Wafer carrying device

Abstract

The utility model provides a wafer carrying device, which relates to the technical field of semiconductor processing equipment and comprises a direct-acting mechanism, a rotating mechanism, a stretching mechanism and a bearing assembly. The direct-acting mechanism is vertically arranged, the rotating mechanisms are arranged on the two opposite side faces of the direct-acting mechanism and are in sliding connection with the direct-acting mechanism, and the direct-acting mechanism is used for driving the rotating mechanisms to move in the vertical direction; the stretching mechanisms are arranged on the rotating mechanisms and rotationally connected with the rotating mechanisms, and the rotating mechanisms are used for driving the stretching mechanisms to rotate on the horizontal plane; the bearing assembly is arranged on the stretching mechanism and is in sliding connection with the stretching mechanism, the stretching mechanism is used for driving the bearing assembly to stretch out and draw back, and the bearing assembly is used for bearing wafers. According to the invention, under the condition that the speed of the wafer carrying device is not increased, the flexibility and the productivity of the manipulator are greatly increased, and the conditions of wafer sliding, wafer falling and wafer breaking caused by too high moving speed are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer transport device. Background Art

[0002] With the continuous development of the semiconductor equipment industry, the degree of automation of wafer processing equipment is getting higher and higher. In semiconductor processing equipment, it is often necessary to transfer wafers between various process units. The use of wafer handling robots to achieve wafer transfer between various process units (such as coating units, developing units, etc.) has become popular.

[0003] Existing rectangular coordinate system wafer handling robots generally adopt single-axis form, which is gradually facing the problem of insufficient production capacity. The current solution is to increase the speed of the robot to improve production capacity, but the speed increase will cause vibration at the end of the robot finger and poor repeated positioning accuracy, and even cause wafer slippage, wafer drop, fragmentation, etc. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer handling device, which can realize the vertical wafer picking and delivering movement, the horizontal wafer picking and delivering movement, and the simultaneous wafer picking and delivering movement in two directions within 360°. Without speeding up the wafer handling device, the flexibility and production capacity of the robot are greatly increased, and the wafer slipping, falling and fragmentation caused by overly fast moving speed are avoided.

[0005] To achieve the above-mentioned purpose, the utility model provides a wafer transport device, including a direct-acting mechanism, a rotating mechanism, an extending mechanism and a carrying assembly; the direct-acting mechanism is vertically arranged, the rotating mechanism is arranged on two opposite sides of the direct-acting mechanism, and is slidably connected to the direct-acting mechanism, and the direct-acting mechanism is used to drive the rotating mechanism to move in the vertical direction; the extending mechanisms are respectively arranged on the rotating mechanism and are rotatably connected to the rotating mechanism, and the rotating mechanism is used to drive the extending mechanism to rotate on the horizontal plane; the carrying assembly is arranged on the extending mechanism and is respectively slidably connected to the extending mechanism, the extending mechanism is used to drive the carrying assembly to extend and retract, and the carrying assembly is used to carry wafers.

[0006] Optionally, the direct-acting mechanism includes a gantry, a first guide rail, a second guide rail, a slide, and a direct-acting drive mechanism; the first guide rail and the second guide rail are respectively arranged on opposite sides of the gantry, and the two ends of the slide are respectively slidably connected to the first guide rail and the second guide rail, the direct-acting drive mechanism is arranged on the gantry, and drives the slide to slide on the first guide rail and the second guide rail, and the rotating mechanism is arranged on opposite sides of the slide.

[0007] Optionally, the direct-acting drive mechanism includes a direct-acting drive motor, a reducer, a driving belt, a synchronous belt, a driving pulley and a plurality of driven pulleys; the driving belt is arranged on one side of the gantry and surrounds the first guide rail, the lower end of the driving belt is connected to the driving pulley, the upper end of the driving belt is connected to the driven pulley, the synchronous belt is arranged on one side of the gantry and surrounds the second guide rail, and both ends of the synchronous belt are connected to the driven pulleys; one end of the slide is connected to the belt surface of the driving belt, and the other end of the slide is connected to the belt surface of the synchronous belt; the direct-acting drive motor is rotatably connected to the driving pulley through the reducer, and the direct-acting drive motor drives the driving belt to rotate, drives the driving belt to move, and further drives the slide to move.

