Flow guide device and thermal management system
By designing the flow guide device of the guide frame, rib mechanism and sealing mechanism in the thermal management system, the problem of hot air return flow is solved and the heat dissipation efficiency and stability of the system are improved.
Patent Information
- Application Number
- CN202420897979.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-26
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2034-04-26
AI Technical Summary
The existing thermal management system is prone to hot air return when exhausting, resulting in poor heat exchange effect and degradation of system performance.
Design a diversion device, including a diversion framework, a blocking agency, and a sealing mechanism. It is set between the air -out device and the air outlet of the thermal management system. Institutions prevent air leakage.
Effectively reduce hot air return flow, improve the heat dissipation efficiency of the thermal management system, ensure normal operation of the system, and enhance system stability and reliability.
Smart Images

Figure CN222394895U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of thermal management technology, and in particular to a flow guide device and a thermal management system. Background Art
[0002] Thermal management systems are used in various new energy vehicles, including battery packs, which are the main energy storage components of electric vehicles. In order to ensure the efficiency of the battery pack, it is necessary to keep the battery pack in a suitable operating temperature range.
[0003] Currently, the thermal management system does not involve a guide device or the guide device has a poor effect. When the thermal management system is exhausting air, hot air backflow and other phenomena will occur, resulting in insufficient heat exchange inside the thermal management system, poor heat exchange effect, and reduced performance of the thermal management system. Utility Model Content
[0004] In order to solve the problems existing in the above-mentioned prior art, the present application provides a guide device, which can reduce hot air reflux, improve the guide effect, and extend the service life of various equipment. The guide device can help the thermal management system maintain a stable operating temperature and avoid performance degradation or failure of the thermal management system due to overheating.
[0005] On the one hand, the present application provides a flow guide device, which is applied to a thermal management system and is arranged between an air outlet device and an air outlet of the thermal management system, and is characterized in that it includes:
[0006] A flow guide frame, the flow guide frame is connected to the thermal management system, and the flow guide frame is used to accommodate the air outlet device;
[0007] A side retaining mechanism, the side retaining mechanism is connected to the air guide frame, and the side retaining mechanism is arranged on a side close to the air outlet;
[0008] A sealing mechanism is provided between the side retaining mechanism and the air outlet, and is used for fitting with the side retaining mechanism.
[0009] In a possible implementation manner, when the sealing mechanism is not connected to the side retaining mechanism, the thickness of the sealing mechanism is greater than or equal to the relative distance between the side retaining mechanism and the air outlet.
[0010] In a possible implementation manner, the side retaining mechanism 11 and the flow guide frame are integrally formed.
[0011] In a possible implementation manner, the guide frame includes a first side plate, a second side plate and an upper top plate, and the first side plate, the upper top plate and the second side plate are connected in sequence.
[0012] The first side plate includes a first baffle plate, the first baffle plate is connected to the upper top plate of the guide frame, and the first baffle plate is arranged at an angle to the upper top plate;
[0013] The second side plate includes a second baffle plate, the second baffle plate is connected to the upper top plate of the guide frame, and the second baffle plate is arranged at an angle to the upper top plate.
[0014] In a possible implementation manner, a notch is provided on a side of the air guide frame close to the air outlet.
[0015] In a possible implementation manner, the flow guide frame is provided with at least two fastener mounting holes.
[0016] In a possible implementation manner, the fastener mounting holes are symmetrically arranged.
[0017] In a possible implementation manner, the angle between the plane where the first baffle plate is located and the plane where the upper top plate is located is 15°-75°, and the angle between the plane where the second baffle plate is located and the plane where the upper top plate is located is 15°-75°.
[0018] In a possible implementation manner, at least one partition is further included, and the partition is accommodated in the flow guide frame.
[0019] On the other hand, the present application also provides a thermal management system, comprising the flow guiding device of any one of the above embodiments.
