High-precision testing device for electronic product

Abstract

The utility model discloses a high-precision testing device for an electronic product. The device comprises a clamp for clamping a product, a pressing module which is arranged above the clamp and is used for pressing the product in the clamp, and a probe card module which is arranged below the clamp and is in butt joint conduction with the product for signal connection to realize related tests. The position adjusting module is fixed below the probe card module and is used for adjusting the position of the probe card module so as to be accurately butted with a Pad point on a product; the supporting frame is used for bearing the position adjusting module; the camera is arranged on the supporting frame and is used for acquiring the position of the product; and the first driving part is used for driving the supporting frame to move up and down. The testing device provided by the utility model is simple in structure, solves the problem of pressing and fixing a tiny product, and can realize accurate positioning of the probe and the product during testing.

Description

[Technical field]

[0001] The utility model belongs to the technical field of product testing, and particularly relates to a high-precision testing device for electronic products. [Background technology]

[0002] In the traditional PCBA testing industry, a purely mechanical positioning method is usually used to achieve product positioning. The structural principle of this type of equipment is: a carrier is set to place the product, and the carrier is generally driven to the test position by a cylinder, and a lifting platen assembly is set above the test position. The platen assembly will be equipped with a pressure block to press the product, and a needle plate module is set below the carrier for signal extraction; during testing, the carrier enters the test position, and the platen assembly will be pressed down by the cylinder, and after being pressed down to contact with the carrier, it will continue to press down together until the product on the carrier contacts the probe and the signal adapter module to achieve the test purpose.

[0003] However, in the face of the increasingly high precision requirements of the testing industry, traditional testing equipment generally has the following problems, making it difficult to meet the high-precision testing needs:

[0004] (1) As the current chips tend to be miniaturized, the pad size of the product is smaller, and the tolerance requirements cannot be met when positioning by purely mechanical methods;

[0005] (2) The test equipment in the prior art usually fixes the product by pressing and fixing it with a pressing block of a pressing plate, or by adding a pressing arm on the carrier plate and fixing it with the pressing arm, or by pressing and fixing it with a flip cover, etc. These fixing methods take up a lot of space and are not suitable for high-precision testing of tiny chips;

[0006] Therefore, it is necessary to provide a high-precision testing device for electronic products to solve the above technical problems. [Contents of the utility model]

[0007] The main purpose of the utility model is to provide a high-precision testing device for electronic products, which has a simple structure, solves the problem of pressing and fixing tiny products, and can achieve accurate positioning of the probe and the product during testing.

[0008] The utility model achieves the above-mentioned purpose through the following technical scheme: a high-precision testing device for electronic products, which includes a fixture for clamping the product, a pressing module arranged above the fixture and pressing the product in the fixture, a probe card module arranged below the fixture and connecting with the product to realize relevant tests after signal connection, a position adjustment module fixed below the probe card module and used to adjust the position of the probe card module to accurately connect with the pad point on the product, a support frame carrying the position adjustment module, a camera arranged on the support frame and obtaining the position of the product, and a first driving member that drives the support frame to move up and down.

[0009] Furthermore, the clamp includes a groove for holding the product, and a plurality of movable clamping blocks are arranged around the groove. Each of the movable clamping blocks is supported by an elastic member to maintain a clamping state and clamp the product. The clamp is provided with a sliding cover to cover the movable clamping block and prevent the movable clamping block from slipping.

[0010] Furthermore, a first through opening is provided in the middle of the slot cavity and is used to allow the probe card module to contact the product for testing; a step groove is provided from the slot cavity to the edge of the fixture, the sliding cover is fixed in the step groove, and a mounting groove for mounting the movable clamp is provided on the step groove; the step groove is separated by a plurality of the sliding covers and four positioning grooves are formed at the four corners, and a positioning hole is provided in at least one of the positioning grooves.

[0011] Furthermore, the pressing die set includes a second driving member, a support plate fixed at an output end of the second driving member and driven by the second driving member to move up and down, and a pressing head fixed at a lower end of the support plate.

