Low-power-consumption wireless lora type main transformer bushing insulation monitoring circuit

Abstract

The utility model discloses a low-power-consumption wireless lora-type main transformer bushing insulation monitoring circuit, and belongs to the technical field of embedding. Comprising an MCU circuit, a battery voltage acquisition circuit, a temperature acquisition circuit, a power management circuit, an end screen electricity taking circuit, a solar charging management circuit, an ad acquisition circuit, a power frequency signal sampling circuit, a high-frequency partial discharge acquisition circuit and a wireless loar communication circuit. The MCU circuit is connected with the battery voltage acquisition circuit, the temperature acquisition circuit, the power management circuit, the ad acquisition circuit, the high-frequency partial discharge acquisition circuit and the wireless loar communication circuit, and the power management circuit is connected with the end screen electricity taking circuit, the solar charging management circuit, the ad acquisition circuit, the power frequency signal sampling circuit and the high-frequency partial discharge acquisition circuit. The ad acquisition circuit is connected with the power frequency signal sampling circuit; according to the utility model, the traditional wired power supply and communication scheme of the transformer device is solved, and the safety before and after construction is ensured.

Description

Technical Field

[0001] The utility model relates to the field of embedded technology, in particular to a low-power wireless Lora type main transformer bushing insulation monitoring circuit. Background Art

[0002] When high-voltage primary electrical equipment in places such as substations is operated in high-voltage power grids for a long time, the insulation performance will be reduced, which will affect the safe operation of the equipment and the power grid. Insulation accidents will cause large-scale power outages and even fires, especially substation transformers. Among them, the insulation failure of transformer bushings has been a concern this year.

[0003] At present, the transformer bushing insulation online monitoring system adopts wired power supply and wired communication methods. The traditional wired power supply and communication methods will firstly cause safety problems, and secondly, will cause inconvenient installation and wiring problems. Because the transformer body is made of metal, if destructive operations such as drilling are performed, it will inevitably cause safety risks during and after installation.

[0004] Therefore, people are in urgent need of a low-power wireless lora-type main transformer bushing insulation monitoring circuit to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a low-power wireless Lora type main transformer bushing insulation monitoring circuit to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0007] Low-power wireless lora type main transformer bushing insulation monitoring circuit, the utility model includes MCU circuit, battery voltage acquisition circuit, temperature acquisition circuit, power management circuit, end screen power circuit, solar charging management circuit, AD acquisition circuit, power frequency signal sampling circuit, high-frequency partial discharge acquisition circuit and wireless loar communication circuit;

[0008] The MCU circuit is connected to a battery voltage acquisition circuit, a temperature acquisition circuit, a power management circuit, an AD acquisition circuit, a high-frequency partial discharge acquisition circuit and a wireless loar communication circuit; the power management circuit is connected to a terminal screen power collection circuit, a solar charging management circuit, an AD acquisition circuit, an industrial frequency signal sampling circuit and a high-frequency partial discharge acquisition circuit; and the AD acquisition circuit is connected to an industrial frequency signal sampling circuit.

[0009] According to the above technical solution, the MCU circuit includes a chip U9, an interface SWD1, a crystal oscillator Y1, a crystal oscillator Y2, a resistor R55, a resistor R57, a resistor R58, a resistor R59, a capacitor C28, a capacitor C29, a capacitor C30, a capacitor C33 and a capacitor C35, the chip U9 includes pin 3, pin 4, pin 5, pin 6, pin 7, pin 12, pin 13, pin 14, pin 15, pin 16, pin 17, pin 25, pin 26, pin 29, pin 34, pin 37, pin 42, pin 43, pin 44, pin 45 and pin 46, the interface SWD1 includes pin 1, pin 2, pin 3 and pin 4, the crystal oscillator Y1 includes pin 1 and pin 2, and the crystal oscillator Y2 includes pin 1 and pin 2;

[0010] Pin 3 of the chip U9 and pin 2 of the crystal oscillator Y2 are both electrically connected to the ground wire through capacitor C29; pin 4 of the chip U9 and pin 1 of the crystal oscillator Y2 are both electrically connected to the ground wire through capacitor C33; pin 5 of the chip U9 and pin 2 of the crystal oscillator Y1 are both electrically connected to the ground wire through capacitor C28; pin 6 of the chip U9 and pin 1 of the crystal oscillator Y1 are both electrically connected to the ground wire through capacitor C30; pin 7 of the chip U9 and the first end of the capacitor C35 are both electrically connected to the VCC3.3 terminal through resistor R59; the second end of the capacitor C35 is electrically connected to the ground wire; pin 12 and pin 13 of the chip U9 are both electrically connected to the wireless loar communication circuit; pin 14, pin 15, pin 16, pin 17, pin 4 of the chip U9 2 and pin 43 are electrically connected to the ad acquisition circuit; pin 25 of the chip U9 is electrically connected to the temperature acquisition circuit; pin 26 of the chip U9 is electrically connected to the battery voltage acquisition circuit; pin 34 of the chip U9 and the first end of the resistor R55 are electrically connected to pin 2 of the interface SWD1; the second end of the resistor R55 and pin 1 of the interface SWD1 are electrically connected to the VCC3.3 terminal; pin 37 of the chip U9 and the first end of the resistor R57 are electrically connected to pin 3 of the interface SWD1; the second end of the resistor R57 and pin 4 of the interface SWD1 are electrically connected to the ground wire; pin 44 of the chip U9 is electrically connected to the ground wire through resistor R58; pins 45 and 46 of the chip U9 are electrically connected to the power management;

[0011] The MCU circuit adopts a low-power MCU design to reduce device energy consumption and battery power consumption.

[0012] According to the above technical solution, the battery voltage acquisition circuit includes a resistor R53, a resistor R54 and a capacitor C27, and the temperature acquisition circuit includes a resistor R60, a resistor R61, a resistor R61 and a capacitor C37;

[0013] The first end of the resistor R53 is electrically connected to the VBAT terminal; the second end of the resistor R53, the first end of the resistor R54 and the first end of the capacitor C27 are electrically connected to the pin 26 of the chip U9 in the MCU circuit; the second end of the resistor R54 and the second end of the capacitor C27 are electrically connected to the ground line; the first end of the resistor R60 is electrically connected to the VCC3.3 terminal; the second end of the resistor R60, the first end of the resistor R61 and the first end of the capacitor C37 are electrically connected to the pin 25 of the chip U9 in the MCU circuit; the second end of the resistor R61 and the second end of the capacitor C37 are electrically connected to the ground line through the resistor R63;

[0014] The battery voltage collection circuit collects the voltage of the battery inside the device and sends the battery voltage information to the station platform via wireless lora, so that the platform personnel can understand the power status of the device in time;

[0015] The temperature acquisition circuit monitors the temperature of the battery inside the device to prevent overcharging or abnormal discharge of the battery and abnormal temperature rise, and uploads the battery temperature during operation to the station platform via Lora.

[0016] According to the above technical solution, the power management circuit includes a chip U1, a chip U3, a transistor Q1, a transistor Q2, a resistor R1, a resistor R2, a resistor R9, a resistor R13, a resistor R18, a resistor R19, a resistor R21, a resistor R25, an inductor L1, a capacitor C1, a capacitor C3, a capacitor C4, a capacitor C6, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a capacitor CZ1, a capacitor CZ2, a diode D1, a diode D2 and a switch S1, the chip U1 includes a pin 1, a pin 2 and a pin 3, the chip U3 includes a pin 1, a pin 3, a pin 4 and a pin 5, the transistor Q1 includes a pin 1, a pin 2 and a pin 3, and the transistor Q2 includes a pin 1, a pin 2 and a pin 3;

[0017] Pin 1 of the chip U1, the first end of the capacitor C3, the first end of the capacitor C4 and the first end of the capacitor C6 are all electrically connected to the ground line; Pin 2 of the chip U1, the second end of the capacitor C4 and the second end of the capacitor C6 are all electrically connected to the VCC3.3 terminal; Pin 3 of the chip U1, the second end of the capacitor C3 and the first end of the switch S1 are all electrically connected to the VCC terminal; The second end of the switch S1 is electrically connected to the VBAT terminal; Pin 1 of the chip U3 is electrically connected to the first end of the diode D1 and the first end of the inductor L1; Pin 3 of the chip U3 is electrically connected to the first end of the resistor R18 and the first end of the resistor R21; Pin 4 of the chip U3 and the first end of the resistor R19 are all electrically connected to the VCC terminal; The first end of the inductor L1 and the first end of the capacitor C10 are electrically connected to the first end of the capacitor CZ2; the second end of the capacitor CZ2 and the first end of the capacitor C11 are electrically connected to the VCC3.3_CS terminal; the second end of the capacitor C10 and the second end of the capacitor C11 are electrically connected to the ground wire; the second end of the resistor R19 is electrically connected to the ground wire; the second end of the resistor R21 is electrically connected to the ground wire through the resistor R25; the second end of the diode D1, the second end of the resistor R18, and the first end of the capacitor C9 are electrically connected to the first end of the capacitor CZ1; the second end of the capacitor CZ1 , the first end of the capacitor C8, the first end of the capacitor C12 and the first end of the diode D2 are all electrically connected to the VCC5_CS terminal; the second end of the capacitor C9, the second end of the capacitor C8, the second end of the capacitor C12 and the second end of the diode D2 are all electrically connected to the ground line; the pin 1 of the transistor Q1 is electrically connected to the pin 3 of the transistor Q2, the first end of the capacitor C1 and the first end of the resistor R1 through the resistor R2; the pin 2 of the transistor Q1 is electrically connected to the VCC3.3 terminal through the resistor R2, the second end of the capacitor C1 and the second end of the resistor R1; the pin 3 of the transistor Q1 is electrically connected to the VCC3.3_CS terminal; the pin 1 of the transistor Q2 is electrically connected to the first end of the resistor R9 Electrical connection; Pin 2 of the transistor Q2 and the first end of the resistor R13 are both electrically connected to the ground wire; the second end of the resistor R9 and the second end of the resistor R13 are both electrically connected to Pin 46 of the chip U9 in the MCU circuit; the power management circuit is electrically connected to the solar charging management circuit through the VBAT endpoint; the power management circuit is electrically connected to the end screen power supply circuit through the VCC endpoint; the power management circuit is electrically connected to the ad acquisition circuit through the VCC3.3_CS endpoint and the VCC5_CS endpoint; the power management circuit is electrically connected to the industrial frequency signal sampling circuit through the VCC5_CS endpoint; the power management circuit is electrically connected to the high-frequency partial discharge acquisition circuit through the VCC5 endpoint;

