Copper-aluminum alloy circuit board and high-thermal-conductivity metal circuit board

Abstract

The utility model discloses a copper-aluminum alloy circuit board and a high-thermal-conductivity metal circuit board, and belongs to the technical field of alloy substrates. Comprising an alloy substrate, and the alloy substrate comprises a heat conduction layer arranged on a top layer; the heat dissipation layer is arranged on the bottom layer; and the copper-aluminum alloy layer is positioned between the heat conduction layer and the heat dissipation layer. The alloy substrate comprises a heat dissipation layer; the copper-aluminum alloy layer is positioned above the heat dissipation layer; the heat conduction layer is positioned above the copper-aluminum alloy layer; and the insulating layer is positioned above the heat conduction layer. The beneficial effects of the above technical scheme are that the electrical connection quality is good, the reliability is high, the production cost is low, and the structure is simple.

Description

Technical Field

[0001] The utility model relates to the technical field of alloy substrates, in particular to a copper-aluminum alloy circuit board and a high-thermal-conductivity metal circuit board. Background Art

[0002] With the development of technology, in other electronic fields such as electrical, automotive, and communications, higher requirements are placed on the thermal conductivity, heat dissipation, corrosion resistance, and wear resistance of electronic circuit boards, and at the same time, cost control is becoming increasingly stringent.

[0003] In the prior art, Figure 1 As shown, a circuit board conventionally used in an application environment requiring high thermal conductivity is generally composed of a thermal conductive layer 13, circuits and pads, and a heating device 4 is arranged on the circuits and pads, wherein the thermal conductive layer 13 is made of copper material. Although it has good thermal conductivity and stable electrical properties, the material cost is high, and the processing cost and processing technology requirements are also high. In addition, the copper substrate is easily affected by mechanical stress and fatigue fracture, and the surface is also easily affected by oxidation and corrosion. Utility Model Content

[0004] The purpose of the utility model is to provide a copper-aluminum alloy circuit board to solve the above technical problems;

[0005] The purpose of the utility model is also to provide a high thermal conductivity metal circuit board to solve the above technical problems;

[0006] A copper-aluminum alloy circuit board, comprising:

[0007] An alloy substrate, the alloy substrate comprising:

[0008] A heat-conducting layer, disposed on the top layer;

[0009] A heat dissipation layer, arranged on the bottom layer;

[0010] The copper-aluminum alloy layer is located between the heat-conducting layer and the heat-dissipating layer.

[0011] Preferably, the thermal conductive layer is made of a copper substrate layer, and the heat dissipation layer is made of an aluminum substrate layer.

[0012] Preferably, circuits and pads are printed on the copper substrate layer, and heating devices are arranged on the circuits and pads.

[0013] Preferably, the copper-aluminum alloy layer is formed by adding chemical reagents to the surfaces where the thermal conductive layer and the heat dissipation layer are attached.

[0014] A high thermal conductivity metal circuit board, comprising:

[0015] An alloy substrate, the alloy substrate comprising:

[0016] Heat dissipation layer;

[0017] A copper-aluminum alloy layer, located above the heat dissipation layer;

[0018] A heat conducting layer, located above the copper-aluminum alloy layer;

[0019] The insulating layer is located above the heat conducting layer.

[0020] Preferably, a copper foil layer for conducting electricity and transmitting electrical signals is provided on the insulating layer;

[0021] The copper foil layer has a thickness of 18 μm to 140 μm.

[0022] Preferably, the thickness of the insulating layer is 10 μm to 50 μm.

[0023] Preferably, the thermal conductivity of the insulating layer is 1 w / (m·k) to 3 w / (m·k).

[0024] Preferably, the alloy substrate has a thickness of 0.8 mm to 2 mm.

[0025] Preferably, the thickness of the heat conducting layer is 100 μm to 300 μm.

[0026] The utility model has the beneficial effects of good electrical connection quality, high reliability, low production cost and simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of a metal circuit board in the prior art;

[0028] Figure 2 It is a structural schematic diagram of the copper-aluminum alloy circuit board of the utility model;

[0029] Figure 3 It is a structural schematic diagram of the circuit and pad of the copper-aluminum alloy circuit board of the utility model;

[0030] Figure 4 It is a structural schematic diagram of a high thermal conductivity metal circuit board of the utility model.

