Semiconductor wafer testing device with heat dissipation device

Abstract

The utility model relates to the technical field of testing devices, and discloses a semiconductor wafer testing device with a heat dissipation device, which comprises a supporting plate, a fixing frame is fixedly arranged at the top of an operation plate, a tester is fixedly arranged at the bottom of the fixing frame, and the supporting plate is fixedly arranged at the top of the operation plate. Supporting legs are fixedly installed at the bottom of the operation panel, a cooling mechanism is arranged on the front face of the tester, the cooling mechanism comprises a fixed block, the fixed block is fixedly installed on the front face of the tester, a movable rod is arranged on the fixed block, a cooling fin is fixedly installed on one side of the movable rod, and the cooling fin is fixedly installed on the other side of the movable rod. And a connecting rod is fixedly mounted on one side of the cooling fin. And by arranging the cooling mechanism, the tester is cooled, so that the tester is not easy to be overheated due to long-time work, and the use convenience of the testing device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of testing devices, in particular to a semiconductor wafer testing device with a heat dissipation device. Background Art

[0002] Semiconductor is a production material with conductivity between conductors and insulators at room temperature. Among them, the more common semiconductor materials are silicon, germanium, gallium arsenide, etc. Nowadays, semiconductors play a very important role in industrial production. Various electronic products contain semiconductor devices to a greater or lesser extent. The development of economy and science and technology cannot be separated from semiconductors. The processing of semiconductors is an indispensable part of applying materials to actual production. During the processing of semiconductor wafers, they need to be tested to determine whether they meet the use standards. It is often necessary to use clamping tooling to clamp and fix the semiconductor wafers for testing.

[0003] After searching, the Chinese patent with publication number: CN217542838U discloses a clamping device for semiconductor wafer testing, including a base plate, a connecting rod is fixed on the top of the base plate, a clamping assembly is fixed on the top of the connecting rod, a constraint belt is connected to the clamping assembly, a mounting rod is fixed on the lower side of the base plate, a clamping rod is slidably connected to the connecting frame, a limiting plate is fixed on one side of the clamping rod, and a clamping plate is fixed on the other side, a spring is sleeved on the periphery of the clamping rod, and the spring is located between the clamping plate and the connecting frame, two connecting frames are provided, which are arranged oppositely and connected by a constraint belt, a rubber pad is fixed on the clamping plate, and the constraint belt is made of a flat rubber band. The utility model has a simple structure and is easy to operate, can meet the needs of clamping and fixing semiconductor wafers of different shapes, and is worthy of popularization and use.

[0004] but:

[0005] In the prior art, the test device still has the problem of being inconvenient to cool down the tester when in use, so improvement is needed. Utility Model Content

[0006] 1. Technical issues to be resolved

[0007] In view of the shortcomings of the prior art, the utility model provides a semiconductor wafer testing device with a heat dissipation device. The advantage is that the cooling mechanism is provided to cool the tester, so that the tester is not easily damaged by high temperature, which is conducive to improving the convenience of using the tester.

[0008] (II) Technical solution

[0009] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor wafer testing device with a heat dissipation device, comprising an operating panel, a fixing frame is fixedly installed on the top of the operating panel, a tester is fixedly installed on the bottom of the fixing frame, a support plate is fixedly installed on the top of the operating panel, a supporting leg is fixedly installed on the bottom of the operating panel, and a cooling mechanism is arranged on the front of the tester, and the cooling mechanism comprises: a fixed block, the fixed block is fixedly installed on the front of the tester, a moving rod is arranged on the fixed block, a heat sink is fixedly installed on one side of the moving rod, and a connecting rod is fixedly installed on one side of the heat sink. The cooling mechanism is arranged to cool the tester.

[0010] Preferably, a connecting block is fixedly mounted on one side of the connecting rod, a rack is fixedly mounted on one side of the connecting block, a motor is fixedly mounted on one side of the tester, and a gear is fixedly mounted on the output end of the motor. The connecting rod is provided to facilitate the movement of the heat sink.

[0011] Preferably, the moving rod passes through the fixed block and is movably connected with the fixed block, the gear and the rack are meshed with each other, and a fan is arranged on the front of the fixed frame. The gear is arranged to drive the rack to move.