[0008] Optionally, the rotating mechanism includes multiple rotating platforms, which are respectively connected to the two side surfaces of the slide, and the rotating platforms are provided with a rotating shaft, a rotating drive motor and a limiting spring block; the rotating shaft is located on the upper surface of the rotating platform, one end of the rotating shaft extends into the rotating platform, the rotating drive motor is located in the rotating platform and is rotatably connected to the rotating shaft, the limiting spring block is arranged on the upper surface of the rotating platform and is located on one side of the rotating shaft, and the extending mechanism is rotatably connected to the rotating shaft; the rotating drive motor is used to drive the rotating shaft to rotate and drive the extending mechanism to rotate, and the limiting spring block is used to limit the rotation angle of the extending mechanism.

[0009] Optionally, the extension mechanism includes multiple extension frames, the extension frames are rotatably connected to the rotating shaft, slide grooves are opened on opposite sides of the extension frames, a slide seat is slidably connected to the slide groove, the extension drive assembly is arranged in the extension frame and connected to the slide seat, the extension drive assembly is used to drive the slide seat to move on the slide groove; the bearing assembly is connected to the slide seat, and the slide seat is used to drive the bearing assembly to move synchronously.

[0010] Optionally, the extension drive assembly includes an extension drive motor, a first transmission belt, a second transmission belt and a plurality of transmission pulleys; the first transmission belt and the second transmission belt are respectively located on both sides of the extension frame and are connected to the slide seat, both ends of the first transmission belt and both ends of the second transmission belt are provided with transmission pulleys, and the extension drive motor is rotatably connected to the transmission pulleys; the extension drive motor is used to drive the transmission pulley to rotate, and drive the first transmission belt and the second transmission belt to rotate, and further drive the slide seat to move.

[0011] Optionally, the carrying assembly includes a finger fixing seat and a manipulator, the finger fixing seat includes a connecting portion and a fixing portion, the connecting portion is connected to the slide seat, and the manipulator is connected to the fixing portion; the manipulator is used to carry the wafer.

[0012] Optionally, there are multiple slides, and the multiple slides are evenly distributed on the first guide rail and the second guide rail.

[0013] Optionally, a first exhaust assembly is disposed on two opposite sides of the bottom of the gantry, and a second exhaust assembly is disposed on two opposite sides of the upper portion of the gantry, and both the first exhaust assembly and the second exhaust assembly are used to generate negative pressure inside the gantry.

[0014] Optionally, hoisting components are provided on opposite sides of the top of the gantry.

[0015] The present application provides a wafer handling device, which comprises a direct-acting mechanism, a rotating mechanism, an extending mechanism and a bearing assembly arranged in a vertical direction, wherein the rotating mechanism is installed on two opposite sides of the direct-acting mechanism and is slidably connected to the direct-acting mechanism, the extending mechanism is arranged on the rotating mechanism and is rotatably connected to the rotating mechanism, and the bearing assembly is arranged on the extending mechanism and is slidably connected to the extending mechanism. When the bearing assembly carries the wafer, the rotating mechanism moves along the vertical direction on the direct-acting mechanism, the extending mechanism rotates on the rotating mechanism, and the bearing assembly is telescoped on the extending mechanism, so that the bearing assembly moves in the vertical direction, rotates in the horizontal plane, and telescopically moves on the two opposite sides of the direct-acting mechanism, so that the bearing assembly can realize the vertical wafer picking and delivering movement, the horizontal wafer picking and delivering movement, and the simultaneous wafer picking and delivering movement in two directions within 360°, and greatly increases the flexibility and production capacity of the robot without speeding up the wafer handling device, thereby avoiding the wafer slipping, wafer falling and wafer fragmentation caused by excessively fast movement speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 The structure of the wafer handling device of this application is shown in FIG. Figure 1 ;

[0018] Figure 2 This is a top view of the wafer handling device of this application;

[0019] Figure 3 This is a schematic diagram of the structure of the direct-acting mechanism for this application Figure 1 ;

[0020] Figure 4 The structure of the wafer handling device of this application is shown in FIG. Figure 2 ;

[0021] Figure 5 This is a schematic diagram of the structure of the direct-acting mechanism for this application Figure 2 ;

[0022] Figure 6 This is a schematic diagram of the structure of the rotating mechanism of this application;

[0023] Figure 7 This is a schematic diagram of the coordination between the extension mechanism and the bearing mechanism of this application.

