Multi-contact heat dissipation type bonding pad

Abstract

The utility model relates to the technical field of bonding pads, in particular to a multi-contact heat dissipation type bonding pad, which comprises a substrate, a plurality of rectangular contact points are arranged on the substrate, a plurality of contact point sheets are fixedly arranged on the plurality of contact points, the contact point sheets are uniform in size, and the plurality of contact point sheets are uniformly arranged in the contact points in a grid shape. During gluing, only a plurality of contact point pieces need to be placed in the contact points, the offset degree of the contact point pieces is eliminated through the surface tension of glue, and therefore the purpose that the contact point pieces are regular is achieved. The utility model aims to solve the problem that the contact point sheet deviates from the contact point in the gluing process, and has the characteristics of ingenious structure and convenience in operation.

Description

Technical Field

[0001] The present application relates to the technical field of solder pads, and in particular to a multi-contact point heat dissipation solder pad. Background Art

[0002] With the rapid development of electronic technology, the integration of electronic components is getting higher and higher, and the spacing between different welding components is shrinking. This makes it easy for welding components to interfere with each other due to irregular arrangement during operation. Therefore, the arrangement of welding components should be regular and orderly. Especially for tiny solder joints or densely arranged solder joints, operation accuracy is particularly important. The overall welding quality and strength play a key and decisive role in the stability and reliability of electronic equipment.

[0003] Most existing pads use solder glue to position and protect the soldering contact points, but the amount of glue applied and the uniformity of the glue application need to be accurately and rigorously controlled, otherwise the regularity requirements of the soldering components cannot be met, affecting the pad production and manufacturing process. In the prior art, the contact point structure design that allows the pad to be evenly coated with glue is insufficient, resulting in the contact point sheet being easily offset from the contact point when the contact point sheet is attached to the substrate, affecting the overall aesthetics of the pad while failing to meet the regularity requirements. Therefore, designing and developing a heat dissipation pad with multiple contact points is of great significance for protecting the stable process performance of electronic components. Utility Model Content

[0004] In view of the shortcomings of the existing technology, a multi-contact point heat dissipation solder pad is proposed. The purpose of this application is to solve the problem of contact point sheet offset from the contact point during the glue coating process, so as to improve the processability and stability of the solder pad.

[0005] The above-mentioned purpose of the present application is achieved through the following technical scheme: a multi-contact point heat dissipation pad, including a substrate, on which a plurality of rectangular contact points are opened, and the side length of the contact points ranges from 6 to 12 mm. Contact point sheets are fixedly arranged on the plurality of contact points, and the plurality of contact point sheets are of the same size, and the plurality of contact point sheets are arranged in a uniform grid shape in the contact points.

[0006] By adopting the above technical solution, considering that only one contact point sheet is pasted in the contact point, it is easy to cause deviation, and in severe cases even cause the pad to fail, by dividing the contact point sheet into multiple contact point sheets of uniform size, during the gluing process, the contact point sheets are restrained and returned to their positions by the surface tension of the glue liquid in the contact point, and finally the deviation is offset to form a regular grid-shaped whole contact point sheet, thereby meeting the requirements of the pad contact point for the regularity of the contact point sheet.

[0007] Furthermore, the contact points are arranged on both sides of the substrate along the length direction of the substrate.

[0008] By adopting the above technical solution, since the welding work requires the positioning of the contact points to facilitate the wiring connection, the contact points are set on both sides of the pad substrate. At the same time, this setting can also facilitate the simultaneous gluing operation on both sides of the substrate, which helps to improve the convenience of the welding work.

[0009] Furthermore, the contact points are arranged in a staggered manner on the substrate, and the distance between the contact points is 17-35 mm.

[0010] By adopting the above technical solution, considering that during welding, the glue on both sides of the substrate and the adjacent contact points are prone to interfere with each other, the distance between the contact points should not be too close, and the contact points are set to be staggered to ensure that there is enough distance between the contact points to avoid interference with each other while maximizing the use of the substrate area, thereby improving the overall stability.

[0011] Furthermore, a raised barrier strip is fixedly provided on the side of the contact point, the raised height of the barrier strip is in the range of 1 mm to 3 mm, the length of the barrier strip is longer than the side length of the rectangular contact point, and the barrier strips are interconnected and combined into a rectangular frame.

