description of this application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.
[0028] Figure 1 Schematic diagram of the electroplating equipment cleaning system provided by the embodiment of the utility model. Figure 1 As shown, the electroplating equipment cleaning system includes a liquid medicine tank 1, a filter tank 2, an electroplating tank 3, a flushing device 4, a first circulation pipeline 5 and a second circulation pipeline 6. Specifically, the liquid medicine tank 1 for containing the electroplating solution a is provided with a drainage channel 11, the filter tank 2 is provided with a filter assembly 21 so that the filter tank 2 is separated into a first tank body 22 and a second tank body 23, the electroplating tank 3 is provided with an anode basket 31 to place an anode ball 32 in the anode basket 31, and the flushing device 4 is configured to flush the anode basket 31 and the anode ball 32. Further, the first circulation pipeline 5 connects the liquid medicine tank 1 and the filter tank 2, and the second circulation pipeline 6 connects the liquid medicine tank 1 and the electroplating tank 3.
[0029] Figure 2 Schematic diagram of the working state of the filter tank provided by the embodiment of the utility model, such as Figure 2 As shown, the first circulation pipeline 5 is configured to extract the electroplating solution a from the chemical tank 1 to the first tank body 22, and extract the filtered electroplating solution a from the second tank body 23 to the chemical tank 1. That is, after the first circulation pipeline 5 extracts the electroplating solution a from the chemical tank 1 to the first tank body 22, the filtering effect of the filter assembly 21 can block the anode mud and other impurities in the electroplating solution a in the first tank body 22, so that the filtered electroplating solution a penetrates into the second tank body 23, and then the first circulation pipeline 5 extracts the filtered electroplating solution a from the second tank body 23 to the chemical tank 1, so that the filtered electroplating solution a can be used for electroplating operations later.
[0030] Figure 3 Schematic diagram of the working state of the electroplating tank provided by the embodiment of the utility model, such as Figure 3 As shown, the second circulation pipeline 6 is configured to extract the electroplating solution a from the chemical tank 1 to the electroplating tank 3, so as to place the product in the electroplating tank 3 for electroplating. It is easy to understand that after the electroplating operation is completed, the electroplating solution a mixed with anode mud can be extracted from the electroplating tank 3 to the chemical tank 1 through the second circulation pipeline 6, so as to be filtered through the filter tank 2 later. Figure 4 Schematic diagram of the working state of the flushing device provided by the embodiment of the utility model, such as Figure 4 As shown, after the flushing device 4 flushes the anode basket 31 and the anode ball 32 , the second circulation pipeline 6 is configured to extract the waste liquid b generated by the flushing device 4 from the electroplating tank 3 into the chemical tank 1 so that the waste liquid b is discharged through the drainage channel 11 .
[0031] As an optional embodiment, the operator puts the electroplating solution a in the chemical tank 1 to manage the chemical solution, and then extracts the electroplating solution a from the chemical tank 1 to the electroplating tank 3 through the second circulation pipeline 6 so that the product is placed in the electroplating tank 3 for electroplating operation. The electroplating solution a with anode mud formed after the electroplating operation is then extracted from the electroplating tank 3 to the chemical tank 1 through the second circulation pipeline 6. Further, the electroplating solution a mixed with anode mud is extracted from the chemical tank 1 to the first tank body 22 of the filter tank 2 through the first circulation pipeline 5, and then the anode mud and other impurities in the electroplating solution a are filtered out through the filter assembly 21. While the electroplating solution a is filtered by the filter tank 2, the flushing device 4 is started to flush the anode basket 31 and the anode ball 32 to remove the residual anode mud, and the waste liquid b mixed with anode mud generated after flushing is extracted from the electroplating tank 3 to the chemical tank 1 through the second circulation pipeline 6 so that the waste liquid b is discharged from the drainage channel 11. After the anode basket 31 and the anode ball 32 are cleaned, the filtered electroplating solution a can be drawn from the second tank body 23 to the liquid medicine tank 1 through the first circulation pipeline 5, so that the filtered electroplating solution a can be further drawn from the liquid medicine tank 1 to the electroplating tank 3 through the second circulation pipeline 6, so as to continue the electroplating operation in the electroplating tank 3, and repeat the above filtering and cleaning operations. Thus, the electroplating equipment cleaning system can complete the cleaning of the anode mud during the continuous electroplating process, which helps to improve the cleaning efficiency and reduce the cleaning cost.
