Mainboard replacement assembly and test equipment

Abstract

The utility model provides a mainboard replacement assembly and test equipment, and relates to the technical field of chip test. The mainboard replacement assembly comprises a first testing mechanism and a second testing mechanism detachably arranged on the first testing mechanism, a first connecting part is arranged between the second testing mechanism and the first testing mechanism, and the first connecting part is used for achieving connection between the second testing mechanism and the first testing mechanism; the second testing mechanism comprises a second connecting part connected with the first connecting part, and a testing part is arranged on the second connecting part. According to the testing device, the first testing mechanism and the second testing mechanism are arranged, the testing part is connected to the first testing mechanism through the first connecting part and the second connecting part, when the testing part is damaged, only the first connecting part and the testing part need to be replaced, the first testing mechanism can be repeatedly used, and then resource waste is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a mainboard replacement component and testing equipment. Background Art

[0002] After the finished chip is produced and before it enters the market, it must be tested. Only chips that pass the test can enter the market. The test method is to contact each pin of the test chip with the corresponding contact on the test circuit board, and power on to test the conduction of the circuit board. Generally, the components on the circuit board are fixedly contacted with the circuit board by welding. Due to the frequent replacement of the test chip, it is impossible to weld it on the test circuit board for testing, so a test socket is needed;

[0003] In the prior art, the test socket is usually directly fixed to the circuit board. When the test socket is damaged, it may be scrapped together with the circuit board. However, due to the testing requirements, some corresponding components are set on the circuit board. The scrapping of the connected circuit board will lead to a waste of resources. Therefore, we make improvements on this and propose a motherboard replacement component and testing equipment.

[0004] For example: Chinese utility model patent: CN216388771U, discloses "a memory chip test socket", and its specification discloses: a memory chip test socket, comprising a test socket base plate, a test circuit board and a test socket cover plate, the test socket cover plate is installed on the test socket base plate, and the test circuit board is installed between the test socket base plate and the test socket cover plate; the above patent can prove the defects of the prior art. Summary of the invention

[0005] The purpose of the utility model is to address the problem that most existing test sockets are directly fixed to the circuit board. When the test socket is damaged, it may be scrapped together with the circuit board. However, some corresponding components are set on the circuit board due to testing requirements. The scrapping of the connected circuit board will lead to a waste of resources.

[0006] In order to achieve the above-mentioned purpose of the invention, the utility model provides a motherboard replacement component and a testing device to improve the above-mentioned problem.

[0007] The specific application is as follows:

[0008] A motherboard replacement component includes a test mechanism 1 and a test mechanism 2 detachably arranged on the test mechanism 1, a connecting part 1 is arranged between the test mechanism 2 and the test mechanism 1, and the connecting part 1 is used to realize the connection between the test mechanism 2 and the test mechanism 1; the test mechanism 2 includes a connecting part 2 connected to the connecting part 1, and a test part is arranged on the connecting part 2.

[0009] As a preferred technical solution of the present application, the test mechanism 1 includes a test circuit board, and a display screen is coupled to the test circuit board.

[0010] As a preferred technical solution of the present application, the second connecting part includes a connecting circuit board placed on top of the test circuit board, and the test part includes a plurality of test sockets coupled to the top of the connecting circuit board.

[0011] As a preferred technical solution of the present application, the test socket is connected to the test circuit board by connecting the circuit board and the connecting part 1, and the connecting circuit board is separated from the test circuit board to realize the replacement of the test mechanism 2.

[0012] As a preferred technical solution of the present application, the first connecting portion includes a connector coupled to the top of the test circuit board, a gold finger is inserted into the connector, and the gold finger is connected to the connecting circuit board.

[0013] As a preferred technical solution of the present application, a groove is provided on the top of the test circuit board, and the groove is located on one side of the bottom of the connector.

[0014] As a preferred technical solution of the present application, a plurality of mounting members are provided on the test circuit board, and the mounting members include a plurality of mounting holes, and the plurality of mounting holes are all opened on the test circuit board.

[0015] A testing device uses a mainboard replacement component, wherein a limiting portion is arranged between the testing circuit board and one side of a connecting circuit board, and the limiting portion is used to achieve the limiting of the connecting circuit board.

[0016] As a preferred technical solution of the present application, the limiting portion includes a limiting baffle located between the test circuit board and the side of the connection circuit board, and a plurality of through holes are formed on the limiting baffle.