[0020] The present application provides a flow guide device, which has at least the following beneficial effects:
[0021] The present application discloses a flow guide device, which is applied to a thermal management system and is arranged between an air outlet device and an air outlet of the thermal management system, and includes: a flow guide frame, which is connected to the thermal management system and is used to accommodate the air outlet device; a side guard mechanism, which is connected to the flow guide frame and is arranged on a side close to the air outlet; and a sealing mechanism, which is arranged between the side guard mechanism and the air outlet and is used to fit with the side guard mechanism. By arranging the flow guide frame between the air outlet device and the air outlet, the phenomenon of hot air backflow is reduced, the heat dissipation efficiency of the thermal management system is improved, and the normal operation of the thermal management system is ensured. The sealing mechanism effectively prevents air from leaking between the side guard mechanism and the air outlet, and ensures the stability and reliability of the thermal management system. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0023] Figure 1 A schematic structural diagram of a flow guiding device provided in an embodiment of the present application;
[0024] Figure 2 An exploded view of a flow guide device provided in an embodiment of the present application;
[0025] Figure 3 A schematic diagram of the structure of a thermal management system provided in an embodiment of the present application;
[0026] Figure 4 A schematic diagram of the operation of a flow guide device provided in an embodiment of the present application.
[0027] Among them, the reference numerals in the figure correspond to:
[0028] 1. air guide device; 10. air guide frame; 101. upper top plate; 102. first side plate; 103. second side plate; 104. lower bottom plate; 105. notch; 11. side retaining mechanism; 12. sealing mechanism; 2. air outlet device; 3. thermal management unit; 4. air outlet. DETAILED DESCRIPTION
[0029] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.
[0031] The following describes the embodiments with reference to the accompanying drawings, which do not limit the application contents described in the claims.
[0032] This specification provides method operation steps such as embodiments or flow charts, but more or fewer operation steps may be included based on routine or non-creative work. The order of steps listed in the embodiments is only one way of executing the steps among many orders, and does not represent the only order of execution.
[0033] Please refer to Figure 1-4 The embodiment of the present application provides a flow guide device 1, which is applied to a thermal management system and is arranged between an air outlet device 2 and an air outlet 4 of the thermal management system, and includes: a flow guide frame 10, which is connected to the thermal management system and is used to accommodate the air outlet device 2; a side guard mechanism 11, which is connected to the flow guide frame 10 and is arranged on a side close to the air outlet 4; a sealing mechanism 12, which is arranged between the side guard mechanism 11 and the air outlet 4 and is used to fit with the side guard mechanism 11. By arranging the flow guide frame 10 between the air outlet device 2 and the air outlet 4, the phenomenon of hot air backflow is reduced, the heat dissipation efficiency of the thermal management system is improved, and the normal operation of the thermal management system is ensured. The sealing mechanism 12 effectively prevents air from leaking between the side guard mechanism 11 and the air outlet 4, and ensures the stability and reliability of the thermal management system.
[0034] Specifically, the thermal management system includes a thermal management unit 3, which is used for heat dissipation, cooling, temperature control and protection of key components inside the system, etc.
[0035] In one embodiment, the thickness of the edge retaining mechanism 11 is greater than or equal to the thickness of the flow guide frame 10 .
[0036] Specifically, the guide frame 10 is made of Q235B material, and the thickness of the guide frame 10 is 2 mm. The thickness of the retaining edge mechanism is 10 mm-20 mm.
[0037] In this embodiment, the thickness of the side retaining mechanism connected to the upper top plate is 10 mm, and the thickness of the remaining side retaining mechanisms is 20 mm.
[0038] Specifically, the thickness of the air guide frame can be modified adaptively according to other components of the thermal management system.
[0039] Optionally, the thermal management system can be set in a battery swap station, a charging station or other electrical equipment.
[0040] Optionally, the sealing mechanism 12 may be sealing cotton, or may be a sealing member such as an O-ring, a sealing ring, or a sealing gasket.
[0041] Specifically, the size and shape of the air guide frame 10 match the thermal management unit 3. The length and width of the air guide frame 10 are both greater than or equal to the outer diameter of the fan.