[0012] Furthermore, a positioning block cooperating with the positioning groove is provided at the lower end of the pressing head, and a guide column inserted into the positioning hole for guiding is provided on the positioning block; a contour block cooperating with the groove hole is provided in the middle of the pressing head, and a plurality of contact protrusions are provided on the surface of the contour block for contacting and pressing the product.

[0013] Furthermore, the probe card module includes a PCBA board connected to an external circuit and a probe assembly fixed on the PCBA board and in contact with the product Pad, and the probe assembly includes a plastic module and a plurality of probes embedded in the plastic module and extending out of the plastic module at both ends.

[0014] Furthermore, the position adjustment module is configured as a UVW alignment platform, and the PCBA board is fixed to an output end of the UVW alignment platform.

[0015] Furthermore, the support frame, the position adjustment module and the PCBA board are all provided with shooting holes that are connected and cooperate with the camera for shooting.

[0016] Compared with the prior art, the beneficial effects of the high-precision test device for electronic products of the utility model are as follows: the pressure head set by the pressing module of the test device matches the concave and convex contour of the internal structure of the fixture, which can realize the precise pressing of the pressing module on the tiny-sized products without damaging the products; the camera optical photography is used to identify the positioning of the identification points, and then the UVW alignment platform is used to adjust the position of the probe card module to ensure that the probe can accurately pierce the product's Pad during the test, and finally achieve precise positioning with high positioning accuracy. Therefore, the test device provided by this scheme has a simple structure, solves the problem of pressing and fixing tiny products, and can realize the precise positioning of the probe and the product during the test.

Brief Description of the Drawings

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the test device of the embodiment of the utility model;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the test device of the embodiment of the utility model;

[0019] Figure 3 This is a schematic diagram of the three-dimensional structure of the test device of the embodiment of the utility model;

[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of the probe card module and the adjustment module of the embodiment of the utility model;

[0021] Figure 5 This is a schematic diagram of the three-dimensional structure of the pressure head in an embodiment of the utility model;

[0022] Figure 6 This is a schematic diagram of the three-dimensional structure of the clamp according to the embodiment of the utility model;

[0023] Figure 7 This is a schematic diagram of the three-dimensional structure of a clamp clamping a product according to an embodiment of the utility model;

[0024] Figure 8 This is a schematic diagram of the three-dimensional structure of the probe assembly of the utility model embodiment;

[0025] The numbers in the figure represent:

[0026] 100-test device, 200-product;

[0027] 1-clamp, 11-groove, 12-movable clamp, 13-slide cover, 14-first opening, 15-positioning groove, 16-positioning hole, 17-step groove, 18-installation groove;

[0028] 2-pressing die set, 21-second driving member, 22-first supporting plate, 23-pressing head, 231-positioning block, 232-guide column, 233-profile block, 234-contact convex position;

[0029] 3-probe card module, 31-PCBA board, 32-probe assembly, 321-plastic module, 322-probe; 4-position adjustment module; 5-first driving member; 6-support frame; 7-camera. [Specific implementation method]

[0030] Please refer to Figure 1-Figure 8 The present embodiment is a high-precision testing device for electronic products. The testing device 100 includes a fixture 1 for clamping a product, a pressing module 2 arranged above the fixture 1 and pressing the product in the fixture 1, a probe card module 3 arranged below the fixture 1 and connected to the product to achieve signal connection and perform relevant tests on the product, a position adjustment module 4 fixed below the probe card module 3 and used to adjust the position of the probe card module 3 to accurately dock with the Pad point on the product 200, a support frame 6 carrying the position adjustment module 4, a camera 7 arranged on the support frame 6 and obtaining the position of the product 200, and a first driving member 5 that drives the first support plate to move up and down.

