Clamping mechanism for wafer detection

Abstract

The utility model relates to the technical field of wafer detection, in particular to a clamping mechanism for wafer detection, which comprises a detection table, a detection head is arranged above the detection table, a fixing mechanism convenient for clamping and fixing a wafer is arranged on the upper surface of the detection table, a first chute is arranged on the upper surface of the detection table, and a second chute is arranged on the upper surface of the detection table. The sliding plate is slidably connected to the interior of the first sliding groove, the supporting plate is fixedly connected to the upper surface of the sliding plate, and the negative pressure suction cup is fixedly connected to the upper surface of the supporting plate. According to the clamping mechanism for wafer detection, a sliding plate and a supporting plate are slidably connected in a first sliding groove formed in the upper surface of a detection table, a negative pressure suction cup arranged on the upper surface of the supporting plate is communicated with an inner cavity of a negative pressure cylinder arranged on the lower surface, and the bottom of a negative pressure pulling plate ascending and descending in the negative pressure cylinder is connected with a connecting rod and a shifting rod; the driving lever is slidably connected in a slope side groove formed in the inner side of the second sliding groove so that the pressure in the negative pressure cylinder can be conveniently controlled to clamp and fix the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a clamping mechanism used for wafer detection. Background Art

[0002] Wafer inspection is an important part of the semiconductor manufacturing process, and its main purpose is to ensure the quality, production consistency and reliability of wafers.

[0003] The prior art does not have a structure for quickly fixing and placing wafers when in use, so that when testing wafers, most of the prior art does not fix the wafers and directly places them on the testing table for testing. Not only is the wafer very easy to move and be damaged after the equipment is hit, but the wafer is also thin and inconvenient to remove from the table. Based on the deficiencies of the prior art, the utility model designs a clamping mechanism for wafer testing. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a clamping mechanism for wafer detection, which has the advantages of fast wafer fixing and placement.

[0005] The utility model provides the following technical solution: a clamping mechanism for wafer detection, comprising a detection platform, a detection head is arranged above the detection platform, and a fixing mechanism for clamping and fixing the wafer is arranged on the upper surface of the detection platform;

[0006] A fixing mechanism, the fixing mechanism includes a first slide groove, a slide plate, a support plate, a negative pressure suction cup, a negative pressure cylinder and a negative pressure pull plate, the first slide groove is opened on the upper surface of the detection platform, the slide plate is slidably connected to the inside of the first slide groove, the support plate is fixedly connected to the upper surface of the slide plate, the negative pressure suction cup is fixedly connected to the upper surface of the support plate, the negative pressure cylinder is fixedly connected to the lower surface of the support plate, and the negative pressure pull plate slides and rises and falls inside the negative pressure cylinder.

[0007] As a preferred technical solution of the utility model, the fixing mechanism also includes a second slide groove, a sloped side groove, a connecting rod, a lever and a pull rod. The second slide groove is opened on the upper surface of the detection table, the sloped side groove is opened on the side of the second slide groove, the connecting rod is fixedly connected to the lower surface of the negative pressure pull plate, the lever is fixedly connected to the side wall of the connecting rod, and the pull rod is fixedly connected to the slide plate.

[0008] As a preferred technical solution of the utility model, a slideway is provided on the upper surface of the detection platform, a support arm is slidably connected inside the slideway, and a control electric box is fixedly connected to one side of the detection platform.

[0009] As a preferred technical solution of the utility model, a mounting seat is fixedly mounted on the back of the detection head, and a conductor belt is arranged on the mounting seat.

[0010] As a preferred technical solution of the utility model, a control wire is provided on the control electric box.

[0011] As a preferred technical solution of the utility model, the conductor belt is connected to the conductor on the control electric box.

[0012] As a preferred technical solution of the utility model, the mounting seat is slidably connected to the support arm.

[0013] As a preferred technical solution of the utility model, the inner cavity of the negative pressure suction cup is communicated with the inner cavity of the negative pressure cylinder, the connecting rod is slidably connected to the inside of the second sliding groove, and the shifting rod is slidably engaged in the inside of the slope side groove.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The clamping mechanism for wafer inspection pulls the slide plate and the support plate outward by holding the pull rod. During the movement of the support plate, the negative pressure cylinder at the bottom drives the connecting rod and the lever to move accordingly. Since the lever is slidably engaged in the inside of the slope side groove, and the slope side groove has a slope, the lever will move up under the influence of the slope side groove during the forward movement, and the upwardly moving lever will drive the connecting rod and the negative pressure pull plate connected thereto to move up in the inside of the negative pressure cylinder. At this time, the position of the support plate and the negative pressure suction cup moves to the maximum The air in the front end and the negative pressure cylinder is discharged from the negative pressure suction cup, and finally the wafer is placed on the negative pressure suction cup and the pull rod is held and pushed backward. The pull rod moving backward drives the lever to slide downward inside the slope side groove, and the downward moving lever pulls the negative pressure pull plate through the connecting rod and moves downward in the negative pressure cylinder. Since the wafer is fixed on the top of the negative pressure suction cup to achieve sealing, the pressure inside the negative pressure cylinder becomes smaller during the downward movement of the negative pressure pull plate, and the wafer is stably fixed on the negative pressure suction cup. The device is convenient for quickly fixing the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the overall structure of wafer detection of the utility model;

[0018] Figure 3 This is a schematic cross-sectional view of the fixing mechanism of the utility model;

[0019] Figure 4 This is a schematic diagram of the internal cross-sectional structure of the negative pressure cylinder of the utility model;

[0020] Figure 5 It is a schematic diagram of the side planar structure of the fixing mechanism of the utility model.

