Solder ball dewatering device

Abstract

The utility model relates to the technical field of solder ball production, in particular to a solder ball dewatering device which comprises a storage bin, a flow divider and a drying line, the storage bin is connected with the drying line and comprises a flow dividing opening, the flow divider is arranged in the flow dividing opening and comprises a rotating door, a fixing disc is arranged at the top end of the rotating door, and the rotating door is connected with the drying line. A fixed disc is arranged on the rotating door, a blocking net is arranged at the bottom end of the fixed disc, a limiting disc is arranged at the bottom end of the blocking net, the axis of the fixed disc penetrates through an adjusting screw rod, a limiting disc is arranged at the bottom end of the adjusting screw rod, and the rotating door is in transmission connection with a driving motor. And meanwhile, the height of a limiting plate in the flow divider is adjustable, so that only part of the bottom layer of the stacked solder balls can enter the limiting plate according to the height adjustment of the solder balls, the solder balls are brought into the drying line through a rotating door, the solder balls are flatly laid on the conveying line, and the solder balls are efficiently dried.

Description

Technical Field

[0001] The utility model relates to the technical field of solder ball production, in particular to a solder ball water removal device. Background Art

[0002] Solder beads are a commonly used welding material. Their main function is to form solder joints during the welding process and fix electronic components on circuit boards. Usually, a layer of non-oxidizable material is applied to the copper foil of the circuit board. During welding, the solder will react with the copper foil of the circuit board under the protection of this layer of material to form strong solder joints. In addition, the solder beads of the circuit board can also prevent the circuit board from oxidation and corrosion.

[0003] After the existing solder balls are produced, the temperature of the solder balls themselves is relatively high. In order to facilitate the subsequent packaging and testing processes, the solder balls need to be cooled down. After cooling down, the excess moisture on the surface of the solder balls needs to be removed. Traditional drying equipment directly dries a large number of solder balls in a centralized manner, which can easily cause the outer solder balls to be completely dried while the inner ones are not dried.

[0004] In view of this, we propose a solder ball dewatering device that can evenly arrange the solder balls and reduce the phenomenon of uneven drying. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a solder ball dewatering device, which solves the problems mentioned in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above objectives, the utility model is implemented through the following technical solutions: a tin ball dewatering device, comprising a storage bin, a diverter and a drying line, the storage bin is connected to the drying line, the storage bin comprises a diverter port, a diverter is arranged inside the diverter port, the diverter comprises a revolving door, a fixed disk is arranged at the top of the revolving door, a blocking net is arranged at the bottom of the fixed disk, a limiting disk is arranged at the bottom of the blocking net, the axis of the fixed disk passes through the adjusting screw, a limiting disk is arranged at the bottom of the adjusting screw, the revolving door is transmission-connected to a driving motor, the tin balls can enter the interior of the drying line quantitatively through the diverter, and the limit plate inside the diverter is height-adjustable, which can be adjusted according to the height of the tin balls.

[0009] Preferably, the revolving door includes a rotating column, sealing plates are equidistantly distributed on the surface of the rotating column, limiting grooves are arranged between the sealing plates, the limiting grooves are located between the sealing plates, and the limiting grooves are used to install a fixed plate and a limiting plate, so that the limiting plate can move up and down on the surface of the rotating column.

[0010] Preferably, a sealing rubber strip is fixed to the inner wall surface of the diversion port, and the cross-section of the sealing rubber strip is triangular. By using the triangular rubber sealing strip, the rotating column touches the sealing rubber strip during the rotation process, and the resistance is small.

[0011] Preferably, the storage bin comprises a silo and a material pool, the diversion port is arranged at the front end of the material pool, the material pool is arranged at the front end of the silo, and a discharge port is arranged on the surface of the silo.

[0012] Preferably, the drying line includes a conveyor line, dryers are arranged on both sides of the conveyor line, multiple axial flow fans are arranged on one side of the dryer, and a conveyor belt is arranged at the bottom end of the conveyor line. The moisture on the surface of the solder ball is dried by the dryer, and the surface temperature is then reduced by the high-speed airflow of the axial flow fan.

[0013] Preferably, the bottom end of the inner wall of the material pool is provided with an inclination angle of 15°-50°, and the tin balls on the inner wall of the material pool enter the interior of the diverter under the action of gravity through the inclined inner wall.

