Chip carrier tape die

Abstract

The utility model discloses a chip carrier tape die which comprises an upper die assembly and a lower die assembly, the upper die assembly is provided with an upper die base, an upper padding plate, an upper die plate, a back stripping plate and a stripper plate which are connected in sequence from top to bottom, and the lower die assembly is provided with a lower die base, a lower padding plate and a lower die plate which are connected in sequence from bottom to top. A plurality of first punching needles, a plurality of second punching needles and a plurality of third punching needles are arranged on the upper base plate, and a heat conduction block capable of switching the heating state through power-on and power-off is installed in the lower die plate. The cold stamping precision die is designed according to the eight-plate structure of the cold stamping precision die, parts of the upper die and the lower die are accurately matched, the parts are easy to replace when damaged, multiple material belts can be formed side by side at the same time, production efficiency is improved, heating can be selected when a large cavity is manufactured so as to ensure that the needed depth size can be manufactured, and when a small cavity for packaging small electronic products is manufactured, production efficiency is improved. And power can be cut off to cancel heating, so that the accuracy of the size is ensured, and the device is suitable for manufacturing different types of chip carrier tapes.

Description

Technical Field

[0001] The utility model relates to the technical field of molds, in particular to a chip carrier mold. Background Art

[0002] Ordinary carrier molds are usually simply made into two upper and lower imitation molds (convex molds and concave molds). The molds are heated during molding to perform thermoforming on the chip carrier. This method is only suitable for the production of ordinary product carriers. It has obvious shortcomings for high-precision chip carriers. Thermoforming affects the accuracy of the cavity size, and only one strip can be molded at a time, resulting in low production efficiency. Utility Model Content

[0003] In view of the above-mentioned technical problems, the purpose of the utility model is to provide a chip carrier mold to improve molding accuracy and increase production efficiency.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A chip carrier mold comprises an upper mold assembly and a lower mold assembly, wherein the upper mold assembly is provided with a connected upper mold base, an upper pad, an upper mold plate, a back stripping plate, and a stripping plate in sequence from top to bottom, and the lower mold assembly is provided with a connected lower mold base, a lower pad, and a lower mold plate in sequence from bottom to top, and a material strip is provided between the stripping plate and the lower mold plate; a first notch, a second notch, and a third notch are provided in sequence on the upper mold plate along the conveying direction of the material strip, the back stripping plate is provided with first square holes arranged at intervals in the width direction within the projection range of the first notch, and second round holes arranged at intervals in the width direction are provided on the back stripping plate within the projection range of the second notch, and the back stripping plate is provided with second round holes arranged at intervals in the width direction. A third long hole arranged at intervals in the width direction is provided on the stripping plate within the projection range of the third notch, and a fourth notch, a fifth notch and a sixth notch corresponding to the first notch, the second notch and the third notch are provided on the stripping plate; a first punch needle, a second punch needle and a third punch needle are provided on the upper pad plate, the first punch needle passes through the first notch, the first square hole and the fourth notch in sequence, the second punch needle passes through the second notch, the second round hole and the fifth notch in sequence, and the third punch needle passes through the third notch, the third long hole and the sixth notch in sequence; a first opening, a second opening and a third opening corresponding to the first notch, the second notch and the third notch are provided on the lower template.

[0006] Preferably, a heating module placement position is provided inside the lower template, and a heat-conducting block capable of switching the heating state by powering on and off is provided inside the heating module placement position.

[0007] Preferably, grooves are evenly spaced apart on the chip carrier tape along the length direction, a first through hole is provided at the bottom of the groove, and second through holes are evenly spaced apart on one side of the groove along the length direction.

[0008] Preferably, the end of the first punch needle corresponds to the shape of the groove, the end of the second punch needle corresponds to the second through hole, and the end of the third punch needle corresponds to the first through hole.

[0009] Preferably, there are four first square holes, and four first punching needles are arranged in the same first square hole along the length direction of the material strip; there are four rows of second circular holes, each row has two second circular holes, and a second punching needle is arranged in each second circular hole; there are four third long holes, and four third punching needles are arranged in the same third long hole along the length direction of the material strip.