[0024] Icons: 100-direct-acting mechanism; 110-gantry; 120-first guide rail; 130-second guide rail; 140-slide; 150-driving belt; 160-synchronous belt; 170-first exhaust assembly; 180-second exhaust assembly; 190-hoisting assembly; 200-rotating mechanism; 210-rotating platform; 220-rotating shaft; 230-limiting spring block; 300-extension mechanism; 310-extension frame; 320-slide; 330-slide seat; 400-bearing assembly; 410-finger fixing seat; 420-manipulator.

[0025] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the utility model clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the utility model application are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0029] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0030] Existing rectangular coordinate system wafer handling robots generally adopt a single-axis form, and are gradually facing the problem of insufficient production capacity. The current solution is to speed up the robot to increase production capacity, but speeding up will cause vibration at the end of the robot finger and deteriorate the repeated positioning accuracy, and even cause wafer slippage, wafer drop, fragmentation, etc. In response to the above problems, the embodiments of the present application provide the following technical solutions to overcome the above problems.

[0031] Please refer to Figures 1 to 7 The embodiment of the present application provides a wafer handling device, including a direct-acting mechanism 100, a rotating mechanism 200, an extending mechanism 300 and a carrying assembly 400; the direct-acting mechanism 100 is vertically arranged, the rotating mechanism 200 is arranged on two opposite sides of the direct-acting mechanism 100, and is slidably connected to the direct-acting mechanism 100, and the direct-acting mechanism 100 is used to drive the rotating mechanism 200 to move in the vertical direction; the extending mechanism 300 is respectively arranged on the rotating mechanism 200 and is rotatably connected to the rotating mechanism 200, and the rotating mechanism 200 is used to drive the extending mechanism 300 to rotate on a horizontal plane; the carrying assembly 400 is arranged on the extending mechanism 300 and is slidably connected to the extending mechanism 300, and the extending mechanism 300 is used to drive the carrying assembly 400 to extend and retract, and the carrying assembly 400 is used to carry wafers.

[0032] Specifically, the direct-acting mechanism 100 is vertically arranged to carry and install the rotating mechanism 200. The rotating mechanism 200 is installed on the front and rear opposite sides of the direct-acting mechanism 100 and is slidably connected to the direct-acting mechanism 100, so that the rotating mechanism 200 can move up and down along the vertical direction on the direct-acting mechanism 100. The extension mechanism 300 is installed on the rotating mechanism 200 and is rotatably connected to the rotating mechanism 200, so that the extension mechanism 300 rotates on the rotating mechanism 200. The bearing assembly 400 is installed on the extension mechanism 300 and is slidably connected to the extension mechanism 300, so that the bearing assembly 400 can slide and retract relative to the extension assembly. In the process of the bearing assembly 400 picking up and delivering the wafer, according to the different positions of the wafer picking up and delivering, the direct-acting mechanism 100 drives the rotating mechanism 200 to move up and down in the vertical direction, the rotating mechanism 200 drives the extension mechanism 300 to rotate, and the extension mechanism 300 drives the bearing assembly 400 to retract relative to the extension mechanism 300, so as to complete the work of the bearing assembly 400 picking up and delivering the wafer.

