Refrigeration equipment

Abstract

The utility model relates to the technical field of refrigeration equipment, and discloses refrigeration equipment which comprises a box body and a radiator, and a cavity is formed in the box body; the radiator comprises a liquid storage box, a radiating pipe and a radiating plate, the liquid storage box is provided with an inner cavity for loading a heat-conducting medium, the liquid storage box is provided with an outlet and an inlet, the two ends of the radiating pipe are arranged at the outlet and the inlet, the radiating plate is arranged on the outer wall of the box body, and the radiating plate is arranged on the outer wall of the box body. The heat dissipation pipe is connected to the side wall, facing the cavity, of the heat dissipation plate. The radiating plate of the radiator is arranged on the outer wall of the box body, the radiating area is large, the contact area of the radiating pipe and the radiating plate is large, the heat exchange efficiency is high, the thickness of the radiating pipe and the thickness of the radiating plate are small, and the volume fraction of the box body can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration equipment, in particular to a refrigeration equipment. Background Art

[0002] Refrigeration equipment is a device used to provide temperature regulation, such as refrigerators and freezers, which can maintain a stable low-temperature environment and are used to keep food or other items at a low temperature. Among them, silent refrigerators use semiconductor refrigeration modules to provide cooling capacity. Usually, semiconductor refrigeration modules are connected to wire-tube radiators to help dissipate heat, but wire-tube radiators have a small heat dissipation area, low heat exchange efficiency, and occupy a large space, affecting the volume ratio of the refrigerator. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a refrigeration device, which adopts a tube-plate radiator and has the advantages of high heat exchange efficiency and small occupied space.

[0004] According to the refrigeration device of the embodiment of the utility model, it includes a box body and a radiator, wherein a chamber is formed inside the box body; the radiator includes a liquid storage box, a heat dissipation pipe and a heat dissipation plate, wherein the liquid storage box has an inner cavity for loading a heat-conducting medium, the liquid storage box is provided with an outlet and an inlet, both ends of the heat dissipation pipe are installed at the outlet and the inlet, the heat dissipation plate is arranged on the outer wall of the box body, and the heat dissipation pipe is connected to the side wall of the heat dissipation plate facing the chamber.

[0005] The refrigerator according to the embodiment of the utility model has at least the following beneficial effects:

[0006] The heat dissipation plate of the radiator is arranged on the outer wall of the box body, has a large heat dissipation area, a large contact area between the heat dissipation pipe and the heat dissipation plate, high heat exchange efficiency, and a small thickness of the heat dissipation pipe and the heat dissipation plate, which helps to improve the volume ratio of the box body.

[0007] According to some embodiments of the present invention, the outlet and the inlet are arranged on both sides of the liquid storage box, and the outlet is higher than the inlet.

[0008] According to some embodiments of the utility model, the radiator has a plurality of the heat dissipation pipes, and the plurality of the heat dissipation pipes are connected to the same outlet and the same inlet, or the number of the outlets, the number of the inlets and the number of the heat dissipation pipes correspond one to one.

[0009] According to some embodiments of the present utility model, the heat dissipation pipe is provided with a coil section, and the coil section is attached to the side wall of the heat dissipation plate.

[0010] According to some embodiments of the present utility model, the liquid storage box and the heat sink are an integrated structure, and the heat sink forms a part of the side wall of the inner cavity.

[0011] According to some embodiments of the utility model, the outer wall of the heat dissipation pipe is provided with a plane abutting against the heat dissipation plate, and the heat dissipation pipe and the heat dissipation plate are fixed by aluminum foil laminating, bonding or welding.

[0012] According to some embodiments of the utility model, the side wall of the heat dissipation plate is provided with an embedding groove, and the heat dissipation pipe is installed in the embedding groove.

[0013] According to some embodiments of the present utility model, the refrigeration device has a semiconductor refrigeration module, and the heat sink is connected to the hot end or the cold end of the semiconductor refrigeration module.

[0014] According to some embodiments of the present utility model, the liquid storage box has a heat-conducting side surface, the hot end or the cold end of the semiconductor refrigeration module is connected to the heat-conducting side surface, and the area of ​​the heat-conducting side surface is larger than the connection surface of the hot end or the cold end of the semiconductor refrigeration module.

