Storage overlapping structure and storage device

Abstract

The utility model discloses a storage overlapping structure and a storage device, the storage overlapping structure comprises a connector, the connector is provided with a first limiting alignment column and a second limiting alignment column, the first limiting alignment column is arranged on the first surface of the connector, the second limiting alignment column is arranged on the second surface of the connector, and the first surface and the second surface are opposite to each other; two circuit boards, wherein each circuit board is provided with an alignment hole; when the two circuit boards are connected in a stacked mode through the connector, the first limiting alignment column of the connector is aligned with the alignment hole in one circuit board, and the second limiting alignment column of the connector is aligned with the alignment hole in the other circuit board. Through the above mode, accurate assembly of the multi-layer circuit board can be effectively carried out, and the storage capacity of the storage device is further improved.

Description

Technical Field

[0001] The present application relates to the field of storage, and in particular to a storage stacking structure and a storage device. Background Art

[0002] In the storage field, as technology continues to develop, computing density continues to grow, and the demand for memory capacity is increasing.

[0003] When the space on the circuit board in the storage device has been utilized as much as possible, in order to further improve the server performance, people usually consider expanding the capacity of the storage particles themselves. However, the process level for expanding the storage particles themselves is high and complex, and the internal space of the storage device is not expanded, that is, the space of the circuit board cannot be expanded within the same space. How to accurately assemble multi-layer circuit boards to increase the memory capacity of the storage device is a technical problem that technicians in this field currently need to solve. Utility Model Content

[0004] The main purpose of this application is to provide a storage stacking structure and a storage device that can effectively and accurately assemble multi-layer circuit boards, thereby increasing the storage capacity of the storage device.

[0005] In order to solve the above technical problems, the first technical solution adopted by the present application is: to provide a storage stacking structure. The storage stacking structure includes: a connector, the connector having a first limit alignment post and a second limit alignment post, wherein the first limit alignment post is arranged on the first side of the connector, the second limit alignment post is arranged on the second side of the connector, and the first side and the second side are opposite to each other; two circuit boards, each of which is provided with an alignment hole; wherein when the two circuit boards are stacked and connected through the connector, the first limit alignment post of the connector is aligned with the alignment hole on one of the circuit boards, and the second limit alignment post of the connector is aligned with the alignment hole on the other circuit board.

[0006] In order to solve the above technical problems, the second technical solution adopted in the present application is: to provide a storage device, which includes: a shell, in which a accommodating cavity is arranged; a storage stacking structure, which is accommodated in the accommodating cavity of the shell, and the storage stacking structure is the above-mentioned storage stacking structure.

[0007] The beneficial effect of the present application is that a first limit alignment post and a second limit alignment post are arranged on the first side and the second side of the connector, so that when two circuit boards are stacked and connected through the connector, the first limit alignment post and the second limit alignment post can be respectively aligned with the alignment holes on the circuit boards, which can effectively improve the accuracy of the stacked connection of the circuit boards and avoid the occurrence of assembly misalignment and the like. At the same time, it can realize the expansion of the storage space of the circuit boards without the need for process improvements to the storage particles on the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 It is a structural schematic diagram of the first embodiment of the storage stacking structure in this application;

[0010] Figure 2 It is a structural schematic diagram of an embodiment of a first circuit board in the present application;

[0011] Figure 3 It is a structural schematic diagram of an embodiment of a second circuit board in the present application;

[0012] Figure 4 It is a structural schematic diagram of an embodiment of a connector in the present application;

[0013] Figure 5 It is a structural schematic diagram of the second embodiment of the storage stacking structure in this application;

[0014] Figure 6 is a schematic structural diagram of the first embodiment of the storage device in this application;

[0015] Figure 7 It is a structural diagram of the second embodiment of the storage device in this application.

