Monocrystalline silicon grinding machine for processing Schottky diode

Abstract

The utility model relates to the technical field of single crystal silicon grinding, in particular to a single crystal silicon grinding machine for processing a Schottky diode, which can automatically finish double-sided grinding of a single crystal silicon wafer by clamping the single crystal silicon wafer once when the single crystal silicon wafer is ground, reduces disassembly and assembly of the single crystal silicon wafer, improves working efficiency, and is convenient to use and high in practicability. Comprising a baseplate; the grinding device further comprises a lifting mechanism, a grinding mechanism, a moving mechanism, a rotating mechanism and a clamping mechanism, the grinding mechanism is installed on the bottom plate through the lifting mechanism, the grinding mechanism has a grinding function, the lifting mechanism is used for lifting the grinding mechanism, the rotating mechanism is installed on the bottom plate through the moving mechanism, and the rotating mechanism has a rotating function; and the moving mechanism is used for moving the rotating mechanism left and right, the clamping mechanism is installed on the rotating mechanism, the clamping mechanism is located below the grinding mechanism, and the clamping mechanism has the clamping and fixing functions.

Description

Technical Field

[0001] The utility model relates to the technical field of single crystal silicon grinding, in particular to a single crystal silicon grinding machine for processing Schottky diodes. Background Art

[0002] Schottky diode is a semiconductor device that converts AC power into DC power. It is widely used in electrical equipment. Monocrystalline silicon is an important component of Schottky diode. When producing and developing Schottky diode, the sliced ​​monocrystalline silicon must first be ground to remove the saw marks on the surface of the monocrystalline silicon so that it can be polished to a flatness that can be processed. Then the monocrystalline silicon can be processed in the next step. In the prior art, a utility model patent with patent application number 201921901765.7 discloses a grinding device for single crystal silicon slices, which is mainly composed of a grinding disc and a clamping mechanism, and the grinding disc is located above the clamping mechanism; when grinding the single crystal silicon wafer, the single crystal silicon wafer is first clamped and fixed by the clamping mechanism, and then the rotating disc is rotated, and the rotating grinding disc is lowered until the rotating grinding disc contacts the single crystal silicon wafer, and the rotating grinding disc grinds the upper surface of the single crystal silicon; the inventor believes that there are the following problems during use, because both the upper and lower surfaces of the single crystal silicon wafer need to be ground, after the upper surface of the single crystal silicon wafer is ground, the single crystal silicon wafer needs to be disassembled from the clamping mechanism, and then the unground side of the single crystal silicon wafer is flushed up and clamped and fixed, and then ground, the staff will waste a lot of time in the process of disassembling and assembling the single crystal silicon wafer, which is inconvenient to use and has poor practicality. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a single crystal silicon grinding machine for processing Schottky diodes, which can automatically complete the double-sided grinding of the single crystal silicon wafer by clamping the single crystal silicon wafer once during grinding, thereby reducing the disassembly and assembly of the single crystal silicon wafer, improving work efficiency, and being easy to use and highly practical.

[0004] The utility model discloses a single crystal silicon grinding machine for processing Schottky diodes, comprising a bottom plate; a lifting mechanism, a grinding mechanism, a moving mechanism, a rotating mechanism and a clamping mechanism, wherein the grinding mechanism is mounted on the bottom plate through the lifting mechanism, the grinding mechanism has a grinding function, the lifting mechanism is used to lift the grinding mechanism, the rotating mechanism is mounted on the bottom plate through the moving mechanism, the rotating mechanism has a rotating function, the moving mechanism is used to move the rotating mechanism left and right, the clamping mechanism is mounted on the rotating mechanism, the clamping mechanism is located below the grinding mechanism, and the clamping mechanism has a clamping and fixing function; when manufacturing Schottky diodes, when single crystal silicon raw material slices are subjected to grinding processing, the single crystal is firstly clamped by the clamping mechanism, and the grinding mechanism is clamped by the clamping mechanism. The silicon wafer is clamped and fixed, and then the grinding mechanism is lowered by the lifting mechanism until the grinding mechanism is lowered to contact the upper end surface of the single crystal silicon wafer, so that the grinding mechanism grinds the upper end of the single crystal silicon wafer, and then the clamping mechanism is turned upside down by 180 degrees through the rotating mechanism, thereby driving the single crystal silicon wafer to turn upside down, so that the unground side of the single crystal silicon wafer is rotated to the side close to the grinding mechanism, and then the unground side of the single crystal silicon wafer is ground by the grinding mechanism; when grinding the single crystal silicon wafer, the single crystal silicon wafer can be automatically ground on both sides by clamping the single crystal silicon wafer once, which reduces the disassembly and assembly of the single crystal silicon wafer, improves work efficiency, is easy to use, and has high practicality.

