Centering disk, sounding monomer and electronic equipment

Abstract

The utility model relates to the technical field of electroacoustic conversion, and provides a centring disk, a sounding monomer and an electronic device, the centring disk comprises a conductive layer, a first surface layer and a second surface layer, the first surface layer and the second surface layer are arranged on two opposite sides of the conductive layer, the first surface layer is provided with a first hollow part opposite to one surface of the conductive layer, and the second surface layer is provided with a second hollow part opposite to the other surface of the conductive layer. The first surface layer is provided with a first hollow part opposite to one surface of the conductive layer, part of the conductive layer is exposed through the first hollow part to form a first bonding pad part, the second surface layer is provided with a second hollow part opposite to the other surface of the conductive layer, and part of the conductive layer is exposed through the second hollow part to form a second bonding pad part. According to the utility model, the conduction of the bonding pads on the front and back surfaces is realized through the single conductive layer, the cost is effectively reduced, the market competitiveness of the product is improved, meanwhile, the circuit break risk caused by the failure of the via hole is eliminated, and the conductive stability of the centering disk is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroacoustic conversion, in particular to a centering support piece, a sound-generating unit and an electronic device. Background Art

[0002] Since the lead pads connected to the voice coil lead and the external pads connected to the external circuit are respectively arranged on the front and back sides of the centering support, the centering support usually adopts a double-sided board, that is, two conductive layers are provided on the centering support to achieve conductive connectivity.

[0003] However, since the double-sided board arranged on the centering support plate requires the upper and lower conductive layers to be conductively connected through copper plating of the through holes, there is a risk of conduction failure during use of the copper plating of the through holes, thereby affecting the conductive stability of the centering support plate; at the same time, the cost of arranging conductive layers on both sides of the centering support plate is high, thereby increasing the production cost of the product. Utility Model Content

[0004] In order to overcome the defects of the prior art pointed out above, the utility model provides a centering support plate, a sound unit and an electronic device, which realizes the conduction of the front and back pads through a single conductive layer, effectively reduces the cost and improves the market competitiveness of the product. At the same time, it eliminates the risk of short circuit caused by failure of the conductive hole and improves the conductive stability of the centering support plate.

[0005] In order to solve the above technical problems, the technical solution of the utility model is:

[0006] According to the embodiment of the utility model, the centering support plate includes a conductive layer and a first surface layer and a second surface layer arranged on opposite sides of the conductive layer, wherein the first surface layer is provided with a first hollow portion opposite to one surface of the conductive layer, and part of the conductive layer is exposed through the first hollow portion to form a first pad portion, and the second surface layer is provided with a second hollow portion opposite to the other surface of the conductive layer, and part of the conductive layer is exposed through the second hollow portion to form a second pad portion.

[0007] According to some embodiments of the present invention, the first surface layer and the second surface layer are made of the same composition material;

[0008] And / or, at least one of the first surface layer and the second surface layer is a PI material layer.

[0009] According to some embodiments of the present invention, the conductive layer and the first surface layer are formed as an integrally formed part, and the first surface layer is formed with the first hollow portion by laser windowing.

[0010] According to some embodiments of the present invention, the centering support plate further includes an adhesive layer, and the adhesive layer is provided between the conductive layer and the second surface layer to connect the conductive layer and the second surface layer.

[0011] In some embodiments of the present invention, the second hollow portion is obtained by partially removing material from the second surface layer.

[0012] According to some embodiments of the present invention, the conductive layer includes two oppositely disposed sub-conductive layers, and the first pad portion and the second pad portion are respectively disposed on two opposite side surfaces of each of the sub-conductive layers.

[0013] According to some embodiments of the present invention, the conductive layer is a rolled copper foil layer.

[0014] The utility model also provides a sound-generating unit, which includes a centering support piece according to the above embodiment of the utility model.

[0015] According to some embodiments of the present utility model, the sound-emitting unit includes:

[0016] A shell and a voice coil, wherein the shell is provided with an external solder pad, the voice coil is provided with a lead portion, and both ends of the centering support are respectively connected to the voice coil and the shell, wherein one of the first solder pad portion and the second solder pad portion is electrically connected to the external solder pad, and the other of the first solder pad portion and the second solder pad portion is electrically connected to the lead portion.

[0017] The utility model also provides an electronic device, which comprises a sound-emitting unit according to the above embodiment of the utility model.

