Turret type heating and heat preservation mechanism for integrated circuit chip

Abstract

The utility model relates to an integrated circuit chip turret type heating and heat preservation mechanism, which is characterized in that the heating and heat preservation mechanism comprises a second base provided with a second turntable and a second motor arranged on the second base and used for driving the second turntable to rotate, and a cover body covered on the second turntable is arranged on the second base. A heating and heat-preserving cavity is arranged between the cover body and the second rotary table, and the heating and heat-preserving cavity is over against a first sinking groove for placing an integrated circuit chip on the second rotary table; first sinking grooves which are not better without being specifically defined and possibly have one circle or multiple circles are formed in the circumferential array of the second rotating disc, the heating and heat preservation cavity is in a ring shape, and the ring-shaped heating and heat preservation cavity directly faces the first sinking grooves in the ring array; the turret type heating and heat preservation mechanism for the integrated circuit chip is reasonable in design and small in occupied area.

Description

Technical field:

[0002] The utility model relates to a turret-type heating and heat preservation mechanism for an integrated circuit chip. Background technology:

[0004] The integrated circuit chip is an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring.

[0005] After production, integrated circuit chips need to be tested for their high temperature resistance, that is, after the integrated circuit chips are heated to a certain temperature, some performance of the integrated circuit chips needs to be tested to see if they still meet their working performance. At present, the high temperature resistance testing equipment of integrated circuit chips is in the form of an assembly line, that is, heating stations, testing stations and qualified product marking stations are arranged in sequence along the length direction of the conveyor line of the assembly line. Since it takes a certain amount of time for the integrated circuit chips to be heated from room temperature to the highest temperature resistance, the heating chamber on the heating station is relatively long, which requires a longer production line and occupies a large area.

[0006] At present, a Chinese patent has been retrieved for a chip testing machine with an assembly line structure, with the publication number CN116699364A. The chip testing machine is provided with a test box, a conveying mechanism and a dual detection mechanism. When batch testing of chips is performed, the operator first starts the main conveying assembly inside the test box to rotate, and appropriately adjusts the operating speed, the rotating time and the pause time of the main conveying assembly. Then, the operator places the chip inside the bearing assembly on the top of the main conveying assembly, and places the side of the chip containing the pins on the top. Then, as the main conveying assembly operates to convey the chip, the auxiliary rubbing assembly inside the test box is used for effective side shielding to avoid scratches. Then, when the chip is moved to the bottom of the chip conductor detection assembly on the front side of the test box, the chip pins are photographed and analyzed by the chip conductor detection assembly, and it is ensured that the chip pins are not bent or missing and the quality is confirmed. Although the patent can continuously and uninterruptedly test the chip, its long production line occupies a large area. Summary of the invention:

[0008] In view of the above problems, the purpose of the utility model is to provide an integrated circuit chip turret heating and heat preservation mechanism, which has a reasonable design and occupies a small area.

[0009] The technical solution of the utility model is as follows:

[0010] The utility model provides a turret-type heating and heat preservation mechanism for integrated circuit chips, characterized in that: the heating and heat preservation mechanism comprises a second base for mounting a second turntable and a second motor arranged on the second base for driving the second turntable to rotate; the second base is provided with a cover body arranged on the second turntable, a heating and heat preservation cavity is provided between the cover body and the second turntable, the heating and heat preservation cavity is directly opposite to a first sink groove for placing the integrated circuit chip on the second turntable; the circular array on the second turntable has one, two or more circles of first sink grooves, the heating and heat preservation cavity is in a ring shape, and the ring-shaped heating and heat preservation cavity is directly opposite to the first sink grooves of the annular array.

[0011] Preferably, the rotation axis lines of the first turntable and the second turntable are connected to form a first plane, and the first turntable has an adsorption mechanism for integrated circuit chips arranged in a circular array. The adsorption mechanism of an integrated circuit chip on the first turntable transfers the integrated circuit chip to a first sink of the second turntable. The transfer station is located on the first plane.

