Metal support ceramic dielectric capacitor

Abstract

The utility model discloses a ceramic dielectric capacitor with a metal support, which comprises the metal support, and a plurality of capacitor chips are distributed in the metal support. The metal support is provided with a supporting plate and a positioning bent pin which are used for fixing the capacitor chip. According to the capacitor, the capacitance of the capacitor is improved, the height of the metal support is controlled, the welding spot area when the number of longitudinally stacked capacitor chips is too large is reduced, and the bending resistance of the metal support ceramic dielectric capacitor is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of capacitors, and in particular relates to a metal bracket ceramic dielectric capacitor. Background Art

[0002] Existing ceramic capacitors are difficult to meet the market application requirements of high specific capacitance and high power, so metal bracket ceramic capacitors that use multiple capacitors assembled in parallel have emerged. However, there are many problems and defects in the existing metal bracket ceramic capacitor assembly method. For example, when there are too many capacitor chips stacked vertically, the height of the metal bracket ceramic capacitor is too high, which seriously affects the height of the circuit board and is inconvenient to install; the metal bracket designs the pins on the lower side of the capacitor chip. When there are too many capacitor chips stacked vertically, the solder joint area is too large, and the bending resistance of the metal bracket ceramic capacitor is reduced. Utility Model Content

[0003] In order to solve the above problems, the utility model aims to provide a metal bracket ceramic capacitor.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A metal bracket ceramic capacitor, comprising a metal bracket, wherein a plurality of capacitor chips are distributed in the metal bracket;

[0006] A support plate and positioning bent feet for fixing the capacitor chip are arranged on the metal bracket.

[0007] The metal bracket comprises a first frame body and a second frame body, and the first frame body and the second frame body are arranged in an L shape.

[0008] The support plate is arranged at the bottom of the first frame body and along the length direction of the first frame body.

[0009] The positioning bent legs are arranged on both sides of the first frame.

[0010] A plurality of heat-transmitting holes are arranged on the first frame, and the heat-transmitting holes are evenly distributed along the length direction of the first frame.

[0011] The heat-transmitting holes are arranged in one-to-one correspondence with the capacitor chips.

[0012] Pins are arranged at the bottom of the second frame.

[0013] A rectangular hole is arranged at the connection between the second frame and the pin.

[0014] Two metal brackets are provided, and the capacitor chip is installed between the two metal brackets.

[0015] The capacitor chip is fixed to the metal bracket by a clip.

[0016] Compared with the prior art, the utility model has the following advantages:

[0017] The utility model provides a metal bracket ceramic capacitor, which improves the capacitance of the capacitor, controls the height of the metal bracket, reduces the solder joint area when the number of capacitor chips stacked vertically is too large, and increases the bending resistance of the metal bracket ceramic capacitor.

[0018] A rectangular hole is provided at the connection between the pin and the metal bracket to improve the welding performance of the metal bracket ceramic capacitor.

[0019] The support plate and the positioning bent feet are provided to position the capacitor chip, so as to avoid the problem of displacement of the capacitor chip or the metal bracket caused by assembling too many capacitor chips.

[0020] The metal bracket is an integrated structure with high reliability, beautiful appearance and simple operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a structural schematic diagram of a metal bracket ceramic capacitor in the utility model;

[0023] Figure 2 It is a schematic diagram of the structure of the metal bracket in the utility model;

[0024] Figure 3 This is the plate structure diagram after the metal bracket is cut;

[0025] Figure numerals: 1-metal bracket, 11-first frame, 12-second frame, 2-capacitor chip, 3-pin, 4-rectangular hole, 5-positioning bent foot, 6-support plate, 7-heat-transmitting hole. DETAILED DESCRIPTION

[0026] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments, but it should not be understood that the scope of the subject matter described in the present invention is limited to the following embodiments. Without departing from the above-mentioned technical ideas of the present invention, various modifications, substitutions and changes made according to the common technical knowledge and customary means in the field are included in the scope of the present invention.

[0027] Reference Figure 1 and Figure 2A metal bracket ceramic capacitor improves the capacitance of the capacitor, controls the height of the metal bracket 1, reduces the solder joint area when the number of capacitor chips 2 stacked vertically is too large, and increases the bending resistance of the metal bracket ceramic capacitor.

[0028] The capacitor includes a metal bracket 1; two metal brackets 1 are provided, which are buckled to form a capacitor chip 2 installation space, and a plurality of capacitor chips 2 are installed in parallel between the two metal brackets 1, and the capacitor chips 2 are fixed to the metal bracket 1 by a retaining spring.