[0010] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0011] The utility model chip carrier mold comprises an upper mold assembly and a lower mold assembly. The upper mold assembly is provided with a connected upper mold base, an upper pad, an upper mold plate, a back stripping plate and a stripping plate in sequence from top to bottom. The lower mold assembly is provided with a connected lower mold base, a lower pad and a lower mold plate in sequence from bottom to top. The structure is designed according to the 8-plate structure of the cold stamping precision mold. The upper and lower mold parts are precisely matched and easy to replace when the parts are damaged. The upper pad is provided with a first punch needle, a second punch needle and a third punch needle. Each type of punch needle has a plurality of them, so that multiple material strips can be formed side by side at the same time, thereby improving production efficiency. A heat conductive block whose heating state can be switched by power on and off is installed inside the lower mold plate. When making a larger cavity, heating can be selected to ensure that the required depth size is made. When making a small cavity for packaging tiny electronic products, the power can be turned off and the heating can be cancelled to ensure the accuracy of the size. The mold is suitable for manufacturing different types of chip carriers and better product quality is obtained for different categories. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The technical solution of the utility model is further described below in conjunction with the accompanying drawings:

[0013] Attached Figure 1 It is a top view of the chip carrier mold of the utility model;

[0014] Attached Figure 2 This is a front view of the chip carrier mold of the utility model;

[0015] Attached Figure 3 A top view of a chip carrier of a chip carrier mold of the utility model;

[0016] Attached Figure 4 It is a side view of the chip carrier of the chip carrier mold of the utility model;

[0017] Attached Figure 5 It is a schematic diagram of the upper mold plate of the chip carrier mold of the utility model;

[0018] Attached Figure 6It is a schematic diagram of the back stripping plate of the chip carrier mold of the utility model;

[0019] Attached Figure 7 It is a schematic diagram of a stripper plate of a chip carrier mold of the utility model;

[0020] Attached Figure 8 It is a schematic diagram of the lower mold plate of the chip carrier mold of the present invention.

[0021] Among them: 1. upper mold base; 2. upper pad; 3. upper template; 31. first notch; 32. second notch; 33. third notch; 4. back stripping plate; 41. first square hole; 42. second round hole; 43. third long hole; 5. stripping plate; 51. fourth notch; 52. fifth notch; 53. sixth notch; 6. lower template; 7. lower pad; 8. lower mold base; 9. material strip; 10. first punch needle; 11. heat conductive block; 12. chip carrier; 121. groove; 122. first through hole; 123. second through hole; 20. second punch needle; 30. third punch needle. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0023] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0024] As attached Figure 1 , Attachment Figure 2 The chip carrier mold of the utility model is shown, including an upper mold assembly and a lower mold assembly. The upper mold assembly is provided with a connected upper mold base 1, an upper pad 2, an upper mold plate 3, a back stripping plate 4, and a stripping plate 5 in sequence from top to bottom. The lower mold assembly is provided with a connected lower mold base 8, a lower pad 7, and a lower mold plate 6 in sequence from bottom to top. There is a movable material strip 9 between the stripping plate 5 and the lower mold plate 6. As shown in the attached figure Figure 5 As shown, the upper template 3 is processed with a first notch 31, a second notch 32, and a third notch 33 in sequence along the conveying direction of the material belt 9; Figure 6As shown, the back-peeling plate 4 has first square holes 41 arranged at intervals along the width direction of the material strip 9 within the projection range of the first notch 31, second round holes 42 arranged at intervals along the width direction are processed on the back-peeling plate 4 within the projection range of the second notch 32, and third long holes 43 arranged at intervals along the width direction are processed on the back-peeling plate 4 within the projection range of the third notch 33; as shown in the attached Figure 7 As shown, the stripping plate 5 is processed with a fourth notch 51, a fifth notch 52, and a sixth notch 53 corresponding to the first notch 31, the second notch 32, and the third notch 33. The upper pad 2 is connected with a first punch needle 10, a second punch needle 20, and a third punch needle 30. The first punch needle 10 passes through the first notch 31, the first square hole 41, and the fourth notch 51 in sequence, the second punch needle 20 passes through the second notch 32, the second round hole 42, and the fifth notch 52 in sequence, and the third punch needle 30 passes through the third notch 33, the third long hole 43, and the sixth notch 53 in sequence, and the material strip 9 is stamped and formed. The upper part of the lower template 6 is processed with a first opening, a second opening, and a third opening corresponding to the first notch 31, the second notch 32, and the third notch 33. The chip carrier mold of the utility model is designed according to the 8-plate structure of the cold stamping precision mold, and the upper and lower mold parts are precisely matched, and the parts are easy to replace when damaged.

