Chip ejector pin device and chip packaging equipment

Abstract

The utility model relates to the technical field of chip packaging, and particularly discloses a chip ejector pin device and chip packaging equipment, and the chip ejector pin device comprises an ejector pin mounting table which is provided with a bearing surface for bearing a chip; the ejector pin mounting table is provided with a plurality of mounting holes which are arranged in an array mode, the extending direction of the mounting holes is perpendicular to the bearing face, an electromagnetic driving assembly is arranged at the end, away from the bearing face, of each mounting hole, and the driving end of each electromagnetic driving assembly is connected with an ejector pin inserted into the corresponding mounting hole. And the electromagnetic driving assembly can push the ejector pin to penetrate through the bearing surface to jack up the chip or enable the ejector pin to be retracted into the mounting hole. Each ejector pin can be controlled to move independently in an electromagnetic driving mode, and large-area stripping of a chip and an adhesive film can be achieved.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a chip ejector device and a chip packaging equipment. Background Art

[0002] In the chip packaging process, ejector pins are usually used to push the chip up, and negative pressure is used to suck the chip at the same time, so that the chip and the film can be separated, and finally the chip can be picked up and transferred. Because the glue on the film has a certain viscosity, the prior art uses multiple sets of ejector pins to lift and lower the chip at the same time when the ejector pins lift the chip, thereby pushing the film and the chip to move toward the negative pressure suction port. When the ejector pins are pushed to the highest point, all the ejector pins still support the film and the chip, resulting in the chip and the film being unable to be peeled off over a large area, so that the film still has a large adhesive force on the chip, resulting in a large pulling traction force on the chip during the negative pressure suction process, making the chip prone to rupture. Especially for chips that are getting thinner and larger in area, the chip yield problem caused by the ejector pin process is becoming more and more prominent. Utility Model Content

[0003] The purpose of the present application is to provide a chip ejector device and a chip packaging device, which can control each ejector to move independently through electromagnetic driving, thereby realizing large-area peeling of the chip and the film.

[0004] The embodiment of the present application is implemented as follows:

[0005] In the first aspect, an embodiment of the present application provides a chip ejector device, including an ejector mounting platform, the ejector mounting platform having a carrying surface for carrying a chip; the ejector mounting platform has a plurality of mounting holes arranged in an array and extending in a direction perpendicular to the carrying surface, each of the mounting holes is provided with an electromagnetic drive component at one end away from the carrying surface, the driving end of the electromagnetic drive component is connected to a ejector pin inserted in the mounting hole, and the electromagnetic drive component can push the ejector pin to pass through the carrying surface to eject the chip or retract the ejector pin into the mounting hole.

[0006] As an optional embodiment, the electromagnetic drive assembly includes an electromagnetic coil and a magnetic push-pull rod inserted in the electromagnetic coil. When the electromagnetic coil is energized, a magnetic force acting on the magnetic push-pull rod is generated, so that the magnetic push-pull rod can drive the ejector pin to extend out of the mounting hole or retract into the mounting hole.

[0007] As an optional implementation, a bottom limit piece is provided at one end of the mounting hole away from the bearing surface, and the magnetic push-pull rod can abut against the bottom limit piece to form a holding force that prevents the magnetic push-pull rod from moving away from the bearing surface.

[0008] As an optional embodiment, an upper limit piece is provided at one end of the mounting hole close to the bearing surface, and a protrusion structure extending radially is provided on the magnetic push-pull rod or the ejector pin; the protrusion structure abuts against the upper limit piece to form a holding force that prevents the magnetic push-pull rod from approaching the bearing surface.

[0009] As an optional embodiment, the ejector mounting platform has ventilation holes arranged in an array, and also includes a negative pressure component connected to the ventilation holes, and the negative pressure component can generate negative pressure suction acting on the adhesive film laid on the supporting surface by drawing air through the ventilation holes; or, the negative pressure component can generate supporting force acting on the adhesive film by blowing air through the ventilation holes.

[0010] As an optional embodiment, it further includes a protective shell with an opening, and the ejector mounting platform is installed in the opening; the protective shell has an installation chamber for accommodating the electromagnetic drive assembly.

[0011] As an optional embodiment, the protective shell is connected to the negative pressure component via a connecting air pipe.

[0012] As an optional implementation, the ejector mounting platform is arranged horizontally.

[0013] As an optional implementation, it further includes a controller electrically connected to the electromagnetic drive assembly, and the controller can control each ejector pin to move independently through the electromagnetic drive assembly.

