Novel precise inner layer interconnection circuit board

Abstract

The utility model discloses a novel precise inner layer interconnection circuit board, which comprises a circuit board and a protective shell, the circuit board is arranged in an opening at the upper end of the protective shell, a strip-shaped opening is arranged on one side surface of the protective shell, a top plate for blocking the opening of the circuit board is inserted into the strip-shaped opening, and a plurality of fixing holes are arranged on the bottom surface of the protective shell. And blocking mechanisms for blocking openings above the fixing holes are mounted at the two ends in the protective shell. According to the utility model, the structure is simple, the circuit board can be sealed in the top plate and the protective shell, the circuit board is effectively protected, the situation that the circuit board is damaged due to external impact is avoided, and after the circuit board is installed in any shell subsequently, the top plate can move to the lower part of the circuit board, so that the circuit board is prevented from being damaged. Therefore, exposure and use of the electronic components on the circuit board are affected, and the circuit board can be transported again in the follow-up process.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a novel precision inner-layer interconnection circuit board. Background Art

[0002] With the rapid advancement of electronic technology, electronic products are moving towards miniaturization, lightweighting, and high integration. Semiconductor component packaging is also rapidly evolving towards multi-pin, fine-pitch designs. This requires the correspondingly smaller, lighter, and denser PCBs that house these components. In recent years, to meet the growing demand for "light, thin, short, and compact" electronic products, the high-density interconnect (HDI) industry has experienced rapid growth, becoming the fastest-growing segment within the PCB industry. Ultra-thin PCBs require a thin core board. Currently, the thinnest FR-4 board on the market is 50µm, which is prone to breakage and fracture. Over-etched lines, reduced copper traces, and black hole traces can easily cause board damage and render the board scrapped. Ultra-thin PCBs require not only the thinnest core board but also the thinnest dielectric layers. However, achieving this thinness also requires the PCB's multifunctionality to ensure quality and extend its life. Existing PCBs are limited in functionality and are susceptible to damage. This is especially true during transportation, where the board's exterior lacks protective structures. External impact damage can damage the electronic components on the board, compromising its safety. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a new type of precision inner layer interconnection circuit board. The circuit board has its own top plate and protective shell, which can move with the movement of the circuit board, and the circuit board can be sealed inside by the protective shell and the top plate, which has solved the problems mentioned in the background technology.

[0004] The utility model is realized through the following technical solutions: a novel precision inner layer interconnection circuit board, comprising a circuit board and a protective shell, wherein the circuit board is arranged in an opening at the upper end of the protective shell, a strip opening is provided on one side surface of the protective shell, a top plate for blocking the opening of the circuit board is inserted into the strip opening, a plurality of fixing holes are provided on the bottom surface of the protective shell, and blocking mechanisms for blocking the openings above the fixing holes are installed at both ends of the interior of the protective shell.

[0005] As an optimal technical solution, the blocking mechanism includes a baffle, a longitudinal rod, multiple positioning rods and multiple first compression springs. The baffle is arranged on the bottom surface inside the protective shell and blocks the opening at the upper end of the fixing hole. The longitudinal rod is arranged at one end of the baffle, and both ends of the longitudinal rod are installed on the inner side surface of the protective shell. The longitudinal rod is provided with multiple positioning holes, and one end of the positioning rod is installed on the baffle through the positioning hole. The first compression springs are all sleeved on the positioning rod, one end of the first compression spring is installed on the baffle, and the other end is installed on the longitudinal rod.

[0006] As a preferred technical solution, one side of the top plate extends to the outside through the strip opening and bends downward to form a fixed part. A slot for inserting a nail is provided on the bottom surface of the fixed part, and a plurality of card blocks are protruded on the inner side surface of the fixed part. Card slots are provided on the side surfaces of the protective shell facing the card blocks, and the card blocks are inserted into the card slots.

[0007] As a preferred technical solution, both ends of the protective shell in the width direction are protruding to form multiple thickened parts, and a sliding groove is provided on the inner side of the protective shell facing the thickened part, one end of the sliding groove extends into the thickened part, and a slider is slidably installed in the sliding groove, one end of the slider is installed on the circuit board, and a second compression spring is installed on the bottom surface of the slider, and the lower end of the second compression spring is installed on the bottom surface of the sliding groove.

[0008] As a preferred technical solution, the circuit board is arranged above the top plate.

