Evaporation source and evaporation equipment

Abstract

The utility model discloses an evaporation source and evaporation equipment, the evaporation source comprises a supporting piece and a heat insulation piece, the supporting piece comprises an opening and a cavity communicating with the opening, and an evaporation piece capable of generating evaporation gas is placed in the cavity; the heat insulation piece covers the opening of the supporting piece and comprises a heat exchange channel used for containing a heat exchange medium and an evaporation channel communicated with the cavity, and evaporation gas can be discharged out of the supporting piece through the evaporation channel. The heat insulation piece with the heat exchange channel is arranged in the evaporation source, the heat exchange medium in the heat exchange channel can adjust the temperature of the whole heat insulation piece, and the heat insulation piece is at a relatively low temperature, so that radiant heat energy transmitted to the substrate due to heating of the evaporation piece can be effectively reduced; the temperature of the substrate is in an ideal temperature range, and a perovskite film with better quality is obtained, so that the photoelectric conversion efficiency of the perovskite solar cell is improved.

Description

Technical Field

[0001] The present application relates to the field of solar cell equipment, and in particular to an evaporation source and evaporation equipment. Background Art

[0002] In recent years, perovskite solar cells have received widespread attention in the photovoltaic field. Because perovskite solar cells combine the advantages of perovskite materials and silicon materials, perovskite solar cells have good photoelectric conversion efficiency.

[0003] When preparing the perovskite light-absorbing layer of a perovskite solar cell, a combination of evaporation and spin coating is usually used, that is, a perovskite film is vacuum-deposited on a substrate by evaporation, and then a cationic solution is spin-coated on the perovskite film to react with lead iodide to obtain a perovskite light-absorbing layer. During the evaporation process, the evaporation source generates a high-temperature evaporation gas that adheres to the substrate to form a perovskite film. However, continuous evaporation causes the temperature of the substrate to be too high, and the perovskite film is recrystallized and too dense due to the high temperature, which will affect the subsequent reaction process with the cationic solution, resulting in unsatisfactory quality of the perovskite light-absorbing layer and also reduces the battery performance of the perovskite solar cell. Utility Model Content

[0004] The embodiments of the present application disclose an evaporation source and an evaporation device. The evaporation source can effectively block high temperature and control the temperature of the substrate within a suitable temperature range, so that the perovskite film formed on the substrate has an ideal density and uniformity, thereby improving the battery performance of the perovskite solar cell.

[0005] In order to achieve the above-mentioned objectives, in the first aspect, an embodiment of the present application discloses an evaporation source, which includes a support member and a thermal insulation member, the support member includes an opening and a cavity connected to the opening, an evaporation member capable of generating evaporation gas is placed in the cavity; the thermal insulation member includes a heat exchange channel for accommodating a heat medium and an evaporation channel connected to the cavity, and the evaporation gas can be discharged from the support member through the evaporation channel.

[0006] In a possible implementation manner of the first aspect, the thermal insulation element includes a shell having a heat exchange channel formed therein, and a medium inlet and a medium outlet formed in the shell, wherein the medium inlet and the medium outlet are in communication with the heat exchange channel.

[0007] In a possible implementation of the first aspect, the medium inlet is connected to a first joint, the first joint is used to connect to a medium storage box, and the medium outlet is connected to a second joint, the second joint is used to connect to a medium recovery box.

[0008] In a possible implementation of the first aspect, the thermal insulation component also includes a barrier portion disposed in the shell, one end of the barrier portion is connected to the inner wall of the shell and is located between the medium inlet and the medium outlet, and the barrier portion extends toward the interior of the shell to separate the heat exchange channel in the shell into a connected medium inlet channel and a medium outlet channel.

[0009] In a possible implementation manner of the first aspect, the evaporation channel is located on an extension path of the barrier portion, and at least a portion of the barrier portion is arranged to avoid the evaporation channel.

[0010] In a possible implementation of the first aspect, the barrier portion includes a first barrier segment and a second barrier segment, the number of evaporation channels is at least two, and at least two evaporation channels are arranged at intervals, one end of the first barrier segment is connected to the inner wall of the shell, the other end of the first barrier segment is connected to an evaporation channel, and the second barrier segment is connected to two adjacent evaporation channels.

[0011] In a possible implementation of the first aspect, the thermal insulation member includes a first surface and a second surface relative to each other, the first surface faces the support member, the evaporation channel is formed in the thermal insulation member and both ends of the evaporation channel respectively pass through the first surface and the second surface, and the evaporation channel corresponds to the evaporation member.