[0018] After adopting the above technical solution, the beneficial effects of the utility model are:

[0019] According to the centering support plate of the utility model embodiment, it includes a conductive layer and a first surface layer and a second surface layer arranged on opposite sides of the conductive layer, the first surface layer is provided with a first hollow portion opposite to one of the surfaces of the conductive layer, and part of the conductive layer is exposed through the first hollow portion to form a first pad portion, and the second surface layer is provided with a second hollow portion opposite to the other surface of the conductive layer, and part of the conductive layer is exposed through the second hollow portion to form a second pad portion. By arranging the first surface layer and the second surface layer and the first hollow portion and the second hollow portion, both sides of the conductive layer can be exposed through the corresponding hollow portions, and the first pad portion and the second pad portion are formed respectively. As a result, conduction of the pads on both sides is achieved through a single-layer conductive layer structure, eliminating the traditional copper-plated conduction between the two conductive layers on both sides through the conduction hole, which has the risk of conduction failure and circuit breaking during use. At the same time, through the single-layer conductive layer structure, at least one side of the conductive layer is saved, which effectively reduces the cost and improves the market competitiveness of the product.

[0020] In summary, the utility model provides a centering support plate, a sound-emitting unit and an electronic device, which realize the conduction of the front and back pads through a single conductive layer, effectively reducing the cost and improving the market competitiveness of the product. At the same time, it eliminates the risk of short circuit caused by failure of the conductive hole and improves the conductive stability of the centering support plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without creative work. In addition, in the drawings, the components or parts are not necessarily drawn according to the actual scale.

[0022] Figure 1 It is a front structural schematic diagram of a centering support piece according to an embodiment of the utility model;

[0023] Figure 2 It is a schematic diagram of the reverse structure of a centering support sheet according to an embodiment of the utility model;

[0024] Figure 3 It is a schematic diagram of the explosion structure of a centering support piece according to an embodiment of the utility model;

[0025] Figure 4 It is a schematic diagram of the front structure of a sound-emitting unit according to an embodiment of the utility model;

[0026] Figure 5 It is a schematic diagram of the reverse structure of a sound-emitting unit according to an embodiment of the utility model;

[0027] Figure 6 A schematic diagram of the connection structure between a voice coil and a centering support according to an embodiment of the utility model;

[0028] Reference numerals:

[0029] 1. Conductive layer, 101. Sub-conductive layer, 2. First surface layer, 3. Second surface layer, 4. First hollow portion, 5. First pad portion, 6. Second hollow portion, 7. Second pad portion, 8. Adhesive layer, 9. Shell, 10. Voice coil, 11. External pad, 12. Lead portion, 100. Centering support plate, 200. Sounding unit. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0032] At the same time, the meaning of "and / or" or "and / or" appearing in the full text includes three options. Taking "A and / or B" as an example, it includes option A, or option B, or a option in which both A and B are satisfied.

[0033] In addition, in the present utility model, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0034] like Figure 1-Figure 3 As shown, according to the embodiment of the utility model, the centering support plate 100 includes a conductive layer 1 and a first surface layer 2 and a second surface layer 3 arranged on opposite sides of the conductive layer 1. In this embodiment, the first surface layer 2 and the second surface layer 3 can be pressed together with the conductive layer 1 to form the centering support plate 100, wherein the first surface layer 2 is provided with a first hollow portion 4 opposite to one surface of the conductive layer 1, and a part of the conductive layer 1 is exposed through the first hollow portion 4 to form a first pad portion 5, and the second surface layer 3 is provided with a second hollow portion 6 opposite to the other surface of the conductive layer 1, and a part of the conductive layer 1 is exposed through the second hollow portion 6 to form a second pad portion 7.

[0035] Specifically, the first surface layer 2 is provided with a first hollow portion 4 opposite to one of the surfaces of the conductive layer 1, and part of the conductive layer 1 is exposed through the first hollow portion 4 to form a first pad portion 5. The second surface layer 3 is provided with a second hollow portion 6 opposite to the other surface of the conductive layer 1, and part of the conductive layer 1 is exposed through the second hollow portion 6 to form a second pad portion 7. Optionally, the first hollow portion 4 can be arranged near the middle position of one side of the conductive layer 1, and the second hollow portion 6 can be arranged near the edge position of the other side of the conductive layer 1. By arranging the first surface layer 2 and the second surface layer 3 as well as the first hollow portion 4 and the second hollow portion 6, both sides of the conductive layer 1 can be exposed through the corresponding hollow portions, and the first pad portion 5 and the second pad portion 7 are formed respectively. Thus, the conduction of the pads on both sides is realized through the single-layer conductive layer 1 structure, eliminating the traditional conduction between the two-sided conductive layers 1 through copper plating through the conductive hole, which has the risk of conduction failure and circuit breaking during use. At the same time, through the single-layer conductive layer 1 structure, at least one side of the conductive layer 1 is saved, which effectively reduces the cost and improves the market competitiveness of the product. Figure 1-Figure 3 As shown, in some embodiments of the present invention, the first surface layer 2 and the second surface layer 3 are made of the same component material. By using the same component material, they can be purchased in a unified manner, thereby reducing material costs.