[0014] (III) Beneficial effects

[0015] The utility model provides a solder ball dewatering device, which has the following beneficial effects:

[0016] (1) The solder ball dewatering device is provided with a diverter so that the solder balls in the storage bin need to pass through the diverter before entering the drying line. The diverter has the function of conveying the solder balls at a uniform speed. During the process of conveying the solder balls, the diverter can spread the accumulated solder balls into a layer before entering the drying line, which will not cause the solder balls to accumulate and enter the drying line. Moreover, through simple adjustment, it can adapt to the diversion of solder balls of different diameters, so that the solder balls are spread flat on the conveyor line, so that the solder balls are dried efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of the utility model;

[0019] Figure 3 For this utility model Figure 2 A schematic diagram of the structure enlargement in the middle;

[0020] Figure 4 This is a schematic diagram of the disassembled structure of the diverter in the utility model.

[0021] In the figure: 1. Storage bin; 2. Diverter; 3. Drying line; 11. Material bin; 12. Discharge port; 13. Material pool; 14. Diverter port; 15. Sealing rubber strip; 21. Fixed plate; 22. Blocking net; 23. Limiting plate; 24. Adjusting screw; 25. Revolving door; 26. Driving motor; 31. Conveyor line; 32. Dryer; 33. Axial flow fan; 34. Conveyor belt; 251. Rotating column; 252. Sealing plate; 253. Limiting groove. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1 - Figure 4 , the utility model provides a technical solution:

[0024] A solder ball dewatering device, comprising a storage bin 1, a diverter 2 and a drying line 3, wherein the storage bin 1 is connected to the drying line 3, the storage bin 1 comprises a diverter port 14, the diverter 2 is arranged inside the diverter port 14, the diverter 2 comprises a revolving door 25, a fixed disk 21 is arranged at the top of the revolving door 25, a blocking net 22 is arranged at the bottom of the fixed disk 21, a limiting disk 23 is arranged at the bottom of the blocking net 22, the axis of the fixed disk 21 passes through an adjusting screw 24, and the adjusting screw 24 A limit plate 23 is arranged at the bottom end, and the revolving door 25 is transmission-connected to a driving motor 26. The solder balls can quantitatively enter the interior of the drying line 3 through the diverter 2. Meanwhile, the limit plate inside the diverter 2 is height-adjustable and can be adjusted according to the height of the solder balls, so that only a part of the bottom layer of the accumulated solder balls can enter the interior of the limit plate and be brought into the interior of the drying line 3 by the revolving door 25, so that the solder balls inside the drying line 3 are spread flat without causing the accumulation of solder balls, thereby reducing the uneven internal drying temperature caused by the accumulation of solder balls.

[0025] The revolving door 25 includes a revolving column 251, and sealing plates 252 are equidistantly distributed on the surface of the revolving column 251. Limiting grooves 253 are arranged between the sealing plates 252. The limiting grooves 253 are located between the sealing plates 252. The limiting grooves 253 are used to install the fixing plate 21 and the limiting plate 23, so that the limiting plate 23 can move up and down on the surface of the revolving column 251, thereby adjusting the height between the limiting plate 23 and the inner wall of the diversion port 14.

[0026] The adjusting screw 24 is threadedly connected to the center of the fixed disk 21, and the bottom end of the adjusting screw 24 is rotatably connected to the axis of the limiting disk 23, so that the wire drum can be driven to rise during the rotation of the adjusting disk, and the limiting disk 23 will not rotate, thereby adjusting the height of the limiting disk 23.

[0027] A sealing rubber strip 15 is fixed to the inner wall surface of the diverter port 14, and the cross-section of the sealing rubber strip 15 is triangular. The triangular rubber sealing strip is used so that the rotating column 251 touches the sealing rubber strip 15 during rotation, with less resistance. At the same time, the sealing performance between the diverter port 14 and the diverter 2 is ensured to prevent the diverter port 14 from entering the drying line 3 through the gap between the diverter port 14 and the diverter 2.

[0028] The storage bin 1 includes a silo 11 and a material pool 13, the diversion port 14 is arranged at the front end of the material pool 13, the material pool 13 is arranged at the front end of the silo 11, and a discharge port 12 is arranged on the surface of the silo 11. The solder balls inside the silo 11 enter the inside of the material pool 13 through the discharge, so that the solder balls inside the material pool 13 enter the diverter 2.

[0029] The drying line 3 includes a conveyor line 31, dryers 32 are arranged on both sides of the conveyor line 31, and multiple axial flow fans 33 are arranged on one side of the dryer 32. A conveyor belt 34 is arranged at the bottom end of the conveyor line 31. The moisture on the surface of the solder ball is dried by the dryer 32, and the surface temperature is reduced by the high-speed airflow of the axial flow fan 33, so that the solder ball maintains a low temperature to complete the dehydration process.