[0042] Specifically, the guide frame 10 is matched with the upper skin, left skin, right skin, and lower skin of the thermal management unit 3 one by one. The guide frame 10 and each skin of the thermal management unit 3 share fastener fixing holes, and the guide frame 10 is matched with the thermal management unit 3 without changing the original thermal management unit 3.
[0043] In another embodiment, the flow guide frame 10 is rectangular.
[0044] In this embodiment, the sealing mechanism 12 is bonded to the side retaining mechanism 11, and the other side of the sealing mechanism 12 is in contact with the air outlet plate, that is, no adhesive is provided on the side of the sealing mechanism 12 in contact with the air outlet plate, thereby facilitating the removal and maintenance of the air outlet plate.
[0045] Specifically, the guide device 1 is arranged between the air outlet device 2 and the air outlet 4, thereby forming a guide channel, and the air outlet and air inlet of the air outlet device 2 are both carried out along this guide channel.
[0046] Specifically, a multi-hole air outlet plate is provided at the air outlet 4, and the area of the multi-hole air outlet plate is greater than or equal to the projection of the air outlet device 2 along the air outlet direction on the multi-hole air outlet plate.
[0047] Furthermore, when the sealing mechanism 12 is not connected to the side retaining mechanism 11, the thickness of the sealing mechanism 12 is greater than or equal to the relative distance between the side retaining mechanism 11 and the air outlet 4. In this way, the interference design of the sealing mechanism 12 can ensure that there is sufficient contact area between the sealing mechanism 12 and the side retaining mechanism 11, thereby achieving a better sealing effect and effectively preventing air leakage.
[0048] Specifically, when the sealing mechanism 12 is connected to the side retaining mechanism 11 and the sealing mechanism 12 cooperates with the side retaining mechanism 11 and the air outlet 4 , the sealing mechanism 12 can fit with the side retaining mechanism 11 and can also fit with the contact surface of the air outlet 4 .
[0049] Specifically, the size and dimension of the sealing mechanism 12 match the rib mechanism 11 .
[0050] In one embodiment, the sealing mechanism 12 is detachably connected to the edge retaining mechanism 11 , and the two are connected by installing fasteners.
[0051] Specifically, the contact area between the sealing mechanism 12 and the side retaining mechanism 11 is equal to the thickness of the side retaining mechanism 11 .
[0052] Specifically, the retaining edge mechanism 11 is integrally formed with the guide frame 10. In this way, the stability of the guide device 1 is effectively improved, air leakage or equipment damage caused by loose or deformed interfaces between the retaining edge mechanism 11 and the guide frame 10 is avoided, and the assembly steps required during the installation process are reduced, thereby improving the installation efficiency and reducing the installation cost.
[0053] In one embodiment, the retaining edge mechanism 11 and the guide frame 10 are made of the same material.
[0054] In another embodiment, the edge retaining mechanism 11 is connected to the flow guide frame 10 by welding.
[0055] Specifically, the air guide frame 10 includes a first side plate 102, a second side plate 103 and an upper plate 101. The first side plate 102, the upper plate 101 and the second side plate 103 are connected in sequence. The first side plate 102 includes a first baffle, which is connected to the upper plate 101 of the air guide frame 10, and the first baffle is set at an angle to the upper plate 101; the second side plate 103 includes a second baffle, which is connected to the upper plate 101 of the air guide frame 10, and the second baffle is set at an angle to the upper plate 101. The design of the first side plate 102 and the second side plate 103 can guide the air flow along a specific path, improve the air flow efficiency, and help to dissipate heat and cool down more effectively. The first baffle and the second baffle are set at an angle to the upper plate 101, which can change the direction and speed of the air flow, optimize the heat dissipation effect, and prevent interference with other components of the thermal management system.
