Circuit board with uniform heat dissipation

Abstract

The utility model discloses a circuit board with uniform heat dissipation, relates to the technical field of circuit boards, and aims to solve the problems that in the working process of a circuit board in the prior art, the aging speed of elements on the circuit board is easy to accelerate and the service life of the circuit board is affected due to the fact that the internal temperature is often too high. The circuit board comprises a circuit board body, a bottom box is arranged below the circuit board body, a refrigeration plate is arranged above the interior of the bottom box, the refrigeration surface of the refrigeration plate faces the circuit board body, a heat conduction layer is arranged between the circuit board body and the refrigeration plate and is a heat conduction silicone grease layer, and pressing assemblies are symmetrically arranged on the two sides of the lower portion of the refrigeration plate respectively. The compressing assembly comprises a top plate, a first spring and an adjusting plate, the top plate makes contact with the first spring, the first spring is fixedly installed below the top plate, and the adjusting plate is fixedly installed below the first spring.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board with uniform heat dissipation. Background Art

[0002] Circuit board is an important electronic component. It is the support of electronic components and the carrier of electrical connection of electronic components. Circuit board has various shapes such as rectangular, circular, oval, special-shaped, etc., and has good mechanical properties and corrosion resistance.

[0003] For example, the authorized patent with announcement number CN208191095U (a PCB circuit board): includes a base plate, a field effect tube, an integrated circuit, a voltage regulator diode, a thyristor, a resistor, a crystal oscillator, a surface mount integrated circuit, a capacitor, and a mounting device. A field effect tube is arranged on the top of the base plate, the base plate is bonded to the integrated circuit, and an integrated circuit is arranged on the right side of the field effect tube;

[0004] Although the above-mentioned prior art is convenient for preventing the circuit board from shaking, the internal temperature of the circuit board is often too high during operation, which can easily lead to accelerated aging of components on the circuit board and affect the service life of the circuit board. Therefore, the market urgently needs to develop a circuit board with uniform heat dissipation to help people solve the existing problem. Utility Model Content

[0005] The utility model aims to provide a circuit board with uniform heat dissipation, so as to solve the problem in the background art that the internal temperature of the circuit board is often too high during operation, which may lead to accelerated aging of components on the circuit board and shorten the service life of the circuit board.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board with uniform heat dissipation, comprising a circuit board body, a bottom box is arranged below the circuit board body, a refrigeration plate is arranged above the inside of the bottom box, and the refrigeration surface of the refrigeration plate faces the circuit board body, a heat-conducting layer is arranged between the circuit board body and the refrigeration plate, and the heat-conducting layer is a heat-conducting silicone grease layer, and clamping components are symmetrically arranged on both sides below the refrigeration plate, and the clamping components include a top plate, a spring and an adjusting plate, the top plate is in contact with, the spring one is fixedly installed below the top plate, and the adjusting plate is fixedly installed below the spring one.

[0007] Preferably, grille nets are symmetrically fixedly installed on the front and rear surfaces of the bottom box, cooling fans are symmetrically fixedly installed on the front and rear ends of the inner side of the bottom box, the cooling fans are connected to the grille nets, and suction pipes are symmetrically fixedly installed on both sides of the bottom box.

[0008] Preferably, a threaded rod is rotatably installed below the adjustment plate, a fixing plate is threadedly installed on the outer side of the threaded rod, the fixing plate is fixedly connected to the bottom box by screws, a straight rod is fixedly installed below the threaded rod, a column is fixedly installed below the top plate, and the lower end of the column passes through the fixing plate.

[0009] Preferably, a heat dissipation plate is provided below the refrigeration plate, and the refrigeration plate is in contact with the heat dissipation plate. A heat sink is fixedly installed below the heat sink, and a plurality of heat sinks are provided.

[0010] Preferably, a support assembly is provided inside the bottom box, and the support assembly includes a support column and a bottom box, the lower end of the support column penetrates into the inside of the bottom box, and the upper end of the support column contacts the heat sink.

[0011] Preferably, a base is provided inside the bottom box, and the base is fixedly connected to the support column by screws, and a second spring is provided below the base.

[0012] Preferably, upper mounting plates are symmetrically fixedly installed above both sides of the bottom box, and lower mounting plates are symmetrically fixedly installed below both sides of the bottom box.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model can generate cold temperature by arranging a refrigeration plate above the inside of the bottom box. During the operation of the circuit board, the cold temperature generated by the refrigeration plate can be transferred to the inside of the circuit board through temperature transfer. In addition, by arranging a heat-conducting layer using thermal conductive silicone grease, the circuit board body and the refrigeration plate can be in stable contact and temperature conduction, which is beneficial to the stable and uniform heat dissipation of the circuit board and increases practicality.