[0015] According to some embodiments of the utility model, a box door is provided on the front of the box body, and the heat dissipation plate includes a back plate and at least one side plate, the back plate is arranged on the back side of the box body, and the side plate is arranged on the side of the box body.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of the structure of the radiator in the embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of a refrigerator as the refrigeration device in the embodiment of the utility model;

[0020] Figure 3 It is a schematic diagram of the structure of the radiator in some other embodiments of the utility model;

[0021] Figure 4 Schematic diagram of the structure of the radiator in other embodiments of the present invention.

[0022] The figures are as follows:

[0023] Box body 100, chamber 101, box door 110;

[0024] Radiator 200, liquid storage box 210, heat pipe 220, coil section 221, heat sink 230, back plate 231, side plate 232;

[0025] Semiconductor refrigeration module 300. DETAILED DESCRIPTION

[0026] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In the description of the utility model, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0029] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0030] Refrigeration equipment is a device used to provide temperature regulation, such as refrigerators, freezers, etc. Refrigerators can maintain a stable low-temperature environment and are used to keep food or other items at a low temperature. They are widely used. In related technologies, refrigerators use a refrigeration system to cool the compartments to maintain a low temperature. Currently, a type of silent refrigerator has emerged. Silent refrigerators use semiconductor refrigeration modules as the refrigeration system to avoid the operating noise of compressors and fans, meeting users' demand for low noise or even zero noise.

[0031] At present, semiconductor refrigeration modules mainly use wire-tube radiators to help dissipate heat. The main structure of the wire-tube radiator is a heat pipe and a metal wire or metal sheet installed on the heat pipe. Heat is dissipated to the outside air through the metal wire or metal sheet. However, the wire-tube radiator has the problems of small heat dissipation area and low heat dissipation efficiency, which leads to the need to use a larger wire-tube radiator to meet the heat dissipation needs. The large wire-tube radiator occupies the internal space of the refrigerator, affecting the volume ratio of the refrigerator. Therefore, it is necessary to develop a new radiator to replace the wire-tube radiator.

[0032] It is understandable that the refrigeration equipment may be a refrigerator, a freezer, or other forms of products. The following refrigeration equipment is described using a refrigerator as an example.

[0033] The embodiment of the utility model provides a refrigeration device, which adopts a plate-tube radiator. The radiator has the advantages of small occupied space and high heat dissipation efficiency.

[0034] It is understandable that the main body of the refrigerator is a box body, and a compartment is arranged inside the box body, and the compartment is usually divided into a refrigerator and a freezer. The refrigeration system commonly used in refrigerators can be a compression refrigeration, including a compressor, a condenser, a throttling device and an evaporator connected in sequence through pipelines. When the refrigeration system is running, the compressor compresses the sucked refrigerant gas, and then inputs the high-temperature and high-pressure refrigerant obtained after compression into the condenser, and uses the condenser to cool the refrigerant. The condensing fan blows air to the condenser to help the condenser cool down. The medium-temperature and high-pressure refrigerant output by the condenser is input into the throttling device. The throttling device plays a role in throttling and reducing pressure, reducing the temperature and pressure of the refrigerant, so that the refrigerant entering the evaporator becomes a low-pressure liquid with a lower saturation temperature. The refrigerant evaporates in the evaporator and absorbs heat from the outside air. The evaporating fan drives the airflow through the evaporator to produce cold air, which is input into the compartment to keep the compartment in a stable low-temperature environment for freezing or storing various items. Finally, the refrigerant returns to the compressor to complete a cycle.

[0035] It should be understood that the compressor, condensing fan, and evaporating fan will generate noise when in operation. For some special use environments or current high-end users, they are more sensitive to the operating noise of refrigerators and require quieter refrigerator products. Therefore, a type of silent refrigerator has been developed, which uses semiconductor refrigeration modules to generate cooling capacity and uses natural convection to cool the compartments. It does not require fans and can basically achieve zero noise.