[0031] The fixture 1 includes a slot 11 for holding the product 200. A plurality of movable clamping blocks 12 are arranged around the slot 11. Each movable clamping block 12 is held in a clamping state by an elastic member to clamp the product 200. In order to prevent the movable clamping block 12 from detaching from the fixture 1, a sliding cover 13 is arranged on the fixture 1 to cover the movable clamping block 12 and prevent the movable clamping block 12 from slipping off. A through first opening 14 is arranged in the middle of the slot 11 for contacting the probe card module 3 with the product for testing. A step groove 17 is arranged between the slot 11 and the edge of the fixture 1. The step groove 17 is provided with mounting grooves 18 for mounting the movable clamping block 12 on the four sides of the fixture 1. The mounting groove 18 matches the shape of the movable clamping block 12. The slot 11 is divided by a plurality of sliding covers 13 and enclosed at four corners to form four positioning grooves 15, wherein two positioning grooves 15 are provided with positioning holes 16.

[0032] The pressing module 2 includes a second driving member 21, a support plate 22 fixed at the output end of the second driving member 21 and driven by the second driving member 21 to move up and down, and a pressing head 23 fixed at the lower end of the supporting plate 22. Positioning blocks 231 cooperating with the positioning groove 15 are arranged at the four corners of the lower end of the pressing head 23, two of which are provided with guide posts 232 inserted into the positioning holes 16, and a profiling block 233 cooperating with the groove 11 is arranged in the middle of the pressing head 23, and a plurality of contact convex positions 234 contacting with the edge of the product are arranged on the surface of the protruding profiling block 233; the pressing head 23 can be made of resin material, and the surface of the contact convex position 234 is smooth and pressed tightly on the edge of the product without damaging the product. The second driving member 21 drives the pressure head 23 to descend, and the guide column 232 of the pressure head 23 is first inserted into the positioning hole 16 for guidance, and then the positioning block 231 cooperates with the positioning groove 15 to position so that the contact protrusion 234 presses the edge of the product, so as to facilitate the close contact and conduction between the probe card module 3 and the lower end of the product 200.

[0033] The probe card module 3 includes a PCBA board 31 and a probe assembly 32 fixed on the PCBA board 31 and in contact with the Pad of the product 200. The PCBA board 31 plays the role of electrical connection and is connected to the external test circuit. The probe assembly 32 is located directly below the fixture 1. The probe assembly 32 includes a plastic module 321 and a plurality of probes 322 embedded in the plastic module 321 and extending from the upper and lower ends of the plastic module 321. During the test, the probe assembly 32 is inserted on the Pad of the product 200 to be tested, so that the signal is transferred to the external test circuit through the probe assembly 32 via the PCBA board 31 for signal processing to achieve the relevant test.

[0034] The position adjustment module 4 is set as a UVW alignment platform, and the PCBA board 31 is set at the output end above the UVW alignment platform. The position adjustment module 4 can drive the PCBA board 31 to perform horizontal, vertical and rotational movements; the camera 7 is set below the UVW alignment platform, and the support frame 6 is slidably set on the first driving member 5. The support frame 6, the position adjustment module 4 and the PCBA board 31 are all provided with shooting holes that are connected and cooperate with the camera 7. The camera 7 is used to shoot and locate the product 200 to obtain the position of the product identification point, so that the position adjustment module 4 adjusts the position of the probe card module 3 according to the shooting information so that the probe card module 3 and the product can be accurately aligned. The position adjustment module 4 is used to adjust the position of the probe card module 3 to ensure that the probe 322 can accurately pierce the product's Pad during the test; the camera 7 is used to optically take pictures to identify the identification point positioning, and then the position adjustment module 4 adjusts the position of the probe assembly 32 according to the shooting information, and finally achieves accurate positioning with high positioning accuracy.