[0029] When producing the capacitor, multiple capacitor chips 2 are first evenly coated with solder paste and arranged neatly, and two metal brackets 1 are placed on both sides of the capacitor chips 2 for positioning; after the positioning is completed, the two metal brackets 1 and the capacitor chips 2 are fixed by retaining springs, which are equivalent to clamps and are located on both sides of the length direction of the metal brackets 1, and the two metal brackets 1 and the capacitor chips 2 are connected by high-temperature soldering.

[0030] The metal bracket 1 includes a first frame body 11 and a second frame body 12 , and the first frame body 11 and the second frame body 12 are arranged in an L shape.

[0031] A support plate 6 and a positioning bent leg 5 for fixing the capacitor chip 2 are arranged on the metal bracket 1. Specifically,

[0032] The support plate 6 is disposed at the bottom of the first frame 11 and along the length direction of the first frame 11 . The support plate 6 is used to support the capacitor chip 2 .

[0033] Two positioning legs 5 are provided, which are disposed on two sides of the first frame 11 , and the capacitor chips 2 on the two sides are positioned by the positioning legs 5 .

[0034] The support plate 6 and the positioning bent feet 5 are provided to position the capacitor chip 2 to avoid the problem of displacement of the capacitor chip 2 or the metal bracket 1 caused by assembling too many capacitor chips 2 .

[0035] A plurality of heat-transmitting holes 7 are disposed on the first frame 11 . The heat-transmitting holes 7 are evenly distributed along the length direction of the first frame 11 . The heat-transmitting holes 7 are disposed one-to-one correspondingly to the capacitor chips 2 .

[0036] During the design, the corresponding heat-transmitting holes 7 are cut out according to the arrangement order of the multilayer capacitor chips 2, so that the solder can be melted evenly during the high-temperature welding of the assembly, and it also helps the natural heat dissipation function of the capacitor chips 2. In one embodiment, when the number of capacitor chips 2 is 10, 10 corresponding heat-transmitting holes 7 are opened.

[0037] A pin 3 is disposed at the bottom of the second frame 12 . The pin 3 and the second frame 12 are disposed in an L shape, and the pin 3 is disposed away from the direction of the first frame 11 . The pin 3 is used for soldering on the PCB board.

[0038] A rectangular hole 4 is provided at the connection between the second frame 12 and the pin 3. The rectangular hole 4 can increase the welding strength when the pin 3 is welded.

[0039] The metal bracket 1, the support plate 6 arranged on the metal bracket 1, the positioning bent foot 5, the heat-transmitting hole 7, the pin 3, and the rectangular hole 4 on the pin 3 are an integrated structure with high reliability, beautiful appearance and simple operation.

[0040] The metal bracket 1 in the utility model is first processed into a shape according to the size and quantity of the capacitor chip 2. Figure 3 The plate structure shown in the figure is then bent correspondingly by bending the pin 3, the positioning bent leg 5, and the support plate 6 to form a plate structure as shown in the figure. Figure 2 The metal bracket 1 is shown.

[0041] The above is a detailed introduction to a metal bracket ceramic capacitor provided by the utility model. This article uses specific examples to illustrate the structure and working principle of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A metal support ceramic capacitor, characterized in that: It comprises a metal support (1), wherein a plurality of capacitor chips (2) are distributed inside the metal support (1); A support plate (6) and a positioning bent foot (5) for fixing the capacitor chip (2) are arranged on the metal bracket (1).

2. A metal support ceramic capacitor according to claim 1, characterized in that: The metal bracket (1) comprises a first frame body (11) and a second frame body (12), and the first frame body (11) and the second frame body (12) are arranged in an L shape.

3. A metal support ceramic capacitor according to claim 2, characterized in that: The support plate (6) is arranged at the bottom of the first frame (11) and along the length direction of the first frame (11).

4. A metal support ceramic capacitor according to claim 2, characterized in that: The positioning bent legs (5) are arranged on both sides of the first frame (11).

5. The metal support ceramic capacitor according to claim 2, characterized in that: A plurality of heat-transmitting holes (7) are arranged on the first frame (11), and the heat-transmitting holes (7) are evenly distributed along the length direction of the first frame (11).

6. A metal support ceramic capacitor according to claim 5, characterized in that: The heat-transmitting holes (7) are arranged in one-to-one correspondence with the capacitor chips (2).

7. The metal support ceramic capacitor according to claim 1, characterized in that: A pin (3) is arranged at the bottom of the second frame (12).

8. The metal support ceramic capacitor according to claim 7, characterized in that: A rectangular hole (4) is provided at the connection between the second frame (12) and the pin (3).

9. The metal support ceramic capacitor according to claim 1, characterized in that: Two metal brackets (1) are provided, and the capacitor chip (2) is installed between the two metal brackets (1).

10. The metal support ceramic capacitor according to claim 9, characterized in that: The capacitor chip (2) is fixed to the metal bracket (1) via a retaining spring.

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