[0036] Semiconductor refrigeration module is also called thermoelectric refrigeration sheet. Its advantage is that it has no sliding parts and is used in some places where space is limited, reliability is high, and there is no refrigerant pollution. Semiconductor refrigeration module can both cool and heat. By changing the polarity of DC current, it is determined whether to achieve cooling or heating on the same refrigeration sheet. Semiconductor refrigeration module uses PN junction composed of special semiconductor materials to form thermocouple pairs to produce Peltier effect. Its working principle is: when a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form an electric couple pair, after the DC current is connected in this circuit, energy transfer can be generated. The current flows from the N-type element to the joint of the P-type element to absorb heat and become the cold end, and the current flows from the P-type element to the joint of the N-type element to release heat and become the hot end. The size of heat absorption and heat release is determined by the size of the current and the number of element pairs of semiconductor materials N and P. The inside of the semiconductor refrigeration module is a thermopile composed of hundreds of pairs of electric couples to achieve the effect of enhanced cooling (heating). Therefore, the semiconductor refrigeration module has a cold end and a hot end, wherein the hot end needs to be connected to a radiator for heat dissipation to maintain the operation of the semiconductor refrigeration module, and the cold end is connected to the wall of the compartment, and the coldness of the cold end is used to reduce the wall temperature of the compartment, and then the temperature in the compartment is reduced through natural convection. Alternatively, the cold end is arranged in the air duct, and the air in the compartment is driven to circulate by a fan to reduce the temperature in the compartment. Since the air volume requirement is low, a low-noise fan can be used to minimize the operating noise of the refrigerator.

[0037] It is understandable that in order to help the hot end of the semiconductor refrigeration module dissipate heat, a radiator is connected to the hot end. The radiator traditionally used is a wire-tube radiator. The main structure of the wire-tube radiator is a plurality of heat dissipating tubes and metal wires or metal sheets installed on the heat dissipating tubes. Heat is dissipated to the outside air through the metal wires or metal sheets. The plurality of heat dissipating tubes are separated from each other and need to be separated in space. Therefore, the wire-tube radiator has the problems of small heat dissipation area and low heat dissipation efficiency, resulting in the need to use a larger wire-tube radiator to meet the heat dissipation needs. The large wire-tube radiator occupies the internal space of the refrigerator, affecting the volume ratio of the refrigerator.

[0038] Reference Figure 1 and Figure 2The embodiment of the utility model provides a refrigeration device. The refrigeration device is described below by taking a refrigerator as an example. The refrigerator includes a box body 100 and a radiator 200. A chamber 101 is formed inside the box body 100. The chamber 101 can be a refrigerator, a freezer, or both. The chamber 101 maintains a low temperature environment for placing various items to help preserve and preserve. It can be understood that the larger the chamber 101, the more convenient it is for users to use and to store more items, but the space size of the chamber 101 is limited by the volume of the radiator 200. In an embodiment of the utility model, the radiator 200 includes a liquid storage box 210, a heat dissipation pipe 220 and a heat dissipation plate 230. The liquid storage box 210 has an inner cavity for loading a heat-conducting medium. The heat-conducting medium can be a refrigerant, water or other heat-conducting fluid. The liquid storage box 210 is provided with an outlet and an inlet. Both ends of the heat dissipation pipe 220 are installed at the outlet and the inlet, thereby connecting the inner cavity of the liquid storage box 210. The heat dissipation plate 230 is arranged on the outer wall of the box body 100. On the one hand, the heat dissipation plate 230 can be set as a large-area plate. On the other hand, the heat dissipation plate 230 contacts the air outside the refrigerator to facilitate the dissipation of heat to the outside air. The heat dissipation pipe 220 is connected to the side wall of the heat dissipation plate 230 facing the chamber.

[0039] The heat dissipation plate 230 of the radiator 200 is arranged on the outer wall of the box 100. The heat dissipation plate 230 can be set as a large-area plate, and the radiator 200 has a large heat dissipation area. The heat dissipation plate 230 directly contacts the air outside the refrigerator, which is conducive to heat dissipation. The contact area between the heat dissipation pipe 220 and the heat dissipation plate 230 is large, and has a high heat dissipation efficiency. The heat at the hot end of the semiconductor refrigeration module can be quickly dissipated, which is conducive to maintaining the stable operation of the semiconductor refrigeration module. The thickness of the heat dissipation pipe 220 and the heat dissipation plate 230 is small, and the radiator 200 occupies less space, which is conducive to the design of the chamber 101 and the improvement of the volume ratio of the box 100. The chamber 101 can accommodate more items, which brings convenience to users.

