Clamping device for chip polishing processing

Abstract

The utility model discloses a clamping device for chip polishing machining, and belongs to the technical field of chip machining, the clamping device comprises a supporting mechanism, the supporting mechanism comprises a supporting body, the upper end of the supporting body is fixedly connected with a top plate, the end, away from the supporting body, of the lower surface of the top plate is provided with a polishing mechanism, and the lower end of the supporting body is fixedly connected with a bottom plate; the clamping device comprises a bottom plate, a supporting body is arranged on the upper surface of the bottom plate, a bottom supporting mechanism is installed at the end, away from the supporting body, of the upper surface of the bottom plate, a base is fixedly connected to the lower surface of the bottom plate, a transmission mechanism is installed in the middle of the supporting body, and a clamping mechanism is installed at the end, away from the supporting body, of the transmission mechanism. The chip is limited and fixed through the clamping mechanism, the chip is polished through the polishing mechanism, the state of the chip is changed through the transmission mechanism, the upper face and the lower face of the chip can be polished, and the polishing effect and stability are improved.

Description

Technical Field

[0001] The present application relates to the technical field of chip processing, and in particular to a clamping device for chip grinding processing. Background Art

[0002] Chip processing refers to the process of manufacturing electronic components and integrated circuits on silicon wafers or other semiconductor materials. This process includes many steps, such as polishing, cleaning, oxidation, photolithography, ion implantation, thin film deposition, metallization, etc., and finally forms a chip with specific functions and performance. In order to avoid some uneven surfaces or uneven layer thicknesses that may appear during the chip manufacturing process, it is generally necessary to polish the original chip board.

[0003] In the patent document with the publication number CN112091747B, a clamping and fixing device for chip processing is provided, which belongs to the field of chip processing technology, including a supporting base plate and a top plate arranged above the supporting base plate, the bottom of the supporting base plate is provided with legs, and the left and right sides of the bottom of the top plate are fixedly connected to the supporting base plate through supporting side plates. The embodiment of the present invention has the advantages of convenient use, stable clamping and good grinding effect. After grinding, the chip body passes through the two groups of grinding components, and the driving shaft is driven to rotate by the first motor, thereby driving the sliding sleeve to move along the driving shaft direction, and the sliding sleeve drives the driving rod and the driving cylinder to move synchronously, and the driving cylinder is driven to move toward the chip body under the action of the limiting slide groove, thereby clamping the chip body, and pulling the chip body with the movement of the sliding sleeve, thereby ensuring that the chip body can completely pass through the two groups of grinding components, and realizing the comprehensive grinding of the chip body.

[0004] The above-mentioned device transports the chip to between two grinding plates for grinding through a conveyor belt. When the chip leaves the conveyor belt, the chip will be stabilized by the driving cylinder, clamping head and grinding plate. The grinding plate will produce a certain deflection force on the chip during grinding. The deflection force may cause the chip position to shift, resulting in uneven chip surface processing or uneven layer thickness, affecting the processing effect. Utility Model Content

[0005] The present application proposes a clamping device for chip grinding to solve the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, this application adopts the following technical solutions:

[0007] A clamping device for chip grinding processing includes a supporting mechanism, which includes a supporting body, a top plate fixedly connected to the upper end of the supporting body, a grinding mechanism installed on the lower surface of the top plate away from the support body, a bottom plate fixedly connected to the lower end of the supporting body, a bottom supporting mechanism installed on the upper surface of the bottom plate away from the support body, a base fixedly connected to the lower surface of the bottom plate, a transmission mechanism installed in the middle of the supporting body, and a clamping mechanism installed on the end of the transmission mechanism away from the support body.

[0008] As a preferred embodiment, the clamping mechanism includes a third motor, two sides of the third motor are fixedly connected to an outer frame, the outer frame is a rectangular frame structure, the middle of the outer frame is fixedly connected to a connecting plate, the output end of the third motor is fixedly connected to a threaded rod, the side of the threaded rod is threadedly sleeved with a push plate, both ends of the push plate away from the third motor are fixedly connected to push rods, the push rod passes through the connecting plate and is fixedly connected to a clamping plate, the end of the clamping plate away from the third motor is fixedly connected to a second anti-slip pad, and the side of the outer frame away from the third motor is fixedly connected to a first anti-slip pad.

[0009] By adopting the above technical solution, the clamping mechanism is responsible for positioning the chip to ensure the stability of the chip when it is polished.

