Copper foil edge-covering adhesive tape

By using copper foil as a substrate, and set up high heat conductive and conductive coating on it, combined with wire grooves and reinforcement design, the existing aluminum foil wrap tape tape shielding performance is insufficient and poor. The excellent shading, shielding, conductivity, thermal conductivity and high -adoption of the foil wrap tape.

CN222411402UActive Publication Date: 2025-01-28GUANGDONG HONGQING ELECTRONICS MATERIALS TECH CO LTD
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Patent Information

Application Number
CN202420726264.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-09
Publication Date
2025-01-28
Estimated Expiration
2034-04-09

AI Technical Summary

Technical Problem

During use, the existing aluminum foil edge-covering tape has insufficient light-shading performance, average shielding effect, and softness, which leads to curling and poor bonding, resulting in poor fit, and is prone to bad phenomena such as curling and light leakage, which cannot meet the display module and The requirements for the assembly quality of the backlight module.

Method used

Use copper foil as a substrate, one side of the copper foil substrate layer is provided with high heat conductive and superconductive shading ink coating, and the other side is provided with high heat -conducting and high -conductive acrylic voltage sensitivity. On the surface, the wire grooves and settings are enhanced to improve the flexibility and strength of the tape.

Benefits of technology

The excellent shading, shielding, conductive, and thermal conductivity of copper foil tape is realized, and the adhereability and strength can be improved, which can meet the needs of the display module.

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Abstract

The utility model discloses a copper foil edge-covering adhesive tape which comprises a copper foil base material layer, a heat-conducting and electric-conducting ink layer and a heat-conducting and electric-conducting adhesive layer are respectively arranged on the upper surface and the lower surface of the copper foil base material layer, and a shielding coating is arranged between the copper foil base material layer and the heat-conducting and electric-conducting ink layer. A wire groove is formed in the surface, making contact with the shielding coating, of the copper foil base material layer, and reinforcing ribs are arranged at the positions, corresponding to the wire groove, of the surface, making contact with the heat conduction and electricity conduction adhesive layer, of the copper foil base material layer. The edge covering adhesive tape disclosed by the utility model has excellent shading, shielding, electric conduction and heat conduction functions and fitness, is good in flexibility and high in strength, and is beneficial to meeting various requirements of the current market on a display screen module.
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Description

Technical Field

[0001] The utility model relates to the field of adhesive tapes, in particular to a copper foil edge-wrapped adhesive tape. Background Art

[0002] The existing liquid crystal display module generally combines an LCD (Liquid Crystal Display) screen with a backlight module, and then wraps the edge of the product with an edge tape to prevent light leakage from the side of the product and strengthen the combination of the LCD screen and the backlight module.

[0003] Traditional edge tape uses aluminum foil as the base material, with one side coated with black Mylar with ordinary ink and the other side coated with ordinary acrylic adhesive. Although it can meet the basic requirements of light-shielding performance, the shielding effect of aluminum foil is general. In addition, due to the softness of the aluminum foil itself, after the release layer is peeled off, the aluminum foil tape is prone to curling and bonding, resulting in poor adhesion. It is easy to cause warping and light leakage when attached to narrow frames, thus failing to meet people's usage needs. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a copper foil edging tape, which has excellent shading, shielding, electrical and thermal conductivity functions, high strength and good adhesion, and effectively improves the assembly quality of display modules and backlight modules.

[0005] The purpose of the utility model is achieved through the following technical solutions:

[0006] A copper foil edging tape comprises a copper foil substrate layer, wherein a thermally conductive and electrically conductive ink layer and a thermally conductive and electrically conductive adhesive layer are respectively provided on the upper and lower surfaces of the copper foil substrate layer, a release material layer is adhered to the outer surface of the thermally conductive and electrically conductive adhesive layer, a shielding coating is provided between the copper foil substrate layer and the thermally conductive and electrically conductive ink layer, a wire groove is provided on the surface of the copper foil substrate layer in contact with the shielding coating, and reinforcing ribs are provided on the surface of the copper foil substrate layer in contact with the thermally conductive and electrically conductive adhesive layer and at positions corresponding to the wire grooves.

[0007] Furthermore, the thickness of the copper foil substrate layer is 6-75 μm.

[0008] Furthermore, the thickness of the shielding coating is 3-20 μm.

[0009] Furthermore, the thickness of the thermally and electrically conductive ink layer is 6-20 μm.

[0010] Furthermore, the thickness of the thermally and electrically conductive adhesive layer is 8.5-50 μm.

