Dispensing device for semiconductor chip packaging

Abstract

The utility model discloses a dispensing device for packaging a semiconductor chip, which comprises a dispensing frame fixedly connected to the front end face and the rear end face of a conveying frame, a chip base is provided with glue grooves distributed in a circumferential array mode, the dispensing frame is rotationally connected with a rotating rod, a second hard glue pipe is arranged in the rotating rod, and a motor is in power connection with a driving gear. The motor can drive the driving gear to rotate, the upper end face of the fixing frame is fixedly connected with an infusion pump connected with the second hard glue pipe, and the fixing frame is fixedly connected with glue dispensers capable of being vertically aligned with the glue grooves, so that the glue dispensers can be driven by the motor to rotate to the positions above the glue grooves, and glue can be pumped into the glue dispensers through the infusion pump. And the motor can drive the driven gear to rotate so as to drive the glue dispenser to rotate, align different glue grooves up and down and perform glue dispensing operation on each glue groove, so that the bonding strength is improved, the distance between the glue dispenser and the bottom of the mounting groove is reduced, and looseness is avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chips, in particular to a glue dispensing device for semiconductor chip packaging. Background Art

[0002] When semiconductor chips are packaged, glue needs to be dispensed inside the base, and then the bottom of the chip is glued to the base and then capped. Traditional glue dispensing is to drip glue in the center of the mounting groove, resulting in a larger gap between the chip and the bottom of the mounting groove, which can easily cause the chip to loosen. By setting multiple glue grooves distributed in a circular array in the mounting groove, dripping a proper amount of glue into each glue groove, the bonding strength is improved, and the distance between the chip and the bottom of the mounting groove is reduced to avoid loosening. Utility Model Content

[0003] The purpose of the utility model is to provide a glue dispensing device for semiconductor chip packaging to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a dispensing device for semiconductor chip packaging, comprising a dispensing frame fixedly connected to the front and rear end surfaces of a conveying frame, the conveying frame is dynamically connected to a conveyor belt, a chip base is placed on the upper end surface of the conveyor belt, and the chip base is provided with glue grooves distributed in a circumferential array, the dispensing frame is rotatably connected to a rotating rod, the rotating rod is fixedly connected to a driven gear rotatably connected to the upper end surface of the dispensing frame, a second hard rubber tube is arranged in the rotating rod, the upper end surface of the dispensing frame is fixedly connected to a motor frame, the upper end surface of the motor frame is fixedly connected to a motor, the motor power is connected to a driving gear, the motor can drive the driving gear to rotate, the driving gear is meshed with the driven gear, the rotating rod is fixedly connected to a fixed frame, the upper end surface of the fixed frame is fixedly connected to a liquid pump connected to the second hard rubber tube, the fixed frame is fixedly connected to a dispensing device that can be aligned with each of the glue grooves up and down, and a third hard rubber tube is fixedly connected between the dispensing device and the liquid pump, so that the dispensing device can be driven by the motor to rotate above each of the glue grooves.

[0005] Advantageously, a connecting groove is provided on the upper side of the rotating rod, the top of the second hard rubber tube is located in the connecting groove, the upper end face of the dispensing frame is fixedly connected to a glue tank, the rear end face of the glue tank is fixedly connected to a first hard rubber tube, and the first hard rubber tube is sealingly and rotatably connected to the second hard rubber tube, so that the glue in the glue tank can be pumped into the dispensing device by the liquid pump to drip;

[0006] Advantageously, the chip base is provided with a plurality of pin slots for mounting pins;

[0007] Advantageously, a controller is fixedly connected to the upper end surface of the dispensing frame, and the controller controls the motor and the liquid pump to achieve automatic dispensing operation.

[0008] Compared with the prior art, the beneficial effects of the utility model are:

[0009] The utility model is provided with a glue dispenser, a glue groove and a rotating rod. The glue can be pumped into the glue dispenser by a liquid pump and then dripped into the glue groove. The motor can drive the driven gear to rotate, thereby driving the glue dispenser to rotate, aligning different glue grooves up and down, and performing glue dispensing operations on each glue groove, thereby improving the bonding strength and reducing the distance from the bottom of the installation groove to avoid loosening. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0011] Figure 2 for Figure 1 A top view of

[0012] Figure 3 for Figure 2 AA cross-sectional diagram of ;

[0013] Figure 4 for Figure 3 A partial enlarged schematic diagram of

[0014] Figure 5 for Figure 4 A partial enlarged schematic diagram of

[0015] Figure 6 It is a three-dimensional schematic cross-sectional view of the dispensing rack of the utility model;

[0016] Figure 7 It is a three-dimensional schematic diagram of the glue dispenser of the utility model.

[0017] In the figure: 100, conveying rack; 101, conveyor belt; 102, glue dispensing rack; 103, glue tank; 104, controller; 105, motor; 106, chip base; 107, glue groove; 108, glue; 109, first hard rubber tube; 110, motor rack; 111, driving gear; 112, driven gear; 113, rotating rod; 114, second hard rubber tube; 115, fixing rack; 116, liquid pump; 117, third hard rubber tube; 118, glue dispenser; 119, connecting groove; 120, pin groove. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail in combination with the embodiments below. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0019] Embodiment 1:

[0020] See also Figure 1-7 The utility model provides a technical solution: a glue dispensing device for semiconductor chip packaging, comprising a glue dispensing frame 102 fixedly connected to the front and rear end surfaces of a conveyor frame 100, the conveyor frame 100 is connected to a conveyor belt 101, a chip base 106 is placed on the upper end surface of the conveyor belt 101, and the chip base 106 is provided with glue grooves 107 distributed in a circumferential array, the glue dispensing frame 102 is rotatably connected to a rotating rod 113, the rotating rod 113 is fixedly connected to a driven gear 112 rotatably connected to the upper end surface of the glue dispensing frame 102, a second hard rubber tube 114 is arranged in the rotating rod 113, the upper end surface of the glue dispensing frame 102 is fixedly connected to a motor frame 110, and the upper end surface of the motor frame 110 is fixedly connected to The motor 105 is connected to a driving gear 111, and the motor 105 can drive the driving gear 111 to rotate. The driving gear 111 is meshed with the driven gear 112. The rotating rod 113 is fixedly connected to a fixing frame 115. The upper end surface of the fixing frame 115 is fixedly connected to a liquid pump 116 connected to the second hard rubber tube 114. The fixing frame 115 is fixedly connected to a glue dispenser 118 that can be aligned with each of the glue grooves 107 in the upper and lower directions. A third hard rubber tube 117 is fixedly connected between the glue dispenser 118 and the liquid pump 116, so that the glue dispenser 118 can be driven by the motor 105 to rotate above each of the glue grooves 107.

[0021] A connecting groove 119 is provided on the upper side of the rotating rod 113, and the top of the second hard rubber tube 114 is located in the connecting groove 119. The upper end surface of the dispensing frame 102 is fixedly connected with a glue tank 103, and the rear end surface of the glue tank 103 is fixedly connected with a first hard rubber tube 109. The first hard rubber tube 109 is sealed and rotatably connected with the second hard rubber tube 114, so that the glue 108 in the glue tank 103 can be pumped into the dispensing device 118 by the liquid pump 116 to drip;

[0022] The chip base 106 is provided with a plurality of pin slots 120 for mounting pins;

[0023] The upper end surface of the dispensing frame 102 is fixedly connected with a controller 104 , and the controller 104 controls the motor 105 and the liquid pump 116 to realize automatic dispensing operation.

[0024] Working principle:

[0025] The conveyor belt 101 drives the chip base 106 to continuously move to the bottom of the glue dispensing rack 102, and then the controller 104 starts the liquid pump 116, and the liquid pump 116 pumps the glue 108 in the glue tank 103 from the first hard rubber tube 109 to the second hard rubber tube 114, and then from the third hard rubber tube 117 into the glue dispenser 118, and drips into the glue tank 107 through the glue dispenser 118, completing the glue dispensing of a single glue tank 107;

[0026] Then start the motor 105, the motor 105 drives the driving gear 111 to rotate, the driving gear 111 drives the driven gear 112 to rotate, the driven gear 112 drives the rotating rod 113 and the second hard rubber tube 114 to rotate, and at the same time drives the fixing frame 115 and the glue dispenser 118 to rotate, so that the glue dispenser 118 is rotated to the top of the next glue groove 107, and then continues to move the liquid pump 116, and glue is dripped from the glue dispenser 118 into the glue groove 107 for glue dispensing, so that each glue groove 107 is glued, and the conveyor belt 101 is cooperated to move the chip base 106 down to the bottom of the glue dispensing frame 102 for cyclic glue dispensing, and glue is dispensed through multiple glue grooves 107 distributed in a circular array, which improves the bonding strength while reducing the distance between the bottom of the installation groove to avoid loosening.

[0027] It is obvious to those skilled in the art that various modifications and variations may be made to the disclosed embodiments. Other embodiments will be readily apparent to those skilled in the art in view of the specification and practice of the disclosed system. It is intended that the specification and examples be considered exemplary only, with the true scope of protection being determined by the appended claims and their equivalents.

Claims

1. A glue dispensing device for semiconductor chip packaging, comprising a glue dispensing frame (102) fixedly connected to the front and rear end surfaces of a conveying frame (100), characterized in that: The conveyor frame (100) is connected to a conveyor belt (101) by power, and a chip base (106) is placed on the upper end surface of the conveyor belt (101), and the chip base (106) is provided with glue grooves (107) distributed in a circumferential array. The dispensing frame (102) is rotatably connected to a rotating rod (113), and the rotating rod (113) is fixedly connected to a driven gear (112) rotatably connected to the upper end surface of the dispensing frame (102), and a second hard rubber tube (114) is provided in the rotating rod (113). The upper end surface of the dispensing frame (102) is fixedly connected to a motor frame (110), and the upper end surface of the motor frame (110) is fixedly connected to a motor (105). The motor (105) is connected to a driving gear (111) by power, and the motor (105) can drive the driving gear (111) to rotate, and the driving gear (111) is meshed with the driven gear (112). The rotating rod (113) is fixedly connected to a fixing frame (115), and the upper end surface of the fixing frame (115) is fixedly connected to a liquid pump (116) connected to the second hard rubber tube (114). The fixing frame (115) is fixedly connected to a glue dispenser (118) that can be aligned with each glue groove (107) in the upper and lower directions, and a third hard rubber tube (117) is fixedly connected between the glue dispenser (118) and the liquid pump (116).

2. A semiconductor chip packaging glue dispensing device according to claim 1, characterized in that: A connecting groove (119) is provided on the upper side of the rotating rod (113), the top of the second hard rubber tube (114) is located in the connecting groove (119), the upper end face of the dispensing frame (102) is fixedly connected to a glue tank (103), the rear end face of the glue tank (103) is fixedly connected to a first hard rubber tube (109), and the first hard rubber tube (109) and the second hard rubber tube (114) are sealed and rotatably connected.

3. A semiconductor chip packaging glue dispensing device according to claim 2, characterized in that: The chip base (106) is provided with a plurality of pin grooves (120) for installing pins.

4. A semiconductor chip packaging glue dispensing device according to claim 3, characterized in that: The upper end surface of the dispensing frame (102) is fixedly connected to a controller (104), and the controller (104) controls the motor (105) and the liquid pump (116).

Images