[0014] In a second aspect, an embodiment of the present application provides a chip packaging device, comprising the above-mentioned chip ejector device and a chip pickup assembly, wherein the chip pickup assembly can be moved above the ejector mounting platform to absorb the chip on the carrying surface through negative pressure.

[0015] The beneficial effects of the embodiments of the present application include:

[0016] In the first aspect, the embodiment of the present application provides a chip ejector device, including an ejector mounting platform, the ejector mounting platform having a bearing surface for carrying a chip; the ejector mounting platform of the embodiment of the present application has a plurality of mounting holes arranged in an array and extending in a direction perpendicular to the bearing surface, and each mounting hole of the embodiment of the present application is provided with an electromagnetic drive assembly at one end away from the bearing surface, and an electromagnetic drive control matrix is ​​formed on the ejector mounting platform. In the embodiment of the present application, an ejector inserted in the mounting hole is connected to the driving end of the electromagnetic drive assembly, and the electromagnetic drive assembly can push the ejector through the bearing surface to lift the chip or retract the ejector into the mounting hole. The electromagnetic drive control matrix formed in the embodiment of the present application can independently control the ejectors arranged in multiple arrays on the bearing surface, and the movement of a single ejector does not affect the other ejectors by controlling the independent movement of the ejectors. Therefore, the embodiment of the present application can first make all the ejectors lift the film and the chip as needed, and at this time, the film is deformed and pulled, and an elastic restoring force can be generated to move toward the bearing surface, and then some ejectors are controlled to fall, and within the range where the ejectors are not held, the film is separated from the chip in a large area under the action of the elastic restoring force. Therefore, the embodiments of the present application can reduce the adhesion force of the adhesive film on the chip, prevent the chip from being damaged due to the strong adhesion force when the chip is removed, effectively improve the safety of the chip packaging process, and help improve the chip packaging yield.

[0017] On the second aspect, the embodiment of the present application provides a chip packaging device, including the above-mentioned chip ejector device and a chip pickup assembly, and the chip pickup assembly can be moved above the ejector mounting table to absorb the chip on the bearing surface through negative pressure. The embodiment of the present application adopts the above-mentioned chip ejector device, which can form an electromagnetic drive control matrix to independently control the movement of each ejector, and the operator can set the lifting and falling of the ejector as needed by controlling the electromagnetic drive assembly. For example, when the chip is lifted to the highest point, most of the ejectors fall back, leaving four ejectors arranged at intervals to lift the four corners of the chip, so that most of the adhesive film in the middle is separated from the chip under the action of elastic force. Therefore, the embodiment of the present application can achieve a large-scale separation of the chip and the adhesive film, reduce the adhesion of the adhesive film to the chip, and prevent the chip from cracking when it is removed by the chip pickup assembly, which is conducive to improving the safety of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is one of the structural schematic diagrams of the chip ejector device according to the embodiment of the present application;

[0020] Figure 2 This is the second structural schematic diagram of the chip ejector device according to the embodiment of the present application;

[0021] Figure 3 This is the third structural schematic diagram of the chip ejector device according to the embodiment of the present application;

[0022] Figure 4 This is the fourth structural schematic diagram of the chip ejector device according to the embodiment of the present application;

[0023] Figure 5 This is the fifth structural schematic diagram of the chip ejector device according to the embodiment of the present application.

[0024] icon:

[0025] 100-chip ejector device; 101-ejector mounting platform; 102-bearing surface; 103-mounting hole; 104-electromagnetic drive assembly; 105-ejector; 106-electromagnetic coil; 107-magnetic push-pull rod; 108-bottom limiter; 109-vent; 110-negative pressure assembly; 111-mounting chamber; 112-chip; 113-adhesive film. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0028] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0029] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In the chip 112 packaging process, the ejector pins 105 are usually used to push the chip 112 up, and the chip 112 is sucked by negative pressure at the same time, so that the chip 112 and the adhesive film 113 can be separated, and finally the chip 112 is picked up and transferred. Because the glue on the adhesive film 113 has a certain viscosity, the prior art uses multiple groups of ejector pins 105 to lift up the chip 112 at the same time, so as to push the adhesive film 113 and the chip 112 to move toward the negative pressure suction port. When the ejector pins 105 are pushed up to the highest point, all the ejector pins 105 still support the adhesive film 113 and the chip 112, resulting in the chip 112 and the adhesive film 113 cannot be peeled off over a large area, so that the adhesive film 113 still has a large adhesive force on the chip 112, resulting in a large pulling traction force on the chip 112 during the negative pressure suction process, making the chip 112 prone to rupture. Especially for the increasingly thin and large-area chips 112, the chip 112 yield problem caused by the ejector pin 105 process is becoming more and more prominent.