[0018] The power management circuit provides each module with the power voltage required for operation.

[0019] According to the above technical solution, the end screen power supply circuit includes a chip U4, an interface P2, a resistor R17, a resistor R20, a resistor R22, a resistor R23, a resistor R24, a resistor R26, a resistor R27, a resistor R28, a resistor R29, a resistor R30, a resistor R31, an inductor L2, a capacitor C15, a capacitor C16, a capacitor FC1, a capacitor E1, a capacitor E2, a transistor Q3, a transistor Q4, a transistor Q5, a transistor Q6, a transistor Q7, a transistor Q8, a transistor Q9, a diode D3, a diode D4, a diode D5, a diode D6, a diode D7, a diode D8, a diode D9 and a diode D10, the chip U4 includes a pin 1, a pin 2, a pin 3, a pin 5 and a pin 6, and the interface P2 includes a pin 1 and a pin 2;

[0020] Pin 1 of the chip U4 is electrically connected to the first end of the diode D3, the first end of the capacitor FC1, pin 6 of the chip U4, the first end of the transistor Q4, the first end of the resistor R17, the first end of the transistor Q3, and the first end of the transistor Q5 through the inductor L2; pin 2 of the chip U4, the first end of the resistor R27, the first end of the capacitor C16, the first end of the capacitor E2, the first end of the transistor Q8, the first end of the transistor Q9, the second end of the capacitor FC1, the first end of the capacitor C15, the first end of the diode D8, and the first end of the diode D9 are all electrically connected to the ground line; the pin 3 of the chip U4 and the first end of the resistor R28 are all electrically connected to the first end of the resistor R29; the pin 5 of the chip U4, the second end of the resistor R29, the second end of the capacitor C16, the second end of the capacitor E2, the second end of the transistor Q8, the first end of the resistor R26 and the first end of the transistor Q7 are all electrically connected to the VCC0 terminal; the pin 1 of the interface P2, the first end of the diode D5 and the second end of the diode D8 are all electrically connected to the first end of the diode D6; the pin 2 ...3 of the chip U4 and the first end of the resistor R28 are all electrically connected to the first end of the resistor R29; the pin 5 of the chip U4, the second end of the resistor R29, the second end of the capacitor C16, the second end of the capacitor E2, the second end of the transistor Q8, the first end of the resistor R26 and the first end of the transistor Q7 are all electrically connected to the VCC0 terminal; the pin 1 of the interface P2, the first end of the diode D5 and the second end of the diode D8 are all electrically connected to the first end of the diode D6 The second end of the diode D6 and the second end of the diode D7 are electrically connected to the first end of the diode D7; the second end of the diode D6, the second end of the diode D7 and the second end of the diode D3 are electrically connected to the second end of the capacitor C15; the second end of R27 is electrically connected to the second end of R28; the second end of the transistor Q4 is electrically connected to the first end of the transistor Q6 through the diode D4 and the resistor R22; the third end of the transistor Q4, the second end of the transistor Q6, the first end of the capacitor E2 and the second end of the transistor Q5 are electrically connected to the ground line; the transistor The third end of the transistor Q6 and the second end of the resistor R17 are electrically connected to the second end of the transistor Q3 through the resistor R20; the third end of the transistor Q3 and the second end of the capacitor E2 are electrically connected to the third end of the transistor Q5 through the resistor R23; the third end of the transistor Q8 is electrically connected to the second end of the transistor Q9 through the resistor R31; the third end of the transistor Q9 and the second end of the resistor R26 are electrically connected to the second end of the transistor Q7 through the resistor R30; the third end of the transistor Q7 is electrically connected to the VCC terminal through the diode D10;

[0021] The end-screen power supply circuit uses the end-screen current signal that needs to be measured to collect the energy of the signal to power the device, and supplies power simultaneously with the solar energy to increase the stability and continuity of the device's power supply, reduce battery power consumption, and reduce power consumption.

[0022] According to the above technical solution, the solar charging management circuit includes a chip U8, an interface P3, a resistor R49, a resistor R50, a resistor R51, a resistor R52, a capacitor C23, a capacitor C24, a capacitor C25, a capacitor C26, a diode D11, a diode LED1, a diode LED2 and a battery BT1, the chip U8 includes pin 1, pin 2, pin 3, pin 4, pin 5, pin 6, pin 7 and pin 8, and the interface P3 includes pin 1 and pin 2;

[0023] Pin 1 of the chip U8 and the first end of the resistor R50 are electrically connected to the first end of the resistor R52; Pin 2 of the chip U8 is electrically connected to the first end of the resistor R51; Pin 3 of the chip U8, the second end of the resistor R51 and the second end of the resistor R52 are electrically connected to the ground line; Pin 4 of the chip U8, the second end of the resistor R50, the first end of the resistor R49, the first end of the capacitor C23 and the first end of the capacitor C25 are electrically connected to Pin 1 of the interface P3 through the diode D11; Pin 5 of the chip U8, Pin 8 of the chip U8, the first end of the capacitor C24, the first end of the capacitor C25 The first end of the pin 6 and the first end of the battery BT1 are electrically connected to the power management circuit through the VBAT endpoint; the pin 6 of the chip U8 is electrically connected to the first end of the diode LED1; the pin 7 of the chip U8 is electrically connected to the first end of the diode LED2; the pin 2 of the interface P3, the second end of the capacitor C23 and the second end of the capacitor C25 are electrically connected to the ground line; the second end of the diode LED1 and the second end of LED2 are electrically connected to the second end of the resistor R49; the second end of the capacitor C24, the second end of the capacitor C26 and the second end of the battery BT1 are electrically connected to the ground line;

[0024] Solar charging management circuit, collecting and transmitting solar energy.

[0025] According to the above technical solution, the ad acquisition circuit includes a chip U10, a crystal oscillator Y3, a resistor R62, a resistor R64, a resistor R65, a capacitor C31, a capacitor C32, a capacitor C34, a capacitor C36, a capacitor C38, a capacitor C39 and a capacitor C40, the chip U10 includes pin 1, pin 3, pin 4, pin 5, pin 6, pin 7, pin 8, pin 11, pin 12, pin 14, pin 15, pin 16, pin 17, pin 19, pin 20, pin 23 and pin 24, the crystal oscillator Y3 includes pin 1 and pin 2;

[0026] Pin 1 of the chip U10 and pin 1 of the crystal oscillator Y3 are electrically connected to the first end of the capacitor C31; Pin 3 of the chip U10, the first end of the capacitor C34 and the first end of the capacitor C36 are electrically connected to the VCC3.3_CS terminal; Pin 4 of the chip U10, Pin 8 of the chip U10, the second end of the capacitor C34 and the second end of the capacitor C36 are electrically connected to the ground wire; Pin 5 of the chip U10 is electrically connected to Pin 15 of the chip U9 in the MCU circuit; Pin 6 of the chip U10 is electrically connected to Pin 16 of the chip U9 in the MCU circuit; Pin 7 of the chip U10 is electrically connected to Pin 14 of the chip U9 in the MCU circuit; Pin 11 of the chip U10 and Pin 12 of the chip U10 are electrically connected to the ground wire through capacitor C40; Pin 14 of the chip U10 is electrically connected to the first end of the resistor R65; Pin 15 of the chip U10 is electrically connected to the power frequency signal sampling circuit; Pin 16 of chip U10 is electrically connected to the power frequency signal sampling circuit and the VCC2.5_CS terminal; Pin 17 of the chip U10 and the first end of the resistor R64 are electrically connected to the ground line through the resistor R62; Pin 19 of the chip U10 is electrically connected to Pin 42 of the chip U9 in the MCU circuit; Pin 20 of the chip U10 is electrically connected to Pin 43 of the chip U9 in the MCU circuit; Pin 23 of the chip U10 is electrically connected to Pin 17 of the chip U9 in the MCU circuit; Pin 24 of the chip U10 and Pin 2 of the crystal oscillator Y3 are electrically connected to the first end of the capacitor C32; The second end of the capacitor C31 and the second end of the capacitor C32 are electrically connected to the ground line; The second end of the resistor R65, the second end of the resistor R64, the first end of the capacitor C38 and the first end of the capacitor C39 are electrically connected to the VCC5_CS terminal; The second end of the capacitor C38 and the second end of the capacitor C39 are electrically connected to the ground line;

[0027] AD acquisition circuit, collects industrial frequency signals.