[0036] And / or, at least one of the first surface layer 2 and the second surface layer 3 is a PI material layer, that is, the first surface layer 2 can be set as a PI material layer, the second surface layer 3 can be set as a PI material layer, and the first surface layer 2 and the second surface layer 3 can also be set as PI material layers at the same time. Among them, the PI material is a polyimide material, which is one of the organic polymer materials with the best comprehensive performance, with a high temperature resistance of more than 400°C, a long-term use temperature range of -200 to 300°C, no obvious melting point, high insulation performance, a dielectric constant of 4.0 at 103 Hz, and a dielectric loss of only 0.004 to 0.007. It belongs to F to H grade insulation material, which can ensure the performance of the product.

[0037] like Figure 1-Figure 3 As shown, in some embodiments of the utility model, the conductive layer 1 and the first surface layer 2 are formed as an integrally formed part, and the first surface layer 2 is formed into a first hollow portion 4 by laser windowing. Specifically, the conductive layer 1 and the first surface layer 2 are combined together through a lamination process to form an integrally formed part, and the first hollow portion 4 is formed by laser windowing on the first surface layer 2. The laser windowing ensures the processing accuracy and the processing quality of the first hollow portion 4, and the laser windowing is convenient, fast and has high processing efficiency.

[0038] like Figure 3As shown, in some embodiments of the utility model, the centering support plate 100 also includes an adhesive layer 8, which is arranged between the conductive layer 1 and the second surface layer 3 to connect the conductive layer 1 and the second surface layer 3. The adhesive layer 8 ensures the connection strength between the conductive layer 1 and the second surface layer 3, thereby ensuring the structural performance of the centering support plate 100 pressed together.

[0039] In a specific embodiment of the present invention, the centering support plate 100 may include three separate parts, namely, an integral part formed by pressing the conductive layer 1 and the first surface layer 2, an adhesive layer 8 and a second surface layer 3, wherein the first surface layer 2 and the second surface layer 3 are both PI material layers. When the centering support plate 100 is assembled, the adhesive layer 8 can be firstly bonded to the side of the conductive layer 1 away from the first surface layer 2, and then the second surface layer 3 can be adhered to the surface of the adhesive layer 8, thereby the second surface layer 3 can be bonded to the side of the conductive layer 1 away from the first surface layer 2.

[0040] like Figure 1-Figure 3 As shown, in the embodiment of the utility model, part of the second surface layer 3 is removed to obtain the second hollow portion 6. Specifically, by partially removing the material of the second surface layer 3, part of the structure of the conductive layer 1 can be exposed to form the second pad portion 7.

[0041] like Figure 3 As shown, in some embodiments of the present invention, the conductive layer 1 includes two sub-conductive layers 101 arranged opposite to each other, and a first pad portion 5 and a second pad portion 7 are respectively provided on two opposite sides of each sub-conductive layer 101. By setting two sub-conductive layers 101, the sub-conductive layers 101 are relatively separated, so that the external pad 11 and the lead portion 12 can be connected respectively without additional separation.

[0042] like Figure 1-Figure 3 As shown, in some embodiments of the present invention, the conductive layer 1 is a rolled copper foil layer, which has better structural strength and better conductivity, thereby improving the structural strength and conductive stability of the centering support 100. It should be noted that the specific material composition of the conductive layer 1 is not limited thereto, as long as it can meet the structural strength and conductive stability requirements of the centering support 100, the present invention does not impose any specific restrictions on this.

[0043] In a specific example of the present invention, the conductive layer 1 is a rolled copper foil layer, the first surface layer 2 and the second surface layer 3 are respectively PI materials, the first surface layer 2 is provided with a first hollow portion 4 opposite to one of the surfaces of the conductive layer 1, part of the rolled copper foil layer is exposed through the first hollow portion 4, and then the part of the rolled copper foil layer exposed through the first hollow portion 4 is tin-plated or gold-plated, thereby forming an exposed first soldering pad portion 5; similarly, the second surface layer 3 is provided with a second hollow portion 6 opposite to the other surface of the conductive layer 1, part of the rolled copper foil layer is exposed through the second hollow portion 6, and then the part of the rolled copper foil layer exposed through the second hollow portion 6 is tin-plated or gold-plated, thereby forming an exposed second soldering pad portion 7.