[0005] Preferably, the lifting mechanism includes a vertical plate, an electric slide rail A and a sliding plate A, the vertical plate is fixedly mounted on the upper end of the base plate, the electric slide rail A is fixedly mounted on the vertical plate, the sliding plate A is mounted on the electric slide rail A, the electric slide rail A is used to move the sliding plate A up and down, and the grinding mechanism is mounted on the sliding plate A; when grinding the single crystal silicon wafer, the electric slide rail A is turned on, and the electric slide rail A lowers the grinding mechanism through the sliding plate A until the grinding mechanism lowers to contact the upper end surface of the single crystal silicon wafer, so that the grinding mechanism grinds the end surface of the single crystal silicon wafer; since the height of the grinding mechanism can be adjusted, it can grind single crystal silicon wafers of different thicknesses, and it is easy to use, has low limitations, and is highly practical.

[0006] Preferably, the grinding mechanism includes a support plate, a drive motor, a rotating shaft and a grinding disc, the support plate is fixedly mounted on the sliding plate A, the drive motor is fixedly mounted on the upper end of the support plate, the rotating shaft is rotatably mounted on the support plate, the upper end of the rotating shaft is connected to the output end of the drive motor, and the grinding disc is fixedly mounted on the lower end of the rotating shaft; when grinding the single crystal silicon wafer, the drive motor is turned on, and the driving motor drives the grinding disc to rotate through the rotating shaft, and then the support plate drives the rotating shaft to descend through the sliding plate A, and the rotating shaft drives the rotating grinding disc to descend, until the rotating grinding disc descends to contact the upper end surface of the single crystal silicon wafer, so that the rotating grinding disc can grind the upper end surface of the single crystal silicon wafer; this facilitates the grinding of the single crystal silicon wafer.

[0007] Preferably, the clamping mechanism includes a fixed plate, a track, a support block, a servo motor, a lead screw, two sets of sliding blocks and two sets of clamping plates. The fixed plate is installed on the rotating mechanism, the track is fixedly installed on the right end of the fixed plate, the support block is fixedly installed on the fixed plate, the servo motor is fixedly installed on the support block, the lead screw is rotatably installed on the support block, the input end of the lead screw is connected to the output end of the servo motor, the front and rear parts of the lead screw are respectively provided with external threads with opposite rotation directions, the two sets of sliding blocks are respectively screwed with the front and rear parts of the lead screw, the two sets of sliding blocks are both slidably installed on the track, and the two sets of clamping plates They are fixedly installed on two sets of sliding blocks respectively; when clamping and fixing the single crystal silicon wafer, the staff holds the single crystal silicon wafer and places the single crystal silicon wafer between the two sets of clamping plates, and then turns on the servo motor, which drives the lead screw to rotate. The rotating lead screw passes through the two sets of sliding blocks to make the two sets of clamping plates approach each other until the two sets of clamping plates contact the front and back parts of the single crystal silicon wafer respectively, so that the two sets of clamping plates clamp and fix the single crystal silicon wafer; since the distance between the two sets of clamping plates can be adjusted, single crystal silicon wafers of different diameters can be clamped and fixed, which is easy to use, has low limitations and high practicality.