[0056] In this embodiment, the guide frame 10 also includes a lower bottom plate 104, the upper top plate 101 and the lower bottom plate 104 are arranged in parallel, the first baffle plate and the second baffle plate are arranged symmetrically, and if the first baffle plate and the second baffle plate are connected and corresponding connecting plates are arranged, the upper top plate 101, the first baffle plate, the second baffle plate and the connecting plate form a trapezoidal shape.
[0057] Specifically, the guide frame 10 is polygonal, and the length of the upper top plate 101 of the guide frame 10 along the air outlet direction is greater than or equal to the length of other plates along the air outlet direction, so that the upper top plate 101 of the guide frame 10 is exposed to the user's field of vision.
[0058] Optionally, the first side plate 102 and the second side plate 103 may be in a straight line shape or in a folded line shape.
[0059] Furthermore, a notch 105 is provided on one side of the guide frame 10 near the air outlet 4. The notch 105 can accommodate other elements or components of the thermal management system, effectively utilizing the space, making the layout of the thermal management system more compact and efficient, and the notch 105 can also reduce the turbulence and noise generated when the airflow passes through the guide frame 10, thereby reducing the noise level when the device is running and improving the user experience.
[0060] In this embodiment, the notch 105 is provided on the first side plate 102, the second side plate 103 and the lower bottom plate 104 near the air outlet 4. The notch 105 provided on the first side plate 102 and the notch 105 provided on the second side plate 103 have the same size and shape.
[0061] Specifically, the notch 105 is an arc-shaped notch 105, and the arc-shaped notch 105 can cooperate with the components of the power exchange cabinet in the thermal management system.
[0062] In one embodiment, the arc-shaped notch 105 is used to cooperate with the cross beams and longitudinal beams of the power exchange cabinet in the thermal management system to avoid interference between the guide frame 10 and the thermal management system.
[0063] Specifically, the guide frame 10 is provided with at least two fastener mounting holes, so that the connection between the guide frame 10 and the thermal management system or other components can be ensured to be more firmly and stably, and the guide frame 10 can be prevented from shaking or loosening, so that the guide frame 10 can work better with other components, thereby improving the performance and efficiency of the overall system.
[0064] In this embodiment, the upper top plate 101, the first side plate 102, the second side plate 103 and the lower bottom plate 104 of the guide frame 10 are all provided with fastener mounting holes, and the fastener mounting holes of the upper top plate 101 share the fastener mounting holes with the upper skin of the thermal management unit 3, that is, the fastener mounting holes of the guide frame 10 are opened according to the model size of the thermal management unit 3.
[0065] Furthermore, the fastener mounting holes are symmetrically arranged. By symmetrically arranging the fastener mounting holes, it is possible to ensure that the connection force is evenly distributed at each connection point, avoiding stability problems caused by uneven connection points. The symmetrically arranged fastener mounting holes can adapt to equipment or structures of different sizes and shapes, thereby improving the versatility and applicability of the guide frame 10.
[0066] In this embodiment, the lower base plate 104 is provided with a plurality of fastener mounting holes, and the plurality of fastener mounting holes arranged on the lower base plate 104 are symmetrically arranged about the central axis of the lower base plate 104 , and the fastener fixing holes of the lower base plate 104 are used to cooperate with other opponent components.
[0067] Specifically, the angle between the plane where the first baffle is located and the plane where the upper top plate 101 is located is 15°-75°, and the angle between the plane where the second baffle is located and the plane where the upper top plate 101 is located is 15°-75°. By setting the angle between each baffle and the top plate, the flow direction and speed of air in the guide frame 10 can be effectively controlled, thereby optimizing the air flow path and improving the thermal management efficiency of the thermal management system. The wide range of angles can adapt to the needs and space constraints of different systems, provide greater flexibility and applicability, and make the guide frame 10 suitable for a variety of different environments and application scenarios.
[0068] In one embodiment, the angle between the plane where the first baffle plate is located and the plane where the upper top plate 101 is located is 30°-60°, and the angle between the plane where the second baffle plate is located and the plane where the upper top plate 101 is located is 30°-60°.