[0016] In the accompanying drawings, the storage stacking structure 10, the connector 100, the first limit alignment post 110, the second limit alignment post 120, the third lock hole 101, the first circuit board 200, the first expansion interface 210, the first circuit board plate 220, the first storage module 230, the main control 240, the first alignment hole 201, the first lock hole 202, the fifth alignment hole 203, the sixth alignment hole 204, the second circuit board 300, the second expansion interface 310, the second circuit board plate 320, the second storage module 330, the second ...1, the first lock hole 202, the fifth alignment hole 203, the sixth alignment hole 204, the second circuit board 300, the second expansion interface 310, the second circuit board plate 320, the second storage module 330, the second alignment hole 201, the first lock hole Hole 301, second locking hole 302, seventh alignment hole 303, eighth alignment hole 304, fastening structure 400, locking hole column 410, fastener 420, bottom plate 430, third alignment hole 431, cover plate 440, fourth alignment hole 441, fourth locking hole 442, shell 500, lower shell 510, third limit alignment column 511, fourth limit alignment column 512, first alignment slot 513, upper shell 520, second alignment slot 521, third alignment slot 522, fourth alignment slot 523, storage device 20. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0019] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0020] As mentioned above, in order to expand the capacity of the storage device, people usually choose to expand the capacity of the storage particles in a limited space when the space on the circuit board has been almost fully utilized. In the same circuit board space, when the storage capacity of a single storage particle increases, the overall storage capacity of the storage device also increases.

[0021] However, expanding the capacity of storage particles is a very challenging technical problem, which involves multiple levels of complexity and technical requirements. First of all, the structure and properties of the storage particles themselves are extremely delicate, and their internal circuit design and material selection have been rigorously scientifically calculated and experimentally verified. Therefore, when expanding their capacity, it is necessary to ensure that the new storage unit is perfectly integrated with the original structure without any conflict or interference. Secondly, various physical and chemical parameters such as temperature, pressure, electric field, etc. need to be precisely controlled during the expansion process to ensure that the newly added storage unit can work stably. Slight changes in these parameters may have a significant impact on the performance of the storage particles, so technicians are required to have extremely high operating precision and rich experience. Moreover, capacity expansion research is not achieved overnight and requires long-term efforts.

[0022] In summary, the research on storage particle expansion requires not only technical personnel to have profound professional knowledge and a deep understanding of storage technology, but also the ability to master and apply these professional knowledge, rich practical experience, and unremitting innovative spirit, and the ability to continuously innovate and try in the long-term research process. Only by overcoming these problems can we find a suitable expansion plan in the process of experiment and realize the improvement of storage particle capacity.

[0023] Considering the difficulty and cycle of implementing the above expansion scheme, in order to realize the expansion of the storage device more quickly and easily, the present application chooses to increase the circuit board space to realize the expansion of the storage device. Adding a circuit board has higher flexibility and scalability. As one of the core components of the storage device, the circuit board can be customized and expanded according to demand. When the storage capacity needs to be increased, the expansion is achieved by adding additional circuit boards or extending the circuit board. Compared with the complex expansion operation of the storage particles themselves, it is simpler, more convenient and easier to implement. Secondly, compared with the expansion of storage particles, adding a circuit board can provide better performance and stability. Because the expansion of storage particles may involve more physical and chemical parameter control, the change of these parameters may have unexpected effects. As part of the overall system, the circuit board can work better with other components to provide a more reliable data storage and access experience. In addition, adding a circuit board also means better compatibility and standardization. Circuit boards usually use standardized interfaces and protocols, which makes it easier to integrate and connect the added circuit boards when expanding capacity, reducing the trouble caused by compatibility issues.

[0024] However, the circuit board in the storage device is almost the same size as the bottom plate of the storage device casing, and there is no extra space for expansion. Therefore, the present application chooses to utilize the longitudinal space to add an expansion circuit board in a direction perpendicular to the circuit board to achieve the expansion of the storage device, and through the limit alignment posts on the connector and the alignment holes on the circuit board, the circuit boards are aligned when they are stacked and connected through the connectors, which improves the accuracy of the stacked connection of the circuit boards and avoids the occurrence of assembly misalignment.

[0025] See also Figure 1 , Figure 1 It is a structural diagram of the first embodiment of the storage stacking structure in this application.

[0026] like Figure 1 As shown, the storage stacking structure 10 includes: a connector 100 and two circuit boards, a first circuit board 200 and a second circuit board 300 .

[0027] The connector 100 has a first limit alignment post 110 and a second limit alignment post 120; wherein the first limit alignment post 110 is arranged on the first side of the connector 100, and the second limit alignment post 120 is arranged on the second side of the connector 100, and the first side and the second side are opposite to each other; an alignment hole is arranged on each circuit board.

[0028] When two circuit boards are stacked and connected via the connector 100 , the first limiting alignment post of the connector 100 is aligned with the alignment hole on one of the circuit boards, and the second limiting alignment post of the connector 100 is aligned with the alignment hole on the other circuit board.

