Anisotropic conductive adhesive conductive structure with high conductivity

Abstract

The utility model discloses an anisotropic conductive adhesive conductive structure with high conductivity, the anisotropic conductive adhesive conductive structure with high conductivity comprises a colloid, graphite nodules are uniformly doped in the colloid, each graphite nodule comprises a hard graphene oxide shell, and the graphite nodules are uniformly doped in the colloid. The graphene oxide shell is internally filled with a soft graphene core body. The graphite nodules are used for replacing gold nodules in the existing anisotropic conductive adhesive, and after the graphite nodule-replaced graphene oxide shell is broken through extrusion, the hard graphene oxide shell can be used as a supporting structure, and the soft graphene core body is used. Therefore, a conductive structure can be formed, a gold ball in the existing anisotropic conductive adhesive can be perfectly replaced, the production cost is greatly reduced, the conductive performance is remarkably improved, and the power consumption is effectively reduced.

Description

Technical Field

[0001] The utility model relates to anisotropic conductive adhesive, more specifically, to anisotropic conductive adhesive conductive structure with high conductive performance. Background Art

[0002] After the traditional anisotropic conductive adhesive (ACF) is pressed, the gold balls are prone to uneven explosion, which leads to weakened conductivity, poor contact, increased power consumption, etc. In addition, this type of anisotropic conductive adhesive requires the use of a large amount of precious metals, which is also costly.

[0003] Chinese invention patent document CN103320045A discloses a reactive heterogeneous conductive hot melt adhesive, which includes 75-97% moisture-curing hot melt adhesive and 3-25% conductive particles by weight percentage. The moisture-curing hot melt adhesive is a polyurethane, polyester, polyether, polyolefin, or polyamide resin containing a hydrolyzable isocyanate group or a hydrolyzable alkoxy silicon. The molecular formula of the hydrolyzable isocyanate group is: -NCO; the molecular formula of the hydrolyzable alkoxy silicon is: -SiRX1X2 or -SiX1X2X3, where 1, 2, and 3 are the same or different, X represents an alkoxy group with 1 to 6 carbon atoms, and R represents a substituted or unsubstituted alkyl group with 1 to 6 carbon atoms. The conductive particles are spherical or random particles of silver, nickel, gold, or platinum. The conductive particles are silver, nickel, gold, or platinum plated on monodispersed polyacrylate microspheres.

[0004] Obviously, the patented reactive heterogeneous conductive hot melt adhesive does not contain any organic solvents at all. It is coated by a low-cost hot melt dispensing method, and then pressurized at room temperature or low temperature. The process is simple and the cost is low. It is suitable for various forms of display connection methods such as COG (Chip On Glass), COF (Chip On Film), FOG (Film On Glass), and FOB (Film On Board). Because it is pressurized at room temperature or low temperature, it is particularly suitable for conductive bonding between materials that are not resistant to high temperatures. After hot pressing, it can be placed at room temperature for moisture curing and cross-linking to form a cured product with excellent heat resistance and chemical resistance. Compared with non-reactive heterogeneous conductive hot melt adhesive, the dispensing temperature of reactive heterogeneous conductive hot melt adhesive is lower (90~120 degrees), and it causes less damage to heat-resistant materials such as PET. This heterogeneous conductive hot melt adhesive also cannot solve the conductive performance and cost problems of existing heterogeneous conductive adhesives.