[0028] According to the above technical solution, the power frequency signal sampling circuit includes a chip U2, an interface P1, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R10, a resistor R11, a resistor R12, a resistor R14, a resistor R15, a resistor R16, a capacitor C2, a capacitor C5, a capacitor C7, a capacitor C13 and a capacitor C14, the chip U2 includes a pin 1, a pin 3, a pin 4 and a pin 5, and the interface P1 includes a pin 1 and a pin 2;

[0029] Pin 1 of the chip U2 and the first end of the resistor R3 are electrically connected to pin 16 of the chip U10 in the ad acquisition circuit; Pin 3 of the chip U2 is electrically connected to the first end of the resistor R7; Pin 4 of the chip U2 and the first end of the resistor R3 are electrically connected to the VCC2.5_CS terminal through the resistor R8; Pin 5 of the chip U2 is electrically connected to the VCC5_CS terminal; The second end of the resistor R7, the first end of the resistor R12, the first end of the capacitor C2 and the first end of the capacitor C5 are electrically connected to the first end of the resistor R4; The second end of the resistor R12 is electrically connected to the ground line; Pin 1 of the interface P1, the first end of the resistor R6 and the first end of the resistor R10 are electrically connected to the first end of the resistor R11; Pin 2 of the interface P1, the second end of the resistor R6 and the first end of the capacitor C2 are electrically connected to the VCC5_CS terminal; The first end of the resistor R5 is electrically connected to the second end of the resistor R4; the second end of the resistor R5, the second end of the resistor R10 and the first end of the capacitor C7 are electrically connected to the second end of the capacitor C2; the second end of the capacitor C7, the second end of the resistor R11 and the second end of the capacitor C5 are electrically connected to the VCC2.5_CS terminal; the first end of the resistor R14 is electrically connected to the VCC5_CS terminal; the first end of the resistor R15 is electrically connected to the VCC2.5_CS terminal; the second end of the capacitor C14, the second end of the resistor R15, the first end of the resistor R16, the first end of the capacitor C13 and the first end of the capacitor C14 are electrically connected to the VCC2.5 terminal; the second end of the resistor R16, the second end of the capacitor C13 and the second end of the capacitor C14 are electrically connected to the ground line;

[0030] The industrial frequency signal sampling circuit amplifies and transmits the industrial frequency signal.

[0031] According to the above technical solution, the high-frequency partial discharge acquisition circuit includes an interface J1, a chip U7, an amplifier U5A, an amplifier U5B, a resistor R32, a resistor R33, a resistor R34, a resistor R35, a resistor R36, a resistor R37, a resistor R38, a resistor R40, a resistor R42, a resistor R43, a resistor R44, a resistor R45, a resistor R46, a resistor R47, a resistor R48, a resistor PT1, a resistor PT2, a capacitor C17, a capacitor C18, a capacitor C19, a capacitor C20 and a capacitor C22, the interface J1 includes a pin 2, the chip U2 includes a pin 1, a pin 4, a pin 5, a pin 7 and a pin 8, the amplifier U5A includes a pin 1, a pin 2, a pin 3 and a pin 8, and the amplifier U5B includes a pin 5, a pin 6 and a pin 7;

[0032] Pin 2 of the interface J1 is electrically connected to the first end of the resistor R33 and the first end of the resistor R38 through the resistor R32 and the capacitor C18; the second end of the resistor R38 is electrically connected to the ground line; the second end of the resistor R32 is electrically connected to pin 3 of the amplifier U5A; pin 2 of the amplifier U5A, the first end of the resistor R42, the first end of the resistor 45, the first end of the resistor R45 and the first end of the resistor PT1 are all electrically connected to the ground line through the resistor R34; the second end of the resistor R42 is electrically connected to the first end of the resistor R43 The pin 8 of the amplifier U5A is electrically connected to the ground wire through the capacitor C17; the pin 1 of the amplifier U5A, the second end of the resistor R43, the second end of the resistor R45, the second end of the resistor PT1 and the first end of the resistor R39 are all electrically connected to the first end of the capacitor C20; the second end of the capacitor C20 is electrically connected to the pin 8 of the chip U7; the second end of the resistor R39 and the first end of the capacitor C19 are both electrically connected to the ground wire; the second end of the capacitor C19 is electrically connected to the pin 1 of the chip U7; the chip Pin 5 of U7, pin 6 of chip U7 and the first end of capacitor C22 are all electrically connected to the first end of resistor R47; the second end of capacitor C22 is electrically connected to ground; the second end of resistor R47 is electrically connected to VCC5 terminal; pin 4 of chip U7 and the first end of resistor R37 are all electrically connected to the first end of resistor R35; the second end of resistor R37 is electrically connected to ground; the second end of resistor R35 is electrically connected to pin 5 of amplifier U5B; pin 6 of amplifier U5B, resistor R4 The first end of the resistor 6, the first end of the resistor 48 and the first end of the resistor PT2 are all electrically connected to the ground through the resistor R41; the second end of the resistor R46, the second end of the resistor 48 and the second end of the resistor PT2 are all electrically connected to the first end of the resistor R44; the pin 7 of the amplifier U5B, the second end of the resistor 44 and the first end of the resistor R40 are all electrically connected to the first end of the resistor R36; the second end of the resistor R40 is electrically connected to the ground; the second end of the resistor R36 is electrically connected to the pin 29 of the chip U9 in the MCU circuit;

[0033] High-frequency partial discharge acquisition circuit, partial discharge acquisition circuit, mainly collects 1M-30M alternating high-frequency discharge pulse signals, amplifies and transmits the high-frequency signals.

[0034] According to the above technical solution, the wireless loar communication circuit includes a chip U6, a capacitor C21 and an antenna ANT1, and the chip U6 includes pins 6, 7 and 17;

[0035] Pin 6 of the chip U6 is electrically connected to pin 12 of the chip U9 in the MCU circuit; pin 7 of the chip U6 is electrically connected to pin 13 of the chip U9 in the MCU circuit; pin 17 of the chip U6 is electrically connected to the ground wire through capacitor C21 and antenna ANT1;

[0036] Wireless lora communication circuit, the communication interface is connected to the MCU serial port transceiver interface for data interaction.

[0037] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0038] The utility model adopts a dual simultaneous power supply solution and wireless lora communication, which provides stability for equipment operation, solves the traditional wired power supply and wired communication solutions of high-voltage transformer devices, reduces the difficulty of on-site construction, provides a safe environment for the construction process, and solves the safety issues of device operation after construction. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0040] Figure 1 This is the system structure diagram of the utility model low-power wireless lora type main transformer bushing insulation monitoring circuit;

[0041] Figure 2 It is the principle diagram of the MCU circuit of the low-power wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0042] Figure 3 It is the principle diagram of the battery voltage acquisition circuit of the low-power wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0043] Figure 4 It is the principle diagram of the temperature acquisition circuit of the low-power wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0044] Figure 5 It is the principle diagram of the power management circuit of the low-power wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0045] Figure 6 It is the principle diagram of the end screen power supply circuit of the low-power wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0046] Figure 7 It is the principle diagram of part A in the end screen power taking circuit of the low power consumption wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0047] Figure 8 It is the principle diagram of part B in the end screen power taking circuit of the low power consumption wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0048] Fig. 9 It is the principle diagram of the solar charging management circuit of the utility model low-power wireless lora type main transformer bushing insulation monitoring circuit;

[0049] Fig.10 It is the principle diagram of the AD acquisition circuit of the low-power wireless LoRa type main transformer bushing insulation monitoring circuit of the utility model;

[0050] Fig.11 It is the principle diagram of the power frequency signal sampling circuit of the low-power wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0051] Fig.12 It is the principle diagram of the high-frequency partial discharge acquisition circuit of the low-power wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0052] Fig.13 It is the principle diagram of part A in the high-frequency partial discharge acquisition circuit of the low-power wireless lora type main transformer bushing insulation monitoring circuit of the utility model;

[0053] Fig.14 It is the principle diagram of part B in the high-frequency partial discharge acquisition circuit of the low-power wireless LoRa type main transformer bushing insulation monitoring circuit of the utility model;

[0054] Fig.15 The utility model is a schematic diagram of a wireless loar communication circuit of a low-power wireless lora type main transformer bushing insulation monitoring circuit. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0056] See also Figure 1 , the utility model provides a technical solution:

[0057] Low-power wireless lora type main transformer bushing insulation monitoring circuit, the utility model includes MCU circuit, battery voltage acquisition circuit, temperature acquisition circuit, power management circuit, end screen power circuit, solar charging management circuit, AD acquisition circuit, power frequency signal sampling circuit, high-frequency partial discharge acquisition circuit and wireless loar communication circuit;

[0058] The MCU circuit is connected to a battery voltage acquisition circuit, a temperature acquisition circuit, a power management circuit, an AD acquisition circuit, a high-frequency partial discharge acquisition circuit and a wireless loar communication circuit; the power management circuit is connected to a terminal screen power collection circuit, a solar charging management circuit, an AD acquisition circuit, an industrial frequency signal sampling circuit and a high-frequency partial discharge acquisition circuit; and the AD acquisition circuit is connected to an industrial frequency signal sampling circuit.