[0017] As a preferred technical solution of the present application, a space-avoiding area is provided on the top of the test circuit board, and the connection circuit board is located in the space-avoiding area.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] In the scheme of this application:

[0020] In order to solve the problem that in the prior art, the test socket is mostly directly fixed to the circuit board, and may be scrapped together with the circuit board when the test socket is damaged, but some corresponding components are set on the circuit board due to testing requirements, and the scrapping of the connected circuit board will lead to waste of resources, the present application provides a test mechanism one and a test mechanism two, and the test part is connected to the test mechanism one through the connection part one and the connection part two. When the test part is damaged, the connection part one and the test part can be replaced, and the test mechanism one can be reused, thereby reducing the waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of the motherboard replacement components and test equipment provided for this application;

[0022] Figure 2 A schematic diagram of the top view of the mainboard replacement assembly and test equipment provided for this application;

[0023] Figure 3 A schematic diagram of the structure of the test circuit board provided for this application;

[0024] Figure 4 This is a schematic diagram of the structure of the connection circuit board provided in this application.

[0025] Indicated in the figure:

[0026] 1. Test mechanism one; 101. Test circuit board; 102. Display screen; 104. Groove; 2. Test mechanism two; 201. Connecting circuit board; 202. Test socket; 3. Limit baffle; 4. Through hole; 5. Connector; 6. Gold finger. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0028] As described in the background technology, in the prior art, the test socket is mostly fixed directly to the circuit board. When the test socket is damaged, it may be scrapped together with the circuit board. However, some corresponding components are set on the circuit board due to testing requirements. The scrapping of the connected circuit board will lead to a waste of resources.

[0029] In order to solve this technical problem, the utility model provides a mainboard replacement component and testing equipment, which are used to reduce the waste of resources.

[0030] Specifically, please refer to Figure 1-4 , the motherboard replacement components specifically include:

[0031] A test mechanism 1 and a test mechanism 2 2 detachably arranged on the test mechanism 1 , a connecting portion 1 is arranged between the test mechanism 2 2 and the test mechanism 1 , and the connecting portion 1 is used to realize the connection between the test mechanism 2 2 and the test mechanism 1 1; the test mechanism 2 2 includes a connecting portion 2 connected to the connecting portion 1, and a test portion is arranged on the connecting portion 2.

[0032] The utility model provides a motherboard replacement component and a testing device. The present application sets up a testing mechanism 1 and a testing mechanism 2. The testing part is connected to the testing mechanism 1 through a connecting part 1 and a connecting part 2. When the testing part is damaged, the connecting part 1 and the testing part can be replaced. The testing mechanism 1 can be reused, thereby reducing the waste of resources.

[0033] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0034] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0036] Example 1

[0037] Please refer to Figure 1-4 A motherboard replacement component includes a test mechanism 1 and a test mechanism 2 2 detachably arranged on the test mechanism 1, a connecting portion 1 is arranged between the test mechanism 2 2 and the test mechanism 1, and the connecting portion 1 is used to realize the connection between the test mechanism 2 2 and the test mechanism 1; the test mechanism 2 2 includes a connecting portion 2 connected to the connecting portion 1, a test portion is arranged on the connecting portion 2, and the test portion is connected to the test mechanism 1 through the connecting portion 1 and the connecting portion 2. When the test portion is damaged, the connecting portion 1 and the test portion can be replaced, and the test mechanism 1 can be reused, thereby reducing the waste of resources.

[0038] Further, such as Figure 1-3 As shown, the test mechanism 1 includes a test circuit board 101, and a display screen 102 is coupled to the test circuit board 101. The display screen 102 is used to display test parameters.

[0039] Further, such as Figure 1 and Figure 4 As shown, the second connection part includes a connection circuit board 201 placed on the top of the test circuit board 101, and the test part includes a plurality of test sockets 202 coupled to the top of the connection circuit board 201. The connection circuit board 201 is only used as a connection test socket 202, and the electronic components related to the chip test are all arranged on the test circuit board 101, thereby reducing the waste of resources.

[0040] Further, such as Figure 1As shown, the test socket 202 is connected to the test circuit board 101 by connecting the circuit board 201 and the connecting part 1. The connecting circuit board 201 is separated from the test circuit board 101 to realize the replacement of the test mechanism 2, so that when the test socket 202 is damaged, there is no need to replace the entirety, thereby reducing the cost of use.