[0012] Preferably, the second base is driven to move by a first screw nut mechanism arranged on the machine platform, and the moving direction of the second base is a vertical connection line of the rotation axis of the first turntable and the second turntable.

[0013] Preferably, a plurality of brackets are fixedly installed on the above-mentioned second base, the brackets are fixedly connected to the cover body, a housing of the second motor is fixedly provided on the second base, an output shaft of the second motor is fixedly connected to the second turntable, the cover body comprises an annular lower cover body and an annular upper cover cover which are fixedly connected, the inner peripheral wall of the annular lower cover body is provided with a groove for the second turntable to extend into, the second turntable rotates relative to the annular lower cover body, an annular heat-conducting block is provided below the annular upper cover cover, an annular heating device is provided on the annular heat-conducting block, a heating and heat-insulating cavity is formed between the lower surface of the annular heat-conducting block and the upper surface of the second turntable extending into the groove, the cover body has a notch for avoiding the adsorption mechanism of the integrated circuit chip of the second turntable to rotate through, the transfer station is arranged at the notch position, and the first sink groove is not blocked by the annular upper cover cover, the annular heat-conducting block and the annular heating device above the notch position.

[0014] Preferably, the first turntable is driven to rotate by a first motor arranged on the machine platform, a plurality of adsorption mechanisms for integrated circuit chips are arranged in a circular array on the first turntable, the adsorption mechanism for the integrated circuit chip comprises a rigid vertical suction pipe and a horizontal suction pipe whose first end is connected to the vertical suction pipe, the lower end of the vertical suction pipe is used to adsorb the integrated circuit chip, the second end of the horizontal suction pipe is connected to a negative pressure pump, and a lifting mechanism for driving the vertical suction pipe to lift and lower is arranged on the first base on which the first turntable is installed.

[0015] Preferably, the symmetry center lines of the two adjacent circles of the first sink grooves fall on the same radial plane, and the radial plane passes through the axis line of the second turntable and the symmetry center lines of the two adjacent circles of the first sink grooves.

[0016] The utility model provides a turret heating and heat preservation mechanism for integrated circuit chips. Since the circular array on the second turntable has one, two or more circles of first sink grooves, the integrated circuit chips can be fully heated and heat preserved in the one, two or more circles of first sink grooves, and the area occupied by the mechanism can be reduced. Description of the drawings:

[0018] The utility model is further described below in conjunction with the accompanying drawings;

[0019] Figure 1 It is a three-dimensional diagram of a turntable type high temperature test and sorting device for integrated circuit chips;

[0020] Figure 2 yes Figure 1 A top view of

[0021] Figure 3 yes Figure 1 A stereogram from another perspective;

[0022] Figure 4 yes Figure 1 A three-dimensional diagram after omitting some parts;

[0023] Figure 5 yes Figure 4 A stereogram from another perspective;

[0024] Figure 6 yes Figure 4 A cross-sectional view from one perspective (a cross-sectional view of the K plane);

[0025] Figure 7 yes Figure 6 A partial view of

[0026] Figure 8 It is a partial view of the heating and heat preservation mechanism;

[0027] Fig. 9 yes Figure 8 sectional view of

[0028] Fig.10 is a three-dimensional diagram of the connection between the first rotating disk and the adsorption mechanism;

[0029] Fig.11 It is a schematic diagram of the first turntable and the second turntable transferring the integrated circuit chip (transfer to the first circle);

[0030] Fig.12 It is a schematic diagram of the first turntable and the second turntable transferring the integrated circuit chip (transfer to the second circle);

[0031] Fig.13 It is a cross-sectional view of the adsorption mechanism and the correction mechanism;

[0032] Fig.14 yes Fig.13 A partial view of

[0033] Fig.15 It is a stereogram of the corrective mechanism;

[0034] Fig.16 It is a three-dimensional diagram of the test organization;