[0040] It can be understood that the outlet and the inlet are arranged on both sides of the liquid storage box 210, and the outlet is located above the inlet. When the heat of the hot end of the semiconductor refrigeration module is transferred to the heat-conducting medium in the inner cavity of the liquid storage box 210, the heat-conducting medium can be a refrigerant, and the liquid refrigerant absorbs heat and evaporates. The gas refrigerant generated by evaporation is naturally concentrated at the upper end of the inner cavity of the liquid storage box 210. The outlet is arranged at a high position of the liquid storage box 210, which is conducive to the flow of the gas refrigerant and entering the heat dissipation pipe 220. The gas refrigerant flows in the heat dissipation pipe 220 and transfers heat to the heat dissipation plate 230. The heat is dissipated by the heat dissipation plate 230. After the gas refrigerant is cooled, it is recondensed into liquid refrigerant. The liquid refrigerant flows back from the inlet to the inner cavity of the liquid storage box 210. The position of the inlet is low, which is conducive to the liquid refrigerant flowing into the inner cavity. The refrigerant circulates and changes between gas and liquid. The heat is dissipated through the heat dissipation pipe 220 and the heat dissipation plate 230, which helps the hot end of the semiconductor refrigeration module to cool down and maintain the stable operation of the semiconductor refrigeration module. Especially when the semiconductor refrigeration module is running at high power, the hot end generates more heat. The heat sink 200 has the advantages of large heat dissipation area and high heat dissipation efficiency to help the hot end dissipate heat and cool down quickly, thereby meeting the heat dissipation requirements of the semiconductor refrigeration module.

[0041] It is understandable that the heat conducting medium may also be water. Water absorbs heat and evaporates. The water vapor generated by evaporation is naturally concentrated at the upper end of the inner cavity of the liquid storage box 210. The outlet is set at a high position of the liquid storage box 210, which is conducive to the flow of water vapor and entering the heat dissipation pipe 220. The water vapor flows in the heat dissipation pipe 220 and transfers heat to the heat dissipation plate 230. The heat is dissipated by the heat dissipation plate 230. After the water vapor cools down, it condenses into water again. The water flows back from the inlet to the inner cavity of the liquid storage box 210. The position of the inlet is low, which is conducive to the flow of water into the inner cavity. In addition, the heat conducting medium may also be other fluids as long as they can meet the requirements of heat conduction.

[0042] It is understandable that the outlet can also be set at the top of the liquid storage box 210, and the inlet can be set at the bottom of the liquid storage box 210. By utilizing the rising characteristics of the gas evaporated by the heat-conducting medium, the outlet at the top is conducive to discharging the gas, and the top surface of the inner cavity of the liquid storage box 210 can be set to a trumpet shape, which helps the gas to enter the heat dissipation pipe 220.

[0043] Reference Figure 1In some embodiments of the present invention, the heat pipe 220 includes a coil section 221, which is attached to the side wall of the heat dissipation plate 230. The coil section 221 has a zigzag shape, which increases the length of the heat pipe 220 in a limited space, has a compact layout, and can increase the contact area between the heat pipe 220 and the heat dissipation plate 230, thereby increasing the heat conduction speed and accelerating the heat dissipation. Moreover, since the coil section 221 has more turning positions, the gas flow rate generated by the evaporation of the heat-conducting medium can be limited, so that the heat exchange efficiency of the gas in the coil section 221 is higher, which is helpful for heat dissipation.

[0044] Reference Figure 4 In some embodiments of the present invention, the coil section 221 includes a plurality of staggered straight pipe sections and inclined pipe sections. Along the flow direction of the heat transfer medium gas, the inlet end of the coil section 221 is located at the upper end of the heat transfer plate 230, and the inclined pipe section is inclined downward, so that the heat transfer medium that is re-condensed into liquid after heat dissipation can quickly flow back to the inner cavity of the liquid storage box 210, preventing the heat transfer medium liquid from staying inside the coil section 221 and affecting the heat exchange efficiency.