[0032] As another optional implementation, the operator puts the electroplating solution a in the chemical tank 1 to manage the chemical solution, and then extracts the electroplating solution a from the chemical tank 1 to the electroplating tank 3 through the second circulation pipeline 6 so that the product is placed in the electroplating tank 3 for electroplating. The electroplating solution a with anode mud formed after the electroplating operation is then extracted from the electroplating tank 3 to the chemical tank 1 through the second circulation pipeline 6. Further, the electroplating solution a mixed with anode mud is extracted from the chemical tank 1 to the first tank body 22 of the filter tank 2 through the first circulation pipeline 5, and then the anode mud and other impurities in the electroplating solution a are filtered out through the filter assembly 21. After the filtration is completed, the filtered electroplating solution a can be extracted from the second tank body 23 to the chemical tank 1 through the first circulation pipeline 5, so that the electroplating solution a can be discharged through the drainage channel 11 so that the electroplating solution a can be collected and processed. After that, the flushing device 4 is started to flush the anode basket 31 and the anode ball 32 to remove the residual anode mud, and the waste liquid b mixed with the anode mud produced after flushing is extracted from the electroplating tank 3 to the chemical tank 1 through the second circulation pipeline 6, so that the waste liquid b is discharged from the drainage channel 11. Therefore, after all the electroplating operations are completed, the electroplating equipment cleaning system can realize the collection of the electroplating solution a and the cleaning of the anode mud, which helps to improve the cleaning efficiency and reduce the cleaning cost.
[0033] It should be noted that the electroplating solution a may not be filtered, but the electroplating solution a mixed with anode mud may be directly discharged from the drainage channel 11, and then the subsequent anode mud cleaning work may be performed to further improve the cleaning efficiency.
[0034] Combination Figures 1 to 4 As shown, in one embodiment, the first circulation pipeline 5 includes a first channel 51 and a second channel 52. Specifically, the first channel 51 connects the medicine tank 1 and the first tank body 22, and the second channel 52 connects the second tank body 23 and the medicine tank 1. It is easy to understand that the first channel 51 is configured to extract the electroplating solution a to be filtered from the medicine tank 1 to the first tank body 22, and the second channel 52 is configured to extract the filtered electroplating solution a from the second tank body 23 to the medicine tank 1. Therefore, the first circulation pipeline 5 can cooperate with the filter tank 2 to achieve the filtering effect on the electroplating solution a by setting a two-way channel.
[0035] Combination Figures 1 to 4 As shown, in one embodiment, the first end of the first channel 51 extends into the bottom of the liquid tank 1, and the second end of the first channel 51 extends to the opening of the first tank body 22. Therefore, when the electroplating solution a to be filtered is extracted from the liquid tank 1 to the first tank body 22 through the first channel 51, the electroplating solution a in the liquid tank 1 can be extracted into the first tank body 22 as much as possible, thereby helping to improve the filtering effect of the electroplating solution a, so as to improve the quality of the electroplating operation.
[0036] Combination Figures 1 to 4 As shown, in one embodiment, the first end of the second channel 52 extends into the bottom of the second tank body 23, and the second end of the second channel 52 extends to the opening of the liquid medicine tank 1. Therefore, when the filtered electroplating solution a is extracted from the second tank body 23 to the liquid medicine tank 1 through the second channel 52, the electroplating solution a in the filter tank 2 can be extracted into the liquid medicine tank 1 as much as possible, which helps to reduce the loss of the electroplating solution a during the filtering process, and further ensures the continuity of the electroplating operation.