[0008] Preferably, the rotating mechanism includes a support block, a support frame, a stepper motor and a driving shaft, a fixed plate is fixedly mounted on the right end of the driving shaft, the driving shaft is rotatably mounted on the support frame, the input end of the driving shaft is connected to the stepper motor, and the stepper motor and the support frame are both fixedly mounted on the support block; when the upper end surface of the single crystal silicon wafer is ground, the stepper motor is turned on, and the stepper motor rotates the fixed plate one hundred and eighty degrees around the axis of the driving shaft through the driving shaft, and the fixed plate drives the two groups of sliding blocks to rotate the two groups of clamping plates through the track, thereby rotating the single crystal silicon wafer one hundred and eighty degrees, so that the unground side of the single crystal silicon wafer is rotated to the side close to the grinding mechanism; the rotation of the single crystal silicon wafer is convenient.

[0009] Preferably, the moving mechanism includes an electric slide rail B, a sliding plate and a bracket, the electric slide rail B is fixedly mounted on the base plate, the sliding plate is mounted on the electric slide rail B, the electric slide rail B is used to move the sliding plate left and right, and the support block is fixedly mounted on the sliding plate through the bracket; when grinding the single crystal silicon wafer, the sliding plate is moved left and right through the electric slide rail B, and the sliding plate drives the rotating mechanism to move the clamping mechanism left and right through the bracket, thereby moving the single crystal silicon wafer left and right, so that the grinding disc can evenly grind the left and right parts of the single crystal silicon wafer; convenience is improved.

[0010] Preferably, it also includes a water tank, a water pump and a nozzle. The water tank is fixedly installed on the upper end of the base plate, the water pump is fixedly installed on the base plate, a water cavity is arranged in the water tank, the input end of the water pump is connected with the water cavity, a hose is arranged at the output end of the water pump, the output end of the water pump is connected with the nozzle through the hose, the nozzle is fixedly installed on the support plate, and the output end of the nozzle rushes toward the grinding disc; when grinding the single crystal silicon wafer, the water pump is turned on to make the water in the water cavity of the water tank enter the nozzle through the water pump, and then the water is sprayed onto the grinding disc through the nozzle, so as to reduce the temperature of the surface of the grinding disc and ensure the service life of the grinding disc.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows: when grinding a single crystal silicon wafer, the double-sided grinding of the single crystal silicon wafer can be automatically completed by clamping the single crystal silicon wafer once, which reduces the disassembly and assembly of the single crystal silicon wafer, improves work efficiency, is easy to use, and has high practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a first axonometric structural schematic diagram of the utility model;

[0013] Figure 2 It is a second axonometric structural schematic diagram of the utility model;

[0014] Figure 3 It is a structural schematic diagram of the clamping mechanism;

[0015] Figure 4 It is a structural diagram of the rotating mechanism;

[0016] Figure 5 It is a structural diagram of the lifting mechanism and the rotating mechanism.

[0017] Markings in the attached drawings: 1. Base plate; 2. Vertical plate; 3. Electric slide rail A; 4. Sliding plate A; 5. Support plate; 6. Drive motor; 7. Rotating shaft; 8. Grinding disc; 9. Fixed plate; 10. Track; 11. Support block; 12. Servo motor; 13. Screw; 14. Sliding block; 15. Clamp plate; 16. Support block; 17. Support frame; 18. Stepper motor; 19. Drive shaft; 20. Electric slide rail B; 21. Sliding plate; 22. Bracket; 23. Water tank; 24. Water pump; 25. Nozzle; 26. Monocrystalline silicon wafer. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively below with reference to the relevant drawings. The utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive. Example 1