[0005] Chinese utility model patent document CN212375209U discloses an anisotropic conductive adhesive, characterized in that the anisotropic conductive adhesive includes a conductive layer, the conductive layer includes a first surface and a second surface, the first surface and the second surface are arranged opposite to each other, the conductive layer has air guide holes, and the air guide holes penetrate the first surface and the second surface. The shape of the air guide hole includes a rectangle, a circle, an ellipse, a triangle, a trapezoid and a combination thereof. The anisotropic conductive adhesive includes a first side and a second side, the first side and the second side are arranged oppositely, the number of the air guide holes is multiple, the multiple air guide holes are arranged in the conductive layer along the extension direction of the conductive layer, and the air guide holes are arranged at a distance from the first side and the second side. The conductive layer includes a first side and a second side, the first side and the second side are arranged oppositely, the number of the air guide holes is multiple, the multiple air guide holes are arranged in the conductive layer along the extension direction of the conductive layer, and the air guide holes penetrate the first side and / or the second side. The conductive layer includes a first side and a second side, the first side and the second side are arranged opposite to each other, the number of the air guide hole is one, the conductive layer is divided into two parts by the air guide hole along the direction in which the conductive layer extends, and the air guide hole is parallel to the first side and the second side. The first surface and the second surface are both sticky. The anisotropic conductive adhesive also includes a substrate, and the substrate is releasably arranged on one surface or two opposite surfaces of the conductive layer.

[0006] Obviously, the anisotropic conductive adhesive in this patent is used to prevent gas from directly acting on the anisotropic conductive adhesive and causing failure of the connection between the anisotropic conductive adhesive and the solder pad, and cannot solve the conductive performance and cost problems of the existing anisotropic conductive adhesive. Utility Model Content

[0007] Based on this, it is necessary to provide a highly conductive anisotropic conductive adhesive conductive structure for the above technical problems, wherein the highly conductive anisotropic conductive adhesive conductive structure comprises a colloid, wherein graphite balls are uniformly doped in the colloid, wherein the graphite balls comprise a hard graphene oxide shell, wherein the interior of the graphene oxide shell is filled with a soft graphene core. Graphite balls are used to replace the gold balls in the existing anisotropic conductive adhesive, and when the graphene oxide shell replaced by the graphite balls is squeezed and broken, the hard graphene oxide shell can be used as a supporting structure, while the soft graphene core. Then, a conductive structure can be formed, which can perfectly replace the gold balls in the existing anisotropic conductive adhesive, greatly reducing production costs, significantly improving conductivity, and effectively reducing power consumption.

[0008] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0009] A highly conductive anisotropic conductive adhesive conductive structure, characterized in that the highly conductive anisotropic conductive adhesive conductive structure comprises a plurality of graphite balls, the graphite balls comprise a hard graphene oxide shell, and the interior of the graphene oxide shell is filled with a soft graphene core.

[0010] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the graphite balls are spherical.

[0011] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the thickness of the graphene oxide shell is 0.05 micrometer to 0.15 micrometer.

[0012] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the thickness of the graphene oxide shell is 0.1 micron.

[0013] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the diameter of the graphene core is 2 microns to 5 microns.

[0014] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the diameter of the graphene core is 4 microns.

[0015] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the outer shell of the graphene oxide shell is distributed with blasting protrusions.

[0016] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the blasting protrusion is wedge-shaped.

[0017] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the blasting protrusion is hemispherical.

[0018] As a preferred implementation of the anisotropic conductive adhesive conductive structure with high conductivity provided by the utility model, the blasting protrusion is in the shape of a spike.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] The utility model provides a highly conductive anisotropic conductive adhesive conductive structure, which uses graphite balls to replace the gold balls in the existing anisotropic conductive adhesive. When the graphene oxide shell replaced by the graphite balls is squeezed and broken, the hard graphene oxide shell can be used as a supporting structure, and the soft graphene core can form a conductive structure, which can perfectly replace the gold balls in the existing anisotropic conductive adhesive, greatly reduce production costs, significantly improve conductivity, and effectively reduce power consumption.

[0021] In addition, the outer shell of the graphene oxide shell can be provided with explosion protrusions. The explosion protrusions are wedge-shaped. By utilizing the explosion protrusions on the outer shell of the graphene oxide shell, the explosion of graphite balls can be accelerated when the anisotropic conductive adhesive is extruded, the process difficulty can be reduced, and thus the production cost can be reduced.