[0012] In a possible implementation of the first aspect, the evaporation source also includes a plug-in plate, on which an exhaust port and a plug-in portion connected to the exhaust port are formed, an air guide cavity is formed in the plug-in portion, the air guide cavity is respectively connected to the cavity body and the exhaust port, the plug-in portion can be detachably inserted into the evaporation channel, and the plug-in portion is used to isolate the evaporation gas from the inner wall of the evaporation channel.

[0013] In a possible implementation of the first aspect, a handle is provided on a side of the insert plate facing away from the thermal insulation component.

[0014] In a possible implementation of the first aspect, the evaporation source further includes a support plate, which is movably covered on the opening of the support member, and the support plate is located between the support member and the heat insulating member; a through opening is provided on the support plate, and the through opening is connected to the evaporation channel.

[0015] In a possible implementation manner of the first aspect, the support plate can slide within the plane where the opening is located, so that at least part of the support plate is exposed from the support member.

[0016] In a possible implementation manner of the first aspect, at least one of the heat insulating member, the support plate and the inserting plate is a metal member.

[0017] In order to achieve the above-mentioned purpose, in the second aspect, an embodiment of the present application further discloses an evaporation device, which includes: a box body, which includes an evaporation chamber; the evaporation source disclosed in the first aspect of the present application, which is arranged in the evaporation chamber; a guide rail is located above the evaporation source; and a substrate is slidably arranged on the guide rail, and a substrate is carried on the substrate.

[0018] In a possible implementation of the second aspect, the evaporation device further includes: a baffle, which is movably disposed in the evaporation chamber and can block or open an evaporation channel of the evaporation source.

[0019] Compared with the prior art, the beneficial effects of this application are:

[0020] By providing a heat-exchange channel with a heat-exchange element in the evaporation source, the heat-exchange medium in the heat-exchange channel can adjust the temperature of the entire heat-exchange element, so that the heat-exchange element is at a relatively low temperature, thereby effectively reducing the radiant heat energy transferred to the substrate due to the heating of the evaporation element, so that the temperature of the substrate is within an ideal temperature range. While the heat-exchange element achieves a good heat-insulating effect, the evaporation channel of the heat-exchange element can also directly discharge the evaporation gas without affecting the temperature of the evaporation gas. In this way, both the evaporation gas and the substrate can be kept within an ideal temperature range, so that the surface of the substrate produces smaller grains, reducing the recrystallization phenomenon of the perovskite film and making the structure of the perovskite film relatively loose. At the same time, the residue of the perovskite film during the spin coating process can be reduced, a better quality perovskite light-absorbing layer is obtained, and the photoelectric conversion efficiency of the perovskite solar cell is improved.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A schematic diagram of the structure of the evaporation source provided in the embodiment of the present application;

[0024] Figure 2 A partial cross-sectional view of an evaporation source provided in an embodiment of the present application;

[0025] Figure 3 A schematic diagram of the structure of a heat insulating member in an evaporation source provided in an embodiment of the present application;

[0026] Figure 4 A cross-sectional view of a heat insulating member in an evaporation source provided in an embodiment of the present application;

[0027] Figure 5 One of the exploded views of the heat insulating member, the support plate and the plug-in in the evaporation source provided in the embodiment of the present application;

[0028] Figure 6The second exploded view of the heat insulating member, the support plate and the plug-in in the evaporation source provided in the embodiment of the present application;

[0029] Figure 7 A partial schematic diagram of the evaporation equipment provided in an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 01-evaporation source; 10-support; 101-opening; 102-cavity; 103-evaporation element; 104-heater; 105-quartz boat; 20-insulation; 201-heat exchange channel; 202-evaporation channel; 203-shell; 204-medium inlet; 205-medium outlet; 206-first joint; 207-second joint; 208-barrier; 208a-first barrier section; 208b-second barrier section; 209-medium inlet channel; 210-medium outlet channel; 30-plug-in plate; 301-exhaust port; 302-plug-in part; 303-air guide cavity; 304-handle; 40-support plate; 401-through port; 402-handle; 100-guide rail; 200-substrate; 300-substrate; 400-baffle. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0034] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0035] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0037] Perovskite solar cells usually use a two-step method to prepare the perovskite light-absorbing layer. First, a perovskite film is vacuum-deposited on a substrate with a velvet size of 3μm to 6μm (for example: HJT silicon-based cells), and then a cationic solution is spin-coated to react with the perovskite film, and annealing is performed to form a perovskite light-absorbing layer. During the process of continuous evaporation of the perovskite film, the heater in the evaporation source continuously heats the perovskite material to produce evaporation gas. The large amount of radiant heat energy generated by the high-temperature heater makes the temperature of the substrate too high, and the high temperature makes the perovskite film formed on the substrate too dense, which is not conducive to the subsequent penetration of the cationic solution in the dense perovskite film, resulting in the difficulty of the cationic solution to fully react with the perovskite film. The perovskite film forms residues, which affects the charge transfer performance and the photoelectric conversion efficiency of the perovskite solar cell.