[0031] In order to solve the above technical problems, the embodiment of the present application provides a chip ejector device 100 and a chip 112 packaging device.

[0032] Reference Figure 1 , Figure 2 as well as Figure 3 As shown, the embodiment of the present application provides a chip ejector device 100, including an ejector mounting platform 101, the ejector mounting platform 101 having a carrying surface 102 for carrying a chip 112; the ejector mounting platform 101 has a plurality of mounting holes 103 arranged in an array and extending in a direction perpendicular to the carrying surface 102, each mounting hole 103 is provided with an electromagnetic driving component 104 at one end away from the carrying surface 102, the driving end of the electromagnetic driving component 104 is connected to a ejector pin 105 inserted in the mounting hole 103, and the electromagnetic driving component 104 can push the ejector pin 105 to pass through the carrying surface 102 to eject the chip 112 or retract the ejector pin 105 into the mounting hole 103.

[0033] It should be noted that the mounting holes 103 of the embodiment of the present application are arranged in an array on the bearing surface 102. The spacing between adjacent mounting holes 103 and the number of mounting holes 103 can be set by those skilled in the art as required, and there is no special limitation on this.

[0034] In each mounting hole 103 of the embodiment of the present application, an ejector pin 105 is inserted, and the spacing between the mounting holes 103 is the spacing between the ejector pins 105. The number of mounting holes 103 is consistent with the number of ejector pins 105. Each ejector pin 105 of the embodiment of the present application is controlled by an electromagnetic drive assembly 104, so the embodiment of the present application can form an electromagnetic drive control matrix corresponding to the mounting hole 103 matrix, and realize independent control of the movement of the ejector pins 105.

[0035] The embodiment of the present application further includes a controller electrically connected to the electromagnetic drive assembly 104 , and the controller can control each ejector pin 105 to move independently through the electromagnetic drive assembly 104 .

[0036] It should be noted that, in the embodiment of the present application, all the ejector pins 105 can be simultaneously lifted up to lift up the chip 112 through the electromagnetic drive control matrix, and the film 113 is deformed during the lifting and raising, generating elastic force. Then, the ejector pins 105 in the middle or the edge fall back, so that a few ejector pins 105 support the core. The film 113 is separated from the chip 112 by shrinking.

[0037] It should be noted that the electromagnetic drive is used to control the lifting of all ejector pins 105 to avoid too few ejector pins 105, thereby causing the chip 112 to bear a large supporting impact force. In the embodiment of the present application, the electromagnetic drive control matrix is ​​used to control the lifting of all ejector pins 105 so that each ejector pin 105 contacts the film 113 at the same time and lifts the film 113 and the chip 112.

[0038] The plurality of ejector pins 105 simultaneously lift the chip 112 to prevent a single ejector pin 105 from exerting a large pressure on the chip 112 and damaging the chip 112 .

[0039] In the embodiment of the present application, the controller can control the electromagnetic drive control matrix to make some predetermined ejector pins 105 fall back to separate the film 113 from the chip 112. It should be noted that those skilled in the art can set a variety of different fall-back schemes in the controller as needed to achieve different separation effects.

[0040] For example, all the ejector pins 105 in the middle may be retracted, leaving only the outermost ejector pins 105 in the outer circle to support the chip 112 .

[0041] For example, for a rectangular chip 112 , four ejector pins 105 may be retained to support the four corners of the chip 112 , respectively, and the remaining ejector pins 105 may be retracted.

[0042] For example, the controller may be used to control all the ejector pins 105 to lift up the chip 112 , and then most of the chip 112 falls back, with some of the ejector pins 105 supporting the chip 112 ; and then the ejector pins 105 that have fallen back are partially lifted up to replace the ejector pins 105 currently supporting the chip 112 , so that the adhesive film 113 and the chip 112 can be effectively separated.

[0043] In this regard, those skilled in the art may make settings as needed, with the goal of achieving effective peeling of the chip 112 and the adhesive film 113 by independently controlling the movement of the ejector pins 105 .

[0044] Reference Figure 1 , Figure 2 as well as Figure 3 As shown, the chip ejector device 100 provided in the embodiment of the present application includes an ejector mounting platform 101, and the ejector mounting platform 101 has a bearing surface 102 for bearing a chip 112; the ejector mounting platform 101 in the embodiment of the present application has a plurality of mounting holes 103 arranged in an array and extending in a direction perpendicular to the bearing surface 102, and each mounting hole 103 in the embodiment of the present application is provided with an electromagnetic drive component 104 at one end away from the bearing surface 102, forming an electromagnetic drive control matrix on the ejector mounting platform 101. In the embodiment of the present application, an ejector 105 inserted in the mounting hole 103 is connected to the driving end of the electromagnetic drive component 104, and the electromagnetic drive component 104 can push the ejector 105 through the bearing surface 102 to lift the chip 112 or retract the ejector 105 into the mounting hole 103.