[0025] As attached Figure 3 , Attachment Figure 4 As shown, the chip carrier tape 12 is formed with grooves 121 at even intervals along the length direction, the bottom of the groove 121 is processed with first through holes 122, and one side of the groove 121 is processed with second through holes 123 at even intervals along the length direction. The end of the first punching needle 10 corresponds to the shape of the groove 121, and the groove 121 is punched out, the end of the second punching needle 20 corresponds to the second through hole 123, and the second through hole 123 is punched out, and the end of the third punching needle 30 corresponds to the first through hole 122, and the first through hole 122 is punched out at the bottom of the groove 121.

[0026] There are four first square holes 41, and the same first square hole 41 has four first punching needles 10 along the length direction of the material strip 9; there are four rows of second circular holes 42, each row has two second circular holes 42, and each second circular hole 42 has a second punching needle 20; there are four third long holes 43, and the same third long hole 43 has four third punching needles 30 along the length direction of the material strip 9, thereby realizing the function of simultaneous side-by-side molding of multiple material strips, which is more efficient.

[0027] In this embodiment, the lower template 6 has a heating module placement position inside, and a heat conductive block 11 is installed in the heating module placement position, which can switch the heating state by power on and off. When making a larger cavity, heating can be selected to ensure the required depth size. When making a small cavity for packaging tiny electronic products, heating can be canceled by power off to ensure the accuracy of the size.

[0028] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip carrier mold, characterized in that: The invention comprises an upper die assembly and a lower die assembly, wherein the upper die assembly is provided with a connected upper die base, an upper pad, an upper template, a back stripping plate and a stripping plate in sequence from top to bottom, and the lower die assembly is provided with a connected lower die base, a lower pad and a lower template in sequence from bottom to top, and a material belt is provided between the stripping plate and the lower template; a first notch, a second notch and a third notch are provided in sequence on the upper template along the conveying direction of the material belt, the back stripping plate is provided with first square holes arranged at intervals in the width direction within the projection range of the first notch, the back stripping plate is provided with second round holes arranged at intervals in the width direction within the projection range of the second notch, and the back stripping plate is provided with second round holes arranged at intervals in the width direction within the projection range of the second notch, and the back stripping plate is provided with a first notch on the first notch. A third long hole arranged at intervals along the width direction is arranged within the projection range of the three notches, and a fourth notch, a fifth notch and a sixth notch corresponding to the first notch, the second notch and the third notch are arranged on the stripping plate; a first punch needle, a second punch needle and a third punch needle are arranged on the upper pad plate, the first punch needle passes through the first notch, the first square hole and the fourth notch in sequence, the second punch needle passes through the second notch, the second round hole and the fifth notch in sequence, and the third punch needle passes through the third notch, the third long hole and the sixth notch in sequence; a first opening, a second opening and a third opening corresponding to the first notch, the second notch and the third notch are arranged on the lower template.

2. The chip carrier mold according to claim 1, characterized in that: A heating module placement position is provided inside the lower template, and a heat-conducting block capable of switching the heating state by power on and off is provided inside the heating module placement position.

3. The chip carrier mold according to claim 1, characterized in that: The chip carrier tape is provided with grooves at even intervals along the length direction, a first through hole is provided at the bottom of the groove, and a second through hole is provided at even intervals along the length direction on one side of the groove.

4. The chip carrier mold according to claim 3, characterized in that: The end of the first punch needle corresponds to the shape of the groove, the end of the second punch needle corresponds to the second through hole, and the end of the third punch needle corresponds to the first through hole.

5. The chip carrier mold according to claim 1, characterized in that: There are four first square holes, and four first punching needles are arranged in the same first square hole along the length direction of the material strip; there are four rows of second circular holes, each row has two second circular holes, and a second punching needle is arranged in each second circular hole; there are four third long holes, and four third punching needles are arranged in the same third long hole along the length direction of the material strip.

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