[0041] Example 2

[0042] The motherboard replacement assembly provided in Example 1 is further optimized, specifically, Figure 1-4 As shown, the connecting part 1 includes a connector 5 coupled to the top of the test circuit board 101, a gold finger 6 is inserted in the connector 5, and the gold finger 6 is connected to the connecting circuit board 201. The gold finger 6 is inserted into the connector 5 to realize the connection between the connecting circuit board 201 and the test circuit board 101, and further realize the connection between the test socket 202 and the test circuit board 101. The connecting circuit board 201 can be removed by pulling the connecting circuit board 201 to separate the gold finger 6 from the connector 5, and the connecting circuit board 201 can be installed by inserting the gold finger 6 into the gold finger 6.

[0043] Further, such as Figure 3 As shown, a groove 104 is provided on the top of the test circuit board 101 , and the groove 104 is located on one side of the bottom of the connector 5 . The setting of the groove 104 can provide sufficient space under the connector 5 for convenient use.

[0044] Further, such as Figure 1 As shown, the test circuit board 101 is provided with a plurality of mounting parts, the mounting parts include a plurality of mounting holes, and the plurality of mounting holes are all opened on the test circuit board 101. The mounting holes are used to cooperate with bolts to fix the test circuit board 101 on the test box.

[0045] Example 3

[0046] Please refer to Figure 2-3 A testing device uses a motherboard replacement component. A limiting portion is set between the test circuit board 101 and one side of the connecting circuit board 201. The limiting portion is used to limit the connecting circuit board 201, that is, during use, it can reduce the force movement of the connecting circuit board 201 during the engagement of the test socket 202 and the process of taking and placing the chip, thereby improving the stability of the connecting circuit board 201 during use.

[0047] Further, such as Figure 3 As shown, the limiting part includes a limiting baffle 3 located between the test circuit board 101 and the side of the connecting circuit board 201. A plurality of through holes 4 are provided on the limiting baffle 3. The connecting circuit board 201 can be limited by the limiting baffle 3. The through holes 4 are used to cooperate with bolts to fix the limiting baffle 3 on the test box.

[0048] Further, such as Figure 3 As shown, a clearance area is provided on the top of the test circuit board 101, and the connection circuit board 201 is located in the clearance area.

[0049] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A motherboard replacement assembly, characterized in that: The invention comprises a test mechanism 1 (1) and a test mechanism 2 (2) detachably arranged on the test mechanism 1 (1), wherein a connecting portion 1 is arranged between the test mechanism 2 (2) and the test mechanism 1 (1), and the connecting portion 1 is used to realize the connection between the test mechanism 2 (2) and the test mechanism 1 (1); the test mechanism 2 (2) comprises a connecting portion 2 connected to the connecting portion 1, and a test portion is arranged on the connecting portion 2.

2. A motherboard replacement assembly according to claim 1, characterized in that: The test mechanism 1 (1) comprises a test circuit board (101), to which a display screen (102) is coupled.

3. A motherboard replacement assembly according to claim 2, characterized in that: The second connection part comprises a connection circuit board (201) placed on the top of the test circuit board (101), and the test part comprises a plurality of test sockets (202) coupled to the top of the connection circuit board (201).

4. A motherboard replacement assembly according to claim 3, characterized in that: The test socket (202) is connected to the test circuit board (101) through the connection circuit board (201) and the first connection part, and the connection circuit board (201) is separated from the test circuit board (101) to realize the replacement of the second test mechanism (2).

5. A motherboard replacement assembly according to claim 4, characterized in that: The first connection part comprises a connector (5) coupled to the top of the test circuit board (101), a gold finger (6) being inserted into the connector (5), and the gold finger (6) being connected to the connection circuit board (201).

6. A motherboard replacement assembly according to claim 5, characterized in that: The top of the test circuit board (101) is provided with a groove (104), and the groove (104) is located on one side of the bottom of the connector (5).

7. A motherboard replacement assembly according to claim 6, characterized in that: The test circuit board (101) is provided with a plurality of mounting parts, the mounting parts comprising a plurality of mounting holes, and the plurality of mounting holes are all opened on the test circuit board (101).

8. A test device using the motherboard replacement assembly as claimed in claim 7, characterized in that: A limiting portion is provided between the test circuit board (101) and one side of the connecting circuit board (201), and the limiting portion is used to limit the connecting circuit board (201).

9. A testing device according to claim 8, characterized in that: The limiting portion comprises a limiting baffle (3) located between the sides of the test circuit board (101) and the connection circuit board (201), and a plurality of through holes (4) are formed on the limiting baffle (3).

10. A testing device according to claim 9, characterized in that: A clearing area is provided on the top of the test circuit board (101), and the connecting circuit board (201) is located in the clearing area.

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