Laser pumping source

Abstract

The embodiment of the utility model provides a laser pumping source, which comprises a base, a plurality of bar packaging modules and a plurality of collimation modules, and is characterized in that the base is provided with a plurality of step parts which are connected in sequence and descend step by step; each step part is provided with the bar packaging module, the collimation module and the reflecting mirror, the bar packaging modules, the collimation modules and the reflecting mirrors are sequentially arranged in the light emitting direction of the bar packaging modules, and the light emitting direction of the bar packaging modules is perpendicular to the arrangement direction of the multiple step parts.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a laser pump source. Background Art

[0002] In the related art, the semiconductor laser chips in the laser pump source are mostly single-die packaging structures. Each laser chip needs to be packaged separately, and each laser chip needs to be provided with beam shaping and beam combining structures separately, resulting in a large overall volume and mass of the laser pump source. Utility Model Content

[0003] The embodiment of the present application provides a laser pump source, which can reduce the overall volume and mass, and achieve miniaturization and lightweight of the laser pump source.

[0004] The laser pump source provided in the embodiment of the present application includes a base, a plurality of bar packaging modules and a plurality of collimation modules, wherein the base is provided with a plurality of step portions which are sequentially connected and gradually descend; each step portion is respectively provided with the bar packaging module, the collimation module and the reflector, the bar packaging module, the collimation module and the reflector are sequentially arranged along the light emitting direction of the bar packaging module, and the light emitting direction of the bar packaging module is perpendicular to the arrangement direction of the plurality of step portions.

[0005] In some embodiments, the bar packaging module includes a heat sink and a bar disposed on the heat sink, the heat sink is disposed on the step portion, and a plurality of light emitting devices are packaged in the bar.

[0006] In some embodiments, the bar has a patch structure, the patch structure has a P surface and an N surface arranged opposite to each other along a thickness direction thereof, and the P surface of the patch structure is welded to a side surface of the heat sink away from the step portion.

[0007] In some embodiments, the heat sink includes a ceramic substrate and two copper-plated layers, and the two copper-plated layers are respectively disposed on two opposite side surfaces of the ceramic substrate along the thickness direction thereof.

[0008] In some embodiments, the laser pump source further includes a plurality of series conductive modules, which are respectively disposed on the plurality of step portions and connected in series in sequence, and each series conductive module is configured to supply power to a bar packaging module.

[0009] In some embodiments, the series conductive module includes a first conductive electrode and a second conductive electrode arranged at intervals, and the first conductive electrode and the second conductive electrode are respectively conductively connected to the two poles of the bar packaging module; in two series conductive modules arranged front and back along the series connection direction, the second conductive electrode of the front series conductive module and the first conductive electrode of the rear series conductive module are conductively connected.

[0010] In some embodiments, the series conductive module further includes a first ceramic gasket, the first ceramic gasket is disposed on the step portion, and the first conductive electrode and the second conductive electrode are disposed on the first ceramic gasket with a spacing therebetween.

[0011] In some embodiments, the collimation module includes at least one of a fast-axis collimation lens group and a slow-axis collimation lens group; when the collimation module includes a fast-axis collimation lens group and a slow-axis collimation lens group, the fast-axis collimation lens group and the slow-axis collimation lens group are arranged in sequence along the light output direction of the bar packaging module.

[0012] In some embodiments, the fast axis collimator lens group includes a second ceramic gasket, a ceramic column and a fast axis collimator lens, the second ceramic gasket is arranged on the step portion, the ceramic column is arranged on the second ceramic gasket, and the fast axis collimator lens is arranged on the ceramic column.

[0013] In some embodiments, the slow-axis collimator lens group includes a third ceramic gasket and a slow-axis collimator lens, the third ceramic gasket is disposed on the step portion, and the slow-axis collimator lens is disposed on the third ceramic gasket.

[0014] In the embodiment of the present application, a plurality of step portions are sequentially arranged on the base, and a bar packaging module, a collimation module and a reflector are respectively arranged on each step portion. On the one hand, the bar packaging module is used to package a plurality of semiconductor laser chips, so that each bar packaging module has a multi-die parallel output structure, so that each packaging structure is small and light, thereby reducing the volume and mass of the overall structure; on the other hand, each bar packaging module is only provided with one collimation module and a reflector, so that a plurality of laser chips can share the same beam shaping and beam combining structure, so that the beam shaping and beam combining structure are effectively simplified, thereby reducing the overall volume and mass, and realizing the miniaturization and lightweight of the laser pump source. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 It is an axonometric structural diagram of a laser pump source provided in some embodiments of the present application.