[0019] like Figures 1 to 5The utility model of the Schottky diode processing single crystal silicon grinding machine comprises a bottom plate 1, a lifting mechanism, a grinding mechanism, a moving mechanism, a rotating mechanism and a clamping mechanism. The grinding mechanism is installed on the bottom plate 1 through the lifting mechanism, and the grinding mechanism has a grinding function. The lifting mechanism is used to lift the grinding mechanism. The rotating mechanism is installed on the bottom plate 1 through the moving mechanism. The rotating mechanism has a rotating function. The moving mechanism is used to move the rotating mechanism left and right. The clamping mechanism is installed on the rotating mechanism. The clamping mechanism is located below the grinding mechanism. The clamping mechanism has a clamping and fixing function. When manufacturing Schottky diodes, when the single crystal silicon raw material slices are ground, the single crystal silicon slice 26 is first clamped and fixed by the clamping mechanism, and then Then, the grinding mechanism is lowered by the lifting mechanism until the grinding mechanism is lowered to contact the upper end surface of the single crystal silicon wafer 26, so that the grinding mechanism grinds the upper end of the single crystal silicon wafer 26, and then the clamping mechanism is turned upside down by 180 degrees by the rotating mechanism, thereby driving the single crystal silicon wafer 26 to turn upside down, so that the unground side of the single crystal silicon wafer 26 is rotated to the side close to the grinding mechanism, and then the unground side of the single crystal silicon wafer 26 is ground by the grinding mechanism; when grinding the single crystal silicon wafer 26, the single crystal silicon wafer 26 can be clamped once to automatically complete the double-sided grinding of the single crystal silicon wafer 26, which reduces the disassembly and assembly of the single crystal silicon wafer 26, improves work efficiency, is easy to use, and has high practicality.

[0020] like Figure 5 The lifting mechanism includes a vertical plate 2, an electric slide rail A3 and a sliding plate A4. The vertical plate 2 is fixedly installed on the upper end of the bottom plate 1, the electric slide rail A3 is fixedly installed on the vertical plate 2, and the sliding plate A4 is installed on the electric slide rail A3. The electric slide rail A3 is used to move the sliding plate A4 up and down, and the grinding mechanism is installed on the sliding plate A4; when grinding the single crystal silicon wafer 26, the electric slide rail A3 is turned on, and the electric slide rail A3 lowers the grinding mechanism through the sliding plate A4 until the grinding mechanism is lowered to contact the upper end surface of the single crystal silicon wafer 26, so that the grinding mechanism grinds the end surface of the single crystal silicon wafer 26; since the height of the grinding mechanism can be adjusted, it can grind single crystal silicon wafers 26 of different thicknesses, which is easy to use, has low limitations, and is highly practical.

[0021] like Figure 5The grinding mechanism includes a support plate 5, a drive motor 6, a rotating shaft 7 and a grinding disc 8. The support plate 5 is fixedly mounted on the sliding plate A4, the drive motor 6 is fixedly mounted on the upper end of the support plate 5, the rotating shaft 7 is rotatably mounted on the support plate 5, the upper end of the rotating shaft 7 is connected to the output end of the drive motor 6, and the grinding disc 8 is fixedly mounted on the lower end of the rotating shaft 7; when grinding the single crystal silicon wafer 26, the drive motor 6 is turned on, and the drive motor 6 drives the grinding disc 8 to rotate through the rotating shaft 7, and then the support plate 5 drives the rotating shaft 7 to descend through the sliding plate A4, and the rotating shaft 7 drives the rotating grinding disc 8 to descend, until the rotating grinding disc 8 descends to contact the upper end surface of the single crystal silicon wafer 26, so that the rotating grinding disc 8 can grind the upper end surface of the single crystal silicon wafer 26; the grinding of the single crystal silicon wafer 26 is convenient.

[0022] like Figure 3 The clamping mechanism includes a fixed plate 9, a track 10, a support block 11, a servo motor 12, a lead screw 13, two sets of sliding blocks 14 and two sets of clamping plates 15. The fixed plate 9 is installed on the rotating mechanism, the track 10 is fixedly installed on the right end of the fixed plate 9, the support block 11 is fixedly installed on the fixed plate 9, the servo motor 12 is fixedly installed on the support block 11, the lead screw 13 is rotatably installed on the support block 11, the input end of the lead screw 13 is connected to the output end of the servo motor 12, the front and rear parts of the lead screw 13 are respectively provided with external threads with opposite rotation directions, the two sets of sliding blocks 14 are respectively screwed with the front and rear parts of the lead screw 13, the two sets of sliding blocks 14 are both slidably installed on the track 10, and the two sets of clamping plates 15 are fixedly installed on the two sets of sliding blocks 14 respectively; when clamping and fixing the single crystal silicon wafer 26, the staff holds the single crystal silicon wafer 26 to make the single crystal silicon wafer 26 located between the two sets of clamping plates 15, and then turns on the servo motor 12, the servo motor 12 drives the lead screw 13 to rotate, and the rotating lead screw 13 makes the two sets of clamping plates 15 approach each other through the two sets of sliding blocks 14, until the two sets of clamping plates 15 are respectively in contact with the front and back parts of the single crystal silicon wafer 26, so that the two sets of clamping plates 15 clamp and fix the single crystal silicon wafer 26; because the distance between the two sets of clamping plates 15 can be adjusted, it can clamp and fix single crystal silicon wafers 26 of different diameters, which is easy to use, has low limitations and high practicality.