[0031] In the attached figure: 1, alloy substrate; 11, heat dissipation layer; 12, copper-aluminum alloy layer; 13, thermal conductive layer; 2, insulation layer; 3, copper foil layer; 4, heating element. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0034] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0035] A copper-aluminum alloy circuit board, such as Figure 2 , Figure 3 As shown, including

[0036] The alloy substrate 1 comprises:

[0037] A heat conducting layer 13, arranged on the top layer;

[0038] The heat dissipation layer 11 is arranged on the bottom layer;

[0039] The copper-aluminum alloy layer 12 is located between the heat-conducting layer 13 and the heat-dissipating layer 11 .

[0040] In the prior art, with the rapid development of the electronics industry and the continuous emergence of some high-performance electronic products, the requirements for electronic products are gradually tending towards miniaturization and lightness. The heat dissipation requirements for circuit boards are also getting higher and higher. At present, high-power devices such as LEDs (light-emitting diodes), MOS (metal oxide semiconductors), IGBTs (insulated gate bipolar transistors), etc. are all mounted on metal substrates to achieve the purpose of heat dissipation. The traditional aluminum substrates on the market currently have a low thermal conductivity, which can no longer meet the heat dissipation requirements for larger and heat-concentrated devices. Although the pure copper substrates on the market have good thermal conductivity, the price of the thermoelectric separation copper substrates on the market has remained high due to the high price of copper.

[0041] Specifically, the utility model provides a copper-aluminum alloy circuit board, which is made of a thermal conductive layer 13, a heat dissipation layer 11 and a copper-aluminum alloy layer 12. The circuit board has a simple and firm structure, high reliability, good electrical connection quality, and effectively reduces production costs.

[0042] In a preferred embodiment, the heat conducting layer 13 is made of a copper substrate layer, and the heat dissipating layer 11 is made of an aluminum substrate layer;

[0043] Circuits and pads are printed on the copper substrate layer, and heating devices 4 are arranged on the circuits and pads;

[0044] The copper-aluminum alloy layer 12 is formed by adding chemical reagents to the surfaces where the heat-conducting layer 13 and the heat-dissipating layer 11 are attached.

[0045] Specifically, the thermal conductive layer 13 is a copper substrate made of copper material, the heat dissipation layer 11 is an aluminum substrate made of aluminum material, the alloy substrate 1 is a copper-aluminum alloy metal circuit board in which the copper substrate and the aluminum substrate are specially treated and pressed into a whole, and the copper-aluminum alloy layer 12 is produced by adding chemical reagents to generate Al2Cu, AlCu, Al4Cu9 and other copper-aluminum compounds between the two metals from aluminum to copper in sequence, and its electrical connection quality is good and the reliability is high.

[0046] Specifically, the copper-aluminum alloy layer 12 is usually made by extrusion rolling and other methods. Through special plastic deformation, the bonding surface of the two metals is close to the distance between atoms, forming the bonding point of copper-aluminum compounds such as zinc, nickel, and iron. Then, a strong bonding surface is formed through diffusion heat treatment and annealing, thereby effectively reducing the risk of fracture and delamination during SMT (surface mount technology) processing, such as high-temperature furnace, etc., which may be caused by the different metal properties of copper and aluminum. The aluminum substrate and the copper substrate on the upper and lower surfaces become a tightly combined whole.

[0047] More specifically, different substrate thicknesses can be matched according to the power of the heating device 4 to achieve the effect of enhancing heat conduction and heat dissipation, so as to ensure the stability of the device operation.

[0048] A high thermal conductivity metal circuit board, referring to Figure 4 include,

[0049] The alloy substrate 1 comprises:

[0050] Heat dissipation layer 11;

[0051] The copper-aluminum alloy layer 12 is located above the heat dissipation layer 11;

[0052] The heat conducting layer 13 is located above the copper-aluminum alloy layer 12;

[0053] The insulating layer 2 is located above the heat conducting layer 13 .

[0054] Specifically, the utility model also provides a high thermal conductivity metal circuit board with a laminated structure. By using a copper-aluminum composite material as the substrate of the metal circuit board, the thermal conductivity is almost the same as that of a copper substrate, and the ratio of copper base to aluminum base is 2:8. Since the proportion of metal aluminum in the copper-aluminum composite material is close to 80%, the quality and price are much lower than those of a pure copper substrate, which is of great significance to the lightweight and cost reduction of the product.