[0029] Specifically, taking two circuit boards including a first circuit board 200 and a second circuit board 300 as an example, when the first circuit board 200 and the second circuit board 300 are stacked and connected through the connector 100, the first limit alignment post 110 on the first surface of the connector 100 is aligned with the alignment hole on the first circuit board 200, and the second limit alignment post 120 on the second surface of the connector 100 is aligned with the alignment hole on the second circuit board 300, which can effectively improve the accuracy of stacking connection between the circuit boards to ensure the connection stability between the circuit boards.

[0030] In some embodiments, the first limit alignment post and the second limit alignment post can be located at the same position corresponding to the first surface and the second surface, and the first limit alignment post and the second limit alignment post can be integrally formed with the connector, or can be formed by casting on the connector; or the first limit alignment post and the second limit alignment post respectively pass through the connector and are connected inside the connector.

[0031] In some embodiments, there are a plurality of first position limiting alignment posts and a plurality of second position limiting alignment posts, and there are a plurality of alignment holes matching them, that is, the number of the position limiting alignment posts matches the number of the alignment holes.

[0032] The circuit boards described in the present application may be storage-type circuit boards or other types of circuit boards, wherein one circuit board is a main circuit board and the other circuit boards are sub-circuits, for example, the main circuit board is a storage-type circuit board and the sub-circuit boards are storage-type circuit boards or other types of circuit boards; this embodiment is described by taking the circuit boards as storage-type circuit boards as an example, so as to use the sub-circuit boards as expansion spaces for the main circuit boards. It can be understood by those skilled in the art that when the main circuit board and the sub-circuit boards are storage-type circuit boards, the storage modules in the sub-circuit boards are expanded into storage spaces in the storage circuit boards.

[0033] In this embodiment, a first limit alignment post and a second limit alignment post are provided on the connector, and when two circuit boards are stacked and connected, the first limit alignment post and the second limit alignment post are respectively aligned with the alignment holes of the corresponding circuit boards, thereby improving the connection accuracy of the two circuit boards when stacked and connected, and ensuring the connection stability between the circuit boards. At the same time, the longitudinal space can be utilized to increase the capacity of the storage device by adding circuit boards in a direction perpendicular to the circuit board, thereby expanding the storage space of the storage circuit board without the need for process improvements to the storage particles on the storage circuit board.

[0034] See also Figure 2 and Figure 3 , Figure 2 is a structural diagram of an embodiment of a first circuit board in this application, Figure 3 It is a structural schematic diagram of an embodiment of the second circuit board in the present application.

[0035] like Figure 2 and Figure 3 As shown, the first circuit board 200 is provided with a first alignment hole (not marked in the drawing) and at least one first expansion interface 210, the second circuit board 300 is provided with a second alignment hole (not marked in the drawing) and a second expansion interface 310 is provided on the second circuit board 300.

[0036] When the first circuit board 200 and the second circuit board 300 are stacked and connected through the connector 100, the first limiting alignment post 110 of the connector 100 is aligned with the first alignment hole of the first circuit board 200, and the second limiting alignment post 120 of the connector 100 is aligned with the second alignment hole of the second circuit board 300.

[0037] A first expansion interface 210 on the first circuit board 200 matches the second expansion interface 310 on the second circuit board 300, and when the first circuit board 200 is expanded, at least one first expansion interface 210 on the first circuit board 200 is configured to connect to the matching second expansion interface of the second circuit board 300 to supplement the storage module set in the second circuit board 300 as the storage space of the first circuit board 200.

[0038] In some embodiments, at least two first expansion interfaces 210 of the first circuit board 200 can be set at appropriate positions on the first circuit board 200, one of the first expansion interfaces 210 is configured to connect to a matching second expansion interface 310 of the second circuit board 300 to supplement the storage space of the first circuit board 200 with a second storage module set in the second circuit board 300; the other first expansion interface 210 is configured to connect to the first storage module and the main control on the first circuit board 200.

[0039] Continue reading Figure 2 The first circuit board 200 includes at least one first expansion interface 210, a first circuit board plate 220, a first storage module 230 and a main control 240; the main control 240, the first storage module 230 and the first expansion interface 210 are all arranged on the first circuit board plate 220; the first storage module 230 is connected to the main control, and the first expansion interface 210 is located between the main control 240 and the first storage module 230.

