Semiconductor chip feeding mechanism

Abstract

The utility model discloses a semiconductor chip feeding mechanism, which is characterized in that a first transmission shaft is rotatably arranged at the top of a movable plate in a manner of being parallel to the length direction of the movable plate, and one end of the first transmission shaft is fixedly connected with a first motor arranged at the top of the movable plate; a first transmission mechanism is arranged between the first transmission shaft and the first rack, two transverse rods are symmetrically installed in parallel to the first transmission shaft, a second rack is installed on the side wall of one of the transverse rods and located between the two transverse rods, and a transverse plate provided with a second motor is slidably connected to the upper portions of the two transverse rods. A second transmission mechanism is arranged between an output shaft of the second motor and the second rack, and the transverse plate is fixedly connected with a placing plate used for bearing the chip body. According to the semiconductor chip feeding mechanism, the position adjustment of the chip is realized, and the adjustment precision of the chip is improved, so that the position precision of the chip is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of feeding mechanisms, in particular to a semiconductor chip feeding mechanism. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. They are not just silicon chips, but also commonly made of semiconductor materials such as gallium arsenide and germanium. At present, in the process of semiconductor chip production, feeding mechanisms are used to transport chips during chip transmission, testing, packaging, etc.

[0003] After searching, the patent publication number CN216189170U discloses "a semiconductor chip production robot conveying device", including a bottom plate, a cylinder fixedly installed on the top of the bottom plate, a box fixedly installed on the top of the cylinder, and a rotating mechanism arranged inside the box. The device uses a negative pressure mechanism to generate negative pressure inside the hollow tube and the inner tube. When the suction cup contacts the workpiece, the negative pressure mechanism generates negative pressure to firmly adsorb the workpiece on the suction cup, thereby transporting the workpiece through the operation of the rotating mechanism and the cylinder. The suction cup in the device is designed with silicone material, which can effectively improve the sealing between the suction cup and the workpiece, and at the same time can form a better protection for the workpiece to avoid damage to the workpiece. In addition, the device is equipped with a secondary suction cup, which can assist the main suction cup to reinforce the workpiece when adsorbing a larger chip to prevent the chip from falling.

[0004] However, after the chip is placed, it is difficult to ensure accurate positioning, and the chip placement tray in the prior art is generally fixed and cannot adjust the position of the chip after placement, resulting in poor positioning accuracy of the chip. Summary of the invention

[0005] The utility model aims to provide a semiconductor chip feeding mechanism, which realizes the position adjustment of the chip and is also conducive to improving the adjustment accuracy of the chip, thereby greatly improving the position accuracy of the chip.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a semiconductor chip feeding mechanism, comprising: a mounting frame, a slide rail slidably connected to a slider is installed on the upper surface of the mounting frame, and the slider is fixedly connected to a moving plate arranged perpendicular to the length direction of the slide rail, a first rack is installed parallel to the slide rail and on the side wall of the mounting frame, a first transmission shaft is rotatably installed on the top of the moving plate in a manner parallel to the length direction of the moving plate, one end of the first transmission shaft is fixedly connected to a first motor installed on the top of the moving plate, and a first transmission mechanism is arranged between the first transmission shaft and the first rack;

[0007] Two cross bars are installed parallel to the first transmission shaft and in a symmetrical manner. A second rack is installed between the two cross bars and on the side wall of one of the cross bars. A cross plate with a second motor is slidably connected above the two cross bars. A second transmission mechanism is arranged between the output shaft of the second motor and the second rack. A placement plate for receiving the chip body is fixedly connected to the cross plate.

[0008] The further improved scheme in the above technical scheme is as follows:

[0009] 1. In the above scheme, the first transmission mechanism includes: a first bevel gear sleeved on the circumferential outer wall of the first transmission shaft, a rotating shaft rotatably mounted on the movable plate, a second bevel gear matched with the first bevel gear mounted on the upper end of the rotating shaft, and a first gear meshingly connected with the first rack mounted on the lower end of the rotating shaft.

[0010] 2. In the above scheme, the second transmission mechanism includes: a second transmission shaft rotatably mounted on the transverse plate, the upper end of the second transmission shaft is fixedly connected to the output shaft of the second motor, and the lower end of the second transmission shaft is fixedly connected to a second gear meshing with the second rack.

[0011] 3. In the above scheme, a slideway is provided on each of the two cross bars at opposite sides thereof, and the cross plate is slidably connected to the two slideways through a plurality of pulleys.

[0012] 4. In the above solution, a pulley is provided at each of the four corners of the horizontal plate.

[0013] 5. In the above solution, at least two slide rails are provided, and the sliders on several slide rails are commonly connected to the moving plate.