[0038] The embodiment of the present application provides an evaporation source that can fundamentally block a large amount of radiant heat energy transmitted to the substrate, thereby effectively controlling the temperature of the substrate, obtaining a perovskite film of ideal density, and further obtaining a better quality perovskite light absorbing layer and perovskite solar cell.

[0039] like Figure 1 The figure shows a schematic diagram of the structure of an evaporation source 01, which includes a support member 10 and a heat insulating member 20. The support member 10 includes an opening 101 and a cavity 102 connected to the opening 101, and an evaporation member 103 capable of generating evaporation gas is placed in the cavity 102. The heat insulating member 20 includes a heat exchange channel 201 for accommodating a heat medium, and the heat insulating member 20 also includes an evaporation channel 202 connected to the cavity 102, and the evaporation gas can be discharged from the support member 10 through the evaporation channel 202.

[0040] Specifically, if Figure 2As shown, the support member 10 is constructed as a structure with a cavity 102 with an opening 101 at one end. An evaporation member 103 capable of generating evaporation gas is also provided in the cavity 102 of the support member 10. The evaporation member 103 may include a quartz boat 105 and a plurality of linearly spaced heaters 104 for heating the quartz boat 105. The quartz boat 105 may contain a perovskite material capable of generating evaporation gas, such as lead iodide or cesium bromide, or other ammonium salts (such as methylamine ammonium iodide, formamidine ammonium iodide, etc.). The high temperature generated by the heater 104 can vaporize the above-mentioned perovskite material and deposit it together on the substrate 300, thereby forming a perovskite film. Taking the example that the quartz boats 105 in the two evaporation sources 01 contain lead iodide and cesium bromide as perovskite materials respectively, the lead iodide provides lead ions and iodine ions after vaporization, while the cesium bromide provides cesium ions and bromide ions after vaporization. These ions attach to the substrate 300 and combine to form a perovskite film.

[0041] It should be noted that vaporizing the perovskite material into a gas may require a high temperature of several hundred degrees Celsius. Therefore, the evaporation element 103 will generate a large amount of radiant heat energy. During the evaporation process, the substrate 300 needs to reciprocate multiple times above the evaporation source 01 so that the evaporation gas is evenly attached to the substrate 300 to ensure the uniformity of the formed perovskite film. When the substrate 300 moves above the evaporation source 01, the large amount of radiant heat energy generated by the evaporation element 103 will cause the temperature of the substrate 300 to be too high. If this thermal radiation is not intervened, the perovskite film produced by evaporation will be recrystallized due to the high temperature, and the perovskite film will become too dense, so that it cannot react thoroughly with the cationic solution.

[0042] Therefore, the evaporation source 01 provided in the present application is provided with a heat insulating member 20, and the heat insulating member 20 includes a heat exchange channel 201 for accommodating a heat exchange medium, and the heat exchange medium can adjust the temperature of the entire heat insulating member 20, that is, the heat exchange medium can reduce the overall temperature of the heat insulating member 20. It can be understood that when the temperature of the evaporation member 103 is too high, the heat exchange medium in the heat insulating member 20 can also absorb part of the radiant heat generated by the evaporation member 103. Therefore, the relatively low temperature heat insulating member 20 can not only effectively reduce the situation where a large amount of radiant heat energy generated by the evaporation member 103 is transferred to the substrate 300, but also absorb a large amount of heat energy radiated by part of the evaporation member 103, thereby further ensuring that the temperature of the substrate 300 is within a relatively ideal range and generating a high-quality perovskite film on the substrate 300. Optionally, the heat exchange medium can be a coolant (for example: mineral oil, synthetic oil, etc.) or water.

[0043] Furthermore, if Figure 3 and 4As shown, the thermal insulation member 20 is also provided with an evaporation channel 202, and the evaporation channel 202 and the heat exchange channel 201 are independently provided, and the evaporation gas and the heat exchange medium flow in the evaporation channel 202 and the heat exchange channel 201 respectively, and the two do not cross. After the perovskite material in the quartz boat 105 is vaporized into the evaporation gas, it is discharged from the evaporation channel 202 to the support member 10, and then attached to the substrate 300 to form a perovskite film.