[0035] Fig.17 is a cross-sectional perspective view of the adsorption mechanism and the third rotating disk;

[0036] Fig.18 It is a three-dimensional diagram of the integrated mechanism of cooling, marking and optical inspection;

[0037] Fig.19 yes Fig.18 A partial view of

[0038] Fig. 20 It is a three-dimensional diagram of the second positioning seat (including the integrated circuit chip thereon), and the first positioning seat and the second positioning seat have the same structure;

[0039] Fig.21 It is a three-dimensional diagram of the waste sorting mechanism;

[0040] Fig. 22 It is a cross-sectional view of a waste sorting mechanism. Specific implementation method:

[0042] The utility model is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0043] The integrated circuit chip turntable high-temperature testing and sorting device comprises a machine 1, a first turntable 2 intermittently rotating on the machine 1, and a second turntable 3 intermittently rotating on the machine next to the first turntable 2, wherein the first turntable 2 rotates intermittently, and each time it rotates through one grid, the grid refers to the spacing between adjacent adsorption mechanisms A6 on the first turntable. If the first turntable 2 has M groups of adsorption mechanisms evenly distributed in the circumferential direction, then each time the first turntable rotates through one grid, it rotates 360 / M degrees each time; wherein the second turntable 3 rotates intermittently, and each time it rotates through one grid, the grid refers to the circumferential spacing between two adjacent first sinks in the same circle on the second turntable. If the second turntable has N groups of first sinks evenly distributed in the circumferential direction in the same circle, then each time the second turntable rotates through one grid, it rotates 360 / N degrees each time.

[0044] The second turntable is provided with a heating and insulation mechanism A for heating and keeping the integrated circuit chip warm. A heating test channel mechanism B and a cooling, marking and optical inspection integrated mechanism C are provided in sequence on the side of the discharge end of the second turntable. The heating test channel mechanism B is used for performing performance test on the integrated circuit chip after position correction, and the cooling, marking and optical inspection integrated mechanism C is used for cooling, marking and optical inspection of the integrated circuit chip.

[0045] The heating and heat preservation mechanism A specifically includes a second base A1 for mounting the second turntable 3 and a second motor A2 arranged on the second base A1 for driving the second turntable 3 to rotate; a cover body A3 is arranged on the second base A1 for covering the second turntable; a heating and heat preservation cavity A4 is arranged between the cover body A3 and the second turntable 3; the heating and heat preservation cavity A4 is opposite to a first sink A5 for placing the integrated circuit chip M on the second turntable 3; the second base A1 is fixedly mounted on the machine platform; the shell of the second motor A2 is fixed on the second base A1; and the free end of the output shaft of the second motor A2 is fixedly connected to the second turntable 3.

[0046] Specifically, the rotation axis lines of the first turntable and the second turntable are connected to form a first plane K. The first turntable has adsorption mechanisms A6 for integrated circuit chips arranged in a circular array. The transfer station of the adsorption mechanism A6 of an integrated circuit chip of the first turntable that transfers the integrated circuit chip to a first sink of the second turntable is located on the first plane. At the transfer station, each adsorption mechanism A6 on the first turntable transfers the integrated circuit chip to the second turntable; that is, the unheated and heat-insulated integrated circuit chip on the first turntable is transferred to the second turntable through the transfer station, and the heated and heat-insulated integrated circuit chip on the second turntable is adsorbed and output by the adsorption mechanism, thereby realizing the replacement of the unheated and heat-insulated integrated circuit chip with the heated and heat-insulated integrated circuit chip.