[0012] Preferably, a cleaning mechanism is provided on the top of the operating panel, and the cleaning mechanism comprises: a groove, the groove is provided on the top of the operating panel, and a mounting block is fixedly installed inside the groove. The cleaning mechanism is provided to clean the surface of the support plate.

[0013] Preferably, a mounting rod is provided on the mounting block, a brush is fixedly installed on the top of the mounting rod, and a handle is fixedly installed on one end of the mounting rod. The mounting rod is provided to drive the brush to move.

[0014] Preferably, the mounting rod passes through the mounting block and is movably connected to the mounting block, and the bottom of the brush contacts the top of the support plate. The brush is provided to clean the surface of the support plate.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the utility model provides a semiconductor wafer testing device with a heat dissipation device, which has the following beneficial effects:

[0017] 1. A semiconductor wafer testing device with a heat dissipation device cools down the tester by setting a cooling mechanism, so that the tester is not easily overheated due to long-term work, which is beneficial to improving the convenience of using the testing device; a motor is set to drive the gear to rotate, so that the gear drives the rack to move, the rack drives the connecting block to move, the connecting block drives the connecting rod to move, and the connecting rod drives the heat sink to move, so that the heat sink cools the tester.

[0018] 2. This semiconductor wafer testing device with a heat dissipation device plays a role in cleaning the surface of the pallet by setting a cleaning mechanism, so that dust is not easily accumulated on the surface of the pallet, which is beneficial to improving the convenience of using the testing device; and plays a role in driving the installation rod to move by setting a handle, so that the installation rod drives the brush to move, and the brush cleans the surface of the pallet, which plays a role in preventing dust from accumulating on the pallet. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 It is a top view of the utility model;

[0022] Figure 3 It is an enlarged view of point A of the present utility model.

[0023] In the figure: 1. operating panel; 2. fixing frame; 3. tester; 4. support plate; 5. supporting leg; 6. cooling mechanism; 7. cleaning mechanism; 601. fixing block; 602. moving rod; 603. heat sink; 604. connecting rod; 605. connecting block; 606. rack; 607. motor; 608. gear; 701. groove; 702. mounting block; 703. mounting rod; 704. brush; 705. handle. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Example 1

[0026] like Figure 1-3As shown, the utility model provides a semiconductor wafer testing device with a heat dissipation device, including an operating panel 1, a fixing frame 2 is fixedly installed on the top of the operating panel 1, a tester 3 is fixedly installed on the bottom of the fixing frame 2, a support plate 4 is fixedly installed on the top of the operating panel 1, a supporting leg 5 is fixedly installed on the bottom of the operating panel 1, and a cooling mechanism 6 is arranged on the front of the tester 3. The cooling mechanism 6 includes: a fixing block 601, the fixing block 601 is fixedly installed on the front of the tester 3, a moving rod 602 is arranged on the fixing block 601, a heat sink 603 is fixedly installed on one side of the moving rod 602, and a connecting rod 604 is fixedly installed on one side of the heat sink 603. The cooling mechanism 6 is arranged to cool the tester 3, so that the tester 3 is not easy to overheat due to long-term work, which is beneficial to improving the test device For ease of use, a connecting block 605 is fixedly installed on one side of the connecting rod 604, a rack 606 is fixedly installed on one side of the connecting block 605, a motor 607 is fixedly installed on one side of the tester 3, and a gear 608 is fixedly installed on the output end of the motor 607. By setting the motor 607, the gear 608 is driven to rotate, so that the gear 608 drives the rack 606 to move, and the rack 606 drives the connecting block 605 to move, and the connecting block 605 drives the connecting rod 604 to move, so that the connecting rod 604 drives the heat sink 603 to move, so that the heat sink 603 cools the tester 3, the moving rod 602 passes through the fixed block 601 and is movably connected to the fixed block 601, the gear 608 and the rack 606 are meshed with each other, and a fan is arranged on the front of the fixed frame 2.

[0027] In this embodiment, the cooling mechanism 6 is provided to cool the tester 3, so that the tester 3 is not easily overheated due to long-term operation; the motor 607 is provided to drive the gear 608 to rotate, so that the gear 608 drives the rack 606 to move, and the rack 606 drives the connecting block 605 to move, and the connecting block 605 drives the connecting rod 604 to move, and the connecting rod 604 drives the heat sink 603 to move, so that the heat sink 603 cools the tester 3.