[0045] The coil section 221 may also include multiple inclined pipe sections, which are connected in sequence through bends. Along the flow direction of the heat transfer medium gas, the inlet end of the coil section 221 is located at the upper end of the heat sink 230, and the inclined pipe sections are all inclined downward, so that the heat transfer medium that is re-condensed into liquid after heat dissipation can quickly flow back to the inner cavity of the liquid storage box 210, preventing the heat transfer medium liquid from staying inside the coil section 221 and affecting the heat exchange efficiency.

[0046] In addition, the coil section 221 can also be set to a spiral shape, such as a single spiral or double spiral structure. The total length of the coil section 221 is larger, the contact area between the coil section 221 and the heat sink 230 is larger, and the heat dissipation efficiency is higher, but the production cost will also increase. The design can be based on the heat dissipation requirements of the semiconductor refrigeration module and the size of the heat sink 230 to select a suitable shape and structure.

[0047] It can be understood that in some embodiments of the present invention, in order to increase the contact area between the heat pipe 220 and the heat sink 230 to accelerate heat dissipation, the heat pipe 220 can be set to a flat tube or other shapes, that is, the outer wall of the heat pipe 220 is provided with a plane abutting the heat sink 230. Compared with a round tube, the heat pipe 220 is provided with a plane abutting the heat sink 230, which increases the contact area between the heat pipe 220 and the heat sink 230, which is beneficial to accelerate heat conduction and improve heat dissipation efficiency.

[0048] It is understandable that the heat pipe 220 and the heat sink 230 need to be in close contact, which is conducive to accelerating heat conduction to improve heat dissipation efficiency. The heat pipe 220 and the heat sink 230 can be fixed together by bonding, such as bonding the heat pipe 220 and the heat sink 230 with aluminum foil, or bonding the heat pipe 220 and the heat sink 230 with sticky thermal grease. The heat pipe 220 and the heat sink 230 can be directly heat-conducted, and the aluminum foil or thermal grease can also conduct heat, which is conducive to accelerating heat conduction and improving the heat dissipation effect.

[0049] It is understandable that the heat pipe 220 and the heat plate 230 can also be fixed by welding. The heat pipe 220 and the heat plate 230 are welded together, tightly combined, and have good heat conduction effect. The heat pipe 220 and the heat plate 230 can be welded by brazing, and the brazing material is made of a high thermal conductivity material such as copper alloy, silver alloy, etc., which is conducive to heat conduction.

[0050] In addition, the heat sink 230 can also be connected to a pressure plate. The heat sink 230 and the pressure plate cooperate to clamp the heat sink 220. The pressure plate can also help conduct heat, so that both sides of the heat sink 220 can conduct heat, thereby accelerating the speed of heat dissipation. It should be understood that the heat sink 220 and the heat sink 230 are both made of metal materials with good thermal conductivity, and materials such as copper alloy and aluminum alloy can be selected to help accelerate heat dissipation. Moreover, the side of the heat sink 230 facing away from the heat sink 220 can be a plane, or it can be provided with raised heat sink fins and other structures to increase the contact area between the heat sink 230 and the air and accelerate the heat dissipation.

[0051] It is understandable that in other embodiments of the present invention, an embedding groove is provided on the side wall of the heat sink 230, and the heat sink 220 is installed in the embedding groove. The shape of the embedding groove is consistent with the shape of the heat sink 220, which can increase the contact area between the heat sink 220 and the heat sink 230, accelerate the heat conduction, and improve the heat dissipation efficiency. In addition, when the heat sink 220 is installed in the embedding groove, thermal conductive silicone grease can be first applied to the inner wall of the embedding groove to eliminate the gap between the heat sink 220 and the heat sink 230, thereby improving the heat dissipation efficiency; or, after the heat sink 220 is installed in the embedding groove, the heat sink 220 and the heat sink 230 are welded together, which can achieve the purpose of fixed connection and improve the heat dissipation efficiency.