[0035] When the test device 100 provided by the present solution is used for testing, when the fixture 1 that clamps the product 20 rotates to the test station, the second driving member 21 drives the pressure head 23 to descend, and the guide column 232 of the pressure head 23 is first inserted into the positioning hole 16 for guidance, and then the positioning block 231 cooperates with the positioning groove 15 to position so that the contact protrusion 234 presses the edge of the product, and the first driving member 5 drives the support frame 6 to drive the probe card module 3 and the position adjustment module 4 to rise into place, and the camera 7 shoots and positions the product 200 to obtain the position of the product identification point, so that the position adjustment module 4 performs horizontal, vertical or rotational movement on the probe card module 3 according to the shooting information so that the probe card module 3 and the product are accurately aligned, and the first driving member 5 drives the support frame 6 to drive the probe card module 3 and the position adjustment module 4 to continue to rise so that the probe 322 of the probe card module 3 is accurately inserted into the pad of the product 200, and the signal is transferred to the external test circuit via the PCBA board 31 through the probe 322 for signal processing to realize related tests.

[0036] This scheme is a high-precision test device for electronic products. The pressure head 23 of the pressing module 2 of the test device 100 is matched with the concave and convex shape of the internal structure of the fixture 1, which can realize the precise pressing of the pressing module 2 on the tiny-sized product without damaging the product; the camera 7 is used to optically take pictures to identify the positioning of the identification point, and then the UVW alignment platform is used to adjust the position of the probe card module 3 to ensure that the probe 322 can accurately pierce the pad of the product 200 during the test, and finally achieve precise positioning with high positioning accuracy. Therefore, compared with the prior art, the test device 100 provided by this scheme has a simple structure, solves the problem of pressing and fixing tiny products, and can achieve precise positioning of the probe 322 and the product during the test.

[0037] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A high-precision testing device for electronic products, characterized in that: It includes a fixture for clamping the product, a pressing module arranged above the fixture and pressing the product in the fixture, a probe card module arranged below the fixture and connecting with the product to realize relevant tests after signal connection, a position adjustment module fixed below the probe card module and used to adjust the position of the probe card module to accurately connect with the Pad point on the product, a support frame carrying the position adjustment module, a camera arranged on the support frame and acquiring the position of the product, and a first driving member that drives the support frame to move up and down.

2. The high-precision testing device for electronic products according to claim 1, characterized in that: The clamp comprises a groove for holding the product, and a plurality of movable clamping blocks are arranged around the groove. Each movable clamping block is held in a clamping state by an elastic member to clamp the product. The clamp is provided with a sliding cover to cover the movable clamping block and prevent the movable clamping block from slipping off.

3. The high-precision testing device for electronic products according to claim 2, characterized in that: A first through opening is provided in the middle of the slot cavity and is used to allow the probe card module to contact the product for testing; a step groove is provided from the slot cavity to the edge of the fixture, the sliding cover is fixed in the step groove, and a mounting groove for mounting the movable clamp is provided on the step groove; the step groove is separated by a plurality of the sliding covers and four positioning grooves are formed at the four corners, and a positioning hole is provided in at least one of the positioning grooves.

4. The high-precision testing device for electronic products as claimed in claim 3, characterized in that: The pressing die set comprises a second driving member, a support plate fixed at the output end of the second driving member and driven by the second driving member to move up and down, and a pressing head fixed at the lower end of the support plate.

5. The high-precision testing device for electronic products as claimed in claim 4, characterized in that: A positioning block cooperating with the positioning groove is arranged at the lower end of the pressing head, and a guide column inserted into the positioning hole for guiding is arranged on the positioning block; a contour block cooperating with the groove hole is arranged in the middle of the pressing head, and a plurality of contact protrusions are arranged on the surface of the contour block for contacting with the product and pressing the product.

6. The high-precision testing device for electronic products according to claim 1, characterized in that: The probe card module includes a PCBA board connected to an external circuit and a probe assembly fixed on the PCBA board and in contact with the product Pad. The probe assembly includes a plastic module and a plurality of probes embedded in the plastic module and extending out of the plastic module at both ends.

7. The high-precision testing device for electronic products according to claim 6, characterized in that: The position adjustment module is configured as a UVW alignment platform, and the PCBA board is fixed to the output end of the UVW alignment platform.

8. The high-precision testing device for electronic products according to claim 6, characterized in that: The support frame, the position adjustment module and the PCBA board are all provided with shooting holes that are connected and cooperate with the camera for shooting.

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