[0045] The electromagnetic drive control matrix formed in the embodiment of the present application can independently control the ejector pins 105 arranged in a plurality of arrays on the carrying surface 102 , and the movement of the ejector pins 105 is independently controlled so that the movement of a single ejector pin 105 does not affect the other ejector pins 105 .

[0046] Therefore, according to the needs, the embodiment of the present application can first make all the ejector pins 105 lift up the adhesive film 113 and the chip 112. At this time, the adhesive film 113 is deformed and pulled, which can generate an elastic restoring force to move toward the bearing surface 102, and then control some of the ejector pins 105 to fall. In the range where the ejector pins 105 are not supporting, the adhesive film 113 is separated from the chip 112 over a large area under the action of the elastic restoring force.

[0047] Therefore, the embodiment of the present application can reduce the adhesion of the adhesive film 113 to the chip 112, prevent the chip 112 from being damaged due to the strong adhesion when the chip 112 is removed, effectively improve the safety of the chip 112 packaging process, and help to improve the chip 112 packaging yield.

[0048] Reference Figure 2 as well as Figure 3As shown, as an optional embodiment, the electromagnetic drive component 104 includes an electromagnetic coil 106 and a magnetic push-pull rod 107 passing through the electromagnetic coil 106. When the electromagnetic coil 106 is energized, a magnetic force acting on the magnetic push-pull rod 107 is generated, so that the magnetic push-pull rod 107 can drive the ejector pin 105 to extend out of the mounting hole 103 or retract into the mounting hole 103.

[0049] Furthermore, the electromagnetic drive assembly 104 of the embodiment of the present application includes an electromagnetic coil 106 and a magnetic push-pull rod 107. It should be noted that the magnetic push-pull rod 107 can be a permanent magnet.

[0050] Reference Figure 2 as well as Figure 3 As shown, as an optional embodiment, a bottom limiter 108 is provided at one end of the mounting hole 103 away from the bearing surface 102 , and the magnetic push-pull rod 107 can abut against the bottom limiter 108 to form a holding force that prevents the magnetic push-pull rod 107 from moving away from the bearing surface 102 .

[0051] Furthermore, an upper limit piece is provided at one end of the mounting hole 103 close to the bearing surface 102 , and a protrusion structure extending radially is provided on the magnetic push-pull rod 107 or the ejector pin 105 ; the protrusion structure abuts against the upper limit piece to form a holding force that prevents the magnetic push-pull rod 107 from approaching the bearing surface 102 .

[0052] The embodiment of the present application uses a bottom stopper 108 and an upper stopper to limit the movement stroke of the ejector pin 105, effectively preventing the ejector pin 105 from being lifted too high or falling back too low. Therefore, it is helpful to improve the reliability of the movement of the ejector pin 105.

[0053] Reference Figure 2 , Figure 3 , Figure 4 as well as Figure 5 As shown, as an optional embodiment, the ejector mounting platform 101 has vent holes 109 arranged in an array, and also includes a negative pressure component 110 connected to the vent holes 109. The negative pressure component 110 draws air through the vent holes 109 to generate a negative pressure suction force acting on the adhesive film 113 laid on the supporting surface 102; or, the negative pressure component 110 blows air through the vent holes 109 to generate a supporting force acting on the adhesive film 113.

[0054] In the embodiment of the present application, the negative pressure assembly 110 is provided to blow air to the structure on the carrying surface 102 so that the structure on the carrying surface 102 is separated from the carrying surface 102. For example, the negative pressure assembly 110 blows air to the vent hole 109 so that the adhesive film 113 is separated from the carrying surface 102.

[0055] The embodiment of the present application can also suck air through the negative pressure component 110, so that the vent hole 109 generates negative pressure, and the negative pressure can negatively adsorb the adhesive film 113 on the carrying surface 102. When the ejector pin 105 lifts up the chip 112, the negative pressure generated through the vent hole 109 can make the adhesive film 113 adsorbed on the carrying surface 102, ensuring that the adhesive film 113 and the chip 112 are effectively separated.

[0056] Reference Figure 5 As shown, as an optional embodiment, it also includes a protective shell with an opening, and the ejector mounting platform 101 is installed in the opening; the protective shell has an installation chamber 111 for accommodating the electromagnetic drive component 104.