[0052] Reference Figure 1The radiator 200 may use one heat pipe 220, or may use multiple heat pipes 220. Multiple heat pipes 220 can increase the contact area with the heat sink 230 and improve the heat dissipation efficiency. The multiple heat pipes 220 may share one outlet and one inlet, or the number of outlets, the number of inlets and the number of heat pipes 220 may correspond one to one, and each heat pipe 220 may correspond to one outlet and one inlet. The multiple heat pipes 220 may also be cross-connected with each other to facilitate the flow of the heat transfer medium.

[0053] Reference Figure 2 In some embodiments of the present invention, the liquid storage box 210 and the heat sink 230 are an integrated structure, and the heat sink 230 forms part of the side wall of the inner cavity. When the heat-conducting medium in the inner cavity of the liquid storage box 210 is heated by the hot end of the semiconductor refrigeration module, part of the heat can be directly transferred to the heat sink 230. It should be understood that the volume of the inner cavity of the liquid storage box 210 is determined according to the heat-conducting medium, and in order to reduce the occupied space, the liquid storage box 210 is set to a relatively flat shape, and the part of the side wall formed by the heat sink 230 has a larger area, and more heat can be directly transferred.

[0054] Reference Figure 2 A silent refrigerator is proposed. The silent refrigerator includes a box body 100, a radiator 200 and a semiconductor refrigeration module 300. A chamber 101 is formed inside the box body 100. The chamber 101 is used to place various items. A door 110 is provided on the front of the box body 100 to open or close the chamber 101. The radiator 200 and the semiconductor refrigeration module 300 are arranged on the back of the box body 100. The radiator 200 includes a liquid storage box 210, a heat dissipation pipe 220 and a heat dissipation plate 230. The liquid storage box 210 has an inner cavity for loading a heat-conducting medium. The heat-conducting medium can be a refrigerant, water or other heat-conducting fluid. The box 210 is provided with an outlet and an inlet, and both ends of the heat dissipation pipe 220 are installed at the outlet and the inlet, so as to connect the inner cavity of the liquid storage box 210. The heat dissipation plate 230 is arranged on the outer wall of the box body 100. On the one hand, the heat dissipation plate 230 can be set as a large-area plate, and on the other hand, the heat dissipation plate 230 contacts the air outside the refrigerator, which is convenient for dissipating heat to the outside air. The heat dissipation pipe 220 is connected to the side wall of the heat dissipation plate 230 facing the chamber, and the hot end or the cold end of the semiconductor refrigeration module 300 is connected to the liquid storage box 210. The liquid storage box 210 can use a metal material with excellent thermal conductivity to transfer heat to the heat-conducting medium.

[0055] It should be understood that the silent refrigerator uses the semiconductor refrigeration module 300 as the refrigeration system, which eliminates the noise of components such as the compressor, so that the operating noise of the refrigerator is greatly reduced, and can even run with zero noise.

[0056] When the silent refrigerator needs to be refrigerated, the cold end of the semiconductor refrigeration module 300 contacts the wall of the chamber 101, and the cold energy is input into the chamber 101. The hot end of the semiconductor refrigeration module 300 transfers the heat to the heat-conducting medium in the liquid storage box 210. The heat-conducting medium is a refrigerant. The liquid refrigerant absorbs heat and evaporates. The gas refrigerant generated by evaporation is naturally concentrated at the upper end of the inner cavity of the liquid storage box 210. The outlet is set at a high position of the liquid storage box 210, which is conducive to the flow of the gas refrigerant and entering the heat dissipation pipe 220. The gas refrigerant flows in the heat dissipation pipe 220 and transfers the heat to the heat dissipation plate 230. The heat is dissipated by the heat dissipation plate 230. After the gas refrigerant is cooled, it is recondensed into liquid refrigerant. The liquid refrigerant flows back from the inlet to the inner cavity of the liquid storage box 210. The position of the inlet is low, which is conducive to the liquid refrigerant flowing into the inner cavity. The refrigerant circulates and changes between gas and liquid. The heat is dissipated through the heat dissipation pipe 220 and the heat dissipation plate 230, which helps the hot end of the semiconductor refrigeration module to cool down and maintain the stable operation of the semiconductor refrigeration module.