[0012] By adopting the above technical solution, considering that during the process of pasting the contact pad, excess glue in the contact point may overflow from the contact point, causing other components on the pad to be attached with glue and fail, the glue is isolated in the contact point by setting a blocking frame to achieve the purpose of protecting the substrate and the components thereon.

[0013] Furthermore, the substrate is provided with heat dissipation vias, the heat dissipation vias are through holes, and the heat dissipation vias are evenly arranged around the contact points.

[0014] By adopting the above technical solution, the heat dissipation vias are provided to increase the heat dissipation area on the surface of the pad substrate, accelerate the heat dissipation, and thus reduce the occurrence of welding defects.

[0015] Furthermore, the radius of the heat dissipation via is in the range of 0.3-0.5 mm, and a cross groove is provided on the outer circumference of the heat dissipation via.

[0016] By adopting the above technical solution, during the welding process, the heat at the welding center point should not be lost too quickly, otherwise the temperature of the molten tin needs to be increased, resulting in problems such as peeling of the PCB substrate. Therefore, by opening the cross groove, the design of the cross groove reduces the direct contact area between the pad and the copper foil, thereby reducing the heat dissipation speed, so that the welding point can maintain a sufficient temperature and improve the welding quality.

[0017] Furthermore, a teardrop-shaped copper foil is provided on the outer diameter of the heat dissipation via, and the teardrop-shaped copper foil is fixedly provided on the substrate.

[0018] By adopting the above technical solution, the teardrop-shaped copper foil forms a transition zone between the pad and the wire, increasing the contact area between the pad and the wire. Since stress concentration is prone to occur at the connection between the pad and the wire, the design of the teardrop-shaped copper foil can alleviate this stress concentration and prevent the wire from loosening or breaking.

[0019] Furthermore, the substrate is made of a material with high thermal conductivity.

[0020] By adopting the above technical solution, since the high thermal conductivity material has excellent thermal conductivity, the heat generated during the welding process can be distributed more evenly, thereby reducing the occurrence of welding defects.

[0021] In summary, the present application includes at least one of the following beneficial technical effects:

[0022] 1. Divide the contact point sheet into multiple pieces of uniform size, and restrain and return them to each other through the surface tension of the glue liquid to form a regular grid-like whole sheet, which effectively prevents deviation, ensures the regularity requirements of the pad contact point, and improves the accuracy and reliability of welding;

[0023] 2. Staggering the contact points on both sides of the pad substrate not only facilitates the positioning of the contact points and the connection of the wiring, but also allows the glue application on both sides at the same time, which improves the convenience and efficiency of the work. At the same time, the staggered arrangement ensures that there is enough distance between the contact points to prevent the glue from interfering with each other during the application of glue, thus enhancing the overall stability;

[0024] 3. By setting up barrier strips, the glue in the contact points can be effectively isolated to protect the substrate and the components on it from contamination. At the same time, the heat dissipation vias increase the heat dissipation area, accelerate heat dissipation, reduce welding defects, and improve welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure in the embodiment.

[0026] Figure numerals: 1. substrate; 2. contact point; 3. contact point sheet; 4. barrier frame; 5. heat dissipation via; 6. cross groove; 7. teardrop-shaped copper foil. DETAILED DESCRIPTION

[0027] The present application is further described in detail below in conjunction with the accompanying drawings.

[0028] Example, see Figure 1A multi-contact point heat dissipation pad includes a substrate 1, on which a plurality of rectangular contact points 2 are provided, the side length of the contact point 2 is 9 mm, and a contact point sheet 3 is fixedly provided on each of the plurality of contact points 2, and the plurality of contact point sheets 3 are uniformly arranged in a grid in the contact point 2. Considering that only one contact point sheet 3 is pasted in the contact point 2, it is easy to deviate, and even cause the pad to fail in severe cases, by dividing the contact point sheet 3 into a plurality of contact point sheets 3 of uniform size, the contact point sheets 3 are restrained and reset by the surface tension of the glue liquid in the contact point 2 during the glue coating process, and finally the deviation is offset to form a regular whole contact point sheet 3 in the shape of a field, thereby satisfying the requirement of the pad contact point 2 for the regularity of the contact point sheet 3.