[0028] Example 2

[0029] like Figure 1-3As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, a cleaning mechanism 7 is provided on the top of the operating panel 1, and the cleaning mechanism 7 includes: a groove 701, the groove 701 is opened on the top of the operating panel 1, and a mounting block 702 is fixedly installed inside the groove 701. By setting the cleaning mechanism 7, the surface of the support plate 4 is cleaned, so that dust is not easily accumulated on the surface of the support plate 4, which is beneficial to improving the convenience of using the testing device. A mounting rod 703 is provided on the mounting block 702, and a brush 704 is fixedly installed on the top of the mounting rod 703. A handle 705 is fixedly installed at one end of the mounting rod 703. By setting the handle 705, the mounting rod 703 is driven to move, so that the mounting rod 703 drives the brush 704 to move, so that the brush 704 cleans the surface of the support plate 4, which prevents dust from accumulating on the support plate 4. The mounting rod 703 passes through the mounting block 702 and is movably connected to the mounting block 702, and the bottom of the brush 704 contacts the top of the support plate 4.

[0030] In this embodiment, the cleaning mechanism 7 is provided to clean the surface of the pallet 4, so that dust is not easily accumulated on the surface of the pallet 4; the handle 705 is provided to drive the mounting rod 703 to move, so that the mounting rod 703 drives the brush 704 to move, and the brush 704 cleans the surface of the pallet 4, thereby preventing dust from accumulating on the pallet 4.

[0031] The working principle of the semiconductor wafer testing device with a heat dissipation device is described in detail below.

[0032] like Figure 1-3 As shown, when in use, the motor 607 is provided to drive the gear 608 to rotate, so that the gear 608 drives the rack 606 to move, and the rack 606 drives the connecting block 605 to move, and the connecting block 605 drives the connecting rod 604 to move, so that the connecting rod 604 drives the heat sink 603 to move, so that the heat sink 603 cools the tester 3, and the handle 705 is provided to drive the mounting rod 703 to move, so that the mounting rod 703 drives the brush 704 to move, so that the brush 704 cleans the surface of the support plate 4, so as to prevent dust from accumulating on the support plate 4.

Claims

1. A semiconductor wafer testing device with a heat dissipation device, comprising an operating panel (1), characterized in that: A fixing frame (2) is fixedly mounted on the top of the operating panel (1), a tester (3) is fixedly mounted on the bottom of the fixing frame (2), a support plate (4) is fixedly mounted on the top of the operating panel (1), a supporting leg (5) is fixedly mounted on the bottom of the operating panel (1), a cooling mechanism (6) is arranged on the front of the tester (3), and the cooling mechanism (6) comprises: a fixing block (601), the fixing block (601) is fixedly mounted on the front of the tester (3), a moving rod (602) is arranged on the fixing block (601), a heat sink (603) is fixedly mounted on one side of the moving rod (602), and a connecting rod (604) is fixedly mounted on one side of the heat sink (603).

2. The semiconductor wafer testing device with a heat dissipation device according to claim 1, characterized in that: A connecting block (605) is fixedly mounted on one side of the connecting rod (604), a rack (606) is fixedly mounted on one side of the connecting block (605), a motor (607) is fixedly mounted on one side of the tester (3), and a gear (608) is fixedly mounted on the output end of the motor (607).

3. The semiconductor wafer testing device with a heat dissipation device according to claim 2, characterized in that: The moving rod (602) passes through the fixed block (601) and is movably connected to the fixed block (601), the gear (608) and the rack (606) are meshed with each other, and a fan is arranged on the front of the fixed frame (2).

4. The semiconductor wafer testing device with a heat dissipation device according to claim 1, characterized in that: A cleaning mechanism (7) is provided on the top of the operating panel (1), and the cleaning mechanism (7) comprises: a groove (701), the groove (701) is opened on the top of the operating panel (1), and a mounting block (702) is fixedly mounted inside the groove (701).

5. The semiconductor wafer testing device with a heat dissipation device according to claim 4, characterized in that: The mounting block (702) is provided with a mounting rod (703), a brush (704) is fixedly mounted on the top of the mounting rod (703), and a handle (705) is fixedly mounted on one end of the mounting rod (703).

6. The semiconductor wafer testing device with a heat dissipation device according to claim 5, characterized in that: The mounting rod (703) passes through the mounting block (702) and is movably connected to the mounting block (702), and the bottom of the brush (704) is in contact with the top of the support plate (4).

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