[0040] Continue reading Figure 3 The second circuit board 300 includes a second expansion interface 310, a second circuit board plate 320 and a second storage module 330; the second expansion interface 310 and the second storage module 330 are both arranged on the second circuit board plate 320; the second expansion interface 310 is connected to the second storage module 330.

[0041] When the first circuit board 200 is expanded, the second expansion interface 310 is used to expand the capacity of the first circuit board 200 when the second circuit board 300 is configured on the first circuit board 200. The second expansion interface 310 is configured to connect a corresponding expansion interface of at least one first expansion interface 210 in the first circuit board 200 to supplement the second storage module 330 set in the second circuit board 300 as the storage space of the first circuit board 200.

[0042] In some embodiments, the first storage module 230 and the second storage module 330 both include a plurality of storage units.

[0043] Those skilled in the art will appreciate that by setting the specifications and quantity of the storage units on the second circuit board 300 to be consistent with the specifications and quantity of the storage units on the first circuit board 200, the main control of the first circuit board does not need to change the communication protocol with the storage units, and does not need to make major improvements to the sending of control signals. The storage units on the second circuit board can be controlled directly in accordance with the control method of the storage units on the first circuit board or with reference to the control method of the storage units on the first circuit board.

[0044] The expansion interfaces described in this application are all standardized connection interfaces with expansion capabilities. The user can connect the second circuit board through the expansion interface to use the second storage module in the second circuit board as the storage space of the first circuit board. It can be understood by those skilled in the art that the expansion interface described in this application is a standardized connection interface, which is dedicated to realizing the connection between the storage circuit board (first circuit board) and the matching expansion capacitor board (second circuit board), so as to expand the storage module in the expansion circuit board (second circuit board) into the storage space in the storage circuit board (first circuit board). The storage circuit board (first circuit board) will not be connected to other types of circuit boards through the first expansion interface, for example, other types of circuit boards without storage modules or other types of circuit boards with other functional electronic devices attached.

[0045] The first circuit board 200 of the present application is based on the design of the original storage circuit board, and further, a dedicated, standardized first expansion interface 210 is further set between the main control and the first storage module. The first expansion interface 210 is not a traditional external interface (used to realize the connection between the first circuit board 200 and other external devices), one of the first expansion interfaces 210 is used to realize the expansion application of the original internal signal between the main control of the first circuit board 200 itself and the first storage module, and is connected to the second storage module of the second circuit board 300 through another first expansion interface 210, and when the first circuit board 200 and the second circuit board 300 are stacked and connected through the connector 100, the first limit alignment column 110 and the second limit alignment column 120 on the connector 100 are respectively aligned with the alignment holes of the first circuit board 200 and the second circuit board 300, so that the two circuit boards can be accurately aligned, improving the connection accuracy and connection stability of the two circuit boards; and enabling the second storage module of the matching second circuit board 300 to directly serve as an extension of the storage space of the first circuit board 200 itself, thereby increasing the storage space of the first circuit board 200.

[0046] See also Figure 4 , Figure 4 It is a structural schematic diagram of an embodiment of a connector in the present application.

[0047] like Figure 4As shown, the connector 100 includes a connector body 130 , a first connection point array 140 , a second connection point array 150 , and a third connection line 160 .

[0048] A first limiting alignment column 110 is provided on the first surface of the connector body 130, and a first connection point array 140 is also provided on the first surface of the connector body 130. The first connection point array 140 includes a plurality of first connection points 141, and each first connection point 141 is configured to be connected to a corresponding first contact in the first expansion interface of the first circuit board 200.

[0049] A second limiting alignment column 120 is provided on the second surface of the connector body 130, and a second connection point array 150 is also provided on the second surface of the connector body 130. The second connection point array 150 includes a plurality of second connection points 151, and each second connection point 151 is configured to be used for connecting to a corresponding second contact in the second expansion interface of the second circuit board 300.

[0050] A plurality of third connection lines 160 are further provided in the connector body 130 , and each first connection point 141 in the first connection point array 140 is connected to a corresponding second connection point 151 in the second connection point array 150 via a corresponding third connection line 160 .

[0051] In some embodiments, the first connection point 141 protrudes from the first surface of the connector body 130 , the second connection point 151 protrudes from the second surface of the connector body 130 , and the first connection point 141 and the second connection point 151 are elastically compressible connection points, respectively.