[0044] like Figure 1-Figure 6 As shown, a sound unit 200 includes a centering support plate 100. The specific structure of the centering support plate 100 refers to the aforementioned embodiment. Since the sound unit 200 adopts all the technical solutions of all the aforementioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the aforementioned embodiments, which will not be described one by one here.

[0045] It can be understood that the sound unit 200 can be applied to electronic devices, such as mobile phones, speakers, computers, headphones, watches, televisions or tablet computers, etc., without limitation herein.

[0046] In addition, the sound unit 200 can also be assembled with the housing into a sound module, and installed in an electronic device in the form of a sound module.

[0047] like Figure 4-Figure 6 As shown, in some embodiments of the present invention, the sound unit 200 includes: a shell 9 and a voice coil 10, the shell 9 is provided with an external solder pad 11, the voice coil 10 is provided with a lead portion 12, and both ends of the centering support plate 100 are connected to the voice coil 10 and the shell 9 respectively, wherein one of the first solder pad portion 5 and the second solder pad portion 7 is electrically connected to the external solder pad 11, and the other of the first solder pad portion 5 and the second solder pad portion 7 is electrically connected to the lead portion 12. Specifically, the first solder pad portion 5 can be electrically connected to the external solder pad 11, and the second solder pad portion 7 is electrically connected to the lead portion 12; it can also be that the first solder pad portion 5 is electrically connected to the lead portion 12, and the second solder pad portion 7 is electrically connected to the external solder pad 11. Both of these connection methods can achieve conduction between the external solder pad 11 and the lead portion 12. The specific connection method can be determined according to the specific design structure.

[0048] like Figure 4-Figure 5 As shown, an electronic device includes a sound unit 200. The specific structure of the sound unit 200 refers to the aforementioned embodiment. Since this electronic device adopts all the technical solutions of all the aforementioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the aforementioned embodiments, which will not be described one by one here.

[0049] It is understandable that the electronic device may be a mobile phone, a speaker, a computer, a headset, a watch, a television or a tablet computer, etc., and is not limited here.

[0050] It should be understood that the purpose of these embodiments is only to illustrate the utility model and is not intended to limit the protection scope of the utility model. In addition, it should also be understood that after reading the technical content of the utility model, those skilled in the art can make various changes, modifications and / or variations to the utility model, and all of these equivalent forms also fall within the protection scope defined by the claims attached to this application.

Claims

1. A centering support, characterized in that: It includes a conductive layer and a first surface layer and a second surface layer arranged on opposite sides of the conductive layer, wherein the first surface layer is provided with a first hollow portion opposite to one of the surfaces of the conductive layer, and part of the conductive layer is exposed through the first hollow portion to form a first pad portion, and the second surface layer is provided with a second hollow portion opposite to the other surface of the conductive layer, and part of the conductive layer is exposed through the second hollow portion to form a second pad portion.

2. The centering support according to claim 1, characterized in that: The first surface layer and the second surface layer are made of the same composition material; And / or, at least one of the first surface layer and the second surface layer is a PI material layer.

3. The centering support according to claim 1, characterized in that: The conductive layer and the first surface layer are formed as an integrally formed part, and the first surface layer is opened by laser to form the first hollow portion.

4. The centering support according to claim 1, characterized in that: The centering support further includes an adhesive layer, and the adhesive layer is arranged between the conductive layer and the second surface layer to connect the conductive layer and the second surface layer.

5. The centering support according to claim 4, characterized in that: The second hollow portion is obtained by partially removing material from the second surface layer.

6. The centering arm according to claim 1, characterized in that: The conductive layer includes two sub-conductive layers arranged opposite to each other, and the first pad portion and the second pad portion are respectively arranged on two opposite side surfaces of each sub-conductive layer.

7. The centering support according to any one of claims 1 to 6, characterized in that: The conductive layer is a rolled copper foil layer.

8. A sound-emitting unit, characterized in that: The invention comprises a centering spider according to any one of claims 1 to 7.

9. The sound-emitting unit according to claim 8, characterized in that: include: A shell and a voice coil, wherein the shell is provided with an external solder pad, the voice coil is provided with a lead portion, and both ends of the centering support are respectively connected to the voice coil and the shell, wherein one of the first solder pad portion and the second solder pad portion is electrically connected to the external solder pad, and the other of the first solder pad portion and the second solder pad portion is electrically connected to the lead portion.

10. An electronic device, characterized in that: Comprising the sound-emitting unit according to claim 8 or 9.

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