[0033] The wafer handling device provided by the present application is provided with a direct-acting mechanism 100, a rotating mechanism 200, an extending mechanism 300 and a bearing assembly 400 in a vertical direction. The rotating mechanism 200 is installed on two opposite sides of the direct-acting mechanism 100 and is slidably connected with the direct-acting mechanism 100. The extending mechanism 300 is provided on the rotating mechanism 200 and is rotatably connected with the rotating mechanism 200. The bearing assembly 400 is provided on the extending mechanism 300 and is slidably connected with the extending mechanism 300. When the bearing assembly 400 carries a wafer, the rotating mechanism 200 moves in a vertical direction on the direct-acting mechanism 100. The extending mechanism 300 rotates on the rotating mechanism 200, and the carrying component 400 is extended and retracted on the extending mechanism 300, so that the carrying component 400 can move in the vertical direction, rotate in the horizontal plane, and telescopically move on the two opposite sides of the direct-acting mechanism 100, which can realize the vertical wafer picking and delivering movement, horizontal wafer picking and delivering movement, and simultaneous wafer picking and delivering movement in two directions within 360°. Without speeding up the wafer handling device, the flexibility and production capacity of the robot 420 are greatly increased, avoiding wafer slippage, wafer falling, and fragmentation caused by excessively fast movement speed.

[0034] In an embodiment of the present application, the direct-acting mechanism 100 includes a gantry 110, a first guide rail 120, a second guide rail 130, a slide 140, and a direct-acting drive mechanism; the first guide rail 120 and the second guide rail 130 are respectively arranged on opposite sides of the gantry 110, and the two ends of the slide 140 are respectively slidably connected to the first guide rail 120 and the second guide rail 130, the direct-acting drive mechanism is arranged on the gantry 110, and drives the slide 140 to slide on the first guide rail 120 and the second guide rail 130, and the rotating mechanism 200 is arranged on two opposite side surfaces of the slide 140.

[0035] Specifically, the first guide rail 120 and the second guide rail 130 are installed in the support arms on opposite sides of the gantry 110, the two ends of the slide 140 are slidably connected to the first guide rail 120 and the second guide rail 130 respectively, the direct drive mechanism is installed on the gantry 110, and drives the slide 140 to slide up and down along the vertical direction, and the rotating mechanism 200 is connected to the opposite sides of the slide 140, and the connection is located between the support arms on opposite sides of the gantry 110. The first guide rail 120 and the second guide rail 130 arranged opposite to each other can balance the force of the slide 140 installed thereon, and the slide 140 is more stable in the process of driving the rotating mechanism 200 to slide.

[0036] In an embodiment of the present application, the direct-acting drive mechanism includes a direct-acting drive motor, a reducer, a driving belt 150, a synchronous belt 160, a driving belt 150 wheel and a plurality of driven pulleys; the driving belt 150 is arranged on one side of the gantry 110 and surrounds the first guide rail 120, the lower end of the driving belt 150 is connected to the driving belt 150 wheel, the upper end of the driving belt 150 is connected to the driven pulley, the synchronous belt 160 is arranged on one side of the gantry 110 and surrounds the second guide rail 130, and both ends of the synchronous belt 160 are connected to the driven pulleys; one end of the slide 140 is connected to the belt surface of the driving belt 150, and the other end of the slide 140 is connected to the belt surface of the synchronous belt 160; the direct-acting drive motor is rotatably connected to the driving belt 150 wheel through the reducer, and the direct-acting drive motor drives the driving belt 150 to rotate, drives the driving belt 150 to move, and further drives the slide 140 to move.

[0037] Specifically, the driving belt 150 wheel is installed in the support column on one side of the gantry 110 and is located at the lower end of the first guide rail 120. The driven pulley is installed in the support column on one side of the gantry 110 and is located at the upper end of the first guide rail 120. The driving belt 150 is installed on the driving belt 150 wheel and the driven pulley and surrounds the first guide rail 120. The direct drive motor is arranged at the lower end of the support column on one side of the gantry 110 and is rotatably connected to the driving belt 150 wheel through a reducer. The upper and lower ends of the second guide rail 130 are both provided with driven pulleys, and the synchronous belt 160 is installed on the driven pulleys at both ends of the second guide rail 130 and surrounds the second guide rail 130. The side surface of one end of the slide 140 is connected to the surface of the driving belt 150, and the side surface of the other end is connected to the surface of the synchronous belt 160. During the wafer handling process, the direct drive motor drives the driving belt 150 wheel to rotate, so that the driving belt 150 moves, and further drives the slide 140 to move synchronously with the driving belt 150. The direct-acting drive motor can make the slide 140 move more accurately. It should be noted that the direct-acting drive motor is preferably a servo motor.