[0052] Elastic compressibility is a special design that has excellent elasticity and compression performance of the connection point. This elastic compressible connection point is usually used in scenarios that require stable and reliable electrical connections, especially in application scenarios that need to withstand compression, vibration or impact. Its design and material selection ensure that the connection point can maintain stable contact with the contact when subjected to external forces, thereby ensuring the stability of data transmission between the first expansion interface and the second expansion interface.

[0053] In some embodiments, the first connection point may not protrude from the first surface of the connector body, and the second connection point may not protrude from the second surface of the connector body. The contact connection between the first connection point and the first contact of the first expansion interface, and the connection contact between the second connection point and the second contact of the second expansion interface, are achieved by locking or pressing structures between circuit boards to achieve stable connection contact.

[0054] See also Figure 5 , Figure 5 It is a structural diagram of the second embodiment of the storage stacking structure in this application.

[0055] like Figure 5 As shown, the storage stacking structure 10 includes: a connector 100 , a first circuit board 200 , a second circuit board 300 and a fastening structure 400 .

[0056] A locking column 410 is provided on the fastening structure 400, and a counter-positioning hole is provided on the fastening structure 400; the locking column 410 is used to cooperate with the fastener 420 to fix the first circuit board 200, the connector 100 and the second circuit board 300 on the fastening structure 400; correspondingly, a first locking hole 202 is also provided on the first circuit board 200, a second locking hole 302 is also provided on the second circuit board 300, and a third locking hole 101 is also provided on the connector.

[0057] When the first circuit board 200 and the second circuit board 300 are stacked and connected through the connector 100, the locking hole column 410 of the fastening structure 400 passes through the first locking hole 202 of the first circuit board 200, the third locking hole 101 of the connector 100 and the second locking hole 302 of the second circuit board 300, and cooperates with the locking hole column 410 through the fastener 420 to fix the first circuit board 200, the connector 100 and the second circuit board 300 on the fastening structure 400; wherein the first limiting alignment column 110 and the second limiting alignment column 120 of the connector 100 are respectively aligned with the alignment holes on the fastening structure 400.

[0058] In some embodiments, the fastening structure 400 includes a keyhole post 410 , a fastener 420 , a base plate 430 , and a cover plate 440 .

[0059] The bottom plate 430 is provided with a third alignment hole 431, and the lock hole column 410 is provided on the bottom plate 430, and the cover plate 440 is provided with a fourth alignment hole 441 and a fourth lock hole 442; when the first circuit board 200 and the second circuit board 300 are stacked and connected through the connector 100, the first limit alignment column 110 of the connector 100 is aligned with the third alignment hole 431 of the bottom plate 430, the second limit alignment column 120 of the connector 100 is aligned with the fourth alignment hole 441 of the cover plate 440, and the bottom plate The key hole column 410 on 430 passes through the first key hole 202 of the first circuit board 200, the third key hole 101 of the connector 100, the second key hole 302 of the second circuit board 300, and the fourth key hole 442 of the cover plate 440 in sequence. The fastener 420 passes through the fourth key hole 442 and cooperates with the key hole column 410 to fix the first circuit board 200, the connector 100 and the second circuit board 300 between the base plate and the cover plate, so that the circuit boards can be accurately stacked and connected, thereby improving the connection stability of the circuit boards.

[0060] In some embodiments, the locking column 410 on the bottom plate 430 may also partially penetrate the fourth locking hole 442 of the cover plate 440 , as long as the locking column 410 is aligned with the fourth locking hole 442 of the cover plate 440 .

[0061] In some embodiments, the base plate can be a rigid substrate, and the cover plate can also be a rigid substrate. Then, when the base plate 430 and the cover plate 440 lock the first circuit board 200, the connector 100 and the second circuit board 300, the stress can be dispersed accordingly to reduce the inconsistent stress of the locked middle circuit board, prevent partial warping of the middle circuit board, and maintain the structural stability of the circuit board fastening.

[0062] In this embodiment, the first circuit board, the connector and the second circuit board are fixed by a fastening structure, so that the multi-layer circuit boards can be effectively assembled, and the limiting alignment columns and alignment holes are used to achieve precise stacking connection between the circuit boards, and the structural stability of the circuit boards after fastening is guaranteed; at the same time, by arranging a connector between the first circuit board and the second circuit board, the first circuit board and the second circuit board also maintain stable contact, and the storage space of the circuit boards is expanded.