[0047] When the integrated circuit chip is heated and kept warm at a fixed temperature in the heating and heat preservation cavity A4, a certain amount of time is required. In order to ensure sufficient heating and heat preservation time, it is hoped that the circumferential diameter of the second turntable is larger, so that the first sink groove is set near the circular edge of the second turntable, which can make the heating time longer to meet the heating and heat preservation time. However, the larger diameter of the second turntable also increases the footprint of the equipment (or the area occupied by the machine). In order to ensure both the heating and heat preservation time and control the diameter of the second turntable, the circular array on the second turntable has one, two or more circles of first sink grooves A5; the heating and heat preservation cavity is in a ring shape, and the ring-shaped heating and heat preservation cavity A4 is opposite to the first sink grooves A5 in the annular array, and the radial width of the heating and heat preservation cavity on the second turntable covers the radial width of two first sink grooves A5 (taking the circular array on the second turntable with two circles of first sink grooves A5 as an example).

[0048] During operation, the adsorption mechanism on the first turntable (through the lower end of the vertical suction pipe) puts the unheated integrated circuit chip into the second turntable, and the second turntable rotates one grid, and the adsorption mechanism on the first turntable adsorbs the heated integrated circuit chip. Then the first turntable rotates one grid, and the first turntable adsorbs the unheated integrated circuit chip. When the first sink groove A5 on the second turntable has two circles (or more than two circles, taking two circles as an example), the integrated circuit chip is equivalent to being sucked out by the adsorption mechanism after rotating two circles. During the operation, the first circle of the second turntable is sucked out by the adsorption mechanism. After the integrated circuit chips are completely replaced one by one (after the heated and heat-insulated integrated circuit chip located at the transfer station is adsorbed by the previous adsorption mechanism, the first turntable rotates one grid, the subsequent adsorption mechanism rotates to the transfer station, and puts the adsorbed integrated circuit chip into the first sink of the transfer station, the second turntable rotates one grid, and the heated and heat-insulated integrated circuit chip in the second turntable rotates to the transfer station, and the subsequent process is repeated as before), the first sink of the integrated circuit chip of the second circle is driven by the subsequent first screw nut mechanism to be pushed to the transfer station so that it can be adsorbed by the adsorption mechanism.

[0049] In order to realize the position adjustment of the first circle first groove and the second circle first groove on the transfer station, specifically, the second base A1 is driven to move by the first screw nut mechanism A7 arranged on the machine platform, and the moving direction of the second base A1 is the vertical connecting line of the rotation axis centerline of the first turntable 2 and the second turntable 3. The second base A1 is driven to move in a straight line by the first screw nut mechanism A7, that is, the distance between the rotation axis centerline of the second turntable and the rotation axis centerline of the first turntable is moved.

[0050] The symmetric center lines of the two adjacent circles of the first sink grooves fall on the same radial plane, and the radial plane passes through the axis line of the second turntable and the symmetric center lines of the two adjacent circles of the first sink grooves.

[0051] The specific connection structure of the cover body is that a plurality of brackets A8 are fixedly installed on the second base A1, and the bracket A8 is fixedly connected to the cover body. The housing of the second motor A2 is fixedly provided on the second base, and the output shaft of the second motor is fixedly connected to the second turntable 3. The cover body A3 includes a fixedly connected annular lower cover body A301 and annular upper cover A302, and the inner peripheral wall of the annular lower cover body A301 is provided with a groove A303 for the second turntable to extend into, and the second turntable can rotate relative to the annular lower cover body, and an annular heat conductive block A304 is provided below the annular upper cover, and the annular heat conductive block A304 is provided below the annular upper cover. An annular heating device A305 is provided on the heat block, and the power supply end of the annular heating device A305 extends out of the cover body. An annular heat-conducting block may also be provided below the second turntable in the cover body, and the annular heat-conducting block is provided with an electric heating wire; a heating and heat-insulating cavity A4 is formed between the lower surface of the annular heat-conducting block A304 and the upper surface of the second turntable 3 extending into the groove, and the cover body has a notch A9 for avoiding the adsorption mechanism of the integrated circuit chip of the second turntable to rotate through, and the transfer station is arranged at the notch position, and the first sink is not blocked by the annular upper cover, the annular heat-conducting block and the annular heating device above the notch position.