[0038] In an embodiment of the present application, the rotating mechanism 200 includes a plurality of rotating platforms 210, and the plurality of rotating platforms 210 are respectively connected to the two side surfaces of the slide 140, and a rotating shaft 220, a rotating drive motor and a limiting spring block 230 are provided on the rotating platform 210; the rotating shaft 220 is located on the upper surface of the rotating platform 210, and one end of the rotating shaft 220 extends into the rotating platform 210, the rotating drive motor is located in the rotating platform 210 and is rotatably connected to the rotating shaft 220, the limiting spring block 230 is arranged on the upper surface of the rotating platform 210 and is located on one side of the rotating shaft 220, and the extending mechanism 300 is rotatably connected to the rotating shaft 220; the rotating drive motor is used to drive the rotating shaft 220 to rotate, and drive the extending mechanism 300 to rotate, and the limiting spring block 230 is used to limit the rotation angle of the extending mechanism 300.

[0039] Specifically, the rotating platform 210 is respectively installed on the front and rear opposite sides of the slide 140, so that the installation platform is located between the two opposite support columns of the gantry 110, and the rotating shaft 220 is set in the center of the rotating platform 210, and the axial direction of the rotating shaft 220 is the vertical direction. One end of the rotating shaft 220 extends into the rotating platform 210 and is rotatably connected with the rotating drive motor. The extension mechanism 300 is rotatably connected with the rotating shaft 220 and is located above the rotating platform 210. The rotating drive motor drives the rotating shaft 220 to rotate, and drives the extension mechanism 300 to rotate synchronously, so that the bearing mechanism set on the extension mechanism 300 can more accurately complete the rotation and delivery of the wafer. Further, a limiting spring block 230 is set on the upper surface of the rotating platform 210 on one side of the rotating shaft 220. When the extension mechanism 300 rotates to the required angle for work, the limiting spring block 230 pops up and limits the extension mechanism 300, so that the extension mechanism 300 is kept at the corresponding angle.

[0040] In an embodiment of the present application, the extension mechanism 300 includes a plurality of extension frames 310, the extension frames 310 are rotatably connected to the rotating shaft 220, and slide grooves 320 are provided on opposite sides of the extension frames 310, and a slide seat 330 is slidably connected to the slide groove 320, the extension drive assembly is arranged in the extension frame 310 and connected to the slide seat 330, and the extension drive assembly is used to drive the slide seat 330 to move on the slide groove 320; the bearing assembly 400 is connected to the slide seat 330, and the slide seat 330 is used to drive the bearing assembly 400 to move synchronously. The stretching drive assembly includes a stretching drive motor, a first transmission belt, a second transmission belt and a plurality of transmission pulleys; the first transmission belt and the second transmission belt are respectively located on both sides of the stretching frame 310 and are connected to the slide 330, and both ends of the first transmission belt and both ends of the second transmission belt are provided with transmission pulleys, and the stretching drive motor is rotatably connected to the transmission pulleys; the stretching drive motor is used to drive the transmission pulley to rotate, and drive the first transmission belt and the second transmission belt to rotate, and further drive the slide to move.

[0041] Specifically, the bottom surface of the stretching frame 310 is rotatably connected to the rotating shaft 220, and a slide groove 320 is opened on the two opposite side surfaces of the stretching frame 310, and a slide seat 330 is slidably connected to the slide groove 320, and the supporting component 400 is connected to the slide seat 330 and is located above the stretching frame 310. The stretching drive component is set in the stretching frame 310, and drives the slide seat 330 to slide in the slide groove 320. The slide seat 330 drives the supporting component 400 to move synchronously to realize the corresponding pick-up and delivery action of the supporting component 400 on the wafer.