[0022] In addition, the blasting protrusion can be made into a hemispherical shape. By using the hemispherical blasting protrusion, the blasting of the graphite ball can be further accelerated, the process difficulty can be reduced, and thus the production cost can be reduced.

[0023] In addition, the blasting protrusion can be made into a spike shape. By using the spike-shaped blasting protrusion, the explosion of the graphite ball can be further accelerated, the process difficulty can be reduced, and thus the production cost can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a schematic diagram of the distribution of the conductive structure of the anisotropic conductive adhesive with high conductivity of the utility model;

[0026] Figure 2 for Figure 1 Schematic diagram of the structure of graphite balls in anisotropic conductive glue;

[0027] Figure 3 A schematic structural diagram of another embodiment of the graphite ball of the anisotropic conductive adhesive conductive structure with high conductivity of the utility model;

[0028] Figure 4 A schematic structural diagram of another embodiment of the graphite ball of the anisotropic conductive adhesive conductive structure with high conductivity of the utility model;

[0029] Figure 5 A schematic structural diagram of another embodiment of the graphite ball of the anisotropic conductive adhesive conductive structure with high conductivity of the utility model;

[0030] The markings in the figure are as follows: 1. Anisotropic conductive adhesive includes colloid; 2. Graphite ball; 21. Graphene oxide shell; 211. Explosion protrusion; 22. Graphene core. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0032] As described in the background art, in the prior art, for traditional anisotropic conductive adhesive (ACF), uneven gold ball explosion is easy to occur after the anisotropic conductive adhesive is pressed, which leads to weakened conductivity, poor contact, increased power consumption, etc. In addition, the anisotropic conductive adhesive requires the use of a large amount of precious metals, and the cost is also high.

[0033] In order to solve this technical problem, the utility model provides a highly conductive anisotropic conductive adhesive conductive structure, comprising a colloid 1, wherein the colloid 1 is uniformly doped with graphite balls 2, wherein the graphite balls 2 comprise a hard graphene oxide shell 21, wherein the inside of the graphene oxide shell 21 is filled with a soft graphene core 22. The graphite balls 2 are spherical. The thickness of the graphene oxide shell 21 is 0.05 microns to 0.15 microns. Preferably, the thickness of the graphene oxide shell 21 is 0.1 microns. The diameter of the graphene core 22 is 2 microns to 5 microns. Preferably, the diameter of the graphene core 22 is 4 microns.

[0034] Through the above structural design, the graphite ball 2 is used to replace the gold ball in the existing anisotropic conductive adhesive. When the graphene oxide shell 21 of the graphite ball 2 is squeezed, the hard graphene oxide shell 21 can be used as a supporting structure, and the soft graphene core 22 can form a conductive structure, which can perfectly replace the gold ball in the existing anisotropic conductive adhesive, greatly reducing the production cost, significantly improving the conductive performance, and effectively reducing the power consumption.

[0035] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0036] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0038] Example 1

[0039] like Figure 1 and Figure 2 As shown, the conductive structure of the anisotropic conductive glue with high conductivity includes a plurality of graphite balls 2. The graphite balls 2 are evenly distributed in the colloid 1. The graphite balls 2 include a hard graphene oxide shell 21, and the inside of the graphene oxide shell 21 is filled with a soft graphene core 22.

[0040] It should be noted that the graphite ball 2 is spherical.

[0041] In addition, the thickness of the graphene oxide shell 21 is 0.05 micrometers to 0.15 micrometers. Preferably, the thickness of the graphene oxide shell 21 is 0.1 micrometers.

[0042] In addition, the diameter of the graphene core 22 is 2 micrometers to 5 micrometers. Preferably, the diameter of the graphene core 22 is 4 micrometers.

[0043] The preparation process of graphite ball 2 is described below. It can be prepared by redox reaction. The specific steps are:

[0044] 1. Preparing a mixture of graphene oxide and graphene;

[0045] 2. Dispersing the mixture in a solvent, such as water or an organic solvent;

[0046] 3. Adding a reducing agent, such as hydrogen or a reducing agent solution, to reduce the graphene oxide in the mixture to graphene and wrap it on the surface of the graphene;

[0047] 4. Separate the mixture by centrifugation or filtration to obtain a graphene oxide composite material wrapped with graphene, namely, graphite balls 2.