[0059] See also Figure 2 , the MCU circuit includes a chip U9, an interface SWD1, a crystal oscillator Y1, a crystal oscillator Y2, a resistor R55=10K, a resistor R57=10K, a resistor R58=1K, a resistor R59=10K, a capacitor C28=20pF, a capacitor C29=12pF, a capacitor C30=20pF, a capacitor C33=12pF and a capacitor C35=100pF, the chip U9 includes pin 3, pin 4, pin 5, pin 6, pin 7, pin 12, pin 13, pin 14, pin 15, pin 16, pin 17, pin 25, pin 26, pin 29, pin 34, pin 37, pin 42, pin 43, pin 44, pin 45 and pin 46, the interface SWD1 includes pin 1, pin 2, pin 3 and pin 4, the crystal oscillator Y1 includes pin 1 and pin 2, and the crystal oscillator Y2 includes pin 1 and pin 2;

[0060] Pin 3 of the chip U9 and pin 2 of the crystal oscillator Y2 are both electrically connected to the ground wire through capacitor C29; pin 4 of the chip U9 and pin 1 of the crystal oscillator Y2 are both electrically connected to the ground wire through capacitor C33; pin 5 of the chip U9 and pin 2 of the crystal oscillator Y1 are both electrically connected to the ground wire through capacitor C28; pin 6 of the chip U9 and pin 1 of the crystal oscillator Y1 are both electrically connected to the ground wire through capacitor C30; pin 7 of the chip U9 and the first end of the capacitor C35 are both electrically connected to the VCC3.3 terminal through resistor R59; the second end of the capacitor C35 is electrically connected to the ground wire; pin 12 and pin 13 of the chip U9 are both electrically connected to the wireless loar communication circuit; pin 14, pin 15, pin 16, pin 17, pin 4 of the chip U9 2 and pin 43 are electrically connected to the ad acquisition circuit; pin 25 of the chip U9 is electrically connected to the temperature acquisition circuit; pin 26 of the chip U9 is electrically connected to the battery voltage acquisition circuit; pin 34 of the chip U9 and the first end of the resistor R55 are electrically connected to pin 2 of the interface SWD1; the second end of the resistor R55 and pin 1 of the interface SWD1 are electrically connected to the VCC3.3 terminal; pin 37 of the chip U9 and the first end of the resistor R57 are electrically connected to pin 3 of the interface SWD1; the second end of the resistor R57 and pin 4 of the interface SWD1 are electrically connected to the ground wire; pin 44 of the chip U9 is electrically connected to the ground wire through resistor R58; pins 45 and 46 of the chip U9 are electrically connected to the power management;

[0061] The MCU circuit adopts a low-power MCU design to reduce device energy consumption and battery power consumption.

[0062] See also Figure 3 The battery voltage acquisition circuit includes a resistor R53 = 510K, a resistor R54 = 510K and a capacitor C27 = 470nF. Please refer to Figure 4 , the temperature acquisition circuit includes a resistor R60=100K, a resistor R61=100K, a resistor R61=100K and a capacitor C37=470nF;

[0063] The first end of the resistor R53 is electrically connected to the VBAT terminal; the second end of the resistor R53, the first end of the resistor R54 and the first end of the capacitor C27 are electrically connected to the pin 26 of the chip U9 in the MCU circuit; the second end of the resistor R54 and the second end of the capacitor C27 are electrically connected to the ground line; the first end of the resistor R60 is electrically connected to the VCC3.3 terminal; the second end of the resistor R60, the first end of the resistor R61 and the first end of the capacitor C37 are electrically connected to the pin 25 of the chip U9 in the MCU circuit; the second end of the resistor R61 and the second end of the capacitor C37 are electrically connected to the ground line through the resistor R63;

[0064] The battery voltage collection circuit collects the voltage of the battery inside the device and sends the battery voltage information to the station platform via wireless lora, so that the platform personnel can understand the power status of the device in time;

[0065] The temperature acquisition circuit monitors the temperature of the battery inside the device to prevent overcharging or abnormal discharge of the battery and abnormal temperature rise, and uploads the battery temperature during operation to the station platform via Lora.

[0066] See also Figure 5 The power management circuit includes a chip U1, a chip U3, a transistor Q1, a transistor Q2, a resistor R1=10K, a resistor R2=100K, a resistor R9=100, a resistor R13=100K, a resistor R18=110K, a resistor R19=100K, a resistor R21=15K, a resistor R25=0, an inductor L1=10uH, a capacitor C1=100nF, a capacitor C3=220uF, a capacitor C4=100uF, a capacitor C6=1uF, and a capacitor C 8=10uF, capacitor C9=10uF, capacitor C10=10uF, capacitor C11=10uF, capacitor C12=100uF, capacitor CZ1, capacitor CZ2, diode D1, diode D2 and switch S1, the chip U1 includes pin 1, pin 2 and pin 3, the chip U3 includes pin 1, pin 3, pin 4 and pin 5, the transistor Q1 includes pin 1, pin 2 and pin 3, and the transistor Q2 includes pin 1, pin 2 and pin 3;

[0067] When the value of each component involved in the technical solution is 0, it means that the component is a spare component;

[0068] Pin 1 of the chip U1, the first end of the capacitor C3, the first end of the capacitor C4 and the first end of the capacitor C6 are all electrically connected to the ground line; Pin 2 of the chip U1, the second end of the capacitor C4 and the second end of the capacitor C6 are all electrically connected to the VCC3.3 terminal; Pin 3 of the chip U1, the second end of the capacitor C3 and the first end of the switch S1 are all electrically connected to the VCC terminal; The second end of the switch S1 is electrically connected to the VBAT terminal; Pin 1 of the chip U3 is electrically connected to the first end of the diode D1 and the first end of the inductor L1; Pin 3 of the chip U3 is electrically connected to the first end of the resistor R18 and the first end of the resistor R21; Pin 4 of the chip U3 and the first end of the resistor R19 are all electrically connected to the VCC terminal; The first end of the inductor L1 and the first end of the capacitor C10 are electrically connected to the first end of the capacitor CZ2; the second end of the capacitor CZ2 and the first end of the capacitor C11 are electrically connected to the VCC3.3_CS terminal; the second end of the capacitor C10 and the second end of the capacitor C11 are electrically connected to the ground wire; the second end of the resistor R19 is electrically connected to the ground wire; the second end of the resistor R21 is electrically connected to the ground wire through the resistor R25; the second end of the diode D1, the second end of the resistor R18, and the first end of the capacitor C9 are electrically connected to the first end of the capacitor CZ1; the second end of the capacitor CZ1 , the first end of the capacitor C8, the first end of the capacitor C12 and the first end of the diode D2 are all electrically connected to the VCC5_CS terminal; the second end of the capacitor C9, the second end of the capacitor C8, the second end of the capacitor C12 and the second end of the diode D2 are all electrically connected to the ground line; the pin 1 of the transistor Q1 is electrically connected to the pin 3 of the transistor Q2, the first end of the capacitor C1 and the first end of the resistor R1 through the resistor R2; the pin 2 of the transistor Q1 is electrically connected to the VCC3.3 terminal through the resistor R2, the second end of the capacitor C1 and the second end of the resistor R1; the pin 3 of the transistor Q1 is electrically connected to the VCC3.3_CS terminal; the pin 1 of the transistor Q2 is electrically connected to the first end of the resistor R9 Electrical connection; Pin 2 of the transistor Q2 and the first end of the resistor R13 are both electrically connected to the ground wire; the second end of the resistor R9 and the second end of the resistor R13 are both electrically connected to Pin 46 of the chip U9 in the MCU circuit; the power management circuit is electrically connected to the solar charging management circuit through the VBAT endpoint; the power management circuit is electrically connected to the end screen power supply circuit through the VCC endpoint; the power management circuit is electrically connected to the ad acquisition circuit through the VCC3.3_CS endpoint and the VCC5_CS endpoint; the power management circuit is electrically connected to the industrial frequency signal sampling circuit through the VCC5_CS endpoint; the power management circuit is electrically connected to the high-frequency partial discharge acquisition circuit through the VCC5 endpoint;

[0069] The power management circuit provides the power supply voltage required for the operation of each module. The VBAT endpoint refers to the battery terminal, which is used to store and release power.