[0021] In the figure: 1. test table; 101. slide; 102. support arm; 103. control electric box; 2. test head; 201. mounting seat; 202. conductor belt; 3. fixing mechanism; 301. first slide slot; 302. second slide slot; 303. slope side slot; 304. slide plate; 305. support plate; 306. negative pressure suction cup; 307. negative pressure cylinder; 308. negative pressure pull plate; 309. connecting rod; 310. lever; 311. pull rod. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-5 A clamping mechanism for wafer inspection includes a detection platform 1, a detection head 2 is arranged above the detection platform 1, a fixing mechanism 3 for clamping and fixing the wafer is arranged on the upper surface of the detection platform 1, a slideway 101 is opened on the upper surface of the detection platform 1, a support arm 102 is slidably connected inside the slideway 101, a control electric box 103 is fixedly connected to one side of the detection platform 1, and a control wire is arranged on the control electric box 103.

[0024] See also Figure 3-5 , the fixing mechanism 3 includes a first slide groove 301, a slide plate 304, a support plate 305, a negative pressure suction cup 306, a negative pressure cylinder 307 and a negative pressure pull plate 308. The first slide groove 301 is opened on the upper surface of the detection platform 1, the slide plate 304 is slidably connected to the inside of the first slide groove 301, the support plate 305 is fixedly connected to the upper surface of the slide plate 304, the negative pressure suction cup 306 is fixedly connected to the upper surface of the support plate 305, the negative pressure cylinder 307 is fixedly connected to the lower surface of the support plate 305, and the negative pressure pull plate 308 slides and rises and falls inside the negative pressure cylinder 307. The fixing mechanism 3 also includes a first Second slide groove 302, slope side groove 303, connecting rod 309, lever 310 and pull rod 311, the second slide groove 302 is opened on the upper surface of the detection platform 1, the slope side groove 303 is opened on the side of the second slide groove 302, the connecting rod 309 is fixedly connected to the lower surface of the negative pressure pull plate 308, the lever 310 is fixedly connected to the side wall of the connecting rod 309, the pull rod 311 is fixedly connected to the slide plate 304, the inner cavity of the negative pressure suction cup 306 is connected to the inner cavity of the negative pressure cylinder 307, the connecting rod 309 is slidably connected to the inside of the second slide groove 302, and the lever 310 is slidably engaged in the inside of the slope side groove 303.

[0025] By providing the first slide groove 301 and the slide plate 304, it is convenient to control the negative pressure suction cup 306 to move forward and backward in a fixed direction for wafer placement and pick-up. By providing the negative pressure cylinder 307 and the negative pressure pull plate 308, negative pressure can be used to reduce the pressure inside the negative pressure suction cup 306 and the negative pressure cylinder 307, so that the wafer can be fixed on the negative pressure suction cup 306 by negative pressure. By providing the slope side groove 303, the connecting rod 309 and the lever 310, when the negative pressure suction cup 306 moves to the front end, the slope side groove 303 and the lever 310 can control the negative pressure pull plate 308 to move upward, so that the internal and external pressures of the negative pressure suction cup 306 and the negative pressure cylinder 307 are consistent and the fixation is released. When the negative pressure suction cup 306 moves to the middle, the slope side groove 303 and the lever 310 can control the negative pressure pull plate 308 to move downward, so that the internal pressure of the negative pressure suction cup 306 and the negative pressure cylinder 307 is relatively small to fix the wafer.

[0026] See also Figure 1 A mounting seat 201 is fixedly mounted on the back of the detection head 2 . A conductor belt 202 is provided on the mounting seat 201 . The conductor belt 202 is connected to the conductor on the control electric box 103 . The mounting seat 201 is slidably connected to the support arm 102 .

[0027] By setting up the detection head 2, it is convenient to detect the wafer. By setting up the mounting base 201, it is convenient to control the lateral movement of the detection head 2 to detect multiple areas of the wafer. By setting up the conductor belt 202, it is convenient to connect with an external computer device to control the detection head 2.