[0010] As a preferred embodiment, the grinding mechanism includes a first electric telescopic rod, the upper end of the first electric telescopic rod is installed on the lower surface of the top plate, the lower end of the first electric telescopic rod is installed with a first motor, and the output end of the first motor is fixedly connected to a grinding disc.

[0011] By adopting the above technical solution, the polishing mechanism is responsible for polishing the chip.

[0012] As a preferred embodiment, the transmission mechanism includes a third electric telescopic rod, which is installed in the middle of the support body, the extending end of the third electric telescopic rod is fixedly connected to the second motor, the output end of the second motor is fixedly connected to the third motor, and the outer side of the output end of the third motor is sleeved with a limiting ring.

[0013] By adopting the above technical solution, the transmission mechanism changes the state of the clamping mechanism, thereby changing the state of the chip, thereby ensuring the grinding effect of the grinding mechanism.

[0014] As a preferred embodiment, the bottom supporting mechanism includes a second electric telescopic rod, the lower end of the second electric telescopic rod is fixedly connected to the upper surface of the placement board, the upper end of the second electric telescopic rod is equipped with a placement board, and a soft board is fixedly connected to the middle of the upper surface of the placement board.

[0015] By adopting the above technical solution, the bottom supporting mechanism is responsible for supporting the clamping mechanism and the chip to ensure the stability of the chip during the polishing process.

[0016] As a preferred implementation, the width of the soft board is the same as the inner width of the outer frame, and the polishing mechanism is located directly above the bottom supporting mechanism.

[0017] By adopting the above technical solution, the flexible board is responsible for limiting the outer frame to ensure that the movement direction of the outer frame does not deviate.

[0018] Beneficial effects of this application:

[0019] The clamping device for chip grinding processing supports the chip through a bottom supporting mechanism to maintain the chip stable, limits and fixes the chip through the clamping mechanism, grinds the chip through the grinding mechanism, and changes the state of the chip through the transmission mechanism, so that both the upper and lower surfaces of the chip can be polished, thereby improving the grinding effect and stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the main structure of this application;

[0021] Figure 2 This is a schematic diagram of the longitudinal section structure of this application;

[0022] Figure 3 It is a side view structural schematic diagram of this application;

[0023] Figure 4 This is a schematic diagram of the clamping mechanism structure of this application.

[0024] Numbers in the figure: 1. supporting mechanism; 101. supporting body; 102. top plate; 103. bottom plate; 104. base; 2. grinding mechanism; 201. first electric telescopic rod; 202. first motor; 203. grinding disc; 3. bottom supporting mechanism; 301. second electric telescopic rod; 302. placement plate; 303. soft board; 4. transmission mechanism; 401. third electric telescopic rod; 402. second motor; 403. limiting ring; 5. clamping mechanism; 501. third motor; 502. outer frame; 503. connecting plate; 504. first anti-skid pad; 505. push plate; 506. push rod; 507. clamping plate; 508. second anti-skid pad; 509. threaded rod. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0026] Reference Figure 2A clamping device for chip grinding processing includes a supporting mechanism 1, which includes a supporting body 101, a top plate 102 is fixedly connected to the upper end of the supporting body 101, a grinding mechanism 2 is installed on the lower surface of the top plate 102 away from the supporting body 101, a bottom plate 103 is fixedly connected to the lower end of the supporting body 101, a bottom supporting mechanism 3 is installed on the upper surface of the bottom plate 103 away from the supporting body 101, a base 104 is fixedly connected to the lower surface of the bottom plate 103, a transmission mechanism 4 is installed in the middle of the supporting body 101, and a clamping mechanism 5 is installed on the end of the transmission mechanism 4 away from the supporting body 101.

[0027] Reference Figure 4 The clamping mechanism 5 includes a third motor 501, and the outer frame 502 is fixedly connected to both sides of the third motor 501. The outer frame 502 is a rectangular frame structure, and a connecting plate 503 is fixedly connected in the middle of the outer frame 502. A threaded rod 509 is fixedly connected to the output end of the third motor 501, and a push plate 505 is threadedly sleeved on the side of the threaded rod 509. Push rods 506 are fixedly connected to both ends of the push plate 505 away from the third motor 501. The push rod 506 penetrates the connecting plate 503 and is fixedly connected to a clamping plate 507. The clamping plate 507 is fixedly connected to a second anti-slip pad 508 at one end away from the third motor 501, and a first anti-slip pad 504 is fixedly connected to the side of the frame of the outer frame 502 away from the third motor 501, and the side close to the third motor 501. First, the chip to be polished needs to be placed on the upper end of the bottom supporting mechanism 3. The clamping mechanism 5 is also initially located at the upper end of the bottom supporting mechanism 3. After the chip is placed, the third motor 501 starts to drive the threaded rod 509 to rotate, and the threaded rod 509 drives the push plate 505 to move. The push plate 505 drives the push rod 506 and the clamping plate 507 to move, pushing the chip located at the upper end of the bottom supporting mechanism 3 and squeezing it between the first anti-slip pad 504 and the second anti-slip pad 508, thereby achieving the fixation of the chip.