[0052] The first turntable 2 is driven to rotate by a first motor A10 arranged on the machine platform. A plurality of integrated circuit chip adsorption mechanisms A6 are arranged in a circular array on the first turntable 2. The integrated circuit chip adsorption mechanism A6 comprises a rigid vertical suction pipe A601 and a horizontal suction pipe A602 whose first end is connected to the vertical suction pipe (the horizontal suction pipe A602 can be a plastic hose). The lower end of the vertical suction pipe is used to adsorb the integrated circuit chip. The second end of the horizontal suction pipe is connected to a negative pressure pump. A lifting mechanism (not shown in the figure) for driving the vertical suction pipe to lift and lower is arranged on the first base installed on the first turntable. The lifting mechanism can be a screw nut mechanism driven by a cylinder or a motor, or a cam mechanism driven by a motor. The cam surface of the cam mechanism presses against the upper end of the vertical suction pipe to drive the vertical suction pipe to descend (so that the vertical suction pipe descends close to the integrated circuit chip to achieve adsorption or release). At the same time, a return spring is arranged between the vertical suction pipe and the first turntable to achieve return and rise.

[0053] After the integrated circuit chip is heated and kept warm, each integrated circuit chip needs to be tested for performance at high temperature.

[0054] Specifically, the above-mentioned heating test channel mechanism B includes an integrated circuit chip position correction mechanism B1 and a plurality of testing mechanisms B2. The integrated circuit chip position correction mechanism B1 includes a first mounting seat B3 and a first positioning seat B4 arranged on the first mounting seat. The upper surface of the first positioning seat B4 is provided with a first positioning groove B5 for positioning the integrated circuit chip. The shape of the first positioning groove B5 matches the shape of the integrated circuit chip.

[0055] A rotating adjustment motor B6 for driving the first positioning seat B4 to rotate is installed on the first mounting seat B3. Since it is necessary to ensure that each integrated circuit chip corresponds to the test probe during the high temperature resistance performance test, after the integrated circuit chip is placed in the first positioning seat B4, the first positioning seat B4 is driven to rotate a certain angle by the adjusting motor B6 to correct the position of the integrated circuit chip. The angle that needs to be driven by the adjusting motor to rotate the first positioning seat B4 can be detected by a position detection device. The position detection device detects the degree of misalignment of the integrated circuit chip and is an existing device, which will not be described here.

[0056] The testing mechanism B2 includes a second mounting seat B7 and a test seat B8 disposed on the second mounting seat. The second mounting seat B7 and the test seat B8 may have multiple groups for detecting different electrical properties of the integrated circuit chip.

[0057] For the sake of reasonable design, the above-mentioned first mounting seat B3 and the second mounting seat B7 both include a horizontally arranged transverse seat B9 and a first L-shaped connecting plate B10 whose first end is fixedly connected to the first end of the transverse seat, the second end of the first L-shaped connecting plate B10 is connected to the first end of the second L-shaped connecting plate B11, and the second end of the second L-shaped connecting plate B11 is provided with the first positioning seat B4 or the second mounting seat B7.

[0058] In order to adjust the installation position of the first positioning seat B4 or the second mounting seat B7, a screw hole B12 is provided on the first end of the second L-shaped connecting plate B11, and a strip groove B13 corresponding to the screw hole B12 is provided on the second end of the first L-shaped connecting plate. A screw B14 passes through the strip groove and is locked with the screw hole. After the relative position of the first L-shaped connecting plate and the second L-shaped connecting plate is determined by adjustment, the screw hole B12 is locked to achieve relative fixation of the first L-shaped connecting plate and the second L-shaped connecting plate.

[0059] In order to more accurately adjust the relative position of the first L-shaped connecting plate and the second L-shaped connecting plate, the first end of the second L-shaped connecting plate is vertically threadedly connected with an adjustable screw B15 through a connecting piece B19, and the free end of the adjustable screw is placed on the upper end of the second end of the first L-shaped connecting plate. When it is necessary to adjust the relative position of the first L-shaped connecting plate and the second L-shaped connecting plate, the adjustable screw B15 is rotated. After the position is determined, the nut on the adjustable screw B15 is locked, and the nut abuts against the connecting piece B19.