[0028] Working principle: when a clamping mechanism for wafer inspection is used, in the initial state, first, the support arm 102 is slidably connected in the slideway 101 opened on the upper surface of the inspection platform 1, and the inspection head 2 is fixedly connected to the mounting seat 201 slidably connected to the side of the support arm 102, so as to facilitate the inspection of the wafer, and the slide plate 304 and the support plate 305 are slidably connected in the first slide groove 301 opened on the upper surface of the inspection platform 1, and the negative pressure suction cup 306 arranged on the upper surface of the support plate 305 is communicated with the inner cavity of the negative pressure cylinder 307 arranged on the lower surface, and the bottom of the negative pressure pull plate 308 that rises and falls in the negative pressure cylinder 307 is connected with a connecting rod 309 and a lever 310, and the lever 310 is slidably connected in the slope side groove 303 opened on the inner side of the second slide groove 302, so as to control the pressure in the negative pressure cylinder 307 to clamp and fix the wafer;

[0029] When the wafer needs to be quickly fixed, first hold the pull rod 311 to pull the slide plate 304 and the support plate 305 outward. During the movement of the support plate 305, the negative pressure cylinder 307 at the bottom drives the connecting rod 309 and the lever 310 to move accordingly. Since the lever 310 is slidably engaged in the inside of the sloped side groove 303, and the sloped side groove 303 has a slope, the lever 310 will move up under the influence of the sloped side groove 303 during the forward movement, and the upward moving lever 310 will drive the connecting rod 309 and the negative pressure pull plate 308 connected thereto to move up inside the negative pressure cylinder 307. At this time, the position of the support plate 305 and the negative pressure suction cup 306 Move to the front end and the air in the negative pressure cylinder 307 is discharged from the negative pressure suction cup 306. Finally, the wafer is placed on the negative pressure suction cup 306 and the pull rod 311 is held and pushed backward. The pull rod 311 moving backward drives the lever 310 to slide downward inside the slope side groove 303. The downward moving lever 310 pulls the negative pressure pull plate 308 through the connecting rod 309 and moves downward in the negative pressure cylinder 307. Since the wafer is fixed on the top of the negative pressure suction cup 306 to achieve sealing, the internal pressure of the negative pressure cylinder 307 becomes smaller during the downward movement of the negative pressure pull plate 308, and the wafer is stably fixed on the negative pressure suction cup 306. This device is convenient for quickly fixing the wafer.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A clamping mechanism for wafer inspection, comprising an inspection table (1), characterized in that: A detection head (2) is arranged above the detection platform (1), and a fixing mechanism (3) for clamping and fixing a wafer is arranged on the upper surface of the detection platform (1); A fixing mechanism (3), the fixing mechanism (3) comprising a first slide groove (301), a slide plate (304), a support plate (305), a negative pressure suction cup (306), a negative pressure cylinder (307) and a negative pressure pull plate (308), the first slide groove (301) being opened on the upper surface of the detection platform (1), the slide plate (304) being slidably connected inside the first slide groove (301), the support plate (305) being fixedly connected to the upper surface of the slide plate (304), the negative pressure suction cup (306) being fixedly connected to the upper surface of the support plate (305), the negative pressure cylinder (307) being fixedly connected to the lower surface of the support plate (305), and the negative pressure pull plate (308) being slidably raised and lowered inside the negative pressure cylinder (307).

2. A clamping mechanism for wafer inspection according to claim 1, characterized in that: The fixing mechanism (3) also includes a second slide groove (302), a slope side groove (303), a connecting rod (309), a lever (310) and a pull rod (311), wherein the second slide groove (302) is provided on the upper surface of the detection platform (1), the slope side groove (303) is provided on the side of the second slide groove (302), the connecting rod (309) is fixedly connected to the lower surface of the negative pressure pull plate (308), the lever (310) is fixedly connected to the side wall of the connecting rod (309), and the pull rod (311) is fixedly connected to the slide plate (304).

3. The clamping mechanism for wafer inspection according to claim 1, characterized in that: The upper surface of the detection platform (1) is provided with a slideway (101), the interior of the slideway (101) is slidably connected to a support arm (102), and one side of the detection platform (1) is fixedly connected to a control electric box (103).

4. The clamping mechanism for wafer inspection according to claim 1, characterized in that: A mounting seat (201) is fixedly mounted on the back of the detection head (2), and a conductor belt (202) is arranged on the mounting seat (201).

5. The clamping mechanism for wafer inspection according to claim 3, characterized in that: The control electric box (103) is provided with a control wire.

6. The clamping mechanism for wafer inspection according to claim 4, characterized in that: The conductor belt (202) is connected to the conductor on the control electric box (103).

7. The clamping mechanism for wafer inspection according to claim 4, characterized in that: The mounting seat (201) is slidably connected to the support arm (102).

8. The clamping mechanism for wafer inspection according to claim 2, characterized in that: The inner cavity of the negative pressure suction cup (306) is communicated with the inner cavity of the negative pressure cylinder (307), the connecting rod (309) is slidably connected to the inside of the second sliding groove (302), and the shifting rod (310) is slidably engaged with the inside of the slope side groove (303).

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