[0029] In this embodiment, the contact points 2 are arranged on both sides of the substrate 1 along the length direction of the substrate 1, the contact points 2 are arranged in a staggered manner on the substrate 1, the distance between the contact points 2 is 27 mm, and a raised barrier frame 4 is fixedly provided on the edge of the contact point 2, the raised height of the barrier frame 4 is 2 mm, the length of the barrier frame 4 is longer than the side length of the rectangular contact point 2, and the barrier frame 4 is connected to each other and combined into a rectangular frame. While facilitating the glue coating operation, it prevents glue overflow from interfering with each other at adjacent contact points 2.

[0030] In this embodiment, the substrate 1 is provided with heat dissipation vias 5, which are through holes. The heat dissipation vias 5 are evenly arranged around the contact point 2, and the radius of the heat dissipation vias 5 is 0.4 mm. A cross groove 6 is provided on the outer diameter of the heat dissipation vias 5. A teardrop-shaped copper foil 7 is also provided on the outer diameter of the heat dissipation vias 5, and the teardrop-shaped copper foil 7 is fixedly provided on the substrate 1. By providing the heat dissipation vias 5 and the cross grooves 6, the heat in the pad is evenly and reasonably distributed, which improves the heat dissipation performance and effect of the pad during the welding process. At the same time, in order to reduce the stress concentration at the connection between the wire and the soldering point, a teardrop-shaped copper foil 7 is provided on the outer diameter of the heat dissipation vias 5.

[0031] Specific implementation process: Before the welding work begins, first place the substrate 1 on a horizontal plane, then place four contact point sheets 3 evenly in the contact point 2, and use glue to fix the contact point sheets 3 in the contact point 2. The contact point sheets 3 in the contact point 2 are restrained and returned to their original positions by the surface tension of the glue liquid, and finally offset each other's deviation to form a regular field-shaped contact point sheet 3. After the glue coating process is completed, wait for the glue to solidify, and the pad can be further welded.

[0032] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A multi-contact point heat dissipation pad, characterized in that: The invention comprises a substrate (1), wherein a plurality of rectangular contact points (2) are provided on the substrate (1), wherein the side length of the contact points (2) ranges from 6 to 12 mm, and contact point sheets (3) are fixedly arranged on the plurality of contact points (2). The plurality of contact point sheets (3) are of uniform size, and the plurality of contact point sheets (3) are arranged in a uniform grid shape in the contact points (2).

2. A multi-contact point heat dissipation pad according to claim 1, characterized in that: The contact points (2) are arranged on both sides of the substrate (1) along the length direction of the substrate (1).

3. A multi-contact point heat dissipation pad according to claim 2, characterized in that: The contact points (2) are arranged in a staggered manner on the substrate (1), and the distance between the contact points (2) is between 17 and 35 mm.

4. The multi-contact point heat dissipation pad according to claim 1, characterized in that: A raised barrier strip (4) is fixedly arranged on the edge of the contact point (2); the raised height of the barrier strip (4) is in the range of 1 mm to 3 mm; the length of the barrier strip (4) is longer than the side length of the rectangular contact point (2); and the barrier strips (4) are interconnected and combined into a rectangular frame.

5. The multi-contact point heat dissipation pad according to claim 1, characterized in that: The substrate (1) is provided with heat dissipation vias (5), the heat dissipation vias (5) are through holes, and the heat dissipation vias (5) are evenly arranged around the contact points (2).

6. The multi-contact point heat dissipation pad according to claim 5, characterized in that: The radius of the heat dissipation via hole (5) is between 0.3 and 0.5 mm, and a cross groove (6) is provided on the outer diameter circumference of the heat dissipation via hole (5).

7. The multi-contact point heat dissipation pad according to claim 5, characterized in that: A teardrop-shaped copper foil (7) is also provided on the outer diameter of the heat dissipation via (5), and the teardrop-shaped copper foil (7) is fixedly arranged on the substrate (1).

8. The multi-contact point heat dissipation pad according to claim 1, characterized in that: The substrate (1) is made of a material with high thermal conductivity.

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