[0055] In a preferred embodiment, a copper foil layer 3 for conducting electricity and transmitting electrical signals is provided on the insulating layer 2;

[0056] The thickness of the copper foil layer 3 is 18 μm to 140 μm.

[0057] Specifically, by arranging etching circuits on the copper foil layer 3, signal transmission can be achieved on the surface of the copper foil layer without perforation or other complex structures, reducing the space occupied on the copper foil layer and making the copper foil layer design more compact and efficient. Etching circuits can help improve the electromagnetic compatibility of the copper foil layer. By properly designing and arranging the circuits, electromagnetic interference during signal transmission can be reduced, thereby improving the performance and stability of the copper foil layer.

[0058] More specifically, the copper foil layer 3, i.e., the copper foil layer, is generally 18 μm (thickness) or 0.5 oz (weight), 35 μm or 1 oz, 70 μm or 2 oz, 105 μm or 3 oz, 140 μm or 4 oz, etc., and is mainly used to etch out circuits for conducting electricity and transmitting electronic signals.

[0059] In a preferred embodiment, the thickness of the insulating layer 2 is 10 μm to 50 μm.

[0060] Specifically, the insulating layer 2 is mainly used to isolate the electrical signal between the copper foil layer 3 and the alloy substrate 1 to prevent short circuit.

[0061] Specifically, the special ceramic has good high temperature resistance, so that the insulating layer 2 can maintain stable performance in a high temperature environment. The special polymer provides good mechanical strength and toughness, so that the insulating layer 2 has high tensile, compressive and impact resistance. It helps to protect the electronic components on the copper foil layer from damage by external mechanical vibration, impact or pressure.

[0062] More specifically, the special polymer material of the insulating layer 2 usually has good chemical stability and can resist corrosion by chemicals such as acids, alkalis, solvents, etc. This enables the insulating layer 2 to work stably for a long time under harsh environmental conditions, thereby extending the service life of the circuit board.

[0063] More specifically, special polymers usually have low density and lightweight properties, which can help reduce the overall weight of the circuit board and improve the portability and installation convenience of the circuit board.

[0064] In a preferred embodiment, the thermal conductivity of the insulating layer is 1 W / (m·k) to 3 W / (m·k).

[0065] Specifically, the thermal conductivity of the insulating layer 2 is required to be relatively high, usually requiring a thermal conductivity of 1W / (m·k) to 3W / (m·k). It is generally composed of a special polymer filled with special ceramics with low thermal resistance but good insulation performance. The main features are low thermal resistance, strong thermal conductivity, good insulation performance, high voltage resistance, and excellent viscoelastic properties. It can effectively isolate the conductive part of the circuit, prevent current loss or short circuit, thereby improving the stability and safety of the circuit.

[0066] In a preferred embodiment, the thickness of the alloy substrate 1 is 0.8 mm to 2 mm.

[0067] Specifically, the alloy substrate 1 is a supporting component of a high thermal conductivity metal circuit board, and is composed of a copper-aluminum composite material with high thermal conductivity, so that the alloy substrate 1 can effectively and quickly conduct and disperse the heat generated on the copper foil layer, which helps to reduce the operating temperature of components on the copper foil layer and improve the stability and reliability of the circuit.

[0068] More specifically, the copper-aluminum composite material has high strength and rigidity, so that the alloy substrate 1 has good structural stability. It can provide sufficient support and protection to prevent the copper foil layer from being deformed or damaged during use.

[0069] In a preferred embodiment, the thickness of the heat conducting layer 13 is 100 μm to 300 μm.

[0070] Specifically, a thicker heat-conducting layer 13 can provide a larger heat conduction channel, thereby optimizing the heat dissipation performance of the copper foil layer. The thicker the heat-conducting layer 13 is, the stronger its heat conduction capability is, and the heat can be more effectively conducted from the electronic device to the entire board, and the heat dispersion and heat dissipation can be accelerated.

[0071] More specifically, the thickening of the heat-conducting layer 13 can enhance the structural stability and mechanical strength of the alloy substrate 1. The thicker heat-conducting layer 13 can provide better support and protection, preventing the copper foil layer from bending, deforming or being damaged during transportation, installation or use.

[0072] More specifically, the thicker heat-conducting layer 13 can distribute heat more evenly, reduce the concentration and impact range of thermal stress, help reduce the risk of components on the copper foil layer being affected by thermal stress, and improve the reliability and stability of the copper foil layer.