[0014] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0015] The utility model semiconductor chip feeding mechanism is parallel to the slide rail and is installed with a first rack on the side wall of the mounting frame, one end of the first transmission shaft is fixedly connected to a first motor installed on the top of the moving plate, a first transmission mechanism is arranged between the first transmission shaft and the first rack, a second rack is arranged between the two cross bars and is installed on the side wall of one of the cross bars, and a cross plate with a second motor is slidably connected above the two cross bars, a second transmission mechanism is arranged between the output shaft of the second motor and the second rack, the cross plate is fixedly connected with a placement plate for receiving the chip body, the first motor The first transmission mechanism is connected to the first rack, and the second motor is connected to the second rack through the second transmission mechanism, so that the movable plate can move along the length direction of the first rack, and the cross plate can move along the length direction of the second rack, thereby driving the placement plate fixedly connected to the cross plate to move on the X and Y axes, so that the chip body located on the surface of the placement plate can move in the X and Y axis directions, thereby realizing the position adjustment of the chip, and the cooperation between the first rack and the first transmission mechanism, and the second rack and the second transmission mechanism is also conducive to improving the adjustment accuracy of the chip, thereby greatly improving the position accuracy of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 This is a schematic diagram of the overall structure of the semiconductor chip feeding mechanism of the utility model;

[0017] Attached Figure 2 It is a structural schematic diagram of the first transmission mechanism in the utility model;

[0018] Attached Figure 3 It is a structural schematic diagram of the second transmission mechanism in the utility model;

[0019] Attached Figure 4 It is a partial structural schematic diagram of the semiconductor chip feeding mechanism of the utility model.

[0020] In the above drawings: 1, mounting frame; 2, slide rail; 3, slider; 4, moving plate; 51, first motor; 52, first transmission shaft; 53, first bevel gear; 54, rotating shaft; 55, second bevel gear; 56, first rack; 57, first gear; 61, cross bar; 62, slideway; 63, cross plate; 64, pulley; 65, second gear; 66, second motor; 67, second transmission shaft; 68, second rack; 71, limit seat; 72, slide bar; 73, fixed block; 74, placement plate; 9, mounting block; 10, chip body; 11, second positioning seat. DETAILED DESCRIPTION

[0021] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0022] Embodiment 1: A semiconductor chip feeding mechanism comprises: a mounting frame 1, a slide rail 2 slidably connected to a slider 3 is mounted on the upper surface of the mounting frame 1, and the slider 3 is fixedly connected to a moving plate 4 arranged perpendicular to the length direction of the slide rail 2, a first rack 56 is mounted parallel to the slide rail 2 and on the side wall of the mounting frame 1, a first transmission shaft 52 is rotatably mounted on the top of the moving plate 4 and parallel to the length direction of the moving plate 4, one end of the first transmission shaft 52 is fixedly connected to a first motor 51 mounted on the top of the moving plate 4, and a first transmission mechanism is arranged between the first transmission shaft 52 and the first rack 56;

[0023] When the chip body needs to be inspected, the chip body is placed on the placement plate, and then the first motor is started. The first motor drives the first transmission shaft to rotate, and the first transmission shaft drives the first bevel gear to rotate when it rotates. The first bevel gear drives the rotating shaft to rotate when it rotates, and the rotating shaft drives the first gear to rotate when it rotates. The first gear can be meshed with the first rack for transmission, and drives the slider to slide outside the slide rail, and the sliding of the slider drives the moving plate to move;

[0024] Two cross bars 61 are installed parallel to the first transmission shaft 52 and in a symmetrical manner. A second rack 68 is installed between the two cross bars 61 and on the side wall of one of the cross bars 61. A cross plate 63 with a second motor 66 is slidably connected above the two cross bars 61. A second transmission mechanism is provided between the output shaft of the second motor 66 and the second rack 68. A placement plate 74 for receiving the chip body 10 is fixedly connected to the cross plate 63.

[0025] The horizontal plate 63 is fixedly connected with a support 74 for receiving the chip body 10;

[0026] Start the second motor, the second motor drives the second transmission shaft to rotate, the second transmission shaft drives the second gear to rotate, the second gear meshes with the second rack for transmission, and then drives the pulley to slide outside the slideway, the sliding of the pulley can drive the cross plate to move, when the cross plate moves, it drives the slide bar to move inside the limit seat, when the slide bar moves, it drives the placement plate to move, the placement plate can drive the chip body to move when it moves, so that the feeding position of the placement plate can be adjusted.

[0027] The above-mentioned first transmission mechanism includes: a first bevel gear 53 sleeved on the circumferential outer wall of the above-mentioned first transmission shaft 52, and a rotating shaft 54 ​​rotatably installed on the movable plate 4, and a second bevel gear 55 cooperating with the first bevel gear 53 is installed on the upper end of the above-mentioned rotating shaft 54, and a first gear 57 meshingly connected with the first rack 56 is installed on the lower end of this rotating shaft 54.