[0044] Alternatively, if Figure 3 As shown, the thermal insulation member 20 includes a first surface and a second surface opposite to each other, the first surface faces the support member 10, and the second surface faces away from the support member 10. The evaporation channel 202 is formed in the thermal insulation member 20, and the two ends of the evaporation channel 202 are respectively connected to the first surface and the second surface, that is, the evaporation channel 202 passes through the thermal insulation member 20 along the thickness direction of the thermal insulation member 20, so that the length of the evaporation channel 202 is the thickness of the thermal insulation member 20. The length of the evaporation channel 202 can be controlled by controlling the thickness of the thermal insulation member 20 within a suitable range, so as to reduce the temperature influence of the thermal insulation member 20 on the evaporation gas, thereby keeping the evaporation gas within the target temperature range.

[0045] Optionally, the evaporation channel 202 may be provided corresponding to the evaporation member 103. Specifically, the evaporation channel 202 may be provided corresponding to the quartz boat 105, and the evaporation gas after the perovskite material is vaporized may be directly discharged from the evaporation channel 202 and attached to the substrate 300, and reducing the contact between the evaporation gas and the insulation member 20 can further reduce the temperature effect of the insulation member 20 at a lower temperature on the evaporation gas.

[0046] Optionally, in order to improve the uniformity of the deposition gas adhering to the substrate 300 , the number of the deposition channels 202 may be at least two, so that the deposition gas discharged from different deposition channels 202 is uniformly adhered to the substrate 300 to form a uniform perovskite film.

[0047] In this way, by setting a heat insulating member 20 having a heat exchange channel 201 in the evaporation source 01, the heat exchange medium in the heat exchange channel 201 can adjust the temperature of the entire heat insulating member 20, so that the heat insulating member 20 is at a relatively low temperature, thereby effectively reducing the radiant heat energy transferred to the substrate 300 due to the heating of the evaporation member 103, so that the temperature of the substrate 300 is in an ideal temperature range. While the heat insulating member 20 achieves a good heat insulation effect, the evaporation channel 202 of the heat insulating member 20 can also directly discharge the evaporation gas, so as not to affect the temperature of the evaporation gas. In this way, the evaporation gas and the substrate 300 can be kept within the ideal temperature range, so that the surface of the substrate 300 produces smaller grains, reducing the recrystallization phenomenon of the perovskite film and making the structure of the perovskite film relatively loose, and at the same time, it can also reduce the residue of the perovskite film during the spin coating process, and obtain a perovskite light absorption layer with better quality, thereby improving the photoelectric conversion efficiency of the perovskite solar cell.

[0048] In order to further improve the thermal insulation effect of the thermal insulation element 20 , the thermal insulation element 20 includes a shell 203 formed with a heat exchange channel 201 , and a medium inlet 204 and a medium outlet 205 formed in the shell 203 , and the medium inlet 204 and the medium outlet 205 are connected to the heat exchange channel 201 .

[0049] like Figure 3 and Figure 4 As shown, the heat insulating member 20 includes a shell 203, and the heat insulating member 20 is located at the opening 101 of the support member 10, so the shell 203 will be affected by the heat radiation of the evaporation member 103 in the support member 10. The shell 203 may be provided with a medium inlet 204 and a medium outlet 205 connected with the heat exchange channel 201, so that the heat exchange medium can flow into and out of the heat exchange channel 201, and the heat exchange medium with a lower temperature flows into the heat exchange channel 201 through the medium inlet 204, and then flows out of the shell 203 through the medium outlet 205 after heat exchange with the shell 203, thereby cooling the shell 203, so that the shell 203 is always kept within the set temperature range, so that the heat insulating member 20 can more effectively isolate the heat energy generated by the evaporation member 103, so as to reduce the heat energy radiated to the substrate 300.

[0050] Optionally, the thermal insulation member 20 may be a metal member, so that the thermal insulation member 20 has better thermal conductivity and good structural strength.

[0051] In this way, the heat exchange medium can flow into and out of the heat exchange channel 201 through the medium inlet 204 and the medium outlet 205. The flowing heat exchange medium can quickly cool the shell 203, thereby improving the heat exchange efficiency of the shell 203 and making the insulation component 20 have ideal insulation performance.

[0052] In some embodiments, the thermal insulation member 20 may further include a first joint 206 and a second joint 207 , wherein the first joint 206 is connected to the medium inlet 204 and used to connect to the medium storage box, and the second joint 207 is connected to the medium outlet 205 and used to connect to the medium recovery box.