[0048] It should be noted that during the reduction process, the selection of reducing agents and the control of reaction conditions have an important influence on the quality and performance of the composite material. At the same time, the mixture in the solvent needs to be evenly dispersed during the preparation process to ensure that the graphene oxide can be evenly wrapped on the graphene surface.

[0049] The working mode of this embodiment is described below.

[0050] The graphite ball 2 is used to replace the gold ball in the existing anisotropic conductive adhesive. When the graphene oxide shell 21 of the graphite ball 2 is squeezed, the hard graphene oxide shell 21 can be used as a supporting structure, and the soft graphene core 22 can form a conductive structure, which can perfectly replace the gold ball in the existing anisotropic conductive adhesive, greatly reduce the production cost, significantly improve the conductive performance, and effectively reduce the power consumption.

[0051] Example 2

[0052] like Figure 3 As shown, the conductive structure of the anisotropic conductive adhesive with high conductivity provided in Example 1 is further optimized. Specifically, the outer shell of the graphene oxide shell 21 is distributed with blasting protrusions 211.

[0053] The blasting protrusion 211 is wedge-shaped.

[0054] The working mode of this embodiment is described below.

[0055] By utilizing the bursting protrusions 211 on the outer shell of the graphene oxide outer shell 21, the bursting of the graphite balls 2 can be accelerated when the anisotropic conductive adhesive is extruded, thereby reducing the process difficulty and thus reducing the production cost.

[0056] Example 3

[0057] like Figure 4 As shown, the conductive structure of the anisotropic conductive adhesive with high conductivity provided in Example 1 or 2 is further optimized. Specifically, the blasting protrusion 211 is hemispherical.

[0058] The working mode of this embodiment is described below.

[0059] By utilizing the hemispherical blasting protrusions 211 , the blasting of the graphite balls 2 can be further accelerated, the process difficulty can be reduced, and thus the production cost can be reduced.

[0060] Example 4

[0061] like Figure 5 As shown, the conductive structure of the anisotropic conductive adhesive with high conductivity provided in Example 1 or 2 is further optimized. Specifically, the blasting protrusion 211 is in the shape of a spike.

[0062] The working mode of this embodiment is described below.

[0063] By using the spike-shaped blasting protrusions 211, the blasting of the graphite balls 2 can be further accelerated, the process difficulty can be reduced, and thus the production cost can be reduced.

[0064] The terms "coupling" and "coupling" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0065] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0066] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A highly conductive anisotropic conductive adhesive conductive structure, characterized in that: The highly conductive anisotropic conductive adhesive conductive structure comprises a plurality of graphite balls (2), wherein the graphite balls (2) comprise a hard graphene oxide shell (21), and the interior of the graphene oxide shell (21) is filled with a soft graphene core (22).

2. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 1, characterized in that: The graphite balls (2) are spherical.

3. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 1, characterized in that: The thickness of the graphene oxide shell (21) is 0.05 micrometers to 0.15 micrometers.

4. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 3, characterized in that: The thickness of the graphene oxide shell (21) is 0.1 micrometer.

5. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 1, characterized in that: The graphene core (22) has a diameter of 2 micrometers to 5 micrometers.

6. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 5, characterized in that: The diameter of the graphene core (22) is 4 micrometers.

7. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 1, characterized in that: The graphene oxide shell (21) is provided with blasting protrusions (211) distributed on the shell.

8. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 7, characterized in that: The blasting protrusion (211) is wedge-shaped.

9. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 7, characterized in that: The blasting protrusion (211) is hemispherical.

10. The anisotropic conductive adhesive conductive structure with high conductivity according to claim 7, characterized in that: The blasting protrusion (211) is in the shape of a spike.

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