[0063] See also Figure 6 , Figure 6 It is a structural diagram of the first embodiment of the storage device in this application.

[0064] like Figure 6 As shown, the storage device 20 includes a shell 500 and a storage stacking structure 10 ; wherein a receiving cavity is provided in the shell 500 , and the storage stacking structure 10 is accommodated in the receiving cavity of the shell 500 .

[0065] In some embodiments, the bottom plate of the storage stacking structure 10 is fixedly disposed in the accommodating cavity of the shell 500, so that the storage stacking structure has a stable structure inside the shell, which can effectively avoid the instability of the storage stacking structure caused by the shell tilting or impact, and ensure the stability of the contact between the circuit boards in the storage stacking structure.

[0066] See also Figure 7 , Figure 7 It is a structural diagram of the second embodiment of the storage device in this application.

[0067] like Figure 7 As shown, the shell 500 includes a lower shell 510 and an upper shell 520 , the bottom plate of the storage stacking structure 10 is fixedly arranged on the lower shell 510 , and the upper shell 520 is arranged corresponding to the lower shell 510 .

[0068] The lower shell 510 is further provided with a third limiting alignment post 511 , a fourth limiting alignment post 512 and a first alignment slot 513 ; the upper shell 520 is provided with a second alignment slot 523 .

[0069] Correspondingly, a fifth alignment hole 203 and a sixth alignment hole 204 are further provided on the first circuit board 200 , and a seventh alignment hole 303 and an eighth alignment hole 304 are further provided on the second circuit board 300 .

[0070] When the first circuit board 200 and the second circuit board 300 in the storage stacking structure 10 are stacked and connected through the connector 100, the third limiting alignment post 511 of the lower shell 510 is aligned with the fifth alignment hole 203 of the first circuit board 200 and the seventh alignment hole 303 of the second circuit board 300 respectively; and the fourth limiting alignment post 512 of the lower shell 510 is aligned with the sixth alignment hole 204 of the first circuit board 200 and the eighth alignment hole of the second circuit board 300 respectively.

[0071] In some embodiments, the first limit alignment post 110 of the connector 100 in the storage stacking structure 10 is aligned with the first alignment groove 513 of the lower shell 510, and the second limit alignment post 120 of the connector 100 is aligned with the second alignment groove 523 of the upper shell 520, so that the first circuit board 200 and the second circuit board 300 can be further aligned for a more precise stacking connection, further ensuring the connection stability of the first circuit board 200 and the second circuit board 300.

[0072] In some embodiments, the upper housing 520 may further include a third alignment groove (not marked in the figure) and a fourth alignment groove (not marked in the figure), which are arranged on the inner wall of the upper housing 520; when the third limit alignment post 511 of the lower housing 510 is aligned with the fifth alignment hole 203 of the first circuit board 200 and the seventh alignment hole 303 of the second circuit board 300 respectively, the third limit alignment post 511 is also aligned with the third alignment groove (not marked in the figure) of the upper housing 520; and when the fourth limit alignment post 512 of the lower housing 510 is aligned with the sixth alignment hole 204 of the first circuit board 200 and the eighth alignment hole of the second circuit board 300 respectively, the fourth limit alignment post 512 is also aligned with the fourth alignment groove (not marked in the figure) of the upper housing 520. This allows the first circuit board 200 and the second circuit board 300 to be further aligned, to perform more accurate stacking connection, and to further ensure the connection stability of the first circuit board 200 and the second circuit board 300.

[0073] In some embodiments, the third limit alignment column 511 and the fourth limit alignment column 512 are respectively arranged at two opposite first edges and second edges of the lower shell 510; wherein, the first distance between the third limit alignment column 511 and the first edge is not equal to the second distance between the fourth limit alignment column 512 and the second edge.

[0074] For example, the third limiting alignment column 511 is set at the first edge, and the distance between the third limiting alignment column 511 and the first edge is the first distance. The fourth limiting alignment column 512 is set at the second edge B, and the distance between the fourth limiting alignment column 512 and the second edge is the second distance, that is, the first distance is not equal to the second distance, the first edge and the second edge are parallel to each other, and do not belong to the same edge.

[0075] In some embodiments, the first distance D1 may be equal to the second distance D2, while the third distance D3 between the third limiting alignment column 511 and the third edge is not equal to the fourth distance D4 between the fourth limiting alignment column 512 and the fourth edge, and the third edge and the fourth edge may be the same edge and different from the first edge and the second edge.