[0042] Furthermore, two transmission pulleys are arranged at intervals on one side of the stretching frame 310 along the extension direction of the slide groove 320, and the first transmission belt is installed on the two transmission pulleys; two transmission pulleys are arranged at intervals on the other side of the stretching frame 310 along the extension direction of the slide groove 320, and the first transmission belt is installed on the two transmission pulleys, the slides 330 on both sides of the stretching frame 310 are respectively connected to the first transmission belt and the second transmission belt, the stretching drive motor is rotatably connected to a transmission pulley on one side of the stretching frame 310, the stretching drive motor drives the transmission pulley to rotate, and drives the first rotating belt to move, and the first transmission belt drives the slide 330 to move synchronously, so that the slide 330 drives the bearing assembly 400 to move synchronously.

[0043] In an embodiment of the present application, the supporting assembly 400 includes a finger fixing seat 410 and a manipulator 420, the finger fixing seat 410 includes a connecting portion and a fixing portion, the connecting portion is connected to the slide seat 330, and the manipulator 420 is connected to the fixing portion; the manipulator 420 is used to carry the wafer.

[0044] Specifically, the connecting portion on the finger fixing seat 410 is connected to the slide seat 330, and the fixing portion on the finger fixing seat 410 is used to fix the robot 420, and the robot 420 is located above the extension frame 310. During the operation of the wafer handling device, the robot 420 carries the wafer to perform the wafer picking and delivery process. It should be noted that the robot 420 can be set as a ceramic finger or an aluminum alloy finger, and the robot 420 can be set to carry the wafer in a vacuum adsorption or mechanical clamping manner.

[0045] Please refer to Figure 4 and Figure 5 In an embodiment of the present application, there are multiple slides 140 , and the multiple slides 140 are evenly distributed on the first guide rail 120 and the second guide rail 130 .

[0046] Specifically, a plurality of slides 140 are arranged on the first guide rail 120 and the second guide rail 130 in the vertical direction, and the spacing distance of each slide 140 needs to be set according to the working window in actual work, so that the spacing distance of the slide 140 corresponds to the working window. It should be noted that the mechanism and components arranged on each slide 140 are the same as those in the aforementioned embodiment, and are not described in detail here. The arrangement of a plurality of slides 140 further expands the capacity of the wafer handling device to take and deliver wafers, and improves the efficiency of wafer handling and wafer processing.

[0047] In an embodiment of the present application, a first exhaust assembly 170 is provided on two opposite sides of the bottom of the gantry 110, and a second exhaust assembly 180 is provided on two opposite sides of the upper part of the gantry 110. The first exhaust assembly 170 and the second exhaust assembly 180 are both used to generate negative pressure in the gantry 110, and a hoisting assembly 190 is provided on two opposite sides of the top of the gantry 110.

[0048] Specifically, a first exhaust assembly 170 is provided at the lower end of the supporting columns on the opposite sides of the gantry 110, and a second exhaust assembly 180 is provided at the upper end of the supporting columns on the opposite sides of the gantry 110. When the wafer handling device is working, the first exhaust assembly 170 and the second exhaust assembly 180 generate negative pressure in the gantry 110 to prevent dust from escaping from the gantry 110 and contaminating the surface of the wafer. Further, a hoisting assembly 190 is provided on the opposite sides of the top of the gantry 110. When moving and transferring the wafer handling device, the external moving equipment can lift and move the wafer handling device through the hoisting assembly 190, thereby avoiding damage to the wafer handling device when the wafer handling device is manually handled and avoiding injuries to personnel.

[0049] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. A wafer transport device, characterized in that: It includes a direct-acting mechanism, a rotating mechanism, an extension mechanism and a bearing assembly; The direct-acting mechanism is arranged vertically, the rotating mechanism is arranged on two opposite sides of the direct-acting mechanism and is slidably connected with the direct-acting mechanism, and the direct-acting mechanism is used to drive the rotating mechanism to move in the vertical direction; The stretching mechanisms are respectively arranged on the rotating mechanisms and are rotationally connected with the rotating mechanisms, and the rotating mechanisms are used to drive the stretching mechanisms to rotate on a horizontal plane; The bearing assembly is arranged on the extending mechanism and is slidably connected to the extending mechanism respectively. The extending mechanism is used to drive the bearing assembly to extend and retract. The bearing assembly is used to bear the wafer.