[0060] In order to facilitate the adjustment of the position of the transverse seat B9, the bottom surface of the transverse seat B9 is slidably connected to the transverse slide rail B16, and the rear part of the transverse seat B9 is threadedly connected with an adjusting bolt B17, and the free end of the adjusting bolt B17 is placed on the rear end surface of the transverse slide rail. The side of the transverse seat B9 is penetrated by a locking screw B18, and the free end of the locking screw is placed on the side of the transverse slide rail. The transverse slide rail is fixed on the machine platform. When adjustment is needed, the adjusting bolt B17 is rotated to change the relative position of the transverse seat B9 and the transverse slide rail B16. When the relative position of the transverse seat B9 is adjusted, the locking screw B18 is tightened to achieve the fixation of the relative position of the transverse seat B9 and the transverse slide rail B16.

[0061] After the integrated circuit chip is heated and kept warm and its performance is tested at high temperature, it is necessary to cool the integrated circuit chip, and mark and inspect the appearance of qualified products.

[0062] The specific cooling, marking and optical inspection integrated mechanism C includes a third turntable C1 installed on the machine 1, and the third turntable C1 is provided with a plurality of second positioning seats C2 in a circular array. Preferably, the second positioning seats C2 are evenly distributed on the circumference of the third turntable C1, and each second positioning seat C2 has a second positioning groove C3 for placing an integrated circuit chip on its upper surface, and the shape of the second positioning groove C3 matches the shape of the integrated circuit chip.

[0063] An adsorption mechanism A6 on the first turntable of the heating and heat preservation mechanism intersects with a second positioning seat C2 of the third turntable C1, and the two form an intersection area. The intersection area is a fixed position and is used to transfer the integrated circuit chip on the adsorption mechanism of the first turntable to a second positioning seat C2 of the third turntable. A first blowing cooling nozzle C4 is provided above several second positioning seats of the third turntable C1, and a third base C5 fixedly installed on the machine is provided at the center of the third turntable C1. A plurality of second blowing cooling nozzles C6 are provided in a circular array on the third base C5. The second blowing cooling nozzles C6 blow air in a circumferential direction of the third turntable to achieve blowing cooling of the integrated circuit chips in the second positioning grooves C3 on the third turntable.

[0064] The third base is provided with a marking mechanism C7, and the marking head of the marking mechanism is opposite to the second positioning groove of the handover area, that is, the marking mechanism C7 and the handover area are relatively fixedly arranged in the circumferential direction of the third turntable.

[0065] In order to collect the waste gas, debris and dust generated during marking, a negative pressure dust suction mechanism C8 is provided on the third base C5 and located next to the marking mechanism. The negative pressure dust suction mechanism includes a base body C801 and a suction pipe C802 fixed on the upper part of the base body. The first end of the suction pipe is close to the marking head, and the second end of the suction pipe is connected to the negative pressure pump through a pipeline.

[0066] The third base is provided with an optical inspection device C9, which is arranged opposite to the first blowing cooling nozzle C4 on the third turntable, that is, the optical inspection device C9 and the first blowing cooling nozzle C4 are relatively fixedly arranged in the circumferential direction of the third turntable.

[0067] In order to classify the unqualified products tested in the previous steps (the specific tester and the testing method are existing technologies and will not be described here), the above-mentioned machine 1 is provided with an integrated circuit chip waste sorting mechanism D, and the integrated circuit chip waste sorting mechanism D includes a rotating wheel D1, a partition block D2 with a partition channel and a plurality of waste trough boxes D3 from top to bottom. The rotating wheel D1 is stepped, and has an upper boss D5 and a lower boss D6 rotatably hinged on the fourth base D4. The outer periphery of the lower boss D6 is provided with pulley teeth D7. The pulley teeth D7 of the lower boss are connected to a driving pulley driven by a motor through a belt D8. The driving pulley, the pulley teeth D7 and the lower boss D6 rotate under the driving action of the motor.

