Electrodeless LED device with bidirectional rectification, stroboflash removal, uniform temperature and heat dissipation functions

Abstract

The utility model discloses a bidirectional rectification stroboflash removal and uniform temperature heat dissipation electrodeless LED device, which comprises a heat dissipation lamp body, LED chips are arranged on the surface of a uniform temperature heat dissipation device, a plurality of bidirectional half-wave rectification circuits are integrated on the LED chips, a plurality of LED chips are connected in series or in parallel, driving chips used for driving the LED chips to emit light are arranged in the LED chips, and the driving chips are connected with the bidirectional half-wave rectification circuits. The heat dissipation lamp body is provided with an electrode bonding pad, the electrode bonding pad, a driving chip and a plurality of LED chips are connected in series or in parallel, the LED chips are connected in series with built-in or external current-limiting resistors and electrodeless constant-current resistors or constant-current chips, and the soft light powder layer is packaged in the heat dissipation lamp body. The LED chip has the circuit characteristics that a plurality of bidirectional half-wave rectifiers are arranged in the LED chip to work alternately and a plurality of chipsets can be arranged outside the LED chip to form full-wave self-rectification, the heating value of the lamp can be effectively reduced, meanwhile, the LED chip can uniformly dissipate heat and emit light bidirectionally through the heat conduction block and the uniform-temperature radiator, the production cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamps, in particular to a bidirectional rectifying and flicker-free electrodeless LED device with uniform temperature and heat dissipation. Background Art

[0002] LED lamps are generally equipped with aluminum heat sinks, which can enhance the heat dissipation capacity of LED lamps and extend the service life of LED chips. At present, the industry usually uses the method of concentrating and packaging the LED chips in the lamp body together, which will cause serious heat generation while emitting light, affecting the light effect. Due to the serious heat generation itself, the temperature of the aluminum heat sink is also high.

[0003] The above heat dissipation method will cause the temperature of the part where the aluminum heat dissipation lamp shell and the LED chip are attached to be higher than other parts. When the LED chips are packaged together to emit light, the temperature in the middle of the LED chip will be significantly higher than the temperature at the edge of the LED chip. The LED chip has the problem of light attenuation and shortened life due to local overheating. The LED chip is also prone to some point light source burnout.

[0004] In addition, traditional lamps need to be equipped with a rectifier bridge to connect to the high-voltage AC power supply, which increases the size of the entire lamp, increases the cost and makes the structure more complicated, reducing production efficiency. Since the rectifier bridge is installed inside the lamp, it is necessary to make the internal parts of the lamp more compact while controlling the overall volume of the lamp, which ultimately leads to serious heating inside the lamp, causing the lamp to

[0005] The heat accumulation will cause breakdown and damage, affecting the normal operation of various electronic components and shortening the life of the lamp. Utility Model Content

[0006] The purpose of the utility model is to provide a bidirectional rectifying and flicker-free electrodeless LED device with uniform heat dissipation, so as to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a bidirectional rectifying and flicker-free electrodeless LED device with uniform heat dissipation, a lamp body, a plurality of limit grooves and a heat conduction block placed in the limit grooves are arranged inside the lamp body, a uniform heat sink is arranged on the surface of the heat conduction block, an LED chip is arranged on the surface of the uniform heat sink, the LED chip integrates a plurality of bidirectional half-wave rectifying circuits, and a plurality of LED chips are connected in series or in parallel;

[0008] The heat dissipation lamp body is made of aluminum alloy to improve the heat conduction effect. The temperature-averaging heat sink can make the local high temperature of the LED chip evenly diffuse to the heat dissipation lamp body to prevent the LED chip from burning out. The LED chip with bidirectional rectification can also be externally placed. After combination, the self-formed full-wave rectification circuit can realize AC or DC universality, saving the manufacturing cost of traditional bridge rectifier components and power supplies;

[0009] The LED chip is built with a driver chip for driving the LED chip itself to emit light, the heat dissipation lamp body is provided with an electrode pad, the electrode pad and the driver chip and a plurality of LED chips are connected in series or in parallel, and the LED chip is connected in series with a built-in or external current limiting resistor and a stepless constant current resistor or a constant current chip;

[0010] The soft light powder layer is encapsulated inside the heat dissipation lamp body. A plurality of heat sinks are arranged on the lower surface of the heat dissipation lamp body. The soft light powder layer can prevent the glare of the light emitted by the LED chip. At the same time, it has a delayed relief effect and soft light emission to suppress flicker, effectively reducing or eliminating flicker and protecting vision health.