[0069] In another embodiment, the angle between the plane where the first baffle plate is located and the plane where the upper top plate 101 is located is 45°, and the angle between the plane where the second baffle plate is located and the plane where the upper top plate 101 is located is 45°.
[0070] Specifically, a side of the first baffle and the second baffle close to the air outlet device 2 has an escape area, and the escape area is used to install other components.
[0071] In this embodiment, the avoidance area is used to install the lifting ring of the thermal management unit 3, and the rope, chain or other lifting equipment can cooperate with the lifting ring to change the position of the thermal management unit 3.
[0072] Specifically, the first side plate 102 further includes a third baffle, the second side plate 103 further includes a fourth baffle, the upper top plate 101, the first baffle, the third baffle, the lower bottom plate 104, the fourth baffle, and the second baffle are connected in sequence.
[0073] In one embodiment, the third baffle and the fourth baffle are arranged in parallel.
[0074] Furthermore, at least one partition is included, and the partition is accommodated in the air guide frame 10. The partition can effectively divide the internal space of the air guide frame 10 into different areas, which helps to organize and manage the air flow path, avoid confusion and cross interference when the air outlet device 2 discharges air, and improve the heat dissipation efficiency of the system. The setting of the partition provides greater flexibility and applicability, making the air guide frame 10 suitable for different environments and application scenarios.
[0075] Specifically, the air outlet device 2 includes a plurality of fans, and a partition is disposed between the upper top plate 101 and the lower bottom plate 104 . The partition is used to separate the fans to form a plurality of guide channels.
[0076] In this embodiment, the air outlet device 2 is provided with three fans, and partitions are correspondingly provided between the fans, that is, the number of partitions = the number of fans - 1.
[0077] Preferably, the partition plate and the flow guide frame 10 are made of the same material, and the partition plate and the flow guide frame 10 are integrally formed.
[0078] A thermal management system comprises the flow guiding device 1 of any one of the above embodiments. The thermal management system has a better heat dissipation effect and optimizes the performance of the overall thermal management system.
[0079] The following describes the assembly process of the flow guide device 1 in the embodiment of the present application in combination with a specific application scenario, which is as follows:
[0080] First, place the air guide frame 10 at the air outlet device 2 of the thermal management system to ensure that it is firmly connected to the thermal management system. According to the design of the air guide frame 10, use screws or other fixing devices to fix it to the thermal management system;
[0081] Then, install the sealing mechanism 12 between the side retaining mechanism 11 and the air outlet 4, and ensure that the sealing mechanism 12 and the side retaining mechanism 11 are tightly fitted;
[0082] Finally, check the assembly of the entire air guide device 1 to ensure that each component is installed correctly and firmly. Turn on the power of the thermal management system and perform a test to confirm that the air guide device 1 works normally and effectively guides the hot air to the air outlet 4.
[0083] Through the above steps, the user can complete the assembly process of the flow guide device 1, improve the efficiency and performance of the thermal management system, and ensure the normal operation of the system and effective heat discharge.
[0084] The following introduces specific embodiments of the present application based on the above technical solution.
[0085] Example 1
[0086] Please refer to Figure 1-4 The embodiment of the present application provides a flow guide device 1, which is applied to a thermal management system and is arranged between an air outlet device 2 and an air outlet 4 of the thermal management system, and includes: a flow guide frame 10, which is connected to the thermal management system and is used to accommodate the air outlet device 2; a side guard mechanism 11, which is connected to the flow guide frame 10 and is arranged on a side close to the air outlet 4; a sealing mechanism 12, which is arranged between the side guard mechanism 11 and the air outlet 4 and is used to fit with the side guard mechanism 11. The thermal management system includes a thermal management unit 3, which is used for heat dissipation, cooling, temperature control and protection of key components inside the system, etc.
[0087] The guide device 1 is arranged between the air outlet device 2 and the air outlet 4, thereby forming a guide channel, and the air outlet and air inlet of the air outlet device 2 are both carried out along this guide channel.