[0068] A vertical material transfer channel D501 is provided in the upper boss D5, and an inclined material transfer channel D601 is provided in the lower boss D6. The lower end of the vertical material transfer channel D501 is connected with the upper end of the inclined material transfer channel D601, and the lower end of the inclined material transfer channel D601 is connected with the upper end of the separation channel D9. There are multiple separation channels. Driven by a motor, the wheel can rotate to 4 or more workstations and stop. At any workstation, the lower end of the inclined material transfer channel D601 is connected with the upper end of a separation channel D9, and the lower end of each separation channel D9 is connected with the upper port of a waste trough box D3.

[0069] The working method of the adsorption mechanism on the first turntable to replace the integrated circuit chip thereon with the integrated circuit chip on the third turntable is the same as the working method of the adsorption mechanism on the first turntable to replace the integrated circuit chip thereon with the integrated circuit chip on the second turntable, and will not be repeated here.

[0070] When the integrated circuit chip waste sorting mechanism D is working, when the previous step detects integrated circuit chips that do not meet the performance requirements such as high temperature resistance, when the adsorption mechanism of the first turntable rotates to the upper end of the vertical transfer channel D501, the adsorption mechanism releases the unqualified integrated circuit chip products, and the unqualified integrated circuit chip products fall into the vertical transfer channel D501. At the same time, the motor drives the lower boss D6 to rotate, so that the lower end of the inclined transfer channel D601 is connected with the upper end of different separation channels D9. The unqualified integrated circuit chip products in the vertical transfer channel D501 pass through the inclined transfer channel D601 and the separation channel D9 and then fall into one of the waste trough boxes D3.

[0071] The working method of the utility model integrated circuit chip turntable high temperature testing and sorting device is as follows:

[0072] Through the intermittent rotation of the first turntable, each rotation of one grid (the distance between adjacent adsorption mechanisms on the first turntable) drives the adsorption mechanisms on the first turntable to rotate, that is, drives the integrated circuit chips adsorbed by the adsorption mechanisms to rotate, and then when the first turntable rotates to the transfer station, the adsorption mechanism of the first turntable releases (without negative pressure adsorption force) to adsorb the integrated circuit chip, and the integrated circuit chip falls into the first sink groove of the second turntable at this station. As the second turntable rotates, the integrated circuit chips in the first sink groove are heated by the heat transfer of the heating and heat preservation cavity. When the adsorption mechanism of the first rotating disk releases the adsorption of an integrated circuit chip, the second rotating disk rotates one grid (referring to the circumferential spacing between two adjacent first sinks in the same circle) so that the integrated circuit chip that has been heated and kept warm for one circle in the second rotating disk is placed in the transfer station. At this time, the adsorption mechanism of the first rotating disk in this station adsorbs the integrated circuit chip in the first sink, and the first sink position in the second rotating disk is vacated. Then the first rotating disk rotates one grid, and the adsorption mechanism of the next grid rotates to the transfer station. At this time, the adsorption mechanism of the next grid releases the adsorption of the integrated circuit chip, and the integrated circuit chip falls into the vacated first sink;

[0073] The heated and heat-insulated integrated circuit chips adsorbed by the first turntable adsorption mechanism are tested by the heating test channel mechanism in sequence after being output, and after the test, they are cooled and marked by the cooling, marking and optical inspection integrated mechanism, and the appearance is optically inspected.