[0011] Furthermore, a first silicone thermal conductive adhesive layer is provided on the lower surface of the LED chip, the first silicone thermal conductive adhesive layer is arranged on the upper surface of the temperature uniform heat sink, and a second silicone layer is encapsulated on the upper surface of the LED chip. The thermal conductivity of the LED chip is increased by the first silicone thermal conductive adhesive layer and the second silicone layer, which can accelerate heat dissipation and protect the LED chip.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] (1) The heat sink can evenly distribute the heat of the LED chip to avoid the problem of local overheating of the LED chip. The heat generated by the LED chip can be evenly distributed to the surface of the heat dissipation lamp body through the heat sink, avoiding the problem of LED chip attenuation and shortened life due to local overheating.

[0014] (2) Several bidirectional half-wave rectifiers are integrated inside the LED chip. At the same time, the LED chips can also be combined and connected to form a full-wave rectifier circuit that can be used for both AC and DC, saving the manufacturing cost of traditional bridge rectifier components and power supplies.

[0015] (3) LED chips can be arranged in several groups, and can freely realize single-color, dual-color, and three or more colors of free mixed light emission, making the light texture of the LED chip more colorful and achieving better dimming and color adjustment. At the same time, it saves the cost of LED power drive.

[0016] (4) Several half-wave or full-wave chip self-rectification circuits are built into the circuit of the LED chip. When connected to a high-voltage power supply, the LED chip can directly rectify the input voltage, reducing the number of rectifying components and effectively improving production efficiency.

[0017] (5) The LED chip has the circuit characteristics of several built-in bidirectional half-wave rectifiers working alternately and several external chips forming a full-wave self-rectifier, which can effectively reduce the heat generated by the lamp. At the same time, the LED chip can dissipate heat and emit light evenly in both directions through the heat conductive block and the temperature radiator, reducing production costs and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the heat dissipation lamp body and the LED chip connected to the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the heat dissipation lamp body of the utility model;

[0020] Figure 3 It is a schematic diagram of the disassembly of the utility model;

[0021] Figure 4 It is a schematic diagram of the connection between the LED chip of the utility model and the current limiting resistor and the stepless constant current resistor or the constant current chip.

[0022] In the figure: 1. heat dissipation lamp body; 2. electrode pad; 3. uniform temperature heat sink; 4. LED chip; 5. heat conductive block; 6. limiting groove; 7. first silicone thermal conductive adhesive layer; 8. snap-in groove; 9. second silicone layer; 10. mounting welding hole; 11. heat sink; 12. soft light powder layer; 13. light-transmitting plate. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example:

[0025] See also Figure 1-4The utility model provides a technical solution: a bidirectional rectifying and flicker-free and uniform heat dissipation electrodeless LED device, comprising a heat dissipation lamp body 1, wherein the heat dissipation lamp body 1 is provided with a plurality of limit grooves 6 and a heat conduction block 5 placed in the limit grooves 6, wherein the surface of the heat conduction block 5 is provided with a uniform temperature heat sink 3, wherein the surface of the uniform temperature heat sink 3 is provided with an LED chip 4, wherein the LED chip 4 integrates a plurality of bidirectional half-wave rectifying circuits, and the plurality of LED chips 4 are connected in series or in parallel;

[0026] The heat dissipation and pad safety spacing distance between two adjacent LED chips 4 is within 0.2mm-2mm. Within this range, the heat dissipation performance of the LED chip 4 can be improved and the electrical creepage safety distance can be made safer and more reliable.