[0076] In one embodiment, the specification of the housing complies with one of the E3.S specification, the E3.S2T specification, the E3.L specification and the E3.L 2T specification of the network storage.

[0077] The specifications of E3.S are: Height 76mm, Length 112.75mm, Thickness 7.5mm.

[0078] The specifications of E3.S2T are 76mm in height, 112.75mm in length and 16.8mm in thickness.

[0079] The specifications of E3.L are height 76mm, length 142.2mm, and thickness 7.5mm.

[0080] The specifications of E3.L 2T are 76mm in height, 142.2mm in length and 16.8mm in thickness.

[0081] In this application Figure 7 In the example, only a first circuit board is shown to be connected to a second circuit board, which is limited by the current E3 specification, as well as the circuit board manufacturing process and the device manufacturing process on the circuit board. It can be imagined that in this application, the first circuit board can be provided with multiple first expansion interfaces, and the first expansion interface can be set at multiple positions on the first side of the first circuit board, and can also be set on the second side of the first circuit board. Both the first side and the second side of the first circuit board can be provided with a first expansion interface to establish a connection with the second expansion interfaces of multiple second circuit boards.

[0082] It is understandable that the first circuit board can be connected to multiple expanded circuit boards, such as the second circuit board and the third circuit board, through a connector; the fastening structure can also pass through the locking holes of the multiple circuit boards to fix the multiple circuit boards on the fastening structure.

[0083] In some embodiments, the storage device may include a plurality of storage stacking structures, each of which includes a connector and two circuit boards, which are aligned through limiting alignment posts and alignment holes.

[0084] All the expanded circuit boards and the first circuit board can be stacked in parallel.

[0085] To summarize, the present application sets a first limit alignment post and a second limit alignment post on the connector, so that when two circuit boards are stacked and connected through the connector, the first limit alignment post and the second limit alignment post can be respectively aligned with the alignment holes on the circuit boards, which can effectively improve the accuracy of the stacked connection of the circuit boards and avoid the occurrence of assembly misalignment and the like, and use fasteners and keyhole posts to cooperate so that multiple circuit boards are fixed on the fastening structure; at the same time, the storage space of the circuit board can be expanded without the need to make process improvements to the storage particles on the circuit board; and the manufacturing process requirements for the circuit board are not high, the circuit board to be manufactured can still use the current manufacturing process, and the various devices arranged thereon can also use the current manufacturing process or communication standards, without the need for major process improvements. Therefore, by adding circuit boards, the assembly and fixation of the storage circuit boards and the expansion of the storage space can be achieved conveniently and quickly in a short time.

[0086] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation described above is only illustrative, for example, the division of the modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0087] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0088] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0089] If the integrated units in the above other embodiments are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) or a processor (processor) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, RandomAccess Memory), disk or optical disk and other media that can store program codes.

[0090] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A storage stacking structure, characterized in that: include: A connector, the connector having a first limiting alignment post and a second limiting alignment post, wherein the first limiting alignment post is arranged on a first surface of the connector, the second limiting alignment post is arranged on a second surface of the connector, and the first surface and the second surface are opposite to each other; Two circuit boards, each of which is provided with an alignment hole; When the two circuit boards are stacked and connected via the connector, the first limit alignment post of the connector is aligned with the alignment hole on one of the circuit boards, and the second limit alignment post of the connector is aligned with the alignment hole on the other circuit board.

2. The storage stacking structure according to claim 1, characterized in that: The two circuit boards include: A first circuit board, wherein the first circuit board is provided with a first alignment hole and at least one first expansion interface; A second circuit board, wherein the second circuit board is provided with a second alignment hole and a second expansion interface; When the first circuit board and the second circuit board are stacked and connected through the connector, the first limit alignment post of the connector is aligned with the first alignment hole of the first circuit board, and the second limit alignment post of the connector is aligned with the second alignment hole of the second circuit board; The first expansion interface matches the second expansion interface, and when the first circuit board is expanded, at least one of the first expansion interfaces is configured to connect to the matching second expansion interface of the second circuit board.