[0057] The protective shell is connected to the negative pressure assembly 110 via a connecting air pipe.

[0058] As an optional implementation, the ejector mounting platform 101 is arranged horizontally.

[0059] The embodiment of the present application provides a chip 112 packaging device, including the above-mentioned chip ejector device 100 and a chip 112 pickup component. The chip 112 pickup component can be moved above the ejector mounting platform 101 to absorb the chip 112 on the carrying surface 102 through negative pressure.

[0060] The embodiment of the present application adopts the above-mentioned chip ejector device 100, which can form an electromagnetic drive control matrix to independently control the movement of each ejector 105. By controlling the electromagnetic drive component 104, the operator can set the lifting and falling of the ejector 105 as needed. For example, when the chip 112 is lifted to the highest point, most of the ejectors 105 are dropped back, leaving four ejectors 105 arranged at intervals to lift the four corners of the chip 112, so that most of the adhesive film 113 in the middle is separated from the chip 112 under the action of elastic force. Therefore, the embodiment of the present application can achieve a large-scale separation of the chip 112 and the adhesive film 113, reduce the adhesive force of the adhesive film 113 on the chip 112, prevent the chip 112 from cracking when it is removed by the chip 112 pickup component, and help improve the safety of the operation.

[0061] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip ejector device, characterized in that: The invention comprises an ejector pin mounting platform (101), wherein the ejector pin mounting platform (101) is provided with a carrying surface (102) for carrying a chip; the ejector pin mounting platform (101) is provided with a plurality of mounting holes (103) arranged in an array and extending in a direction perpendicular to the carrying surface (102); an electromagnetic driving component (104) is provided at one end of each mounting hole (103) away from the carrying surface (102); a driving end of the electromagnetic driving component (104) is connected to an ejector pin (105) inserted into the mounting hole (103); and the electromagnetic driving component (104) can push the ejector pin (105) through the carrying surface (102) to lift the chip or retract the ejector pin (105) into the mounting hole (103).

2. The chip ejector device according to claim 1, characterized in that: The electromagnetic drive assembly (104) comprises an electromagnetic coil (106) and a magnetic push-pull rod (107) inserted into the electromagnetic coil (106). When the electromagnetic coil (106) is energized, a magnetic force is generated on the magnetic push-pull rod (107), so that the magnetic push-pull rod (107) can drive the ejector pin (105) to extend out of the mounting hole (103) or retract into the mounting hole (103).

3. The chip ejector device according to claim 2, characterized in that: A bottom stopper (108) is provided at one end of the mounting hole (103) away from the bearing surface (102), and the magnetic push-pull rod (107) can abut against the bottom stopper (108) to form a holding force that prevents the magnetic push-pull rod (107) from moving away from the bearing surface (102).

4. The chip ejector device according to claim 2, characterized in that: An upper stopper is provided at one end of the mounting hole (103) close to the bearing surface (102), and a protruding structure extending radially is provided on the magnetic push-pull rod (107) or the ejector pin (105); the protruding structure abuts against the upper stopper to form a holding force that prevents the magnetic push-pull rod (107) from approaching the bearing surface (102).

5. The chip ejector device according to any one of claims 1 to 4, characterized in that: The ejector mounting platform (101) has ventilation holes (109) arranged in an array, and also includes a negative pressure component (110) connected to the ventilation holes (109). The negative pressure component (110) extracts air through the ventilation holes (109) to generate a negative pressure suction force acting on the adhesive film laid on the supporting surface (102); or, the negative pressure component (110) blows air through the ventilation holes (109) to generate a supporting force acting on the adhesive film.

6. The chip ejector device according to claim 5, characterized in that: It also comprises a protective shell having an opening, wherein the ejector mounting platform (101) is mounted in the opening; and the protective shell comprises a mounting chamber (111) for accommodating an electromagnetic drive assembly (104).

7. The chip ejector device according to claim 6, characterized in that: The protective shell is connected to the negative pressure component (110) via a connecting air pipe.

8. The chip ejector device according to claim 1, characterized in that: The ejector mounting platform (101) is arranged horizontally.

9. The chip ejector device according to claim 1, characterized in that: It also includes a controller electrically connected to the electromagnetic drive assembly (104), and the controller can control each ejector pin (105) to move independently through the electromagnetic drive assembly (104).

10. A chip packaging device, characterized in that: The invention comprises a chip ejector device (100) as claimed in any one of claims 1 to 9 and a chip pickup assembly, wherein the chip pickup assembly can be moved above an ejector mounting platform (101) to absorb the chip on a carrying surface (102) by negative pressure.

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