[0053] like Figure 3 As shown, the medium storage box may store heat exchange medium, and the medium storage box may be connected to the first joint 206 through a connecting pipe. The medium recovery box is used to store the heat exchange medium that has been heat exchanged with the shell 203, and the medium recovery box may be connected to the second joint 207 through a connecting pipe. In this way, a continuous supply of heat exchange medium can continuously perform heat exchange on the thermal insulation element 20, so as to further ensure that the thermal insulation element 20 is always kept within the set temperature range, thereby achieving a good thermal insulation effect.

[0054] Furthermore, the temperature of the heat exchange medium in the medium storage box can be adjusted. Since the perovskite materials contained in the quartz boat 105 are different, the evaporation temperatures of different perovskites are different. Therefore, the temperature of the heat exchange medium in the medium storage box can be adjusted so that the set temperature range of the insulation 20 matches the different perovskite materials placed in the quartz boat 105.

[0055] For example, the evaporation temperature of cesium bromide is much higher than that of lead iodide. When the perovskite material placed in the quartz boat 105 is cesium bromide, the heat exchange medium in the medium storage box can be adjusted to a lower first temperature, so that the lower temperature heat insulation member 20 can better isolate the radiant heat energy generated by the higher temperature evaporation member 103. At the same time, the lower temperature heat exchange medium can also absorb more heat energy to reduce the radiant heat energy transferred to the substrate 300. When the perovskite material placed in the quartz boat 105 is lead iodide, the heat exchange medium in the medium storage box can be adjusted to a second temperature higher than the first temperature, so that an ideal heat insulation effect can be obtained without using a heat exchange medium at an excessively low temperature, so as to achieve energy saving and cost reduction.

[0056] In addition, the first joint 206 and the second joint 207 are also used to support the shell 203 , so that the thermal insulation member 20 can be stably placed above the support member 10 , ensuring that the thermal insulation member 20 can continue to effectively isolate the heat radiation generated by the evaporation member 103 .

[0057] Optionally, the first joint 206 , the second joint 207 and the connecting pipe may all be made of metal pipes having a certain supporting force, so as to stably support the thermal insulation member 20 .

[0058] In this way, the first joint 206 and the second joint 207 connected to the thermal insulation member 20 can be connected to a medium storage box and a medium recovery box capable of controlling the temperature of the heat exchange medium, so that the set temperature range of the thermal insulation member 20 after heat exchange matches the different perovskite materials placed in the quartz boat 105. On the other hand, the first joint 206 and the second joint 207 can also support the thermal insulation member 20, so that the thermal insulation member 20 can be stably placed above the support member 10.

[0059] In some embodiments, Figure 4 As shown, the heat insulating member 20 further includes a barrier portion 208 disposed inside the shell 203. The barrier portion 208 is used to plan the flow path of the heat exchange medium.

[0060] The shell 203 may be constructed as a rectangular parallelepiped structure, and the two sides of the barrier portion 208 are respectively connected to two inner wall surfaces opposite to each other in the thickness direction of the shell 203 to isolate the space in the shell 203. The barrier portion 208 extends along the length direction of the shell 203, one end of the barrier portion 208 along the length direction is connected to the inner wall of the shell 203 and is located between the medium inlet 204 and the medium outlet 205, the barrier portion 208 extends toward the inside of the shell 203 along the length direction of the shell 203, and a gap is formed between the other end of the barrier portion 208 and the inner wall of the shell 203 to separate the space in the shell 203 into a connected medium inlet channel 209 and a medium outlet channel 210, that is, the heat exchange channel 201 includes the medium inlet channel 209 and the medium outlet channel 210. New heat exchange medium flows into the medium channel 209 from the medium inlet 204 , then flows to the medium discharge channel 210 through the above-mentioned spacing, and then discharges from the medium discharge channel 210 through the medium outlet 205 . The heat exchange medium can exchange heat with the shell 203 during the flow process.

[0061] Optionally, the evaporation channel 202 is located on an extension path of the barrier portion 208 , and at least a portion of the barrier portion 208 is disposed to avoid the evaporation channel 202 .

[0062] It can be understood that the barrier 208 can be located in the middle of the width direction of the shell 203, so that the medium inlet channel 209 and the medium outlet channel 210 divided by the barrier 208 can have a relatively consistent cross-sectional area, thereby achieving a balance of the heat exchange medium flow and reducing the imbalance of the heat exchange medium flow or pressure. The evaporation channel 202 penetrates the shell 203 along the thickness direction of the shell 203 and needs to occupy a certain space in the shell 203. Therefore, the evaporation channel 202 is arranged on the extension path of the barrier 208 so that the occupied area of ​​the evaporation channel 202 for the medium inlet channel 209 and the medium outlet channel 210 is relatively consistent, that is, half of the evaporation channel 202 can occupy the space of the medium inlet channel 209, and the other half of the evaporation channel 202 can occupy the space of the medium outlet channel 210, thereby ensuring the balance of the heat exchange medium flow and improving the heat exchange efficiency of the heat exchange medium. Among them, the barrier 208 can be divided into multiple sections to avoid the evaporation channel 202.