[0028] Reference Figure 3 The grinding mechanism 2 includes a first electric telescopic rod 201, the upper end of which is mounted on the lower surface of the top plate 102, and a first motor 202 is mounted on the lower end of the first electric telescopic rod 201, and a grinding disc 203 is fixedly connected to the output end of the first motor 202. After the clamping mechanism 5 completes the clamping of the chip, the first electric telescopic rod 201 extends to push the first motor 202 downward, and the first motor 202 starts to drive the grinding disc 203 to rotate. The grinding disc 203 approaches the chip under the action of the first electric telescopic rod 201 until the lower surface of the grinding disc 203 contacts the chip, thereby achieving the grinding of the chip.

[0029] Reference Figure 2The transmission mechanism 4 includes a third electric telescopic rod 401, which is installed in the middle of the support body 101. The extension end of the third electric telescopic rod 401 is fixedly connected to the second motor 402, and the output end of the second motor 402 is fixedly connected to the third motor 501. The outer side of the output end of the third motor 501 is sleeved with a limit ring 403. When the grinding mechanism 2 just contacts the chip, the third electric telescopic rod 401 extends, driving the clamping mechanism 5 to move forward slowly until the grinding mechanism 2 completes the grinding of the required grinding area of ​​the chip, and the first electric telescopic rod 201 and the third electric telescopic rod 401 contract, driving the grinding disc 203 to move up and the clamping mechanism 5 to move backward, and stop grinding, that is, the grinding of the single side of the chip is completed.

[0030] Reference Figure 3 The bottom supporting mechanism 3 includes a second electric telescopic rod 301, the lower end of which is fixedly connected to the upper surface of the placement plate 302, the upper end of which is mounted with the placement plate 302, and the middle of the upper surface of the placement plate 302 is fixedly connected with a soft board 303. When the chip is polished on one side and the first electric telescopic rod 201 is retracted, the second electric telescopic rod 301 is also retracted, driving the placement plate 302 and the soft board 303 to move downward and away from the clamping mechanism 5, and then the second motor 402 rotates to drive the clamping mechanism 5 to perform a flipping operation, so that the polished surface of the chip faces downward and the unpolished surface faces upward, and the second electric telescopic rod 301 extends until the soft board 303 contacts the chip, thus realizing the flipping operation of the chip.

[0031] Reference Figure 3 , the width of the soft board 303 is the same as the inner width of the outer frame 502, and the grinding mechanism 2 is located directly above the bottom supporting mechanism 3. When the chip completes the flipping operation, the bottom supporting mechanism 3 re-supports the supporting clamping mechanism 5 and the bottom of the chip, and the first electric telescopic rod 201 extends to repeat the grinding operation. During grinding, the second electric telescopic rod 301 extends to drive the chip to move, thereby ensuring the chip grinding effect. After the grinding is completed, the clamping mechanism 5 stops squeezing the chip, thereby completing the entire grinding operation.

[0032] Working principle: First, the chip to be polished needs to be placed on the upper end of the bottom supporting mechanism 3. The clamping mechanism 5 is also initially located at the upper end of the bottom supporting mechanism 3. After the chip is placed, the third motor 501 starts to drive the threaded rod 509 to rotate, and the threaded rod 509 drives the push plate 505 to move. The push plate 505 drives the push rod 506 and the clamping plate 507 to move, pushing the chip located at the upper end of the bottom supporting mechanism 3 and squeezing it between the first anti-skid pad 504 and the second anti-skid pad 508, thereby achieving the fixation of the chip. After the clamping mechanism 5 completes the clamping of the chip, the first electric telescopic rod 201 extends to push the first motor 202 downward, and the first motor 202 starts to drive the grinding disc 203 to rotate. The grinding disc 203 approaches the chip under the action of the first electric telescopic rod 201 until the lower surface of the grinding disc 203 contacts the chip, thereby achieving the grinding of the chip;