[0037] Combination Figures 1 to 4 As shown, in one embodiment, the first circulation pipeline 5 further includes a first liquid pump 53 and a second liquid pump 54. It is easy to understand that the first liquid pump 53 is arranged at the first channel 51, and the second liquid pump 54 is arranged at the second channel 52. Thus, the first circulation pipeline 5 can extract the electroplating solution a to be filtered from the chemical tank 1 into the first tank body 22 through the first liquid pump 53, and can extract the filtered electroplating solution a from the second tank body 23 into the chemical tank 1 through the second liquid pump 54.
[0038] Combination Figures 1 to 4As shown, in one embodiment, the second circulation pipeline 6 includes a third channel 61 and a fourth channel 62. Specifically, the third channel 61 connects the chemical tank 1 and the electroplating tank 3, and the fourth channel 62 connects the electroplating tank 3 and the chemical tank 1. It is easy to understand that the third channel 61 is configured to extract the electroplating solution a from the chemical tank 1 to the electroplating tank 3, and the fourth channel 62 is configured to extract the electroplating solution a mixed with anode mud or the waste liquid b generated after the flushing device 4 is flushed from the electroplating tank 3 to the chemical tank 1. Therefore, the second circulation pipeline 6 can complete the electroplating operation by setting a two-way channel and can cooperate with the flushing device 4 to achieve the cleaning effect of the anode basket 31 and the anode ball 32.
[0039] Combination Figures 1 to 4 As shown, in one embodiment, the second circulation pipeline 6 also includes a third liquid pump 63. It is easy to understand that the third channel 61 extends from the bottom of the chemical tank 1 to the electroplating tank 3, and the third liquid pump 63 is arranged at the third channel 61. Therefore, the second circulation pipeline 6 can realize the extraction of the electroplating solution a from the chemical tank 1 to the electroplating tank 3 as much as possible through the third liquid pump 63. Further, the second circulation pipeline 6 also includes a first valve 64. It should be noted that the electroplating tank 3 is arranged above the chemical tank 1, and the fourth channel 62 extends from the bottom of the electroplating tank 3 to the chemical tank 1, and the first valve 64 of the fourth channel 62 is arranged at the fourth channel 62. Thus, when it is necessary to extract the electroplating solution a mixed with anode mud or the waste liquid b generated after flushing by the flushing device 4 from the electroplating tank 3 into the chemical water tank 1, the first valve 64 can be opened to allow the electroplating solution a mixed with anode mud or the waste liquid b generated after flushing by the flushing device 4 to flow from the bottom of the electroplating tank 3 into the chemical water tank 1. It is easy to understand that after the electroplating solution a mixed with anode mud or the waste liquid b generated after flushing by the flushing device 4 flows into the chemical water tank 1, the first valve 64 can be closed so that the third liquid pump 63 can subsequently extract the electroplating solution a from the chemical water tank 1 into the electroplating tank 3.
[0040] Combination Figures 1 to 4 As shown, in one embodiment, a drainage channel 11 is provided at the bottom of the chemical tank 1, and a second valve 12 is also provided at the drainage channel 11. Therefore, when it is necessary to discharge the electroplating solution a or the waste liquid b through the drainage channel 11, the second valve 12 can be opened to allow the electroplating solution a or the waste liquid b to flow out of the drainage channel 11. It is easy to understand that after the electroplating solution a or the waste liquid b flows out through the drainage channel 11, the second valve 12 can be closed so that the electroplating solution a can be subsequently loaded into the chemical tank 1 for electroplating operation.
[0041] In one embodiment, the filter assembly 21 includes at least two layers of filter screens to improve the filtering effect on the anode mud. Exemplarily, the filter screen aperture in the filter assembly 21 is set to 1 micron to reduce the free sedimentation and filtering time of the anode mud, thereby improving the filtering effect on the anode mud.