[0088] The guide frame 10 is provided with at least two fastener mounting holes. The upper top plate 101, the first side plate 102, the second side plate 103 and the lower bottom plate 104 of the guide frame 10 are all provided with fastener mounting holes, and the fastener mounting holes of the upper top plate 101 share the fastener mounting holes with the upper skin of the thermal management unit 3, that is, the fastener mounting holes of the guide frame 10 are opened according to the model size of the thermal management unit 3, etc.
[0089] The retaining edge mechanism 11 is integrally formed with the guide frame 10. The thickness of the retaining edge mechanism 11 is greater than or equal to the thickness of the guide frame 10. The guide frame 10 is made of Q235B material, the thickness of the guide frame 10 is 2mm, the thickness of the retaining edge mechanism close to the upper skin of the thermal management unit is 10mm, and the thickness of the remaining retaining edge mechanisms is 20mm. The size and shape of the guide frame 10 match the thermal management unit 3. The length and width of the guide frame 10 are both greater than or equal to the outer diameter of the fan. The guide frame 10 matches the upper skin, left skin, right skin, and lower skin of the thermal management unit 3 one by one.
[0090] The sealing mechanism 12 is bonded to the side retaining mechanism 11, and the other side of the sealing mechanism 12 is in contact with the air outlet plate, that is, no adhesive is provided on the side of the sealing mechanism 12 in contact with the air outlet plate, thereby facilitating the removal and maintenance of the air outlet plate.
[0091] When the sealing mechanism 12 is not connected to the side guard mechanism 11, the thickness of the sealing mechanism 12 is greater than or equal to the relative distance between the side guard mechanism 11 and the air outlet 4. When the sealing mechanism 12 is connected to the side guard mechanism 11 and the sealing mechanism 12 cooperates with the side guard mechanism 11 and the air outlet 4, the sealing mechanism 12 can fit with the side guard mechanism 11 and can also fit with the contact surface of the air outlet 4. The size and dimension of the sealing mechanism 12 cooperate with the side guard mechanism 11.
[0092] The guide frame 10 includes a first side plate 102, a second side plate 103 and an upper plate 101. The first side plate 102, the upper plate 101 and the second side plate 103 are connected in sequence. The first side plate 102 includes a first baffle, which is connected to the upper plate 101 of the guide frame 10, and the first baffle is set at an angle to the upper plate 101; the second side plate 103 includes a second baffle, which is connected to the upper plate 101 of the guide frame 10, and the second baffle is set at an angle to the upper plate 101. The guide frame 10 also includes a lower bottom plate 104. The upper plate 101 and the lower bottom plate 104 are arranged in parallel, the first baffle and the second baffle are arranged symmetrically, and the first side plate 102 and the second side plate 103 are in a broken line shape. The angle between the plane where the first baffle is located and the plane where the upper plate 101 is located is 45°, and the angle between the plane where the second baffle is located and the plane where the upper plate 101 is located is 45°. The first side plate 102 further includes a third baffle plate, the second side plate 103 further includes a fourth baffle plate, the upper top plate 101, the first baffle plate, the third baffle plate, the lower bottom plate 104, the fourth baffle plate, and the second baffle plate are connected in sequence.
[0093] A notch 105 is provided on one side of the guide frame 10 near the air outlet 4. The notch 105 is provided on the first side plate 102, the second side plate 103 and the lower bottom plate 104 near the air outlet 4. The arc-shaped notch 105 is used to cooperate with the cross beam and longitudinal beam of the power exchange cabinet in the thermal management system to avoid interference between the guide frame 10 and the thermal management system.
[0094] The lower base plate 104 is provided with a plurality of fastener mounting holes, and the plurality of fastener mounting holes arranged on the lower base plate 104 are symmetrically arranged about the central axis of the lower base plate 104 , and the fastener fixing holes of the lower base plate 104 are used to cooperate with other opponent components.