[0023] like Figure 4The rotating mechanism includes a support block 16, a support frame 17, a stepper motor 18 and a drive shaft 19. The fixed plate 9 is fixedly installed on the right end of the drive shaft 19. The drive shaft 19 is rotatably installed on the support frame 17. The input end of the drive shaft 19 is connected to the stepper motor 18. The stepper motor 18 and the support frame 17 are both fixedly installed on the support block 16. After the upper end surface of the single crystal silicon wafer 26 is ground, the stepper motor 18 is turned on. The stepper motor 18 rotates the fixed plate 9 180 degrees around the axis of the drive shaft 19 through the drive shaft 19. The fixed plate 9 drives the two groups of sliding blocks 14 to drive the two groups of clamping plates 15 to rotate through the track 10, thereby rotating the single crystal silicon wafer 26 180 degrees, so that the unground side of the single crystal silicon wafer 26 is rotated to the side close to the grinding mechanism; the rotation of the single crystal silicon wafer 26 is convenient.

[0024] like Figure 1 The moving mechanism includes an electric slide rail B20, a sliding plate 21 and a bracket 22. The electric slide rail B20 is fixedly installed on the base plate 1, and the sliding plate 21 is installed on the electric slide rail B20. The electric slide rail B20 is used to move the sliding plate 21 left and right. The support block 16 is fixedly installed on the sliding plate 21 through the bracket 22; when the single crystal silicon wafer 26 is ground, the sliding plate 21 is moved left and right through the electric slide rail B20, and the sliding plate 21 drives the clamping mechanism to move left and right through the bracket 22, thereby moving the single crystal silicon wafer 26 left and right, so that the grinding disk 8 can evenly grind the left and right parts of the single crystal silicon wafer 26; the convenience is improved. Example 2

[0025] like Figure 1 and Figure 5 On the basis of Example 1, a water tank 23, a water pump 24 and a nozzle 25 are additionally provided. The water tank 23 is fixedly installed on the upper end of the base plate 1, and the water pump 24 is fixedly installed on the base plate 1. A water cavity is provided in the water tank 23. The input end of the water pump 24 is connected with the water cavity. A hose is provided at the output end of the water pump 24. The output end of the water pump 24 is connected with the nozzle 25 through the hose. The nozzle 25 is fixedly installed on the support plate 5, and the output end of the nozzle 25 rushes toward the grinding disc 8. When grinding the single crystal silicon wafer 26, the water pump 24 is turned on to make the water in the water cavity of the water tank 23 enter the nozzle 25 through the water pump 24, and then the water is sprayed onto the grinding disc 8 through the nozzle 25, so as to reduce the surface temperature of the grinding disc 8 and ensure the service life of the grinding disc 8.

[0026] The electric slide rail A3, drive motor 6, grinding disc 8, servo motor 12, stepper motor 18, electric slide rail B20 and water pump 24 of the Schottky diode processing single crystal silicon grinder of the utility model are all purchased on the market. The technicians in this industry only need to install and operate them according to the accompanying instruction manual, without the need for the technicians in this field to make creative labor.