[0011] Furthermore, the release material layer is composed of release paper or release film, and the thickness of the release material layer is 25-100 μm.

[0012] Furthermore, the thermally conductive and electrically conductive ink layer is made of black ink added with thermally conductive powder and conductive powder, and the thermally conductive and electrically conductive adhesive layer is made of acrylic pressure-sensitive adhesive added with thermally conductive powder and conductive powder; the thermally conductive powder is at least one of aluminum oxide, magnesium oxide, silicon dioxide, aluminum hydroxide, antimony trioxide, graphite, carbon nanotubes, and graphene; and the conductive powder contains at least one of ultrafine nickel powder, ultrafine copper powder, ultrafine silver powder, copper-coated nickel powder, silver-coated nickel powder, and silver-coated copper powder.

[0013] Furthermore, the depth of the wire groove is less than the thickness of the shielding coating layer, and the depth of the wire groove is less than one quarter of the thickness of the copper foil substrate layer.

[0014] Furthermore, the height of the reinforcing rib is less than the thickness of the thermally and electrically conductive adhesive layer, and the height of the reinforcing rib is less than one quarter of the thickness of the copper foil substrate layer.

[0015] The beneficial effects of the utility model are:

[0016] The utility model copper foil edge tape uses copper foil with better thermal conductivity, shielding and softness as the base material; a high thermal conductivity and superconductivity shading ink coating is arranged on one side of the copper foil base material layer, and an acrylic pressure-sensitive adhesive layer with high thermal conductivity and high conductivity is arranged on the other side of the copper foil base material layer, so that the edge tape has excellent shading, shielding, electrical conductivity, thermal conductivity and conformability, which is more conducive to meeting the various needs of the current market for display screen modules. At the same time, a wire groove is opened on one surface of the copper foil base material layer to avoid the tape from breaking when the tape is bent as a whole, thereby improving the overall flexibility of the tape; reinforcing ribs are arranged at the position corresponding to the wire groove on the other surface of the copper foil base material layer to prevent the copper foil base material from breaking from the wire groove when the tape is bent, thereby improving the overall strength of the tape.

[0017] The reinforcing ribs provided on the copper foil substrate layer can also improve the bonding effect between the substrate layer and the thermally and electrically conductive adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the utility model;

[0019] Figure numerals: 10 - thermally conductive and electrically conductive ink layer; 20 - shielding coating layer; 30 - copper foil substrate layer; 31 - wire groove; 32 - reinforcing rib; 40 - thermally conductive and electrically conductive adhesive layer; 50 - release material layer. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present invention, it should be noted that the terms "vertical direction", "upper", "lower", "horizontal" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, a mechanical connection, an electrical connection, a direct connection, or a connection through an intermediate medium, or the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] Reference Figure 1 As shown, an embodiment of the utility model provides a copper foil edging tape, including a copper foil substrate layer 30, wherein a thermal conductive ink layer 10 and a thermal conductive adhesive layer 40 are respectively provided on the upper and lower surfaces of the copper foil substrate layer 30, a release material layer 50 is adhered to the outer surface of the thermal conductive adhesive layer 40, and a shielding coating 20 is provided between the copper foil substrate layer 30 and the thermal conductive ink layer 10.

[0024] A wire groove 31 is provided on the surface of the copper foil substrate layer 30 that contacts the shielding coating layer 20 , and a reinforcing rib 32 is provided on the surface of the copper foil substrate layer 30 that contacts the thermally and electrically conductive adhesive layer 40 and at a position corresponding to the wire groove 31 .

[0025] Furthermore, the depth of the wire groove 31 is less than the thickness of the shielding coating 20 , and the depth of the wire groove 31 is less than one quarter of the thickness of the copper foil substrate layer 30 .

[0026] Furthermore, the height of the reinforcing rib 32 is less than the thickness of the thermally and electrically conductive adhesive layer 40 , and the height of the reinforcing rib 32 is less than one quarter of the thickness of the copper foil substrate layer 30 .

[0027] Specifically, the protective film of the copper foil edge tape is prepared by the following steps:

[0028] A wire groove is provided on one side of a copper foil substrate with a thickness of 6-75 μm, and an integrally formed reinforcing rib is provided at a position corresponding to the wire groove on the other side. A layer of shielding coating is sprayed on the side of the copper foil substrate with the wire groove and cured to form a shielding coating 20 with a thickness of 3-20 μm; a layer of thermally conductive and electrically conductive adhesive is applied on the other side of the copper foil substrate by a comma scraper and cured to form a thermally conductive and electrically conductive adhesive layer 40 with a thickness of 8.5-50 μm; a release paper or release film material with a thickness of 25-100 μm is adhered to the outer surface of the thermally conductive and electrically conductive adhesive layer 40; finally, a thermally conductive and electrically conductive ink layer 10 with a thickness of 6-20 μm is attached to the surface of the shielding coating 20 by silk screen printing or micro-concave coating to form a copper foil hemming tape.