[0027] The limiting groove 6 can clamp the temperature radiator 3, improve the sealing performance of the connection between the temperature radiator 3 and the heat dissipation lamp body 1, and prevent the temperature radiator 3 from falling off the heat dissipation lamp body 1 when the heat dissipation lamp body 1 is vibrated;

[0028] The LED chip 4 is manufactured using a flicker-free lighting technology, so that the flicker of the LED chip 4 is lower when it emits light, which relieves visual fatigue and protects vision health;

[0029] The bidirectionally rectified LED chip 4 is built with a driver chip for driving the LED chip 4 to emit light, the heat dissipation lamp body 1 is provided with an electrode pad 2, the electrode pad 2 and the driver chip and a plurality of LED chips 4 are bidirectionally connected in series or in parallel, the LED chip 4 is connected in series with a built-in or external current limiting resistor R1 and a stepless constant current resistor or a constant current chip R2, and the current limiting resistor R1 is used for shunting, thereby extending the service life of the LED chip 4;

[0030] A soft light powder layer 12 is encapsulated inside the heat dissipation lamp body 1. A plurality of heat sinks 11 are provided on the lower surface of the heat dissipation lamp body 1 to enhance the heat conduction effect of the heat dissipation lamp body 1 to the air. The soft light powder layer 12 can diffuse and spread the light, reduce visual fatigue, make the glare light softer, alleviate and suppress stroboscopic light, and protect the eyes;

[0031] In this embodiment, if Figure 3 As shown, the lower surface of the LED chip 4 is provided with a first silicone thermal conductive adhesive layer 7, the first silicone thermal conductive adhesive layer 7 is arranged on the upper surface of the temperature radiator 3, and the upper surface of the LED chip 4 is encapsulated with a second silicone layer 9;

[0032] The first silicone heat-conductive adhesive layer 7 can fill the gap between the LED chip 4 and the temperature-averaging heat sink 3 , thereby improving the heat dissipation effect of the LED chip 4 and evenly dissipating the heat, thereby improving the luminous efficiency of the LED chip 4 .

[0033] In this embodiment, if Figure 1 and Figure 3 As shown, the inner surface of the heat dissipation lamp body 1 is provided with a snap-in groove 8, and a light-transmitting plate 13 is installed inside the snap-in groove 8, the soft light powder layer 12 is mixed and encapsulated inside the second silicone layer 9, and the soft light powder layer 12, the second silicone layer 9, and the LED chip 4 are encapsulated as a whole to achieve a sealed encapsulation connection between the LED chip 4 and the soft light powder layer 12.

[0034] In this embodiment, if Figure 1 and Figure 3 As shown, the electrode pad 2 is arranged on the side of the heat dissipation lamp body 1, and the surface of the electrode pad 2 is provided with a mounting welding hole 10 to facilitate the connection of wires.

[0035] In this embodiment, if Figure 4 As shown, the LED chip 4 is provided with a P-type semiconductor and an N-type semiconductor, a PN junction is provided between the P-type semiconductor and the N-type semiconductor, and the P-type semiconductor and the N-type semiconductor are electrically connected through a wire. When current passes through the LED chip 4, the electrons of the P-type semiconductor and the N-type semiconductor are combined in the PN junction vacancies, and then emit energy in the form of photons to realize light emission;

[0036] The surface of the LED chip 4 is provided with a packaging layer, which can be made of high-refractive silicone or low-refractive silicone material. During the specific implementation, the packaging layer is arranged between the LED chip 4 and the air, which can effectively reduce the loss of photons of the LED chip 4 and improve the light collection efficiency.