[0017] Description of main component symbols:

[0018] 1-laser pump source, 10-base, 11-step portion, 20-bar packaging module, 21-bar, 22-heat sink, 30-collimation module, 31-fast axis collimation lens group, 311-second ceramic gasket, 312-ceramic column, 313-fast axis collimation lens, 32-slow axis collimation lens group, 321-third ceramic gasket, 322-slow axis collimation lens, 40-reflector, 41-fourth ceramic gasket, 50-series conductive module, 51-first conductive electrode, 52-second conductive electrode, 53-first ceramic gasket. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0020] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0021] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0022] The use of "suitable for" or "configured to" in this application is meant to be open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps. In addition, the use of "based on" is meant to be open and inclusive, because the process, step, calculation or other action "based on" one or more stated conditions or values ​​can be based on additional conditions or values ​​beyond the stated values ​​in practice.

[0023] In this application, the word "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described in this application as "exemplary" is not necessarily to be construed as being preferred or advantageous over other embodiments. The following description is given to enable any technician in the field to implement and use the present application. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present application can be implemented without using these specific details. In other instances, well-known structures and processes will not be elaborated in detail to avoid obscuring the description of the present application with unnecessary details. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in the present application.

[0024] like Figure 1 As shown, an embodiment of the present application provides a laser pump source 1, which includes a base 10, a plurality of bar packaging modules 20 and a plurality of collimation modules 30, which can reduce the overall volume and weight to achieve a miniaturized and lightweight design effect.

[0025] Here, the base 10 can be made of metal material, and is provided with a plurality of step portions 11 which are connected in sequence and step down. Each step portion 11 is provided with a bar packaging module 20, a collimation module 30 and a reflector 40, respectively. The bar packaging module 20, the collimation module 30 and the reflector 40 are arranged in sequence along the light emitting direction of the bar packaging module 20, and the light emitting direction of the bar packaging module 20 is perpendicular to the arrangement direction of the plurality of step portions 11. A plurality of semiconductor laser chips arranged in an array are respectively encapsulated in each bar packaging module 20 to form a multi-die parallel output structure. In some embodiments, the number of step portions 11, bar packaging modules 20, collimation modules 30 and reflectors 40 is equal, and the four are arranged one by one. Here, the angle between the mirror surface of the reflector 40 and the light emitting direction of the bar packaging module 20 can be set to 45°, so that the light reflected by the reflector 40 is perpendicular to the light emitting direction of the bar packaging module 20 and parallel to the arrangement direction of the plurality of step portions 11.

[0026] When the laser pump source 1 is working, multiple semiconductor laser chips of the same bar packaging module 20 emit lasers respectively to form a light beam, which is first collimated and shaped by the collimation module 30, and then reflected and deflected by the reflector 40 to the beam combining and coupling direction; similarly, the light beams emitted by the bar packaging modules 20 on each step portion 11 pass through the collimation module 30 and the reflector 40 correspondingly arranged thereto in turn, so that the light beams emitted by each bar packaging module 20 are finally combined and coupled into the optical fiber.

[0027] Compared with the related art, the embodiment of the present application sequentially arranges a plurality of step portions 11 on the base 10, and arranges a bar packaging module 20, a collimation module 30 and a reflector 40 on each step portion 11. On the one hand, the bar packaging module 20 is used to package a plurality of semiconductor laser chips, so that each bar packaging module 20 has a multi-die parallel output structure, so that each packaging structure is small and light, thereby reducing the volume and mass of the overall structure; on the other hand, each bar packaging module 20 is only provided with one collimation module 30 and a reflector 40, so that a plurality of laser chips can share the same beam shaping and beam combining structure, so that the beam shaping and beam combining structure are effectively simplified, thereby reducing the overall volume and mass, and realizing the miniaturization and lightweight of the laser pump source 1.

[0028] The composition structure of the bar packaging module 20 can be determined according to actual needs, and the embodiments of the present application do not limit this. In some embodiments, the bar packaging module 20 may include a heat sink 22 and a bar 21 disposed on the heat sink 22; the heat sink 22 is disposed on the step portion 11, and a plurality of light-emitting devices are packaged in the bar 21. Here, each light-emitting device can be a semiconductor laser chip. In this way, multiple light-emitting devices can be disposed on the same heat sink 22, which can simplify and compress the packaging structure.