[0042] Combination Figures 1 to 4 As shown, in one embodiment, the filter assembly 21 includes a first filter screen 211 and a second filter screen 212. The second filter screen 212 is located on a side relatively close to the second tank body 23. It should be noted that the aperture of the second filter screen 212 is smaller than that of the first filter screen 211. Therefore, after the first filter screen 211 filters out the anode mud and other impurities of larger size, the second filter screen 212 can further filter the particles of smaller size, thereby improving the filtering effect.
[0043] Combination Figures 1 to 4 As shown, in one embodiment, the electroplating equipment cleaning system also includes a liquid level sensor 7. Specifically, the liquid level sensor 7 is arranged in the filter tank 2 and is located at a predetermined height. It should be noted that the predetermined height can be set according to the capacity of the medicine tank 1 and the filter tank 2. It should be further noted that when the first circulation pipeline 5 can extract the electroplating liquid a to be filtered from the medicine tank 1 to the first tank body 22 through the first liquid pump 53, the liquid level of the electroplating liquid a in the filter tank 2 gradually rises until the electroplating liquid a contacts the liquid level sensor 7 so that the liquid level sensor 7 sends a signal. Exemplarily, the liquid level sensor 7 is connected to a prompting device or a controller. That is, when the electroplating liquid a contacts the liquid level sensor 7 so that the liquid level sensor 7 sends a signal, the operator can be prompted by the prompting device to open the second liquid pump 54 to extract the filtered electroplating liquid a from the second tank body 23 into the medicine tank 1, or the second liquid pump 54 can be directly controlled by the controller to open to extract the filtered electroplating liquid a from the second tank body 23 into the medicine tank 1.
[0044] Combination Figures 1 to 4 As shown, in one embodiment, the flushing device 4 includes a high-pressure nozzle 41 to ensure the flushing effect of the anode basket 31 and the anode ball 32 through the high-pressure nozzle 41. Further, the high-pressure nozzle 41 is located on the side of the anode basket 31 to ensure that the high-pressure nozzle 41 can flush the anode basket 31 and the anode ball 32 within a larger range. Optionally, the high-pressure nozzle 41 is made of stainless steel. It should be noted that the number and distribution of the high-pressure nozzles 41 can be set as needed, for example, three high-pressure nozzles 41 are arranged from top to bottom to ensure that the entire anode basket 31 and the anode ball 32 therein can be flushed. As an optional embodiment, the high-pressure nozzle 41 or the entire flushing device 4 can be moved relative to the anode basket 31, so that the high-pressure nozzle 41 can flush the anode basket 31 and the anode ball 32 therein from all angles, which helps to improve the flushing effect of the anode basket 31 and the anode ball 32.
[0045] The embodiment of the utility model provides a cleaning system for electroplating equipment, which includes a chemical water tank 1, a filter tank 2, an electroplating tank 3, a flushing device 4, a first circulation pipeline 5, and a second circulation pipeline 6. The chemical water tank 1 is used to contain the electroplating solution a and is provided with a drainage channel 11. The filter tank 2 is separated by a filter assembly 21 to form a first tank body 22 and a second tank body 23. An anode basket 31 is provided in the electroplating tank 3, and an anode ball 32 is provided in the anode basket 31. The flushing device 4 is used to flush the anode basket 31 and the anode ball 32. The first circulation pipeline 5 is used to extract the electroplating solution a from the chemical water tank 1 to the first tank body 22, and to extract the filtered electroplating solution a from the second tank body 23 to the chemical water tank 1. The second circulation pipeline 6 is used to extract the electroplating solution a from the chemical water tank 1 to the electroplating tank 3, and to extract the waste liquid b after flushing by the flushing device 4 from the electroplating tank 3 to the chemical water tank 1 so that the waste liquid b is discharged from the drainage channel 11. Therefore, the electroplating equipment cleaning system does not need to remove the anode mud after extracting the electroplating liquid a, and does not need to remove the anode basket 31 and the anode ball 32 and clean them separately, thereby improving the cleaning efficiency and reducing the cleaning cost.