[0037] Specifically, when in use, after the LED chip 4 integrates several bidirectional half-wave rectifier circuits, it has the advantage of no positive or negative poles. When connected to the external power supply through the electrode pad 2, there is no need to adjust the positive and negative poles, and the LED chip 4 can be lit. After the external power supply is connected to the LED chip 4, while the entire closed circuit is powered, the half-wave or full-wave rectifier circuit combined by the LED chip 4 is used to rectify the entire closed circuit, and realizes stepless bidirectional rectification and luminescence. Due to the reduction of the rectifier components, the internal structure of the entire LED light source is more compact, and the gaps between multiple electronic components can be dispersed, thereby improving the heat dissipation effect of the entire LED light source;

[0038] The heat generated by the working LED chip 4 is transferred to the uniform temperature radiator 3, and the uniform temperature radiator 3 dissipates heat through its own internal liquid cooling system to achieve the effect of uniform heat dissipation, ensuring that the LED chip 4 will not have the problem of local high temperature. The uniform temperature radiator 3 then evenly transfers the heat to the heat dissipation lamp body 1. The heat dissipation lamp body 1 made of aluminum alloy transfers the heat to the flowing air, providing a suitable working environment for the LED chip 4, ensuring that the service life of the LED chip 4 can be extended.

[0039] The external dimensions of a bidirectional rectifying and flicker-free LED device with uniform heat dissipation are set to different sizes according to different heat dissipation lamp bodies 1. The LED lamp body size is not limited to 6060 (6.0x6.0 : It is suitable for SMD chip LED applications such as 2016 (2.0x1.6mm), 2025 (2.0x2.5mm), 1616 (1.6x1.6mm), 3838 (3.8x3.8mm), 5730 (5.7x3.0mm), 1010 (10.0x10.0mm), etc.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A bidirectional rectifying and flicker-free LED device with uniform heat dissipation, characterized in that: include: A heat dissipation lamp body (1), wherein the heat dissipation lamp body (1) is provided with a plurality of limit grooves (6) and a heat conduction block (5) disposed in the limit grooves (6), a temperature radiator (3) is provided on the surface of the heat conduction block (5), an LED chip (4) is provided on the surface of the temperature radiator (3), the LED chip (4) integrates a plurality of bidirectional half-wave rectification circuits, and the plurality of LED chips (4) are connected in series or in parallel; The LED chip (4) is built with a driver chip for driving the LED chip (4) to emit light, the heat dissipation lamp body (1) is provided with an electrode pad (2), the electrode pad (2) and the driver chip and a plurality of LED chips (4) are connected in series or in parallel, and the LED chip (4) is connected in series with a built-in or external current limiting resistor and a stepless constant current resistor or a constant current chip; A soft light powder layer (12), wherein the soft light powder layer (12) is encapsulated inside a heat dissipation lamp body (1), and a plurality of heat dissipation fins (11) are provided on the lower surface of the heat dissipation lamp body (1).

2. A bidirectional rectifying and flicker-free electrodeless LED device with uniform heat dissipation according to claim 1, characterized in that: The lower surface of the LED chip (4) is provided with a first silicone thermal conductive adhesive layer (7), the first silicone thermal conductive adhesive layer (7) is arranged on the upper surface of the temperature-averaging heat sink (3), and the upper surface of the LED chip (4) is encapsulated with a second silicone layer (9).

3. A bidirectional rectifying and flicker-free electrodeless LED device with uniform heat dissipation according to claim 2, characterized in that: The inner surface of the heat dissipation lamp body (1) is provided with a clamping groove (8), and a light-transmitting plate (13) is installed inside the clamping groove (8), and the soft light powder layer (12) is mixed and encapsulated inside the second silicone layer (9).

4. The bidirectional rectifying and flicker-free and heat-dissipating electrodeless LED device according to claim 1, characterized in that: The electrode pad (2) is arranged on the side of the heat dissipation lamp body (1), and a mounting welding hole (10) is provided on the surface of the electrode pad (2).

5. The bidirectional rectifying and flicker-free and uniform heat dissipating electrodeless LED device according to claim 1, characterized in that: The LED chip (4) is provided with a P-type semiconductor and an N-type semiconductor, a PN junction is provided between the P-type semiconductor and the N-type semiconductor, and the P-type semiconductor and the N-type semiconductor are electrically connected via a wire.

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