[0029] in:

[0030] The shielding coating 20 is formed by the preparation process of patent CN202111380796.4;

[0031] The thermal conductive ink layer 10 is made of the ink material of the black coating disclosed in patent ZL201911114588.2, with thermal conductive powder and conductive powder added thereto. The amount of thermal conductive powder added to the ink material is 10-20%, and the amount of conductive powder added to the ink material is 3-8%.

[0032] The thermally conductive and electrically conductive adhesive layer 40 is made of the acrylic glue material disclosed in patent ZL201911114588.2 by adding thermally conductive powder and conductive powder. The added amount of thermally conductive powder relative to the acrylic glue material is 5-10%, and the added amount of conductive powder relative to the acrylic glue material is 5-10%.

[0033] Specifically, the thermally conductive powder is at least one of alumina, magnesium oxide, silicon dioxide, aluminum hydroxide, antimony trioxide, graphite, carbon nanotubes, and graphene; the conductive powder contains at least one of ultrafine nickel powder, ultrafine copper powder, ultrafine silver powder, copper-coated nickel powder, silver-coated nickel powder, and silver-coated copper powder.

[0034] In order to further illustrate the structure of the copper foil edge tape of the present invention, the following is a description through specific embodiments:

[0035] Example 1

[0036] In this embodiment, the copper foil edge tape includes a thermally conductive and electrically conductive ink layer 10 , a shielding coating layer 20 , a copper foil substrate layer 30 , a thermally conductive and electrically conductive adhesive layer 40 and a release film 50 in sequence.

[0037] The thickness of the thermal conductive ink layer 10 is 8 μm, the thickness of the shielding coating 20 is 10 μm, the thickness of the copper foil substrate layer 30 is 20 μm, the thickness of the thermal conductive adhesive layer 40 is 10 μm, and the thickness of the release film 50 is 40 μm. The depth of the wire groove 31 is 3 μm, and the height of the reinforcing rib 32 is 4 μm.

[0038] The shielding coating 20 in this embodiment is formed by the preparation process of patent CN202111380796.4;

[0039] The thermally conductive and electrically conductive ink layer 10 in this embodiment is formed by adding 15 parts by weight of graphite, 2 parts by weight of ultrafine nickel powder and 3 parts by weight of copper-clad nickel powder to 100 parts by weight of black ink material (prepared from the black ink in the black coating disclosed in patent ZL201911114588.2);

[0040] The thermally conductive and electrically conductive adhesive layer 40 in this embodiment is formed by adding 8 parts by weight of graphite, 5 parts by weight of ultrafine nickel powder and 3 parts by weight of copper-clad nickel powder to an acrylic glue material (acrylic glue material disclosed in patent ZL201911114588.2).

[0041] In this embodiment, the 180° peeling force of the copper foil edge tape at room temperature is 15N / 25.4mm; the thermal conductivity (steady-state heat flow method) is 0.82W / mK, the electromagnetic wave shielding effectiveness is 92dB (frequency 10MHZ-3GHZ), and the surface resistance is 28mΩ.

[0042] Example 2

[0043] In this embodiment, the copper foil edge tape includes a thermally conductive and electrically conductive ink layer 10 , a shielding coating layer 20 , a copper foil substrate layer 30 , a thermally conductive and electrically conductive adhesive layer 40 , and a release paper 50 in sequence.

[0044] The thickness of the thermal conductive ink layer 10 is 12 μm, the thickness of the shielding coating 20 is 15 μm, the thickness of the copper foil substrate layer 30 is 45 μm, the thickness of the thermal conductive adhesive layer 40 is 20 μm, and the thickness of the release paper 50 is 60 μm. The depth of the wire groove 31 is 5 μm, and the height of the reinforcing rib 32 is 4 μm.

[0045] The shielding coating 20 in this embodiment is formed by the preparation process of patent CN202111380796.4;

[0046] The thermally conductive and electrically conductive ink layer 10 in this embodiment is formed by adding 100 parts by weight of black ink material (prepared from the black ink in the black coating disclosed in patent ZL201911114588.2) to 10 parts by weight of graphene, 3 parts by weight of ultrafine nickel powder and 3 parts by weight of ultrafine copper powder;

[0047] The thermally conductive and electrically conductive adhesive layer 40 in this embodiment is formed by adding 6 parts by weight of graphene, 5 parts by weight of ultrafine nickel powder and 3 parts by weight of ultrafine copper powder to an acrylic glue material (acrylic glue material disclosed in patent ZL201911114588.2).