[0009] As a preferred technical solution, the circuit board is an inner layer interconnection circuit board.

[0010] The beneficial effects of the utility model are as follows: the utility model has a simple structure, and the circuit board has an automatic top plate and a protective shell. When not in use, the circuit board can be sealed inside the top plate and the protective shell, effectively protecting the circuit board and avoiding damage to the circuit board due to external impact. After the circuit board is subsequently installed in any shell, the top plate can be moved to the bottom of the circuit board, thereby affecting the exposure and use of electronic components on the circuit board, and also facilitating the subsequent re-transportation of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 It is a bottom view of the utility model;

[0014] Figure 3 This is a schematic diagram of the structure of the utility model after removing the circuit board;

[0015] Figure 4 This is a schematic diagram of the structure of the utility model after the top plate is further removed.

[0016] Among them, 1. Protective shell; 2. Circuit board; 3. Thickened part; 4. Fixed part; 5. Slot; 6. Fixed hole; 7. Top plate; 8. Slider; 9. Slide groove; 11. Second compression spring; 12. Baffle; 13. First compression spring; 14. Longitudinal rod; 15. Strip mouth; 16. Positioning rod. DETAILED DESCRIPTION

[0017] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0018] All features disclosed in this specification, or all steps in the disclosed methods or processes, except mutually exclusive features and / or steps, can be combined in any manner.

[0019] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless otherwise stated, may be replaced by other equivalent or similar features. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0020] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, the utility model is a new type of precision inner layer interconnection circuit board, including a circuit board 2 and a protective shell 1, the circuit board 2 is arranged in the opening at the upper end of the protective shell 1, and a strip opening 15 is provided on one side surface of the protective shell 1. A top plate 7 that blocks the opening of the circuit board 2 is inserted into the strip opening 15, and a plurality of fixing holes 6 are provided on the bottom surface of the protective shell 1. Blocking mechanisms that block the openings above the fixing holes 6 are installed at both ends of the interior of the protective shell 1.

[0021] In this embodiment, the blocking mechanism includes a baffle 12, a longitudinal rod 14, a plurality of positioning rods 16 and a plurality of first compression springs 13. The baffles 12 are arranged on the bottom surface of the interior of the protective shell 1 and block the opening at the upper end of the fixing hole 6. The longitudinal rod 14 is arranged at one end of the baffle 12. Both ends of the longitudinal rod 14 are mounted on the inner side of the protective shell 1. The longitudinal rod 14 is provided with a plurality of positioning holes. One end of the positioning rod 16 is mounted on the baffle 12 through the positioning hole. The first compression springs 13 are sleeved on the positioning rod 16. One end of the first compression spring 13 is mounted on the baffle 12, and the other end is mounted on the longitudinal rod 14.

[0022] When installing the protective shell, the baffle can be moved inward by using any rod. After the baffle is removed from above the fixing hole, the fixing hole can be exposed, so that the bolts on the shell can fix the protective shell from bottom to top. Conversely, after the bolts are removed from the protective shell, the rebound of the first compression spring can drive the baffle to move outward until it covers the opening at the upper end of the fixing hole, thereby sealing the interior of the protective shell.

[0023] Among them, anti-slip grooves are provided on the bottom surface of the baffle, which increase the friction between the baffle and any rod after contact, and can better move the baffle.

[0024] In this embodiment, one side of the top plate 7 extends to the outside through the strip-shaped opening 15 and bends downward to form a fixing portion 4. A slot 5 for inserting a nail is provided on the bottom surface of the fixing portion 4. A plurality of card blocks are protruded on the inner side surface of the fixing portion 4. Card slots are provided on the side surfaces of the protective shell 1 facing the card blocks, and the card blocks are inserted into the card slots.

[0025] In this embodiment, both ends of the protective shell 1 in the width direction are protruding to form multiple thickened parts 3, and the inner side surface of the protective shell 1 is provided with a slide groove 9 opposite the thickened part 3, one end of the slide groove 9 extends into the thickened part 3, and a slider 8 is slidably installed in the slide groove 9, one end of the slider 8 is installed on the circuit board 2, and a second compression spring 11 is installed on the bottom surface of the slider 8, and the lower end of the second compression spring 11 is installed on the bottom surface of the slide groove 9.