[0073] More specifically, the thickening of the heat-conducting layer 13 can improve the overall high-temperature resistance of the copper foil layer. A thicker heat-conducting layer 13 can disperse heat more effectively and provide better heat-bearing capacity, so that the copper foil layer can maintain stable performance in a high-temperature environment.

[0074] The alloy substrate 1 of the utility model includes a copper base layer, an alloy layer, and an aluminum base layer. The metal base layer is the supporting component of the metal-based circuit board and is also its most important heat dissipation part. The copper base layer serves as a fast heat-conducting layer 13, which quickly absorbs the heat generated by the device and transfers it to the lower aluminum base layer with faster heat dissipation. The alloy layer seen in the copper base and the aluminum base is an aluminum-copper multi-element alloy formed by reaction after adding chemical reagents to the bonding surface of the copper base and the aluminum base. It is relatively stable at high temperatures and has high strength. Therefore, the metal substrate with the copper-aluminum alloy as the base material can withstand higher thermal stress and metal stress in application.

[0075] Specifically, a new copper-aluminum composite material is used as the circuit board substrate, so that it has the advantages of high thermal conductivity of metal copper materials and high heat dissipation of aluminum-based materials. The high thermal conductivity of the surface copper base quickly absorbs the heat generated by the device and transfers it to the lower aluminum-based material with faster heat dissipation. Its electrical and thermal conductivity are close to that of pure copper substrates, but compared with copper substrates, its weight is only one-third of that of pure copper substrates, and its cost is greatly reduced, which is of great significance to the lightweight and cost optimization of subsequent metal substrates.

[0076] In summary, the present application provides a copper-aluminum alloy circuit board and a high thermal conductivity metal circuit board, which are composed of a bottom aluminum substrate, a middle layer of copper-aluminum metal that is processed by rolling, crimping or other special processes to form a copper-aluminum alloy layer and a top copper substrate, and a circuit board with circuit pads printed on the surface. High-power, high-heat-dissipating LEDs and other heat-generating devices can be placed on it, which has the advantages of enhanced thermal conductivity and heat dissipation effects, and can also ensure the stability of device operation.

[0077] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A copper-aluminum alloy circuit board, characterized in that: include, An alloy substrate (1), the alloy substrate (1) comprising: A heat conducting layer (13), arranged on the top layer; A heat dissipation layer (11), disposed on the bottom layer; The copper-aluminum alloy layer (12) is located between the heat-conducting layer (13) and the heat-dissipating layer (11).

2. The copper-aluminum alloy circuit board according to claim 1, characterized in that: The heat-conducting layer (13) is made of a copper substrate layer, and the heat-dissipating layer (11) is made of an aluminum substrate layer.

3. The copper-aluminum alloy circuit board according to claim 2, characterized in that: Circuits and pads are printed on the copper substrate layer, and heating devices (4) are arranged on the circuits and pads.

4. The copper-aluminum alloy circuit board according to claim 1, characterized in that: The copper-aluminum alloy layer (12) is formed by adding a chemical reagent to the surfaces where the heat-conducting layer (13) and the heat-dissipating layer (11) are bonded.

5. A high thermal conductivity metal circuit board, characterized in that: include, An alloy substrate (1), the alloy substrate (1) comprising: heat dissipation layer (11); A copper-aluminum alloy layer (12) located above the heat dissipation layer (11); A heat conducting layer (13) located above the copper-aluminum alloy layer (12); The insulating layer (2) is located above the heat conducting layer (13).

6. The high thermal conductivity metal circuit board according to claim 5, characterized in that: A copper foil layer (3) for conducting electricity and transmitting electrical signals is provided on the insulating layer (2); The copper foil layer (3) has a thickness of 18 μm to 140 μm.

7. The high thermal conductivity metal circuit board according to claim 5, characterized in that: The thickness of the insulating layer (2) is 10 μm to 50 μm.

8. The high thermal conductivity metal circuit board according to claim 5, characterized in that: The thermal conductivity of the insulating layer is 1W / (m·k) to 3W / (m·k).

9. The high thermal conductivity metal circuit board according to claim 5, characterized in that: The alloy substrate (1) has a thickness of 0.8 mm to 2 mm.

10. The high thermal conductivity metal circuit board according to claim 5, characterized in that: The thickness of the heat-conducting layer (13) is 100 μm to 300 μm.

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