[0030] The bottom end of the inner wall of the material pool 13 is set with an inclination angle of 15°-50°. Through the inclined inner wall, the solder balls on the inner wall of the material pool 13 enter the interior of the diverter 2 under the action of gravity.

[0031] When the tin ball dewatering device of the utility model is in use, before using the dewatering device, it is necessary to adjust the height of the limit plate 23 and the bottom end of the inner wall of the diverter port 14 according to the diameter of the tin ball, and rotate the adjusting screw 24 so that the limit plate 23 at the bottom end of the adjusting screw 24 rises on the surface of the rotating column 251, so that the gap between the limit plate 23 and the bottom end of the inner wall of the discharge port 12 is enlarged, so that the tin ball can enter the bottom end of the limit plate 23, and then the tin ball is introduced into the interior of the silo 11, so that the tin ball enters the interior of the material pool 13 through the discharge port 12. The bottom end of the inner wall of the material pool 13 is provided with an inclination angle, so that the tin ball automatically gathers to the front end of the diverter 2, and then the driving motor 26 of the diverter 2 can be started, and the driving motor 26 drives the rotating door 25 to rotate, and the sealing plate 252 of the rotating door 25 rotates to drive the movement of the tin ball in the material pool 13 and enter the drying at the rear end of the diverter 2. Line 3, since the height of the limit plate on the revolving door 25 is adjusted to be consistent with the solder balls, only the bottom layer of the accumulated solder balls can enter the gap between the limit plate and the diversion port 14, so that the solder balls brought into the conveying line 31 by the revolving door 25 will not accumulate. When the diameter of the solder balls increases greatly, the adjusting screw 24 continues to be rotated to make the limit plate 23 rise on the surface of the rotating column 251, so that the gap between the limit plate 23 and the bottom end of the inner wall of the discharge is enlarged, and the solder balls with larger diameters can enter the bottom end of the limit plate 23 of the rotating column 251. After the solder balls enter the drying line 3 through the diversion, they enter the hot air drying of the dryer 32, and then cool down through the axial flow fan 33 to complete the dehydration of the surface of the solder balls. Compared with traditional direct drying, it will not cause incomplete drying. At the same time, the solder balls are dried after being laid flat, which effectively reduces the uneven melting of the accumulated solder balls due to heat, causing the solder balls to stick together.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A solder ball dewatering device, comprising a storage bin (1), a diverter (2) and a drying line (3), characterized in that: The storage bin (1) is connected to a drying line (3), the storage bin (1) comprises a diversion port (14), a diverter (2) is arranged inside the diversion port (14), the diverter (2) comprises a revolving door (25), a fixed disk (21) is arranged at the top of the revolving door (25), a blocking net (22) is arranged at the bottom of the fixed disk (21), a limiting disk (23) is arranged at the bottom of the blocking net (22), the axis of the fixed disk (21) passes through the adjusting screw (24), the limiting disk (23) is arranged at the bottom of the adjusting screw (24), and the revolving door (25) is transmission-connected to a driving motor (26).

2. The solder ball dewatering device according to claim 1, characterized in that: The revolving door (25) comprises a revolving column (251), the surface of the revolving column (251) is provided with sealing plates (252) at equal intervals, limiting grooves (253) are arranged between the sealing plates (252), and the limiting grooves (253) are located between the sealing plates (252).

3. A solder ball dewatering device according to claim 2, characterized in that: The adjusting screw (24) is threadedly connected to the center of the fixed disk (21), and the bottom end of the adjusting screw (24) is rotatably connected to the axis of the limiting disk (23).

4. The solder ball dewatering device according to claim 1, characterized in that: A sealing rubber strip (15) is fixed on the inner wall surface of the diversion port (14), and the cross section of the sealing rubber strip (15) is triangular.

5. The solder ball dewatering device according to claim 1, characterized in that: The storage bin (1) comprises a material bin (11) and a material pool (13), the diversion port (14) is arranged at the front end of the material pool (13), the material pool (13) is arranged at the front end of the material bin (11), and a discharge port (12) is arranged on the surface of the material bin (11).

6. The solder ball dewatering device according to claim 1, characterized in that: The drying line (3) comprises a conveyor line (31), dryers (32) are arranged on both sides of the conveyor line (31), a plurality of axial flow fans (33) are arranged on one side of the dryer (32), and a conveyor belt (34) is arranged at the bottom end of the conveyor line (31).

7. The solder ball dewatering device according to claim 5, characterized in that: The bottom end of the inner wall of the material pool (13) is provided with an inclination angle of 15°-50°.

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