[0070] See also Figure 6-Figure 8 The end screen power supply circuit includes chip U4, interface P2, resistor R17 = 10K, resistor R20 = 10K, resistor R22 = 10K, resistor R23 = 1M, resistor R24 ​​= 1K, resistor R26 = 10K, resistor R27 = 300K, resistor R28 = 300K, resistor R29 = 1M, resistor R30 = 10K, resistor R31 = 10K, inductor L2 = 4.7uF, capacitor C15 = 100nF, capacitor C16 = 100nF , capacitor FC1=5F, capacitor E1=10uF, capacitor E2=10uF, transistor Q3, transistor Q4, transistor Q5, transistor Q6, transistor Q7, transistor Q8, transistor Q9, diode D3, diode D4, diode D5, diode D6, diode D7, diode D8, diode D9 and diode D10, the chip U4 includes pin 1, pin 2, pin 3, pin 5 and pin 6, and the interface P2 includes pin 1 and pin 2;

[0071] Pin 1 of the chip U4 is electrically connected to the first end of the diode D3, the first end of the capacitor FC1, pin 6 of the chip U4, the first end of the transistor Q4, the first end of the resistor R17, the first end of the transistor Q3, and the first end of the transistor Q5 through the inductor L2; pin 2 of the chip U4, the first end of the resistor R27, the first end of the capacitor C16, the first end of the capacitor E2, the first end of the transistor Q8, the first end of the transistor Q9, the second end of the capacitor FC1, the first end of the capacitor C15, the first end of the diode D8, and the first end of the diode D9 are all electrically connected to the ground line; the pin 3 of the chip U4 and the first end of the resistor R28 are all electrically connected to the first end of the resistor R29; the pin 5 of the chip U4, the second end of the resistor R29, the second end of the capacitor C16, the second end of the capacitor E2, the second end of the transistor Q8, the first end of the resistor R26 and the first end of the transistor Q7 are all electrically connected to the VCC0 terminal; the pin 1 of the interface P2, the first end of the diode D5 and the second end of the diode D8 are all electrically connected to the first end of the diode D6; the pin 2 ...3 of the chip U4 and the first end of the resistor R28 are all electrically connected to the first end of the resistor R29; the pin 5 of the chip U4, the second end of the resistor R29, the second end of the capacitor C16, the second end of the capacitor E2, the second end of the transistor Q8, the first end of the resistor R26 and the first end of the transistor Q7 are all electrically connected to the VCC0 terminal; the pin 1 of the interface P2, the first end of the diode D5 and the second end of the diode D8 are all electrically connected to the first end of the diode D6 The second end of the diode D6 and the second end of the diode D7 are electrically connected to the first end of the diode D7; the second end of the diode D6, the second end of the diode D7 and the second end of the diode D3 are electrically connected to the second end of the capacitor C15; the second end of R27 is electrically connected to the second end of R28; the second end of the transistor Q4 is electrically connected to the first end of the transistor Q6 through the diode D4 and the resistor R22; the third end of the transistor Q4, the second end of the transistor Q6, the first end of the capacitor E2 and the second end of the transistor Q5 are electrically connected to the ground line; the transistor The third end of the transistor Q6 and the second end of the resistor R17 are electrically connected to the second end of the transistor Q3 through the resistor R20; the third end of the transistor Q3 and the second end of the capacitor E2 are electrically connected to the third end of the transistor Q5 through the resistor R23; the third end of the transistor Q8 is electrically connected to the second end of the transistor Q9 through the resistor R31; the third end of the transistor Q9 and the second end of the resistor R26 are electrically connected to the second end of the transistor Q7 through the resistor R30; the third end of the transistor Q7 is electrically connected to the VCC terminal through the diode D10;

[0072] The end-screen power supply circuit uses the end-screen current signal that needs to be measured to collect the energy of the signal to power the device, and supplies power simultaneously with the solar energy to increase the stability and continuity of the device's power supply, reduce battery power consumption, and reduce power consumption.

[0073] See also Fig. 9, the solar charging management circuit includes a chip U8, an interface P3, a resistor R49=3.3K, a resistor R50=1K, a resistor R51=2K, a resistor R52 is a negative temperature coefficient thermistor, a capacitor C23=22uF, a capacitor C24=22uF, a capacitor C25=100nF, a capacitor C26=100nF, a diode D11, a diode LED1, a diode LED2 and a battery BT1, the chip U8 includes pin 1, pin 2, pin 3, pin 4, pin 5, pin 6, pin 7 and pin 8, and the interface P3 includes pin 1 and pin 2;

[0074] Pin 1 of the chip U8 and the first end of the resistor R50 are electrically connected to the first end of the resistor R52; Pin 2 of the chip U8 is electrically connected to the first end of the resistor R51; Pin 3 of the chip U8, the second end of the resistor R51 and the second end of the resistor R52 are electrically connected to the ground line; Pin 4 of the chip U8, the second end of the resistor R50, the first end of the resistor R49, the first end of the capacitor C23 and the first end of the capacitor C25 are electrically connected to Pin 1 of the interface P3 through the diode D11; Pin 5 of the chip U8, Pin 8 of the chip U8, the first end of the capacitor C24, the first end of the capacitor C25 The first end of the pin 6 and the first end of the battery BT1 are electrically connected to the power management circuit through the VBAT endpoint; the pin 6 of the chip U8 is electrically connected to the first end of the diode LED1; the pin 7 of the chip U8 is electrically connected to the first end of the diode LED2; the pin 2 of the interface P3, the second end of the capacitor C23 and the second end of the capacitor C25 are electrically connected to the ground line; the second end of the diode LED1 and the second end of LED2 are electrically connected to the second end of the resistor R49; the second end of the capacitor C24, the second end of the capacitor C26 and the second end of the battery BT1 are electrically connected to the ground line;

[0075] Solar charging management circuit, collecting and transmitting solar energy.

[0076] See also Fig.10 , the ad acquisition circuit includes a chip U10, a crystal oscillator Y3, a resistor R62=33K, a resistor R64=30K, a resistor R65=0, a capacitor C31=12pF, a capacitor C32=12pF, a capacitor C34=220uF, a capacitor C36=100nF, a capacitor C38=220uF, a capacitor C39=100nF and a capacitor C40=100nF, the chip U10 includes pin 1, pin 3, pin 4, pin 5, pin 6, pin 7, pin 8, pin 11, pin 12, pin 14, pin 15, pin 16, pin 17, pin 19, pin 20, pin 23 and pin 24, the crystal oscillator Y3 includes pin 1 and pin 2;

[0077] Pin 1 of the chip U10 and pin 1 of the crystal oscillator Y3 are electrically connected to the first end of the capacitor C31; Pin 3 of the chip U10, the first end of the capacitor C34 and the first end of the capacitor C36 are electrically connected to the VCC3.3_CS terminal; Pin 4 of the chip U10, Pin 8 of the chip U10, the second end of the capacitor C34 and the second end of the capacitor C36 are electrically connected to the ground wire; Pin 5 of the chip U10 is electrically connected to Pin 15 of the chip U9 in the MCU circuit; Pin 6 of the chip U10 is electrically connected to Pin 16 of the chip U9 in the MCU circuit; Pin 7 of the chip U10 is electrically connected to Pin 14 of the chip U9 in the MCU circuit; Pin 11 of the chip U10 and Pin 12 of the chip U10 are electrically connected to the ground wire through capacitor C40; Pin 14 of the chip U10 is electrically connected to the first end of the resistor R65; Pin 15 of the chip U10 is electrically connected to the power frequency signal sampling circuit; Pin 16 of chip U10 is electrically connected to the power frequency signal sampling circuit and the VCC2.5_CS terminal; Pin 17 of the chip U10 and the first end of the resistor R64 are electrically connected to the ground line through the resistor R62; Pin 19 of the chip U10 is electrically connected to Pin 42 of the chip U9 in the MCU circuit; Pin 20 of the chip U10 is electrically connected to Pin 43 of the chip U9 in the MCU circuit; Pin 23 of the chip U10 is electrically connected to Pin 17 of the chip U9 in the MCU circuit; Pin 24 of the chip U10 and Pin 2 of the crystal oscillator Y3 are electrically connected to the first end of the capacitor C32; The second end of the capacitor C31 and the second end of the capacitor C32 are electrically connected to the ground line; The second end of the resistor R65, the second end of the resistor R64, the first end of the capacitor C38 and the first end of the capacitor C39 are electrically connected to the VCC5_CS terminal; The second end of the capacitor C38 and the second end of the capacitor C39 are electrically connected to the ground line;

[0078] The ad acquisition circuit acquires the power frequency signal processed by the power frequency signal sampling circuit.