[0063] Furthermore, if Figure 4 As shown, the number of the evaporation channels 202 may be at least two, and at least two evaporation channels 202 are arranged at intervals along the length direction of the housing 203. In order to achieve that at least part of the barrier 208 avoids the evaporation channel 202, the barrier 208 may be divided into a first barrier section 208a and at least one second barrier section 208b, wherein one end of the first barrier section 208a is connected to the inner wall of the housing 203 and is located between the medium inlet 204 and the medium outlet 205, and the other end of the first barrier section 208a is connected to one evaporation channel 202. The second barrier section 208b is located between two adjacent evaporation channels 202.

[0064] In this way, the multi-segment partitions 208 are arranged between the multiple evaporation channels 202. On the one hand, it does not affect the spacing of the multiple evaporation channels 202, so that the evaporation gas can be evenly discharged from the support 10 and the balance of the evaporated perovskite film can be guaranteed; on the other hand, it can also achieve relative consistency in the occupied area of ​​the evaporation channel 202 to the medium inlet channel 209 and the medium outlet channel 210, ensuring that the flow of the heat exchange medium in the medium inlet channel 209 and the medium outlet channel 210 is relatively balanced; at the same time, the multi-segment partitions 208 are arranged between the multiple evaporation channels 202, which also optimizes the internal space of the shell 203, making the structure of the thermal insulation component 20 compact.

[0065] In order to improve the cleaning efficiency of the evaporation source 01 after evaporation, in some embodiments, such as Figure 1 , Figure 5 and Figure 6As shown, the evaporation source 01 also includes an insert plate 30, on which an exhaust port 301 and a plug-in portion 302 connected to the exhaust port 301 are formed, and an air guide cavity 303 is formed in the plug-in portion 302, which is connected to the cavity body 102 and the exhaust port 301 respectively, and the plug-in portion 302 can be detachably inserted into the evaporation channel 202, and the plug-in portion 302 is used to isolate the evaporation gas from the inner wall of the evaporation channel 202.

[0066] An exhaust port 301 and a plug-in portion 302 connected to the exhaust port 301 are formed on the plug-in plate 30. The plug-in portion 302 is constructed as a hollow cylindrical structure to form an air guide cavity 303. The plug-in portion 302 is inserted into the evaporation channel 202 connected to the cavity 102, so that the exhaust port 301 can be connected to the cavity 102, and the evaporation air can be discharged from the support member 10 through the plug-in portion 302.

[0067] It can be understood that the plug-in portion 302 of the plug-in plate 30 isolates the evaporation gas from the evaporation channel 202, so that the evaporation channel 202 can be kept clean and not attached by the evaporation gas. Since the plug-in plate 30 can be detachably connected to the thermal insulation member 20 through the plug-in portion 302, when the evaporation is completed, the plug-in plate 30 can be removed from the thermal insulation member 20, and the inner wall of the plug-in portion 302 can be cleaned using a scraper with a certain hardness to complete the cleaning of the plug-in plate 30. Compared with the thermal insulation member 20 containing the heat exchange medium, the weight of the plug-in plate 30 is relatively lighter, and cleaning the plug-in plate 30 is obviously more convenient and easier than cleaning the heavier thermal insulation member 20, and the work efficiency of cleaning the evaporation source 01 is significantly improved. Optionally, the plug-in plate 30 can be made of metal material to have good structural strength, so that when the scraper cleans the plug-in plate 30, the plug-in plate 30 will not be damaged or deformed, and the use efficiency is improved.

[0068] In order to allow the gas guide cavity 303 to discharge more evaporation gas, the cross-sectional area of ​​the plug-in part 302 can be slightly smaller than the cross-sectional area of ​​the evaporation channel 202, that is, when the plug-in part 302 is inserted into the evaporation channel 202, it can fit into the evaporation channel 202. This can also prevent the evaporation gas from flowing into between the plug-in part 302 and the evaporation channel 202, thereby further keeping the thermal insulation part 20 clean.

[0069] The number of the exhaust ports 301 and the plug-in parts 302 provided on the plug-in board 30 corresponds to the number of the evaporation channels 202 , and each plug-in part 302 is inserted into one evaporation channel 202 .