[0015] 2. The utility model arranges a heat dissipation fan inside the bottom box so that the air inside the bottom box can be drawn to flow outwards, and with the arrangement of the air suction pipe, when the air inside the bottom box is discharged, the air suction pipe will draw external air into the bottom box, and the pipe mouth of the air suction pipe is located above the circuit board body, so that the air flow above the circuit board body can be increased, which is beneficial to the uniformity of the heat dissipation of the circuit board and increases the practicality.

[0016] 3. The utility model arranges a heat dissipation plate under the refrigeration plate, and a heat sink is fixedly installed under the heat dissipation plate, so that the temperature of the heating surface of the refrigeration plate can be transferred to the heat dissipation plate and the heat sink, which is beneficial to the heat dissipation of the heating surface of the refrigeration plate and increases practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of a circuit board with uniform heat dissipation according to the utility model;

[0018] Figure 2 This is a cross-sectional view of a circuit board with uniform heat dissipation according to the utility model;

[0019] Figure 3 It is an enlarged schematic diagram of the A part of the utility model;

[0020] Figure 4 It is a cross-sectional view of the support assembly of the utility model.

[0021] In the figure: 1. circuit board body; 2. bottom box; 3. grille; 4. air suction pipe; 5. upper mounting plate; 6. lower mounting plate; 7. pressing assembly; 701. top plate; 702. spring one; 703. adjustment plate; 8. thermal conductive layer; 9. cooling plate; 10. heat sink; 11. heat sink; 12. heat dissipation fan; 13. support assembly; 1301. support column; 1302. bottom box; 14. fixing plate; 15. threaded rod; 16. straight rod; 17. column; 18. base; 19. spring two. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] See also Figure 1-4 The utility model provides an embodiment: a circuit board with uniform heat dissipation, including a circuit board body 1, a bottom box 2 is arranged below the circuit board body 1, a refrigeration plate 9 is arranged above the inside of the bottom box 2, the refrigeration plate 9 is a semiconductor refrigeration plate, and the refrigeration surface of the refrigeration plate 9 faces the circuit board body 1, a heat conduction layer 8 is arranged between the circuit board body 1 and the refrigeration plate 9, and the heat conduction layer 8 is a heat conduction silicone grease layer, and the two sides below the refrigeration plate 9 are symmetrically arranged with a pressing assembly 7, the pressing assembly 7 includes a top plate 701, a spring 702 and an adjusting plate 703, the top plate 701 is in contact with, the spring 702 is fixedly installed below the top plate 701, and the adjusting plate 703 is fixedly installed below the spring 702.

[0024] During use, when the circuit board is working, the cooling plate 9 is energized so that the cooling surface above the cooling plate 9 generates cold temperature, which can be transferred to the inside of the circuit board body 1 through temperature transfer, and the heat conductive layer 8 using thermal conductive silicone grease is set to enable stable contact and temperature conduction between the circuit board body 1 and the cooling plate 9, which is beneficial to the stable and uniform heat dissipation of the circuit board and increases practicality.

[0025] Furthermore, grille nets 3 are symmetrically fixedly installed on the front and rear surfaces of the bottom box 2, and heat dissipation fans 12 are symmetrically fixedly installed on the front and rear ends of the inner side of the bottom box 2. The heat dissipation fans 12 are connected to the grille nets 3, and suction pipes 4 are symmetrically fixedly installed on both sides of the bottom box 2. By starting the heat dissipation fans 12, the air inside the bottom box 2 is drawn to flow outward, and the suction pipes 4 absorb external air to increase the flow of air inside the bottom box 2, dissipate heat to the heat dissipation plate 10 and the heat sink 11, and make the refrigeration plate 9 work stably. The pipe mouth of the suction pipe 4 is above the circuit board body 1, so that the air flow above the circuit board body 1 can be increased, which is beneficial to the uniformity of heat dissipation of the circuit board.

[0026] Furthermore, a threaded rod 15 is rotatably installed below the adjustment plate 703, and a fixing plate 14 is threadedly installed on the outer side of the threaded rod 15. The fixing plate 14 is fixedly connected to the bottom box 2 by screws. A straight rod 16 is fixedly installed below the threaded rod 15. By rotating the straight rod 16, the threaded rod 15 can drive the adjustment plate 703 to move up and down, which is beneficial for elastically pressing and fixing the refrigeration plate 9. A column 17 is fixedly installed below the top plate 701, and the lower end of the column 17 passes through the fixing plate 14. The setting of the column 17 increases the stability of the lifting and lowering movement of the top plate 701.

[0027] Furthermore, a heat sink 10 is provided below the refrigeration plate 9, and the refrigeration plate 9 is in contact with the heat sink 10. A heat sink 11 is fixedly installed below the heat sink 10, and a plurality of heat sinks 11 are provided. Both the heat sink 10 and the heat sink 11 are made of die-cast aluminum alloy to increase thermal conductivity, which is beneficial to heat dissipation of the heating surface of the refrigeration plate 9.