[0046] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A cleaning system for electroplating equipment, characterized in that: include: A liquid medicine tank (1), wherein the liquid medicine tank (1) is provided with a drainage channel (11), and the liquid medicine tank (1) is configured to contain a plating solution (a); A filter tank (2), wherein a filter assembly (21) is provided in the filter tank (2) to separate and form a first tank body (22) and a second tank body (23); An electroplating tank (3), wherein an anode basket (31) is provided in the electroplating tank (3), and an anode ball (32) is provided in the anode basket (31); a flushing device (4), the flushing device (4) being configured to flush the anode basket (31) and the anode ball (32); a first circulation pipeline (5), the first circulation pipeline (5) being connected to the chemical solution tank (1) and the filtering tank (2), and being configured to extract the electroplating solution (a) from the chemical solution tank (1) to the first tank body (22), and to extract the filtered electroplating solution (a) from the second tank body (23) to the chemical solution tank (1); as well as A second circulation pipeline (6), wherein the second circulation pipeline (6) is connected to the chemical water tank (1) and the electroplating tank (3), and is configured to extract the electroplating solution (a) from the chemical water tank (1) to the electroplating tank (3), and to extract the waste liquid (b) after flushing by the flushing device (4) from the electroplating tank (3) to the chemical water tank (1) so that the waste liquid (b) is discharged through the drainage channel (11).
2. The electroplating equipment cleaning system according to claim 1, characterized in that: The first circulation pipeline (5) comprises: a first channel (51), the first channel (51) communicating with the chemical solution tank (1) and the first tank body (22), and being configured to draw the electroplating solution (a) from the chemical solution tank (1) to the first tank body (22); and A second channel (52), wherein the second channel (52) connects the second tank body (23) and the chemical solution tank (1), and is configured to extract the filtered electroplating solution (a) from the second tank body (23) to the chemical solution tank (1).
3. The electroplating equipment cleaning system according to claim 2, characterized in that: The first end of the first channel (51) extends into the bottom of the medicine tank (1), and the second end of the first channel (51) extends to the opening of the first tank body (22).
4. The electroplating equipment cleaning system according to claim 2, characterized in that: The first end of the second channel (52) extends into the bottom of the second trough body (23), and the second end of the second channel (52) extends to the opening of the medicine tank (1).
5. The electroplating equipment cleaning system according to claim 2, characterized in that: The first circulation pipeline (5) also includes: a first liquid pump (53), the first liquid pump (53) being disposed at the first channel (51); and A second liquid pump (54), wherein the second liquid pump (54) is disposed at the second channel (52).
6. The electroplating equipment cleaning system according to claim 1, characterized in that: The second circulation pipeline (6) comprises: a third channel (61), the third channel (61) communicating with the chemical bath (1) and the electroplating bath (3), and being configured to draw the electroplating solution (a) from the chemical bath (1) to the electroplating bath (3); and A fourth channel (62), wherein the fourth channel (62) connects the electroplating tank (3) and the chemical tank (1), and is configured to extract the electroplating solution (a) or the waste solution (b) from the electroplating tank (3) to the chemical tank (1).
7. The electroplating equipment cleaning system according to claim 1, characterized in that: The filter assembly (21) comprises at least two layers of filter screens.
8. The electroplating equipment cleaning system according to claim 7, characterized in that: The filter assembly (21) comprises a first filter screen (211) and a second filter screen (212), wherein the second filter screen (212) is located on a side close to the second tank body (23), and the aperture of the second filter screen (212) is smaller than that of the first filter screen (211).
9. The electroplating equipment cleaning system according to claim 1, characterized in that: The electroplating equipment cleaning system also includes: A liquid level sensor (7), wherein the liquid level sensor (7) is arranged in the filter tank (2) and is located at a predetermined height.
10. The electroplating equipment cleaning system according to claim 1, characterized in that: The flushing device (4) comprises a high-pressure nozzle (41), and the high-pressure nozzle (41) is located on the side of the anode basket (31).