[0048] In this embodiment, the 180° peeling force of the copper foil edge tape at room temperature is 22N / 25.4mm; the thermal conductivity (steady-state heat flow method) is 0.52W / mK, the electromagnetic wave shielding effectiveness is 93dB (frequency 10MHZ-3GHZ), and the surface resistance is 26mΩ.

[0049] Example 3

[0050] In this embodiment, the copper foil edge tape includes a thermally conductive and electrically conductive ink layer 10 , a shielding coating layer 20 , a copper foil substrate layer 30 , a thermally conductive and electrically conductive adhesive layer 40 and a release film 50 in sequence.

[0051] The thickness of the thermal conductive ink layer 10 is 20 μm, the thickness of the shielding coating 20 is 20 μm, the thickness of the copper foil substrate layer 30 is 60 μm, the thickness of the thermal conductive adhesive layer 40 is 30 μm, and the thickness of the release film 50 is 60 μm. The depth of the wire groove 31 is 6 μm, and the height of the reinforcing rib 32 is 3 μm.

[0052] The shielding coating 20 in this embodiment is formed by the preparation process of patent CN202111380796.4;

[0053] The thermally conductive and electrically conductive ink layer 10 in this embodiment is formed by adding 100 parts by weight of black ink material (prepared from the black ink in the black coating disclosed in patent ZL201911114588.2) to 10 parts by weight of graphene, 3 parts by weight of ultrafine nickel powder and 3 parts by weight of ultrafine copper powder;

[0054] The thermally conductive and electrically conductive adhesive layer 40 in this embodiment is formed by adding 10 parts by weight of graphite, 3 parts by weight of ultrafine nickel powder and 3 parts by weight of copper-clad nickel powder to an acrylic glue material (acrylic glue material disclosed in patent ZL201911114588.2).

[0055] In this embodiment, the 180° peeling force of the copper foil edge tape at room temperature is 26N / 25.4mm; the thermal conductivity (steady-state heat flow method) is 1.1W / mK, the electromagnetic wave shielding effectiveness is 95dB (frequency 10MHZ-3GHZ), and the surface resistance is 43mΩ.

[0056] The above only expresses the preferred technical solution of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and the utility model is also intended to include these modifications and modifications.

Claims

1. A copper foil edge tape, characterized in that: It comprises a copper foil substrate layer, wherein a thermal conductive ink layer and a thermal conductive adhesive layer are respectively provided on the upper and lower surfaces of the copper foil substrate layer, a shielding coating is provided between the copper foil substrate layer and the thermal conductive ink layer, a wire groove is provided on the surface of the copper foil substrate layer in contact with the shielding coating, and reinforcing ribs are provided on the surface of the copper foil substrate layer in contact with the thermal conductive adhesive layer and at the position corresponding to the wire groove.

2. The copper foil edge tape according to claim 1, characterized in that: The thickness of the copper foil substrate layer is 6-75 μm.

3. The copper foil edge tape according to claim 1, characterized in that: The thickness of the barrier coating is 3-20 μm.

4. The copper foil edge tape according to claim 1, characterized in that: The thickness of the thermally and electrically conductive ink layer is 6-20 μm.

5. The copper foil edge tape according to claim 1, characterized in that: The thickness of the thermally and electrically conductive adhesive layer is 8.5-50 μm.

6. The copper foil edge tape according to claim 1, characterized in that: The outer surface of the thermally and electrically conductive adhesive layer is covered with a release material layer, the release material layer is composed of release paper or release film, and the thickness of the release material layer is 25-100 μm.

7. The copper foil edge tape according to any one of claims 1 to 6, characterized in that: The depth of the wire groove is less than the thickness of the shielding coating layer, and the depth of the wire groove is less than one quarter of the thickness of the copper foil substrate layer.

8. The copper foil edge tape according to any one of claims 1 to 6, characterized in that: The height of the reinforcing rib is less than the thickness of the thermally and electrically conductive adhesive layer, and the height of the reinforcing rib is less than one quarter of the thickness of the copper foil substrate layer.

Citation Information

Patent Citations

  • Electroconductive light-shielding adhesive tape and preparation method thereof

    CN110862781A

  • Optical high-transmittance diffusion film for liquid crystal display backlight module

    CN114265234A