2. The wafer transport device according to claim 1, characterized in that: The direct-acting mechanism comprises a gantry, a first guide rail, a second guide rail, a slide, and a direct-acting driving mechanism; The first guide rail and the second guide rail are respectively arranged on opposite sides of the gantry, and the two ends of the slide are respectively slidably connected to the first guide rail and the second guide rail. The direct-acting drive mechanism is arranged on the gantry and drives the slide to slide on the first guide rail and the second guide rail. The rotating mechanism is arranged on opposite sides of the slide.

3. The wafer transport device according to claim 2, characterized in that: The direct drive mechanism comprises a direct drive motor, a speed reducer, a driving belt, a synchronous belt, a driving pulley and a plurality of driven pulleys; The driving belt is arranged on one side of the gantry and surrounds the first guide rail, the lower end of the driving belt is connected to a driving pulley, the upper end of the driving belt is connected to a driven pulley, the synchronous belt is arranged on one side of the gantry and surrounds the second guide rail, and both ends of the synchronous belt are connected to driven pulleys; One end of the slide is connected to the belt surface of the active belt, and the other end of the slide is connected to the belt surface of the synchronous belt; The direct-acting drive motor is rotationally connected to the active pulley through the speed reducer. The direct-acting drive motor drives the active belt to rotate, drives the active belt to move, and further drives the slide to move.

4. The wafer transport device according to claim 3, characterized in that: The rotating mechanism comprises a plurality of rotating platforms, which are respectively connected to the two sides of the slide, and the rotating platforms are provided with a rotating shaft, a rotating drive motor and a limit spring block; The rotating shaft is located on the upper surface of the rotating platform, one end of the rotating shaft extends into the rotating platform, the rotating drive motor is located in the rotating platform and is rotatably connected to the rotating shaft, the limiting spring block is arranged on the upper surface of the rotating platform and is located on one side of the rotating shaft, and the extending mechanism is rotatably connected to the rotating shaft; The rotary drive motor is used to drive the rotating shaft to rotate and drive the extending mechanism to rotate. The limiting spring block is used to limit the rotation angle of the extending mechanism.

5. The wafer transport device according to claim 4, characterized in that: The stretching mechanism comprises a plurality of stretching frames, the stretching frames are rotatably connected to the rotating shaft, two opposite sides of the stretching frames are provided with slide grooves, a slide seat is slidably connected to the slide grooves, a stretching driving assembly is arranged in the stretching frame and connected to the slide seat, and the stretching driving assembly is used to drive the slide seat to move on the slide grooves; The bearing assembly is connected to the slide seat, and the slide seat is used to drive the bearing assembly to move synchronously.

6. The wafer transport device according to claim 5, characterized in that: The extension drive assembly includes an extension drive motor, a first transmission belt, a second transmission belt and a plurality of transmission pulleys; The first transmission belt and the second transmission belt are respectively located on both sides of the stretching frame and connected to the slide seat, both ends of the first transmission belt and both ends of the second transmission belt are provided with transmission pulleys, and the stretching drive motor is rotatably connected to the transmission pulleys; The extension drive motor is used to drive the transmission pulley to rotate, and drive the first transmission belt and the second transmission belt to rotate, and further drive the slide to move.

7. The wafer transport device according to claim 5, characterized in that: The bearing assembly comprises a finger fixing seat and a manipulator, the finger fixing seat comprises a connecting portion and a fixing portion, the connecting portion is connected to the sliding seat, and the manipulator is connected to the fixing portion; The robot is used for carrying the wafer.

8. The wafer transport device according to claim 7, characterized in that: There are multiple slides, and the multiple slides are evenly distributed on the first guide rail and the second guide rail.

9. The wafer transport device according to any one of claims 2 to 8, characterized in that: The bottom of the gantry is provided with first exhaust components on two opposite sides, and the upper part of the gantry is provided with second exhaust components on two opposite sides. The first exhaust component and the second exhaust component are both used to generate negative pressure in the gantry.

10. The wafer transport device according to claim 9, characterized in that: Hoisting components are arranged on opposite sides of the top of the gantry.

Images