3. The storage stacking structure according to claim 2, characterized in that: The connector comprises: A connector body, wherein the first limiting alignment post and the second limiting alignment post are disposed on the connector body, wherein the first limiting alignment post is disposed on the first surface of the connector body, and the second limiting alignment post is disposed on the second surface of the connector body, and the first surface of the connector body and the second surface of the connector body are opposite to each other; A first connection point array, the first connection point array is arranged on the first surface of the connector body, and includes a plurality of first connection points, each of the first connection points is configured to be connected to a corresponding first contact point of the first expansion interface of the first circuit board; A second connection point array; the second connection point array is arranged on the second surface of the connector body, including a plurality of second connection points, each of the second connection points being configured to be connected to a corresponding second contact in the second expansion interface of the second circuit board; A plurality of third connection lines are also provided in the connector body, and each of the first connection points in the first connection point array is connected to a corresponding second connection point in the second connection point array through a corresponding third connection line.

4. The storage stacking structure according to claim 3, characterized in that: The first connection point and the second connection point protrude from the first surface and the second surface of the connector body respectively, and the first connection point and the second connection point are elastically compressible connection points respectively.

5. The storage stacking structure according to claim 2, characterized in that: Also includes: A fastening structure, wherein the fastening structure is provided with a locking column and an alignment hole; The first circuit board is also provided with a first locking hole, the second circuit board is also provided with a second locking hole, and the connector is also provided with a third locking hole; When the first circuit board and the second circuit board are stacked and connected via the connector, the key hole column of the fastening structure passes through the first key hole of the first circuit board, the third key hole of the connector and the second key hole of the second circuit board, and the first circuit board, the connector and the second circuit board are fixed to the fastening structure via fasteners, wherein the first limit alignment column and the second limit alignment column of the connector are respectively aligned with the alignment holes on the fastening structure.

6. The storage stacking structure according to claim 5, characterized in that: The fastening structure comprises: A bottom plate, wherein the bottom plate is provided with a third alignment hole and the locking hole column; A cover plate, wherein the cover plate is provided with a fourth alignment hole and a fourth lock hole; When the first circuit board and the second circuit board are stacked and connected through the connector, the first limit alignment post of the connector is aligned with the third alignment hole of the base plate, and the second limit alignment post of the connector is aligned with the fourth alignment hole of the cover plate; and the locking hole post of the base plate passes through the first locking hole, the third locking hole, the second locking hole, and / or part of the fourth locking hole, and the fastener passes through the fourth locking hole and cooperates with the locking hole post to fix the first circuit board, the connector and the second circuit board between the base plate and the cover plate.

7. A storage device, characterized in that: include: A housing having a receiving cavity disposed therein; A storage stacking structure, wherein the storage stacking structure is accommodated in the accommodating cavity of the shell, and the storage stacking structure is the storage stacking structure according to any one of claims 1-6.

8. The storage device according to claim 7, characterized in that: The bottom plate of the storage stacking structure is fixedly disposed in the accommodating cavity of the shell.

9. The storage device according to claim 8, characterized in that: The housing comprises: A lower shell, on which the bottom plate of the storage stacking structure is fixedly arranged, wherein the lower shell is provided with a third limit alignment post, a fourth limit alignment post and a first alignment groove; An upper shell, wherein the upper shell is provided with a second alignment groove, a third alignment groove and a fourth alignment groove, and the upper shell is arranged corresponding to the lower shell; The first circuit board of the storage stacking structure is further provided with a fifth alignment hole and a sixth alignment hole, and the second circuit board of the storage stacking structure is further provided with a seventh alignment hole and an eighth alignment hole; When the first circuit board and the second circuit board in the storage stacking structure are stacked and connected through the connector, the third limit alignment post of the lower shell is aligned with the fifth alignment hole of the first circuit board and the seventh alignment hole of the second circuit board respectively; the fourth limit alignment post of the lower shell is aligned with the sixth alignment hole of the first circuit board and the eighth alignment hole of the second circuit board respectively; The first alignment groove of the lower shell is aligned with the first limit alignment post of the connector in the storage stacking structure, the second alignment groove of the upper shell is aligned with the second limit alignment post of the connector in the storage stacking structure, and the third alignment groove and the fourth alignment groove of the upper shell are aligned with the third limit alignment post and the fourth limit alignment post of the lower shell respectively.

10. The storage device according to claim 9, characterized in that: The third limiting alignment post and the fourth limiting alignment post are respectively arranged at two opposite first edges and second edges of the lower shell; Wherein, a first distance between the third position limiting and alignment post and the first edge is not equal to a second distance between the fourth position limiting and alignment post and the second edge.

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