[0074] The integrated circuit chip turntable high-temperature testing and sorting device transfers the integrated circuit chips adsorbed by the adsorption mechanism on the first turntable to the second turntable through the intermittent rotation of the first turntable and the intermittent rotation of the second turntable. The chips are heated and kept warm by the heating and heat preservation mechanism of the second turntable to reach the highest temperature resistance required for detecting the integrated circuit chips. The performance test under high temperature state, as well as cooling, marking and optical inspection are carried out through the heating test channel mechanism and the integrated cooling, marking and optical inspection mechanism arranged in sequence beside the discharge end of the second turntable.

[0075] Due to the turntable structure adopted by the utility model, the floor space of the equipment is reduced.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the utility model can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the utility model, which should be included in the scope of the technical solution for protection of the utility model.

Claims

1. A turret heating and heat preservation mechanism for integrated circuit chips, characterized in that: The heating and heat preservation mechanism includes a second base for mounting a second turntable and a second motor on the second base for driving the second turntable to rotate; the second base is provided with a cover body which is covered on the second turntable; a heating and heat preservation cavity is provided between the cover body and the second turntable; the heating and heat preservation cavity is opposite to a first sink groove on the second turntable where an integrated circuit chip is placed; the second turntable has a circular array of one, two or more circles of first sink grooves; the heating and heat preservation cavity is in a ring shape; the ring-shaped heating and heat preservation cavity is opposite to the first sink grooves in the annular array.

2. The integrated circuit chip turret heating and heat preservation mechanism according to claim 1, characterized in that: The second turntable is connected to the rotation axis of the first turntable installed on the machine to form a first plane. The first turntable has an adsorption mechanism for integrated circuit chips arranged in a circular array. The adsorption mechanism of an integrated circuit chip on the first turntable transfers the integrated circuit chip to a first sink of the second turntable as a transfer station, and the transfer station is located on the first plane.

3. The integrated circuit chip turret heating and heat preservation mechanism according to claim 2, characterized in that: The second base is driven to move by a first screw nut mechanism arranged on the machine platform, and the moving direction of the second base is a vertical connection line between the rotation axis lines of the first turntable and the second turntable.

4. The integrated circuit chip turret heating and heat preservation mechanism according to claim 3, characterized in that: A plurality of brackets are fixedly installed on the second base, and the brackets are fixedly connected to the cover body. A housing of the second motor is fixedly provided on the second base, and an output shaft of the second motor is fixedly connected to the second turntable. The cover body comprises an annular lower cover body and an annular upper cover cover which are fixedly connected. The inner peripheral wall of the annular lower cover body is provided with a groove for the second turntable to extend into, and the second turntable rotates relative to the annular lower cover body. An annular heat-conducting block is provided below the annular upper cover cover, and an annular heating device is provided on the annular heat-conducting block. A heating and heat-insulating cavity is formed between the lower surface of the annular heat-conducting block and the upper surface of the second turntable extending into the groove. A notch is provided on the cover body for avoiding the adsorption mechanism of the integrated circuit chip of the second turntable to rotate through. The transfer station is provided at the notch position, and the first sink groove is not blocked by the annular upper cover cover, the annular heat-conducting block and the annular heating device above the notch position.

5. The integrated circuit chip turret heating and heat preservation mechanism according to claim 4, characterized in that: The first turntable is driven to rotate by a first motor arranged on the machine platform. A plurality of adsorption mechanisms for integrated circuit chips are arranged in a circular array on the first turntable. The adsorption mechanisms for the integrated circuit chips include a rigid vertical suction pipe and a horizontal suction pipe whose first end is connected to the vertical suction pipe. The lower end of the vertical suction pipe is used to adsorb the integrated circuit chip. The second end of the horizontal suction pipe is connected to a negative pressure pump. A lifting mechanism for driving the vertical suction pipe to lift and lower is arranged on the first base on which the first turntable is installed.

6. The integrated circuit chip turret heating and heat preservation mechanism according to claim 5, characterized in that: The symmetric center lines of two adjacent circles of the first sink grooves fall on the same radial plane, and the radial plane passes through the axis line of the second turntable and the symmetric center lines of the two adjacent circles of the first sink grooves.

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