[0028] Furthermore, a support assembly 13 is provided inside the bottom box 2, and the support assembly 13 includes a support column 1301 and a bottom box 1302. The lower end of the support column 1301 passes through the bottom box 1302, and the upper end of the support column 1301 contacts the heat sink 10. A base 18 is provided inside the bottom box 1302, and the base 18 is fixedly connected to the support column 1301 by screws. A spring 19 is provided below the base 18, so that the support column 1301 of the support assembly 13 can elastically support the heat sink 10, which is beneficial to the contact between the heat sink 10 and the refrigeration plate 9 and increases practicality.

[0029] Furthermore, upper mounting plates 5 are symmetrically fixedly installed on both sides of the bottom box 2 to facilitate the installation and connection between the bottom box 2 and the circuit board body 1, and lower mounting plates 6 are symmetrically fixedly installed on both sides of the bottom box 2 to facilitate the installation of the bottom box 2.

[0030] Working principle: When in use, during the operation of the circuit board, the cooling plate 9 is energized to generate cold temperature on the cooling surface above the cooling plate 9. Through the action of the heat conductive layer 8, the cold temperature is stably transferred to the circuit board body 1 to achieve heat dissipation of the circuit board body 1. The temperature of the heating surface of the cooling plate 9 is transferred to the inside of the cooling plate 10 and the heat sink 11 through the provided heat sink 10 and the heat sink 11. Then the heat dissipation fan 12 is started to draw the air inside the bottom box 2 to flow outward. The air suction pipe 4 draws in external air to increase the flow of air inside the bottom box 2, and dissipates the heat on the heat sink 10 and the heat sink 11, so that the cooling plate 9 can work stably. The pipe mouth of the air suction pipe 4 is above the circuit board body 1, so that the air flow above the circuit board body 1 can be increased, which is beneficial to the uniformity of heat dissipation of the circuit board.

[0031] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A circuit board with uniform heat dissipation, comprising a circuit board body (1), characterized in that: A bottom box (2) is arranged below the circuit board body (1), a cooling plate (9) is arranged above the inside of the bottom box (2), and the cooling surface of the cooling plate (9) faces the circuit board body (1), a heat conducting layer (8) is arranged between the circuit board body (1) and the cooling plate (9), and the heat conducting layer (8) is a heat conducting silicone grease layer, and clamping components (7) are symmetrically arranged on both sides below the cooling plate (9), and the clamping components (7) include a top plate (701), a spring (702) and an adjusting plate (703), the top plate (701) is in contact with, the spring (702) is fixedly installed below the top plate (701), and the adjusting plate (703) is fixedly installed below the spring (702).

2. A circuit board with uniform heat dissipation according to claim 1, characterized in that: Grille nets (3) are symmetrically fixedly mounted on the front and rear surfaces of the bottom box (2), heat dissipation fans (12) are symmetrically fixedly mounted on the front and rear ends of the inner side of the bottom box (2), the heat dissipation fans (12) are connected to the grille net (3), and air suction pipes (4) are symmetrically fixedly mounted on both sides of the bottom box (2).

3. A circuit board with uniform heat dissipation according to claim 1, characterized in that: A threaded rod (15) is rotatably mounted below the adjustment plate (703); a fixing plate (14) is threadedly mounted on the outer side of the threaded rod (15); the fixing plate (14) is fixedly connected to the bottom box (2) by screws; a straight rod (16) is fixedly mounted below the threaded rod (15); a column (17) is fixedly mounted below the top plate (701); and the lower end of the column (17) passes through the fixing plate (14).

4. A circuit board with uniform heat dissipation according to claim 1, characterized in that: A heat dissipation plate (10) is arranged below the refrigeration plate (9), and the refrigeration plate (9) is in contact with the heat dissipation plate (10). A heat dissipation fin (11) is fixedly installed below the heat dissipation plate (10), and a plurality of heat dissipation fins (11) are arranged.

5. A circuit board with uniform heat dissipation according to claim 4, characterized in that: A support assembly (13) is arranged inside the bottom box (2), and the support assembly (13) comprises a support column (1301) and a bottom box (1302), the lower end of the support column (1301) penetrates into the inside of the bottom box (1302), and the upper end of the support column (1301) contacts the heat dissipation plate (10).

6. A circuit board with uniform heat dissipation according to claim 5, characterized in that: A base (18) is arranged inside the bottom box (1302), and the base (18) is fixedly connected to the support column (1301) by screws, and a second spring (19) is arranged below the base (18).

7. A circuit board with uniform heat dissipation according to claim 1, characterized in that: Upper mounting plates (5) are symmetrically fixedly installed above both sides of the bottom box (2), and lower mounting plates (6) are symmetrically fixedly installed below both sides of the bottom box (2).

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