[0029] The structure of the bar 21 can be determined according to actual needs, and the embodiments of the present application do not limit this. In some examples, the bar 21 can have a patch structure; the patch structure has a P surface and an N surface that are arranged opposite to each other along its thickness direction, and the P surface of the patch structure is welded to a side surface of the heat sink 22 away from the step portion 11. Based on the patch structure, the bar 21 has a relatively thin appearance and is easy to assemble.

[0030] The structure of the heat sink 22 can be determined according to actual needs, and the embodiments of the present application are not limited to this. In some examples, the heat sink 22 may include a ceramic substrate and two copper-plated layers, and the two copper-plated layers are respectively arranged on the ceramic substrate along the thickness direction of the two opposite side surfaces. Exemplarily, the ceramic substrate may be an aluminum nitride ceramic substrate. The heat sink 22 using a ceramic substrate has better heat dissipation performance and can better meet the heat dissipation needs of the bar 21 using a dense packaging structure.

[0031] In some embodiments, the laser pump source 1 may further include a plurality of series conductive modules 50, which are respectively disposed on a plurality of step portions 11 and are sequentially connected in series, and each series conductive module 50 is configured to supply power to a bar package module 20. Based on the series conductive modules 50, a series conductive structure may be formed between the plurality of bar package modules 20, matching the power supply structure characteristics of the power supply actually used.

[0032] The structure of the series conductive module 50 can be determined according to actual needs, and the embodiment of the present application does not limit this. In some examples, the series conductive module 50 may include a first conductive electrode 51 and a second conductive electrode 52 arranged at intervals, and the first conductive electrode 51 and the second conductive electrode 52 are respectively conductively connected to the two poles of the bar packaging module 20; illustratively, the first conductive electrode 51 can be conductively connected to the N surface of the bar 21, and the second conductive electrode 52 can be conductively connected to the surface of one side of the heat sink 22 away from the step portion 11. In the two series conductive modules 50 arranged front and back along the series connection direction, the second conductive electrode 52 of the front series conductive module 50 is conductively connected to the first conductive electrode 51 of the rear series conductive module 50. Exemplarily, the first conductive electrode 51 and the second conductive electrode 52 can be conductive blocks made of conductive materials.

[0033] Exemplarily, the series conductive module 50 may further include a first ceramic gasket 53. The first ceramic gasket 53 is disposed on the step portion 11, and the first conductive electrode 51 and the second conductive electrode 52 are disposed on the first ceramic gasket 53 at intervals from each other. Here, the first ceramic gasket 53 can respectively keep the first conductive electrode 51 and the base 10, and the second conductive electrode 52 and the base 10 insulated, thereby ensuring safety during power supply use.

[0034] The composition structure of the collimation module 30 can be determined according to actual needs, and the embodiments of the present application do not limit this. In some embodiments, the collimation module 30 may include at least one of a fast-axis collimation lens group 31 and a slow-axis collimation lens group 32; when the collimation module 30 includes the fast-axis collimation lens group 31 and the slow-axis collimation lens group 32, the fast-axis collimation lens group 31 and the slow-axis collimation lens group 32 are sequentially arranged along the light emitting direction of the bar packaging module 20. Exemplarily, the collimation module 30 may include only a fast-axis collimation lens group 31, which is used to collimate the light beam emitted by the bar packaging module 20 in the fast axis direction; another exemplary embodiment, the collimation module 30 may include only a slow-axis collimation lens group 32, which is used to collimate the light beam emitted by the bar packaging module 20 in the slow axis direction; another exemplary embodiment, the collimation module 30 may include a fast-axis collimation lens group 31 and a slow-axis collimation lens group 32, which is used to collimate the light beam emitted by the bar packaging module 20 in the fast axis direction by the fast-axis collimation lens group 31, and which is used to collimate the light beam emitted by the bar packaging module 20 in the slow axis direction by the slow-axis collimation lens group 32.

[0035] The structure of the fast axis collimator lens group 31 can be determined according to actual needs, and the embodiments of the present application are not limited to this. In some examples, the fast axis collimator lens group 31 may include a second ceramic gasket 311, a ceramic column 312, and a fast axis collimator lens 313, the second ceramic gasket 311 is arranged on the step portion 11, the ceramic column 312 is arranged on the second ceramic gasket 311, and the fast axis collimator lens 313 is arranged on the ceramic column 312. Here, the second ceramic gasket 311 can match the thermal expansion coefficient between the base 10 and the ceramic column 312, so that the base 10 and the ceramic column 312 have relatively consistent thermal expansion characteristics.