[0026] In this embodiment, the circuit board 2 is disposed above the top plate 7 so that the upper half of the circuit board can be smoothly exposed.

[0027] In this embodiment, circuit board 2 is an inner-layer interconnect circuit board. An inner-layer interconnect circuit board is a circuit board that contains multiple layers of wiring, connecting the various layers of the circuit board. Inner-layer interconnect circuit boards are typically used for high-speed circuits and high-density wiring, improving the performance and reliability of the circuit board.

[0028] When not in use or transporting, a fingernail can be inserted into the slot and the fixing part can be pulled outward to disengage the card block on the fixing part from the card slot. At this time, the top plate can move outward along the strip opening. After the top plate is moved out of the interior of the protective shell, the circuit board can be pressed down to move the circuit board downward along the slide groove. After the circuit board is lower than the top plate, the top plate can be reinserted into the protective shell so that the top plate can be located above the circuit board. When the card block is inserted into the card slot again, the outer side surface of the top plate can contact the inner side surface of the protective shell, thereby covering the opening at the upper end of the protective shell, and the fixing hole at the lower end of the protective shell can be covered by the baffle, so that the circuit board can be completely sealed in the protective shell, avoiding external impact and increasing safety.

[0029] When in use, the top plate can be moved outward along the strip opening again. After losing the obstruction of the top plate, the circuit board can push the slider and the circuit board upward through the rebound of the second compression spring, so that a part of the circuit board protrudes out of the opening of the protective shell, so that the electronic components on the circuit board can be exposed, thereby not affecting the normal use of the circuit board.

[0030] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that do not require creative effort should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection defined in the claims.

Claims

1. A new type of precision inner layer interconnection circuit board, characterized in that: The invention comprises a circuit board (2) and a protective shell (1), wherein the circuit board (2) is arranged in an opening at the upper end of the protective shell (1), a strip opening (15) is arranged on one side surface of the protective shell (1), a top plate (7) is inserted into the strip opening (15) to block the opening of the circuit board (2), a plurality of fixing holes (6) are arranged on the bottom surface of the protective shell (1), and blocking mechanisms are installed at both ends of the interior of the protective shell (1) to block the openings above the fixing holes (6).

2. The novel precision inner layer interconnection circuit board according to claim 1 is characterized in that: The blocking mechanism comprises a baffle (12), a longitudinal rod (14), a plurality of positioning rods (16) and a plurality of first compression springs (13); the baffle (12) is arranged on the bottom surface of the protective shell (1) and blocks the opening at the upper end of the fixing hole (6); the longitudinal rod (14) is arranged at one end of the baffle (12); both ends of the longitudinal rod (14) are mounted on the inner side surface of the protective shell (1); a plurality of positioning holes are arranged on the longitudinal rod (14); one end of the positioning rod (16) passes through the positioning hole and is mounted on the baffle (12); the first compression spring (13) is sleeved on the positioning rod (16); one end of the first compression spring (13) is mounted on the baffle (12) and the other end is mounted on the longitudinal rod (14).

3. The novel precision inner layer interconnection circuit board according to claim 1 is characterized in that: One side of the top plate (7) extends through the strip opening (15) to the outside and is bent downward to form a fixing portion (4). A slot (5) for inserting a fingernail is provided on the bottom surface of the fixing portion (4). A plurality of card blocks are protruded from the inner side surface of the fixing portion (4). Card slots are provided on the side surfaces of the protective shell (1) facing the card blocks, and the card blocks are inserted into the card slots.

4. The novel precision inner layer interconnection circuit board according to claim 1 is characterized in that: Both ends of the protective shell (1) in the width direction are protruding to form a plurality of thickened portions (3); a slide groove (9) is provided on the inner side surface of the protective shell (1) opposite to the thickened portion (3); one end of the slide groove (9) extends into the thickened portion (3); a slider (8) is slidably installed in the slide groove (9); one end of the slider (8) is installed on the circuit board (2); a second compression spring (11) is installed on the bottom surface of the slider (8); and the lower end of the second compression spring (11) is installed on the bottom surface of the slide groove (9).

5. The novel precision inner layer interconnection circuit board according to claim 1 is characterized in that: The circuit board (2) is arranged above the top plate (7).

6. The novel precision inner layer interconnection circuit board according to claim 1 is characterized in that: The circuit board (2) is an inner layer interconnection circuit board.

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