[0070] Optionally, Figure 5 and Figure 6 As shown, a handle 304 is further provided on the side of the inserting plate 30 facing away from the heat insulating member 20 , so as to facilitate the removal of the inserting plate 30 from the heat insulating member 20 .

[0071] In order to further improve the efficiency of cleaning the evaporation source 01 after evaporation, in some embodiments, Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the evaporation source 01 further includes a support plate 40 , which is movably disposed to cover the opening 101 of the support member 10 , and the support plate 40 is located between the support member 10 and the heat insulating member 20 .

[0072] As described above, if the thermal insulation 20 is in direct contact with the evaporation gas, the weight of the heat exchange medium contained in the thermal insulation 20 is relatively large, and when cleaning the thermal insulation 20, the thermal insulation 20 needs to be separated and disassembled from the medium storage box and the medium recovery box, which will lead to low cleaning efficiency. Therefore, the evaporation source 01 provided in the embodiment of the present application is further provided with a support plate 40 between the support 10 and the thermal insulation 20, and the support plate 40 can be movably covered at the opening 101 of the support 10, thereby preventing the evaporation gas from directly contacting the thermal insulation 20.

[0073] Furthermore, if Figure 5 As shown, a through opening 401 is provided on the support plate 40, and the through opening 401 is connected to the evaporation channel 202, and the plug-in portion 302 on the plug-in plate 30 can pass through the evaporation channel 202 and be inserted into the through opening 401. In this way, a part of the evaporation gas is in direct contact with the support plate 40 and attached to the support plate 40, and a part of the evaporation gas is discharged from the air guide cavity 303 of the plug-in portion 302 on the plug-in plate 30 to the support member 10 and attached to the substrate 300 to form a perovskite film. By providing the support plate 40 and the plug-in plate 30, the thermal insulation member 20 is isolated from the evaporation gas, so that the thermal insulation member 20 can be kept clean. After the evaporation is completed, it is only necessary to use a scraper with a certain hardness to clean the surface of the support plate 40 facing the support member 10 and the inner surface of the plug-in portion 302 of the plug-in plate 30 to complete the cleaning work.

[0074] Optionally, the support plate 40 can be made of metal material to have good structural strength, so that when the scraper cleans the surface of the support plate 40, the support plate 40 will not be damaged or deformed, and can be recycled for multiple times.

[0075] Optionally, by reasonably setting the sizes of the through opening 401 and the plug-in portion 302, the outer surface of the plug-in portion 302 can be closely fitted with the inner wall of the through opening 401, thereby preventing the evaporation gas from leaking from the gap between the two and keeping the thermal insulation member 20 clean.

[0076] In some embodiments, the support plate 40 can slide within the plane where the opening 101 is located, so that at least a portion of the support plate 40 is exposed to the support member.

[0077] As shown in FIG. 6 , the heat insulating member 20 can be fixedly arranged relative to the support member 10, such as fixing the heat insulating member 20 to the support member 10 through a connecting member, or supporting the heat insulating member 20 through the connection between the first joint 206 and the second joint 207 and the medium storage box and the medium recovery box. The support plate 40 can slide in the plane where the opening 101 is located. When it is necessary to clean the support plate 40, the plug plate 30 can be removed from the heat insulating member 20, and then the handle 402 on the support plate can be pulled out to pull the support plate 40 out from between the support member 10 and the heat insulating member 20, so that at least part of the support plate 40 is exposed to the support member 10 to clean the perovskite attached to the support plate 40, and then the support plate 40 is slid back to the initial position after cleaning. In the case of needing to clean thoroughly, the support plate 40 can also be completely removed from between the support member 10 and the heat insulating member 20. When the cleaning is completed, the support plate 40 is inserted between the support member 10 and the heat insulating member 20, and the support plate 40 is slid to the initial position, so as to achieve efficient cleaning of the evaporation source.

[0078] The embodiment of the present application also provides an evaporation device, which includes the evaporation source 01 provided in any of the above embodiments of the present application, as well as a box, a guide rail 100 and a substrate 200. The box includes an evaporation chamber, in which the evaporation source 01 is arranged; the guide rail 100 is located above the evaporation source 01; the substrate 200 is slidably arranged on the guide rail 100, and the substrate 200 carries a substrate 300.

[0079] like Figure 7 As shown, an evaporation chamber is formed in the box, and the evaporation process occurs in the evaporation chamber. The evaporation chamber can be in a vacuum state, so that the perovskite film obtained by evaporation has good uniformity and density. The evaporation source 01 is located at the bottom of the evaporation box, and the guide rail 100 is located above the evaporation source 01. After the evaporation gas flows out of the evaporation source 01, it is evaporated onto the substrate 200 located above the guide rail 100. A plurality of substrates 300 can be arranged on the substrate 200, and the substrate 200 can reciprocate on the guide rail 100. During the reciprocating movement of the substrate 200, a perovskite film of a target thickness can be formed on the substrate 300.