[0079] See also Fig.11 , the power frequency signal sampling circuit includes a chip U2, an interface P1, a resistor R3=9K, a resistor R4=10K, a resistor R5=100, a resistor R6=100, a resistor R7=1K, a resistor R8=1K, a resistor R10=100, a resistor R11=10K, a resistor R12=10K, a resistor R14=100K, a resistor R15=0, a resistor R16=100K, a capacitor C2=100nF, a capacitor C5=100nF, a capacitor C7=100nF, a capacitor C13=100nF and a capacitor C14=100nF, the chip U2 includes pins 1, 3, 4 and 5, and the interface P1 includes pins 1 and 2;

[0080] Pin 1 of the chip U2 and the first end of the resistor R3 are electrically connected to pin 16 of the chip U10 in the ad acquisition circuit; Pin 3 of the chip U2 is electrically connected to the first end of the resistor R7; Pin 4 of the chip U2 and the first end of the resistor R3 are electrically connected to the VCC2.5_CS terminal through the resistor R8; Pin 5 of the chip U2 is electrically connected to the VCC5_CS terminal; The second end of the resistor R7, the first end of the resistor R12, the first end of the capacitor C2 and the first end of the capacitor C5 are electrically connected to the first end of the resistor R4; The second end of the resistor R12 is electrically connected to the ground line; Pin 1 of the interface P1, the first end of the resistor R6 and the first end of the resistor R10 are electrically connected to the first end of the resistor R11; Pin 2 of the interface P1, the second end of the resistor R6 and the first end of the capacitor C2 are electrically connected to the VCC5_CS terminal; The first end of the resistor R5 is electrically connected to the second end of the resistor R4; the second end of the resistor R5, the second end of the resistor R10 and the first end of the capacitor C7 are electrically connected to the second end of the capacitor C2; the second end of the capacitor C7, the second end of the resistor R11 and the second end of the capacitor C5 are electrically connected to the VCC2.5_CS terminal; the first end of the resistor R14 is electrically connected to the VCC5_CS terminal; the first end of the resistor R15 is electrically connected to the VCC2.5_CS terminal; the second end of the capacitor C14, the second end of the resistor R15, the first end of the resistor R16, the first end of the capacitor C13 and the first end of the capacitor C14 are electrically connected to the VCC2.5 terminal; the second end of the resistor R16, the second end of the capacitor C13 and the second end of the capacitor C14 are electrically connected to the ground line;

[0081] The industrial frequency signal sampling circuit amplifies and transmits the industrial frequency signal.

[0082] See also Figure 12-14 The high-frequency partial discharge acquisition circuit includes an interface J1, a chip U7, an amplifier U5A, an amplifier U5B, a resistor R32=0, a resistor R33=2K, a resistor R34=2K, a resistor R35=2K, a resistor R36=100, a resistor R37=200, a resistor R38=2K, a resistor R40=100K, a resistor R42=6.8K, a resistor R43=0, a resistor R44=0, a resistor R45=1M, a resistor R46=20K, a resistor R47=5Ω, a resistor R48=1M, resistor PT1=100K, resistor PT2=100K, capacitor C17=103, capacitor C18=203, capacitor C19=10nF, capacitor C20=10nF and capacitor C22=10nF, the interface J1 includes pin 2, the chip U2 includes pin 1, pin 4, pin 5, pin 7 and pin 8, the amplifier U5A includes pin 1, pin 2, pin 3 and pin 8, and the amplifier U5B includes pin 5, pin 6 and pin 7;

[0083] Pin 2 of the interface J1 is electrically connected to the first end of the resistor R33 and the first end of the resistor R38 through the resistor R32 and the capacitor C18; the second end of the resistor R38 is electrically connected to the ground line; the second end of the resistor R32 is electrically connected to pin 3 of the amplifier U5A; pin 2 of the amplifier U5A, the first end of the resistor R42, the first end of the resistor 45, the first end of the resistor R45 and the first end of the resistor PT1 are all electrically connected to the ground line through the resistor R34; the second end of the resistor R42 is electrically connected to the first end of the resistor R43 The pin 8 of the amplifier U5A is electrically connected to the ground wire through the capacitor C17; the pin 1 of the amplifier U5A, the second end of the resistor R43, the second end of the resistor R45, the second end of the resistor PT1 and the first end of the resistor R39 are all electrically connected to the first end of the capacitor C20; the second end of the capacitor C20 is electrically connected to the pin 8 of the chip U7; the second end of the resistor R39 and the first end of the capacitor C19 are both electrically connected to the ground wire; the second end of the capacitor C19 is electrically connected to the pin 1 of the chip U7; the chip Pin 5 of U7, pin 6 of chip U7 and the first end of capacitor C22 are all electrically connected to the first end of resistor R47; the second end of capacitor C22 is electrically connected to ground; the second end of resistor R47 is electrically connected to VCC5 terminal; pin 4 of chip U7 and the first end of resistor R37 are all electrically connected to the first end of resistor R35; the second end of resistor R37 is electrically connected to ground; the second end of resistor R35 is electrically connected to pin 5 of amplifier U5B; pin 6 of amplifier U5B, resistor R4 The first end of the resistor 6, the first end of the resistor 48 and the first end of the resistor PT2 are all electrically connected to the ground through the resistor R41; the second end of the resistor R46, the second end of the resistor 48 and the second end of the resistor PT2 are all electrically connected to the first end of the resistor R44; the pin 7 of the amplifier U5B, the second end of the resistor 44 and the first end of the resistor R40 are all electrically connected to the first end of the resistor R36; the second end of the resistor R40 is electrically connected to the ground; the second end of the resistor R36 is electrically connected to the pin 29 of the chip U9 in the MCU circuit;

[0084] High-frequency partial discharge acquisition circuit, partial discharge acquisition circuit, mainly collects 1M-30M alternating high-frequency discharge pulse signals, amplifies and transmits the high-frequency signals.

[0085] See also Fig.15 , the wireless loar communication circuit includes a chip U6, a capacitor C21=10pF and an antenna ANT1, and the chip U6 includes pins 6, 7 and 17;

[0086] Pin 6 of the chip U6 is electrically connected to pin 12 of the chip U9 in the MCU circuit; pin 7 of the chip U6 is electrically connected to pin 13 of the chip U9 in the MCU circuit; pin 17 of the chip U6 is electrically connected to the ground wire through capacitor C21 and antenna ANT1;

[0087] Wireless lora communication circuit, the communication interface is connected to the MCU serial port transceiver interface for data interaction.

[0088] Example

[0089] The solar charging management circuit and the end-screen power-taking circuit collect power, and provide the power supply voltage required by each circuit through the power management circuit. The MCU circuit sends an operating instruction, and the power frequency signal sampling circuit samples the power frequency signal and performs corresponding processing. The processed power frequency signal is transmitted to the AD collection circuit, and the AD collection circuit transmits the collected power frequency signal to the MCU circuit; the high-frequency partial discharge collection circuit collects and processes the high-frequency signal, and the processed high-frequency signal is transmitted to the MCU circuit; the battery voltage collection circuit collects the voltage data of the battery and transmits it to the MCU circuit; the temperature collection circuit collects the temperature data of the battery and transmits it to the MCU circuit; after the MCU circuit processes the acquired signal and data, a corresponding display instruction is formed and transmitted through the wireless loar communication circuit.

[0090] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0091] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. Low power consumption wireless lora type main transformer bushing insulation monitoring circuit, characterized by: Including MCU circuit, battery voltage acquisition circuit, temperature acquisition circuit, power management circuit, end screen power collection circuit, solar charging management circuit, AD acquisition circuit, power frequency signal sampling circuit, high frequency partial discharge acquisition circuit and wireless loar communication circuit; The MCU circuit is connected to a battery voltage acquisition circuit, a temperature acquisition circuit, a power management circuit, an AD acquisition circuit, a high-frequency partial discharge acquisition circuit and a wireless loar communication circuit; the power management circuit is connected to a terminal screen power collection circuit, a solar charging management circuit, an AD acquisition circuit, an industrial frequency signal sampling circuit and a high-frequency partial discharge acquisition circuit; and the AD acquisition circuit is connected to an industrial frequency signal sampling circuit.

2. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 1 is characterized in that: The MCU circuit includes a chip U9, an interface SWD1, a crystal oscillator Y1, a crystal oscillator Y2, a resistor R55, a resistor R57, a resistor R58, a resistor R59, a capacitor C28, a capacitor C29, a capacitor C30, a capacitor C33 and a capacitor C35, the chip U9 includes pin 3, pin 4, pin 5, pin 6, pin 7, pin 12, pin 13, pin 14, pin 15, pin 16, pin 17, pin 25, pin 26, pin 29, pin 34, pin 37, pin 42, pin 43, pin 44, pin 45 and pin 46, the interface SWD1 includes pin 1, pin 2, pin 3 and pin 4, the crystal oscillator Y1 includes pin 1 and pin 2, and the crystal oscillator Y2 includes pin 1 and pin 2; Pin 3 of the chip U9 and pin 2 of the crystal oscillator Y2 are both electrically connected to the ground wire through capacitor C29; Pin 4 of the chip U9 and pin 1 of the crystal oscillator Y2 are both electrically connected to the ground wire through capacitor C33; Pin 5 of the chip U9 and pin 2 of the crystal oscillator Y1 are both electrically connected to the ground wire through capacitor C28; Pin 6 of the chip U9 and pin 1 of the crystal oscillator Y1 are both electrically connected to the ground wire through capacitor C30; Pin 7 of the chip U9 and the first end of the capacitor C35 are electrically connected to the VCC3.3 terminal through the resistor R59; The second end of the capacitor C35 is electrically connected to the ground line; Pins 12 and 13 of the chip U9 are electrically connected to the wireless loar communication circuit; Pins 14, 15, 16, 17, 42 and 43 of the chip U9 are all electrically connected to the ad acquisition circuit; Pin 25 of the chip U9 is electrically connected to the temperature acquisition circuit; Pin 26 of the chip U9 is electrically connected to the battery voltage collection circuit; The pin 34 of the chip U9 and the first end of the resistor R55 are both electrically connected to the pin 2 of the interface SWD1; The second end of the resistor R55 and the pin 1 of the interface SWD1 are both electrically connected to the VCC3.3 terminal; Pin 37 of the chip U9 and the first end of the resistor R57 are both electrically connected to pin 3 of the interface SWD1; The second end of the resistor R57 and the pin 4 of the interface SWD1 are both electrically connected to the ground wire; Pin 44 of the chip U9 is electrically connected to the ground wire through resistor R58; Pins 45 and 46 of the chip U9 are both electrically connected to the power management.

3. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 2 is characterized in that: The battery voltage acquisition circuit includes a resistor R53, a resistor R54 and a capacitor C27, and the temperature acquisition circuit includes a resistor R60, a resistor R61, a resistor R61 and a capacitor C37; The first end of the resistor R53 is electrically connected to the VBAT endpoint; The second end of the resistor R53, the first end of the resistor R54 and the first end of the capacitor C27 are all electrically connected to the pin 26 of the chip U9 in the MCU circuit; The second end of the resistor R54 and the second end of the capacitor C27 are both electrically connected to the ground line; The first end of the resistor R60 is electrically connected to the VCC3.3 terminal; The second end of the resistor R60, the first end of the resistor R61 and the first end of the capacitor C37 are all electrically connected to the pin 25 of the chip U9 in the MCU circuit; The second end of the resistor R61 and the second end of the capacitor C37 are both electrically connected to the ground line through the resistor R63.

4. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 2 is characterized in that: The power management circuit includes a chip U1, a chip U3, a transistor Q1, a transistor Q2, a resistor R1, a resistor R2, a resistor R9, a resistor R13, a resistor R18, a resistor R19, a resistor R21, a resistor R25, an inductor L1, a capacitor C1, a capacitor C3, a capacitor C4, a capacitor C6, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a capacitor CZ1, a capacitor CZ2, a diode D1, a diode D2 and a switch S1. The chip U1 includes a pin 1, a pin 2 and a pin 3. The chip U3 includes a pin 1, a pin 3, a pin 4 and a pin 5. The transistor Q1 includes a pin 1, a pin 2 and a pin 3. The transistor Q2 includes a pin 1, a pin 2 and a pin 3. Pin 1 of the chip U1, a first end of the capacitor C3, a first end of the capacitor C4, and a first end of the capacitor C6 are all electrically connected to the ground line; Pin 2 of the chip U1, the second end of the capacitor C4 and the second end of the capacitor C6 are all electrically connected to the VCC3.3 terminal; The pin 3 of the chip U1, the second end of the capacitor C3 and the first end of the switch S1 are all electrically connected to the VCC terminal; The second end of the switch S1 is electrically connected to the VBAT end point; Pin 1 of the chip U3 is electrically connected to the first end of the diode D1 and the first end of the inductor L1; Pin 3 of the chip U3 is electrically connected to the first end of the resistor R18 and the first end of the resistor R21; Pin 4 of the chip U3 and the first end of the resistor R19 are both electrically connected to pin 45 of the chip U9 in the MCU circuit; The pin 5 of the chip U3, the second end of the inductor L1 and the first end of the capacitor C10 are all electrically connected to the first end of the capacitor CZ2; The second end of the capacitor CZ2 and the first end of the capacitor C11 are both electrically connected to the VCC3.3_CS terminal; The second end of the capacitor C10 and the second end of the capacitor C11 are both electrically connected to the ground line; The second end of the resistor R19 is electrically connected to the ground line; The second end of the resistor R21 is electrically connected to the ground wire through the resistor R25; The second end of the diode D1, the second end of the resistor R18, and the first end of the capacitor C9 are all electrically connected to the first end of the capacitor CZ1; The second end of the capacitor CZ1, the first end of the capacitor C8, the first end of the capacitor C12 and the first end of the diode D2 are all electrically connected to the VCC5_CS terminal; The second end of the capacitor C9, the second end of the capacitor C8, the second end of the capacitor C12 and the second end of the diode D2 are all electrically connected to the ground line; The pin 1 of the transistor Q1 is electrically connected to the pin 3 of the transistor Q2, the first end of the capacitor C1 and the first end of the resistor R1 through the resistor R2; The pin 2 of the transistor Q1 is electrically connected to the VCC3.3 terminal through the resistor R2, the second end of the capacitor C1 and the second end of the resistor R1; Pin 3 of the transistor Q1 is electrically connected to the VCC3.3_CS terminal; The pin 1 of the transistor Q2 is electrically connected to the first end of the resistor R9; The pin 2 of the transistor Q2 and the first end of the resistor R13 are both electrically connected to the ground line; The second end of the resistor R9 and the second end of the resistor R13 are both electrically connected to the pin 46 of the chip U9 in the MCU circuit; The power management circuit is electrically connected to the solar charging management circuit via a VBAT endpoint; The power management circuit is electrically connected to the end screen power supply circuit via the VCC terminal; The power management circuit is electrically connected to the ad acquisition circuit via the VCC3.3_CS endpoint and the VCC5_CS endpoint; The power management circuit is electrically connected to the power frequency signal sampling circuit via the VCC5_CS endpoint; The power management circuit is electrically connected to the high-frequency partial discharge acquisition circuit via the VCC5 terminal.

5. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 2 is characterized in that: The end screen power supply circuit includes a chip U4, an interface P2, a resistor R17, a resistor R20, a resistor R22, a resistor R23, a resistor R24, a resistor R26, a resistor R27, a resistor R28, a resistor R29, a resistor R30, a resistor R31, an inductor L2, a capacitor C15, a capacitor C16, a capacitor FC1, a capacitor E1, a capacitor E2, a transistor Q3, a transistor Q4, a transistor Q5, a transistor Q6, a transistor Q7, a transistor Q8, a transistor Q9, a diode D3, a diode D4, a diode D5, a diode D6, a diode D7, a diode D8, a diode D9 and a diode D10. The chip U4 includes a pin 1, a pin 2, a pin 3, a pin 5 and a pin 6. The interface P2 includes a pin 1 and a pin 2. The pin 1 of the chip U4 is electrically connected to the first end of the diode D3, the first end of the capacitor FC1, the pin 6 of the chip U4, the first end of the transistor Q4, the first end of the resistor R17, the first end of the transistor Q3 and the first end of the transistor Q5 through the inductor L2; Pin 2 of the chip U4, a first end of the resistor R27, a first end of the capacitor C16, a first end of the capacitor E2, a first end of the transistor Q8, a first end of the transistor Q9, a second end of the capacitor FC1, a first end of the capacitor C15, a first end of the diode D8 and a first end of the diode D9 are all electrically connected to the ground line; The pin 3 of the chip U4 and the first end of the resistor R28 are both electrically connected to the first end of the resistor R29; Pin 5 of the chip U4, the second end of the resistor R29, the second end of the capacitor C16, the second end of the capacitor E2, the second end of the transistor Q8, the first end of the resistor R26 and the first end of the transistor Q7 are all electrically connected to the VCC0 terminal; The pin 1 of the interface P2, the first end of the diode D5 and the second end of the diode D8 are all electrically connected to the first end of the diode D6; The pin 2 of the interface P2, the second end of the diode D5 and the second end of the diode D9 are all electrically connected to the first end of the diode D7; The second end of the diode D6, the second end of the diode D7 and the second end of the diode D3 are all electrically connected to the second end of the capacitor C15; The second end of R27 is electrically connected to the second end of R28; The second end of the transistor Q4 is electrically connected to the first end of the transistor Q6 through the diode D4 and the resistor R22; The third terminal of the transistor Q4, the second terminal of the transistor Q6, the first terminal of the capacitor E2 and the second terminal of the transistor Q5 are all electrically connected to the ground line; The third end of the transistor Q6 and the second end of the resistor R17 are electrically connected to the second end of the transistor Q3 through the resistor R20; The third terminal of the transistor Q3 and the second terminal of the capacitor E2 are electrically connected to the third terminal of the transistor Q5 through the resistor R23; The third terminal of the transistor Q8 is electrically connected to the second terminal of the transistor Q9 through the resistor R31; The third end of the transistor Q9 and the second end of the resistor R26 are electrically connected to the second end of the transistor Q7 through the resistor R30; The third terminal of the transistor Q7 is electrically connected to the VCC terminal through the diode D10.

6. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 2 is characterized in that: The solar charging management circuit includes a chip U8, an interface P3, a resistor R49, a resistor R50, a resistor R51, a resistor R52, a capacitor C23, a capacitor C24, a capacitor C25, a capacitor C26, a diode D11, a diode LED1, a diode LED2 and a battery BT1, the chip U8 includes pin 1, pin 2, pin 3, pin 4, pin 5, pin 6, pin 7 and pin 8, and the interface P3 includes pin 1 and pin 2; The pin 1 of the chip U8 and the first end of the resistor R50 are electrically connected to the first end of the resistor R52; Pin 2 of the chip U8 is electrically connected to the first end of the resistor R51; The pin 3 of the chip U8, the second end of the resistor R51 and the second end of the resistor R52 are all electrically connected to the ground line; Pin 4 of the chip U8, the second end of the resistor R50, the first end of the resistor R49, the first end of the capacitor C23 and the first end of the capacitor C25 are all electrically connected to pin 1 of the interface P3 through the diode D11; Pin 5 of the chip U8, pin 8 of the chip U8, the first end of the capacitor C24, the first end of the capacitor C26 and the first end of the battery BT1 are all electrically connected to the power management circuit through the VBAT endpoint; Pin 6 of the chip U8 is electrically connected to the first end of the diode LED1; Pin 7 of the chip U8 is electrically connected to the first end of the diode LED2; The pin 2 of the interface P3, the second end of the capacitor C23 and the second end of the capacitor C25 are all electrically connected to the ground line; The second end of the diode LED1 and the second end of the LED2 are both electrically connected to the second end of the resistor R49; The second end of the capacitor C24 , the second end of the capacitor C26 , and the second end of the battery BT1 are all electrically connected to the ground line.

7. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 2 is characterized in that: The ad acquisition circuit includes a chip U10, a crystal oscillator Y3, a resistor R62, a resistor R64, a resistor R65, a capacitor C31, a capacitor C32, a capacitor C34, a capacitor C36, a capacitor C38, a capacitor C39 and a capacitor C40, the chip U10 includes pin 1, pin 3, pin 4, pin 5, pin 6, pin 7, pin 8, pin 11, pin 12, pin 14, pin 15, pin 16, pin 17, pin 19, pin 20, pin 23 and pin 24, the crystal oscillator Y3 includes pin 1 and pin 2; Pin 1 of the chip U10 and pin 1 of the crystal oscillator Y3 are both electrically connected to the first end of the capacitor C31; Pin 3 of the chip U10, the first end of the capacitor C34 and the first end of the capacitor C36 are all electrically connected to the VCC3.3_CS terminal; Pin 4 of the chip U10, pin 8 of the chip U10, the second end of the capacitor C34 and the second end of the capacitor C36 are all electrically connected to the ground line; Pin 5 of the chip U10 is electrically connected to pin 15 of the chip U9 in the MCU circuit; Pin 6 of the chip U10 is electrically connected to pin 16 of the chip U9 in the MCU circuit; Pin 7 of the chip U10 is electrically connected to pin 14 of the chip U9 in the MCU circuit; The pin 11 of the chip U10 and the pin 12 of the chip U10 are both electrically connected to the ground wire through the capacitor C40; The pin 14 of the chip U10 is electrically connected to the first end of the resistor R65; Pin 15 of the chip U10 is electrically connected to the power frequency signal sampling circuit; Pin 16 of the chip U10 is electrically connected to the power frequency signal sampling circuit and the VCC2.5_CS terminal; The pin 17 of the chip U10 and the first end of the resistor R64 are both electrically connected to the ground wire through the resistor R62; Pin 19 of the chip U10 is electrically connected to pin 42 of the chip U9 in the MCU circuit; The pin 20 of the chip U10 is electrically connected to the pin 43 of the chip U9 in the MCU circuit; The pin 23 of the chip U10 is electrically connected to the pin 17 of the chip U9 in the MCU circuit; The pin 24 of the chip U10 and the pin 2 of the crystal oscillator Y3 are both electrically connected to the first end of the capacitor C32; The second end of the capacitor C31 and the second end of the capacitor C32 are both electrically connected to the ground line; The second end of the resistor R65, the second end of the resistor R64, the first end of the capacitor C38 and the first end of the capacitor C39 are all electrically connected to the VCC5_CS terminal; The second end of the capacitor C38 and the second end of the capacitor C39 are both electrically connected to the ground line.

8. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 7 is characterized in that: The power frequency signal sampling circuit includes a chip U2, an interface P1, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R10, a resistor R11, a resistor R12, a resistor R14, a resistor R15, a resistor R16, a capacitor C2, a capacitor C5, a capacitor C7, a capacitor C13 and a capacitor C14, the chip U2 includes a pin 1, a pin 3, a pin 4 and a pin 5, and the interface P1 includes a pin 1 and a pin 2; The pin 1 of the chip U2 and the first end of the resistor R3 are both electrically connected to the pin 16 of the chip U10 in the AD acquisition circuit; Pin 3 of the chip U2 is electrically connected to the first end of the resistor R7; Pin 4 of the chip U2 and the first end of the resistor R3 are electrically connected to the VCC2.5_CS terminal through the resistor R8; Pin 5 of the chip U2 is electrically connected to the VCC5_CS endpoint; The second end of the resistor R7, the first end of the resistor R12, the first end of the capacitor C2 and the first end of the capacitor C5 are all electrically connected to the first end of the resistor R4; The second end of the resistor R12 is electrically connected to the ground line; The pin 1 of the interface P1, the first end of the resistor R6 and the first end of the resistor R10 are all electrically connected to the first end of the resistor R11; The pin 2 of the interface P1, the second end of the resistor R6 and the first end of the resistor R5 are all electrically connected to the second end of the resistor R4; The second end of the resistor R5, the second end of the resistor R10 and the first end of the capacitor C7 are all electrically connected to the second end of the capacitor C2; The second end of the capacitor C7, the second end of the resistor R11 and the second end of the capacitor C5 are all electrically connected to the VCC2.5_CS terminal; The first end of the resistor R14 is electrically connected to the VCC5_CS terminal; The first end of the resistor R15 is electrically connected to the VCC2.5_CS terminal; The second end of the capacitor C14, the second end of the resistor R15, the first end of the resistor R16, the first end of the capacitor C13 and the first end of the capacitor C14 are all electrically connected to the VCC2.5 terminal; The second end of the resistor R16 , the second end of the capacitor C13 , and the second end of the capacitor C14 are all electrically connected to the ground line.

9. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 2 is characterized in that: The high-frequency partial discharge acquisition circuit includes an interface J1, a chip U7, an amplifier U5A, an amplifier U5B, a resistor R32, a resistor R33, a resistor R34, a resistor R35, a resistor R36, a resistor R37, a resistor R38, a resistor R40, a resistor R42, a resistor R43, a resistor R44, a resistor R45, a resistor R46, a resistor R47, a resistor R48, a resistor PT1, a resistor PT2, a capacitor C17, a capacitor C18, a capacitor C19, a capacitor C20 and a capacitor C22, the interface J1 includes a pin 2, the chip U2 includes a pin 1, a pin 4, a pin 5, a pin 7 and a pin 8, the amplifier U5A includes a pin 1, a pin 2, a pin 3 and a pin 8, and the amplifier U5B includes a pin 5, a pin 6 and a pin 7; Pin 2 of the interface J1 is electrically connected to a first end of a resistor R33 and a first end of a resistor R38 via a resistor R32 and a capacitor C18; The second end of the resistor R38 is electrically connected to the ground line; The second end of the resistor R32 is electrically connected to the pin 3 of the amplifier U5A; Pin 2 of the amplifier U5A, the first end of the resistor R42, the first end of the resistor 45, the first end of the resistor R45 and the first end of the resistor PT1 are all electrically connected to the ground line through the resistor R34; The second end of the resistor R42 is electrically connected to the first end of the resistor R43; Pin 8 of the amplifier U5A is electrically connected to the ground wire via capacitor C17; Pin 1 of the amplifier U5A, the second end of the resistor R43, the second end of the resistor R45, the second end of the resistor PT1 and the first end of the resistor R39 are all electrically connected to the first end of the capacitor C20; The second end of the capacitor C20 is electrically connected to the pin 8 of the chip U7; The second end of the resistor R39 and the first end of the capacitor C19 are both electrically connected to the ground line; The second end of the capacitor C19 is electrically connected to the pin 1 of the chip U7; The pin 5 of the chip U7, the pin 6 of the chip U7 and the first end of the capacitor C22 are all electrically connected to the first end of the resistor R47; The second end of the capacitor C22 is electrically connected to the ground line; The second end of the resistor R47 is electrically connected to the VCC5 terminal; The pin 4 of the chip U7 and the first end of the resistor R37 are both electrically connected to the first end of the resistor R35; The second end of the resistor R37 is electrically connected to the ground line; The second end of the resistor R35 is electrically connected to the pin 5 of the amplifier U5B; Pin 6 of the amplifier U5B, the first end of the resistor R46, the first end of the resistor 48, and the first end of the resistor PT2 are all electrically connected to the ground line through the resistor R41; The second end of the resistor R46, the second end of the resistor 48 and the second end of the resistor PT2 are all electrically connected to the first end of the resistor R44; The pin 7 of the amplifier U5B, the second end of the resistor 44 and the first end of the resistor R40 are all electrically connected to the first end of the resistor R36; The second end of the resistor R40 is electrically connected to the ground line; The second end of the resistor R36 is electrically connected to the pin 29 of the chip U9 in the MCU circuit.

10. The low-power wireless lora-type main transformer bushing insulation monitoring circuit according to claim 2 is characterized in that: The wireless loar communication circuit includes a chip U6, a capacitor C21 and an antenna ANT1, and the chip U6 includes pins 6, 7 and 17; Pin 6 of the chip U6 is electrically connected to pin 12 of the chip U9 in the MCU circuit; Pin 7 of the chip U6 is electrically connected to pin 13 of the chip U9 in the MCU circuit; The pin 17 of the chip U6 is electrically connected to the ground wire through the capacitor C21 and the antenna ANT1.

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