[0095] The first baffle and the second baffle have a clearance area on one side close to the air outlet device 2, and the clearance area is used to install other components. The clearance area is used to install the lifting ring of the thermal management unit 3, and the rope, chain or other lifting equipment can cooperate with the lifting ring to change the position of the thermal management unit 3.
[0096] Example 2
[0097] The difference between Example 2 and Example 1 is that a partition is further provided, and the air guide frame 10 further includes at least one partition, which is accommodated in the air guide frame 10. The partition can effectively divide the internal space of the air guide frame 10 into different areas, which helps to organize and manage the air flow path, avoid confusion and cross interference when the air outlet device 2 discharges air, and improve the heat dissipation efficiency of the system.
[0098] The air outlet device 2 includes a plurality of fans, and a partition is arranged between the upper top plate 101 and the lower bottom plate 104. The partition is used to separate the fans to form a plurality of guide channels. The air outlet device 2 is provided with three fans, and the partition is correspondingly arranged between the fans, that is, the number of partitions = the number of fans - 1.
[0099] The partition plate and the guide frame 10 are made of the same material, and the partition plate and the guide frame 10 are integrally formed.
[0100] Example 3
[0101] Embodiment 3 provides a thermal management system, including the flow guiding device of any one of the above embodiments. The thermal management system has a better heat dissipation effect, and the performance of the overall thermal management system is higher than that of the existing thermal management system.
[0102] The various embodiments in the present application are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.
[0103] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A flow guide device, applied to a thermal management system, arranged between an air outlet device (2) and an air outlet (4) of the thermal management system, characterized in that: include: a flow guiding frame (10), the flow guiding frame (10) being connected to the thermal management system, the flow guiding frame (10) being used to accommodate the air outlet device (2), a side retaining mechanism (11), the side retaining mechanism (11) being connected to the air guide frame (10), the side retaining mechanism (11) being arranged on a side close to the air outlet (4), A sealing mechanism (12), wherein the sealing mechanism (12) is arranged between the side retaining mechanism (11) and the air outlet (4), and the sealing mechanism (12) is used to fit with the side retaining mechanism (11).
2. The flow guiding device according to claim 1, characterized in that: When the sealing mechanism (12) is not connected to the side retaining mechanism (11), the thickness of the sealing mechanism (12) is greater than or equal to the relative distance between the side retaining mechanism (11) and the air outlet (4).
3. The flow guiding device according to claim 1, characterized in that: The side retaining mechanism (11) and the flow guide frame (10) are integrally formed.
4. The flow guiding device according to any one of claims 1 to 3, characterized in that: The flow guide frame (10) comprises a first side plate (102), a second side plate (103) and an upper top plate (101), wherein the first side plate (102), the upper top plate (101) and the second side plate (103) are connected in sequence. The first side plate (102) comprises a first baffle plate, the first baffle plate is connected to the upper top plate (101) of the flow guide frame (10), and the first baffle plate and the upper top plate (101) are arranged at an angle; The second side plate (103) comprises a second baffle plate, the second baffle plate is connected to the upper top plate (101) of the flow guide frame (10), and the second baffle plate and the upper top plate (101) are arranged at an angle.
5. The flow guiding device according to any one of claims 1 to 3, characterized in that: A notch (105) is provided on one side of the flow guide frame (10) close to the air outlet (4).
6. The flow guiding device according to any one of claims 1 to 3, characterized in that: The flow guide frame (10) is provided with at least two fastener installation holes.
7. The flow guiding device according to claim 6, characterized in that: The fastener mounting holes are symmetrically arranged.
8. The flow guiding device according to claim 4, characterized in that: The angle between the plane where the first baffle plate is located and the plane where the upper top plate (101) is located is 15°-75°, and the angle between the plane where the second baffle plate is located and the plane where the upper top plate (101) is located is 15°-75°.
9. The flow guiding device according to any one of claims 1 to 3, characterized in that: It also comprises at least one partition, which is accommodated in the flow guide frame (10).
10. A thermal management system, comprising the flow guiding device according to any one of claims 1 to 9.