[0028] The cooperation between the first rack 56 and the first gear 57 can improve the position accuracy of the movement of the cross plate while realizing the transmission connection between the transmission shaft and the rotating shaft, thereby improving the adjustment accuracy of the chip.

[0029] The second transmission mechanism comprises: a second transmission shaft 67 rotatably mounted on the transverse plate 63 , the upper end of the second transmission shaft 67 being fixedly connected to the output shaft of the second motor 66 , and the lower end of the second transmission shaft 67 being fixedly connected to a second gear 65 meshing with the second rack 68 .

[0030] The cooperation between the second gear 65 and the second rack 68 is helpful to improve the position accuracy of the movement of the cross plate, thereby improving the adjustment accuracy of the chip.

[0031] A slideway 62 is provided on each of the two horizontal bars 61 at opposite sides, and the horizontal plate 63 is slidably connected to the two slideways 62 through a plurality of pulleys 64. The cooperation between the pulley and the slideway greatly improves the stability of the movement of the horizontal plate, which is beneficial to improving the position accuracy of the movement of the horizontal plate, thereby improving the adjustment accuracy of the chip.

[0032] A pulley 64 is disposed at each of the four corners of the transverse plate 63 .

[0033] At least two of the slide rails 2 are provided, and the sliders 3 on a plurality of the slide rails 2 are commonly connected to the moving plate 4 .

[0034] A mounting block 9 is provided on the top of the movable plate 4, and the first motor 51 is provided on the mounting block 9; two mounting blocks 9 are provided, and the motor 51 is located between the two mounting blocks 9, and a bearing is provided between the output shaft of the motor 51 and the mounting block 9.

[0035] Embodiment 2: A semiconductor chip feeding mechanism, comprising: a mounting frame 1, a slide rail 2 slidably connected to a slider 3 is mounted on the upper surface of the mounting frame 1, and the slider 3 is fixedly connected to a moving plate 4 arranged perpendicular to the length direction of the slide rail 2, a first rack 56 is installed parallel to the slide rail 2 and on the side wall of the mounting frame 1, a first transmission shaft 52 is rotatably mounted on the top of the moving plate 4 and parallel to the length direction of the moving plate 4, one end of the first transmission shaft 52 is fixedly connected to a first motor 51 installed on the top of the moving plate 4, and a first transmission mechanism is arranged between the first transmission shaft 52 and the first rack 56;

[0036] The first motor is connected to the first rack through the first transmission mechanism, and the second motor is connected to the second rack through the second transmission mechanism, so that the movable plate can move along the length direction of the first rack, and the cross plate can move along the length direction of the second rack, thereby driving the placement plate fixedly connected to the cross plate to move on the X and Y axes;

[0037] Two cross bars 61 are installed parallel to the first transmission shaft 52 and in a symmetrical manner. A second rack 68 is installed between the two cross bars 61 and on the side wall of one of the cross bars 61. A cross plate 63 with a second motor 66 is slidably connected above the two cross bars 61. A second transmission mechanism is provided between the output shaft of the second motor 66 and the second rack 68. A placement plate 74 for receiving the chip body 10 is fixedly connected to the cross plate 63.

[0038] A limit seat 71 movably connected to a slide bar 72 is fixedly installed at one end of the cross bar 61, and is located on one side of the second motor 66 and a fixing block 73 is provided on the cross plate 63. One end of the slide bar 72 is fixedly connected to the fixing block 73, and the other end is fixedly connected to a placement plate 74 for placing the chip body 10.

[0039] The chip body located on the surface of the placement plate can be moved in the X and Y axis directions, thereby realizing the position adjustment of the chip. The cooperation between the first rack and the first transmission mechanism, and the second rack and the second transmission mechanism is also conducive to improving the adjustment accuracy of the chip, thereby greatly improving the position accuracy of the chip.

[0040] The above-mentioned first transmission mechanism includes: a first bevel gear 53 sleeved on the circumferential outer wall of the above-mentioned first transmission shaft 52, and a rotating shaft 54 ​​rotatably installed on the movable plate 4, and a second bevel gear 55 cooperating with the first bevel gear 53 is installed on the upper end of the above-mentioned rotating shaft 54, and a first gear 57 meshingly connected with the first rack 56 is installed on the lower end of this rotating shaft 54.

[0041] The second transmission mechanism comprises: a second transmission shaft 67 rotatably mounted on the transverse plate 63 , the upper end of the second transmission shaft 67 being fixedly connected to the output shaft of the second motor 66 , and the lower end of the second transmission shaft 67 being fixedly connected to a second gear 65 meshing with the second rack 68 .