[0027] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A single crystal silicon grinding machine for processing Schottky diodes, comprising a base plate (1); characterized in that: It also includes a lifting mechanism, a grinding mechanism, a moving mechanism, a rotating mechanism and a clamping mechanism, wherein the grinding mechanism is mounted on the bottom plate (1) via the lifting mechanism, the grinding mechanism has a grinding function, the lifting mechanism is used to lift the grinding mechanism, the rotating mechanism is mounted on the bottom plate (1) via the moving mechanism, the rotating mechanism has a rotating function, the moving mechanism is used to move the rotating mechanism left and right, and the clamping mechanism is mounted on the rotating mechanism, the clamping mechanism is located below the grinding mechanism, and the clamping mechanism has a clamping and fixing function; The clamping mechanism comprises a fixed plate (9), a track (10), a support block (11), a servo motor (12), a lead screw (13), two sets of sliding blocks (14) and two sets of clamping plates (15); the fixed plate (9) is mounted on the rotating mechanism; the track (10) is fixedly mounted on the right end of the fixed plate (9); the support block (11) is fixedly mounted on the fixed plate (9); the servo motor (12) is fixedly mounted on the support block (11); the lead screw (13) is rotatably mounted on the support block (11); the input end of the lead screw (13) is connected to the output end of the servo motor (12); the front and rear parts of the lead screw (13) are respectively provided with external threads with opposite rotation directions; the two sets of sliding blocks (14) are respectively screwed to the front and rear parts of the lead screw (13); the two sets of sliding blocks (14) are both slidably mounted on the track (10) in the front and rear directions; and the two sets of clamping plates (15) are respectively fixedly mounted on the two sets of sliding blocks (14); The rotating mechanism comprises a supporting block (16), a supporting frame (17), a stepping motor (18) and a driving shaft (19); the fixing plate (9) is fixedly mounted on the right end of the driving shaft (19); the driving shaft (19) is rotatably mounted on the supporting frame (17); the input end of the driving shaft (19) is connected to the stepping motor (18); and the stepping motor (18) and the supporting frame (17) are both fixedly mounted on the supporting block (16).

2. A single crystal silicon grinding machine for processing Schottky diodes as claimed in claim 1, characterized in that: The lifting mechanism comprises a vertical plate (2), an electric slide rail A (3) and a sliding plate A (4); the vertical plate (2) is fixedly mounted on the upper end of the bottom plate (1); the electric slide rail A (3) is fixedly mounted on the vertical plate (2); the sliding plate A (4) is mounted on the electric slide rail A (3); the electric slide rail A (3) is used to move the sliding plate A (4) up and down; and the grinding mechanism is mounted on the sliding plate A (4).

3. A single crystal silicon grinding machine for processing Schottky diodes as claimed in claim 2, characterized in that: The grinding mechanism comprises a support plate (5), a drive motor (6), a rotating shaft (7) and a grinding disc (8); the support plate (5) is fixedly mounted on the sliding plate A (4); the drive motor (6) is fixedly mounted on the upper end of the support plate (5); the rotating shaft (7) is rotatably mounted on the support plate (5); the upper end of the rotating shaft (7) is connected to the output end of the drive motor (6); and the grinding disc (8) is fixedly mounted on the lower end of the rotating shaft (7).

4. A single crystal silicon grinding machine for processing Schottky diodes as claimed in claim 1, characterized in that: The moving mechanism comprises an electric slide rail B (20), a sliding plate (21) and a bracket (22); the electric slide rail B (20) is fixedly mounted on the base plate (1); the sliding plate (21) is mounted on the electric slide rail B (20); the electric slide rail B (20) is used to move the sliding plate (21) left and right; and the support block (16) is fixedly mounted on the sliding plate (21) via the bracket (22).

5. A single crystal silicon grinding machine for processing Schottky diodes as claimed in claim 3, characterized in that: It also includes a water tank (23), a water pump (24) and a nozzle (25), wherein the water tank (23) is fixedly mounted on the upper end of the base plate (1), the water pump (24) is fixedly mounted on the base plate (1), a water cavity is arranged in the water tank (23), the input end of the water pump (24) is in communication with the water cavity, a hose is arranged at the output end of the water pump (24), the output end of the water pump (24) is connected to the nozzle (25) via the hose, the nozzle (25) is fixedly mounted on the support plate (5), and the output end of the nozzle (25) is directed toward the grinding disc (8).

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