[0080] Optionally, a baffle 400 may be provided in the evaporation chamber, and the baffle 400 may be movably provided in the evaporation chamber, and may block or open the evaporation channel 202 of the evaporation source 01, so as to form a fixed evaporation area above the evaporation source 01. If necessary, by adjusting the rotation angle of the baffle 400, the evaporation angle may also be adjusted to control the divergence of the evaporation gas and improve the uniformity of the perovskite film.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An evaporation source, characterized in that: The evaporation source comprises: A support member, the support member comprising an opening and a cavity connected to the opening, wherein an evaporation member capable of generating evaporation gas is placed in the cavity; A heat insulating member is provided to cover the opening of the support member, wherein the heat insulating member comprises a heat exchange channel for accommodating a heat-displacing medium and a vapor deposition channel connected to the cavity, and the vapor deposition gas can be discharged from the support member through the vapor deposition channel.

2. The evaporation source according to claim 1, characterized in that: The heat insulating member includes a shell in which the heat exchange channel is formed, and a medium inlet and a medium outlet formed in the shell, wherein the medium inlet and the medium outlet are in communication with the heat exchange channel.

3. The evaporation source according to claim 2, characterized in that: The medium inlet is connected to a first joint, and the first joint is used to connect to a medium storage box. The medium outlet is connected to a second joint, and the second joint is used to connect to a medium recovery box.

4. The evaporation source according to claim 2, characterized in that: The thermal insulation component also includes a barrier portion disposed in the shell, one end of which is connected to the inner wall of the shell and is located between the medium inlet and the medium outlet, and the barrier portion extends toward the interior of the shell to separate the heat exchange channel in the shell into a connected medium inlet channel and a medium outlet channel.

5. The evaporation source according to claim 4, characterized in that: The evaporation channel is located on an extension path of the barrier portion, and at least a portion of the barrier portion is arranged to avoid the evaporation channel.

6. The evaporation source according to claim 4, characterized in that: The barrier portion includes a first barrier section and a second barrier section, the number of the evaporation channels is at least two, and the at least two evaporation channels are arranged at intervals, one end of the first barrier section is connected to the inner wall of the shell, the other end of the first barrier section is connected to one of the evaporation channels, and the second barrier section is connected to two adjacent evaporation channels.

7. The evaporation source according to any one of claims 1 to 6, characterized in that: The thermal insulation member includes a first surface and a second surface opposite to each other, the first surface faces the support member, the evaporation channel is formed in the thermal insulation member and both ends of the evaporation channel respectively pass through the first surface and the second surface, and the evaporation channel is arranged corresponding to the evaporation member.

8. The evaporation source according to any one of claims 1 to 6, characterized in that: The evaporation source also includes: An insert plate is formed with an exhaust port and a plug-in portion connected to the exhaust port, an air guide cavity is formed in the plug-in portion, and the air guide cavity is respectively connected to the cavity body and the exhaust port, the plug-in portion can be detachably inserted into the evaporation channel, and the plug-in portion is used to isolate the evaporation gas from the inner wall of the evaporation channel.

9. The evaporation source according to claim 8, characterized in that: A handle is provided on one side of the inserting plate away from the heat insulating member.

10. The evaporation source according to claim 8, characterized in that: The evaporation source also includes: A support plate, wherein the support plate can be movably covered on the opening of the support member, the support plate is located between the support member and the heat insulating member, and a through opening is arranged on the support plate, which is connected with the evaporation channel.

11. The evaporation source according to claim 10, characterized in that: The support plate can slide in the plane where the opening is located, so that at least a part of the support plate is exposed from the support member.

12. The evaporation source according to claim 10, characterized in that: At least one of the heat insulating member, the support plate and the inserting plate is a metal member.

13. A vapor deposition device, characterized in that: The evaporation equipment comprises: A box body, the box body comprising a vapor deposition chamber; The evaporation source according to any one of claims 1 to 12, wherein the evaporation source is disposed in the evaporation chamber; A guide rail, located above the evaporation source; The base plate is slidably arranged on the guide rail, and the base plate carries a substrate.

14. The evaporation device according to claim 13, characterized in that: The evaporation equipment also includes: The baffle is movably disposed in the evaporation chamber and can block or open the evaporation channel of the evaporation source.

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