[0042] A slideway 62 is respectively provided on the opposite sides of the two cross bars 61 , and the cross plate 63 is slidably connected to the two slideways 62 via a plurality of pulleys 64 .

[0043] A pulley 64 is disposed at each of the four corners of the transverse plate 63 .

[0044] At least two of the slide rails 2 are provided, and the sliders 3 on a plurality of the slide rails 2 are commonly connected to the moving plate 4 .

[0045] A second positioning seat 11 is installed at a distance on the top of the moving plate 4 , and the first transmission shaft 52 is rotatably installed inside the second positioning seat 11 .

[0046] The working principle is:

[0047] When in use, when the chip body needs to be tested, the chip body is placed on the placement plate, and then the first motor is started, the first motor drives the first transmission shaft to rotate, the first transmission shaft drives the first bevel gear to rotate, the first bevel gear drives the rotating shaft to rotate, the rotating shaft drives the first gear to rotate, the first gear rotates to mesh with the first rack and drive the slider to slide outside the slide rail, and the slider slides to drive the moving plate to move;

[0048] Start the second motor, the second motor drives the second transmission shaft to rotate, the second transmission shaft drives the second gear to rotate, the second gear meshes with the second rack for transmission, and then drives the pulley to slide outside the slideway, the sliding of the pulley can drive the cross plate to move, when the cross plate moves, it drives the slide bar to move inside the limit seat, when the slide bar moves, it drives the placement plate to move, the placement plate can drive the chip body to move when it moves, so that the feeding position of the placement plate can be adjusted.

[0049] When the above-mentioned semiconductor chip feeding mechanism is used, the chip body located on the surface of the placement plate can be moved in the X and Y axis directions, thereby realizing the adjustment of the chip position. In addition, the cooperation between the first rack and the first transmission mechanism, and the second rack and the second transmission mechanism is also beneficial to improve the adjustment accuracy of the chip, thereby greatly improving the position accuracy of the chip.

[0050] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A semiconductor chip feeding mechanism, comprising: The mounting frame (1) is characterized in that: a slide rail (2) slidably connected to a slider (3) is mounted on the upper surface of the mounting frame (1), and the slider (3) is fixedly connected to a movable plate (4) arranged perpendicular to the length direction of the slide rail (2), a first rack (56) is mounted parallel to the slide rail (2) and on the side wall of the mounting frame (1), a first transmission shaft (52) is rotatably mounted on the top of the movable plate (4) and parallel to the length direction of the movable plate (4), one end of the first transmission shaft (52) is fixedly connected to a first motor (51) mounted on the top of the movable plate (4), and a first transmission mechanism is arranged between the first transmission shaft (52) and the first rack (56); Two cross bars (61) are installed in parallel with the first transmission shaft (52) in a symmetrical manner, a second rack (68) is installed between the two cross bars (61) and on the side wall of one of the cross bars (61), and a cross plate (63) provided with a second motor (66) is slidably connected above the two cross bars (61), a second transmission mechanism is provided between the output shaft of the second motor (66) and the second rack (68), and the cross plate (63) is fixedly connected to a placement plate (74) for receiving the chip body (10).

2. The semiconductor chip feeding mechanism according to claim 1, characterized in that: The first transmission mechanism comprises: a first bevel gear (53) sleeved on the circumferential outer wall of the first transmission shaft (52), and a rotating shaft (54) rotatably mounted on the movable plate (4); a second bevel gear (55) matched with the first bevel gear (53) is mounted on the upper end of the rotating shaft (54); and a first gear (57) meshingly connected with the first rack (56) is mounted on the lower end of the rotating shaft (54).

3. The semiconductor chip feeding mechanism according to claim 1 or 2, characterized in that: The second transmission mechanism comprises: a second transmission shaft (67) rotatably mounted on the transverse plate (63), the upper end of the second transmission shaft (67) being fixedly connected to the output shaft of the second motor (66), and the lower end of the second transmission shaft (67) being fixedly connected to a second gear (65) meshingly connected to the second rack (68).

4. The semiconductor chip feeding mechanism according to claim 1, characterized in that: A slideway (62) is provided on opposite sides of the two cross bars (61), and the cross plate (63) is slidably connected to the two slideways (62) via a plurality of pulleys (64).

5. The semiconductor chip feeding mechanism according to claim 4, characterized in that: A pulley (64) is provided at each of the four corners of the transverse plate (63).

6. The semiconductor chip feeding mechanism according to claim 4, characterized in that: At least two slide rails (2) are provided, and the sliding blocks (3) on a plurality of slide rails (2) are commonly connected to the moving plate (4).

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