[0036] The structure of the slow axis collimator lens group 32 can be determined according to actual needs, and the embodiment of the present application does not limit this. In some examples, the slow axis collimator lens group 32 may include a third ceramic gasket 321 and a slow axis collimator lens 322, the third ceramic gasket 321 is arranged on the step portion 11, and the slow axis collimator lens 322 is arranged on the third ceramic gasket 321. Here, the second ceramic gasket 311 can match the thermal expansion coefficient between the base 10 and the slow axis collimator lens 322, so that the base 10 and the slow axis collimator lens 322 have relatively consistent thermal expansion characteristics.

[0037] In some embodiments, a fourth ceramic gasket 41 may be further provided between the reflector 40 and the base 10; the fourth ceramic gasket 41 is provided on the step portion 11, and the reflector 40 is provided on a side surface of the fourth ceramic gasket 41 away from the step portion 11. The fourth ceramic gasket 41 may match the thermal expansion coefficient between the base 10 and the reflector 40, so that the base 10 and the reflector 40 have relatively consistent thermal expansion characteristics.

[0038] The laser pump source provided in the embodiment of the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technicians in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A laser pump source, characterized in that: The invention comprises a base, a plurality of bar packaging modules and a plurality of collimating modules, wherein the base is provided with a plurality of step portions which are sequentially connected and gradually descend; each step portion is respectively provided with the bar packaging module, the collimating module and the reflector, the bar packaging module, the collimating module and the reflector are sequentially arranged along the light emitting direction of the bar packaging module, and the light emitting direction of the bar packaging module is perpendicular to the arrangement direction of the plurality of step portions.

2. The laser pump source according to claim 1, characterized in that: The bar packaging module includes a heat sink and a bar disposed on the heat sink, the heat sink is disposed on the step portion, and a plurality of light emitting devices are packaged in the bar.

3. The laser pump source according to claim 2, characterized in that: The bar has a patch structure, the patch structure has a P surface and an N surface arranged opposite to each other along a thickness direction thereof, and the P surface of the patch structure is welded to a side surface of the heat sink away from the step portion.

4. The laser pump source according to claim 2, characterized in that: The heat sink comprises a ceramic substrate and two copper-plated layers, wherein the two copper-plated layers are respectively arranged on two opposite side surfaces of the ceramic substrate along the thickness direction thereof.

5. The laser pump source according to claim 1, characterized in that: The laser pump source further includes a plurality of series conductive modules, which are respectively disposed on the plurality of step portions and are sequentially connected in series, and each series conductive module is configured to supply power to a bar packaging module.

6. The laser pump source according to claim 5, characterized in that: The series conductive module includes a first conductive electrode and a second conductive electrode arranged at intervals, and the first conductive electrode and the second conductive electrode are respectively conductively connected to the two poles of the bar packaging module; in two series conductive modules arranged front and back along the series connection direction, the second conductive electrode of the front series conductive module is conductively connected to the first conductive electrode of the rear series conductive module.

7. The laser pump source according to claim 6, characterized in that: The series conductive module further includes a first ceramic gasket, which is disposed on the step portion, and the first conductive electrode and the second conductive electrode are disposed on the first ceramic gasket with a spacing therebetween.

8. The laser pump source according to claim 1, characterized in that: The collimation module includes at least one of a fast-axis collimation lens group and a slow-axis collimation lens group; when the collimation module includes the fast-axis collimation lens group and the slow-axis collimation lens group, the fast-axis collimation lens group and the slow-axis collimation lens group are arranged in sequence along the light output direction of the bar packaging module.

9. The laser pump source according to claim 8, characterized in that: The fast axis collimator lens group comprises a second ceramic gasket, a ceramic column and a fast axis collimator lens, the second ceramic gasket is arranged on the step portion, the ceramic column is arranged on the second ceramic gasket, and the fast axis collimator lens is arranged on the ceramic column.

10. The laser pump source according to claim 8, characterized in that: The slow axis collimator lens group includes a third ceramic gasket and a slow axis collimator lens. The third ceramic gasket is arranged on the step portion, and the slow axis collimator lens is arranged on the third ceramic gasket.

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