[0033] When the grinding mechanism 2 just contacts the chip, the third electric telescopic rod 401 extends, driving the clamping mechanism 5 to slowly move forward until the grinding mechanism 2 has finished grinding all the required grinding areas of the chip. The first electric telescopic rod 201 and the third electric telescopic rod 401 retract, driving the grinding disc 203 to move up and the clamping mechanism 5 to move backward, and then stop grinding, thus completing the grinding of one side of the chip. When the chip has completed single-sided grinding, when the first electric telescopic rod 201 retracts, the second electric telescopic rod 301 also retracts, driving the placement plate 302 and the soft board 303 to move downward, away from the clamping mechanism 5, and then the second motor 402 rotates to drive the clamping mechanism 5 to perform a flipping operation, so that the polished side of the chip faces downward and the unpolished side faces upward, and the second electric telescopic rod 301 extends until the soft board 303 contacts the chip, thus completing the flipping operation of the chip.

[0034] When the chip completes the flipping operation, the bottom supporting mechanism 3 re-supports the supporting clamping mechanism 5 and the bottom of the chip, and the first electric telescopic rod 201 is extended to repeat the grinding operation. During grinding, the second electric telescopic rod 301 is extended to drive the chip to move, thereby ensuring the chip grinding effect. After the grinding is completed, the clamping mechanism 5 stops squeezing the chip, thereby completing the entire grinding operation.

[0035] The above is only a preferred specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can make equivalent substitutions or changes within the technical scope disclosed in the present application according to the technical solution and utility model concept of the present application, which should be covered by the protection scope of the present application.

Claims

1. A chip grinding clamping device, comprising a supporting mechanism (1), characterized in that: The support mechanism (1) comprises a support body (101), the upper end of the support body (101) is fixedly connected to a top plate (102), a grinding mechanism (2) is installed on the lower surface of the top plate (102) away from the support body (101), the lower end of the support body (101) is fixedly connected to a bottom plate (103), a bottom supporting mechanism (3) is installed on the upper surface of the bottom plate (103) away from the support body (101), a base (104) is fixedly connected to the lower surface of the bottom plate (103), a transmission mechanism (4) is installed in the middle of the support body (101), and a clamping mechanism (5) is installed on the end of the transmission mechanism (4) away from the support body (101).

2. A chip grinding clamping device according to claim 1, characterized in that: The clamping mechanism (5) comprises a third motor (501), both sides of the third motor (501) are fixedly connected to an outer frame (502), the outer frame (502) is of a rectangular frame structure, a connecting plate (503) is fixedly connected to the middle of the outer frame (502), a threaded rod (509) is fixedly connected to the output end of the third motor (501), a push plate (505) is threadedly sleeved on the side of the threaded rod (509), both ends of the push plate (505) away from the third motor (501) are fixedly connected to push rods (506), the push rod (506) passes through the connecting plate (503) and is fixedly connected to a clamping plate (507), the end of the clamping plate (507) away from the third motor (501) is fixedly connected to a second anti-slip pad (508), and a first anti-slip pad (504) is fixedly connected to the frame of the end of the outer frame (502) away from the third motor (501) on the side close to the third motor (501).

3. A chip grinding clamping device according to claim 1, characterized in that: The grinding mechanism (2) comprises a first electric telescopic rod (201), the upper end of the first electric telescopic rod (201) is mounted on the lower surface of the top plate (102), the lower end of the first electric telescopic rod (201) is mounted with a first motor (202), and the output end of the first motor (202) is fixedly connected with a grinding disc (203).

4. A chip grinding clamping device according to claim 1, characterized in that: The transmission mechanism (4) comprises a third electric telescopic rod (401), the third electric telescopic rod (401) is installed in the middle of the support body (101), the extension end of the third electric telescopic rod (401) is fixedly connected to a second motor (402), the output end of the second motor (402) is fixedly connected to the third motor (501), and the outer side of the output end of the third motor (501) is sleeved with a limit ring (403).

5. A chip grinding clamping device according to claim 2, characterized in that: The bottom supporting mechanism (3) comprises a second electric telescopic rod (301), the lower end of the second electric telescopic rod (301) is fixedly connected to the upper surface of a placement plate (302), the upper end of the second electric telescopic rod (301) is provided with a placement plate (302), and the middle of the upper surface of the placement plate (302) is fixedly connected with a soft board (303).

6. A chip grinding clamping device according to claim 5, characterized in that: The width of the soft board (303) is the same as the inner width of the outer frame (502), and the polishing mechanism (2) is located directly above the bottom supporting mechanism (3).

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