[0057] When the silent refrigerator needs to heat (such as defrosting), the hot end of the semiconductor refrigeration module 300 contacts the wall of the chamber 101 to input heat into the chamber 101, while the cold end of the semiconductor refrigeration module 300 transfers the cold to the heat-conducting medium in the liquid storage box 210, and uses the radiator 200 to help dissipate the cold.

[0058] It can be understood that the liquid storage box 210 is provided with a heat-conducting side surface, and the hot end or the cold end of the semiconductor refrigeration module is abutted against the heat-conducting side surface, in close contact, which is conducive to heat conduction, and the area of ​​the heat-conducting side surface is larger than the connecting surface of the hot end or the cold end of the semiconductor refrigeration module, so that the heat conduction speed is faster.

[0059] Reference Figure 2 Considering that the box 100 has 6 sides, the front side of which is the box door, the heat sink 230 can be arranged on the other 5 sides. The heat sink 230 can be composed of a back plate 231 and at least one side plate 232. The back plate is arranged on the back of the box 100, and the side plate is arranged on the side of the box 100. Figure 3 As shown, the heat sink 230 includes a back plate 231 and two side plates 232. The back plate 231 is distributed on the back of the box 100, and the two side plates 232 are arranged on the left and right sides of the box 100. The distribution area of ​​the heat pipe 220 includes the back plate and the two side plates. The heat sink 230 has a larger heat dissipation area, and the heat dissipation capacity of the radiator 200 is better.

[0060] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Refrigeration equipment, characterized in that include: A box body, wherein a chamber is formed inside the box body; The radiator comprises a liquid storage box, a heat dissipation pipe and a heat dissipation plate. The liquid storage box has an inner cavity for loading a heat-conducting medium. The liquid storage box is provided with an outlet and an inlet. Both ends of the heat dissipation pipe are installed at the outlet and the inlet. The heat dissipation plate is arranged on the outer wall of the box body. The heat dissipation pipe is connected to the side wall of the heat dissipation plate facing the chamber.

2. The refrigeration equipment according to claim 1, characterized in that: The outlet and the inlet are arranged at both sides of the liquid storage box, and the outlet is higher than the inlet.

3. The refrigeration equipment according to claim 1, characterized in that: The radiator has a plurality of heat dissipation pipes, and the plurality of heat dissipation pipes are connected to the same outlet and the same inlet, or the number of the outlets, the number of the inlets and the number of the heat dissipation pipes correspond one to one.

4. The refrigeration equipment according to claim 1, characterized in that: The heat dissipation pipe is provided with a coil section, and the coil section is attached to the side wall of the heat dissipation plate.

5. The refrigeration equipment according to claim 1, characterized in that: The liquid storage box and the heat sink are an integrated structure, and the heat sink forms a part of the side wall of the inner cavity.

6. The refrigeration device according to claim 1, characterized in that: The outer wall of the heat dissipation pipe is provided with a plane abutting against the heat dissipation plate, and the heat dissipation pipe and the heat dissipation plate are fixed by aluminum foil lamination, bonding or welding.

7. The refrigeration device according to claim 1, characterized in that: The side wall of the heat dissipation plate is provided with an embedding groove, and the heat dissipation pipe is installed in the embedding groove.

8. The refrigeration device according to claim 1, characterized in that: The refrigeration device has a semiconductor refrigeration module, and the heat sink is connected to the hot end or the cold end of the semiconductor refrigeration module.

9. The refrigeration device according to claim 8, characterized in that: The liquid storage box has a heat-conducting side surface, the hot end or the cold end of the semiconductor refrigeration module is connected to the heat-conducting side surface, and the area of ​​the heat-conducting side surface is larger than the connection surface of the hot end or the cold end of the semiconductor refrigeration module.

10. The refrigeration device according to claim 8, characterized in that: A box door is arranged on the front side of the box body, and the heat dissipation plate includes a back plate and at least one side plate. The back plate is arranged on the back side of the box body, and the side plate is arranged on the side of the box body.

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