Power electronic equipment and heat dissipation system thereof

By reasonably laying up the location of the thermal exchanger and the heat dissipation fan in the electronic equipment to form an effective heat exchange path, it solves the problem of heat accumulation in high -power density equipment, and achieves more efficient cooling effects and longer device life.

CN222424448UActive Publication Date: 2025-01-28SHANGHAI CHINT POWER SYST CO LTD +1
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Patent Information

Application Number
CN202323496070.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-20
Publication Date
2025-01-28
Estimated Expiration
2033-12-20

AI Technical Summary

Technical Problem

In high-power density sealing equipment, existing heat dissipation solutions cannot effectively solve the problem of increasing heat, resulting in an increase in the internal temperature of the equipment, affecting device life and equipment reliability.

Method used

By reasonably laying the location of the thermal exchanger and the heat dissipation fan in the electronic equipment, the effective heat exchange path is formed, and the heat exchange channel shell and the heat exchange device are used to realize the heat exchange of air inside the cabinet.

Benefits of technology

The size of the electrical electronic equipment is reduced, the cooling effect of the internal meta device inside the cabinet is improved, the life of the device is prolonged and the reliability of the device is improved.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to the technical field of cabinet heat dissipation, in particular to power electronic equipment and a heat dissipation system thereof, which comprises a cabinet with a heating device, a heat exchanger arranged on one side of the cabinet, and a heat exchange device sleeved on the heat exchanger. The heat exchange device is provided with a third opening used for being communicated with the external environment, an external fan used for blowing air or feeding air and a sealing piece used for guiding air to make contact with the heat exchanger. The heat exchanger is provided with a first air collecting shell and a second air collecting shell which are communicated with the cabinet, a heat exchanger runner shell is arranged between the first air collecting shell and the second air collecting shell, and heat exchange of air in the cabinet can be achieved through the heat exchanger. According to the utility model, the positions of the heat exchanger and the cooling fan are reasonably arranged in the power electronic equipment, so that the size waste of the power electronic equipment can be reduced, and the cooling effect of internal components of the power electronic equipment cabinet is improved, thereby improving the reliability of the power electronic equipment.
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Description

Technical Field

[0001] The utility model relates to the technical field of cabinet heat dissipation, in particular to a high heat flux density power electronic sealing device and a heat dissipation system thereof. Background Art

[0002] With the advancement of electronic technology and market demand, the trend of equipment miniaturization is becoming more and more obvious. For fully sealed outdoor equipment, the heat flux density inside the equipment cabinet is getting larger and larger. Conventional solutions may cause the equipment to be unable to operate normally for a long time in the required environment. One existing technical solution is that the outside of the sealed device completely relies on natural convection and thermal radiation to dissipate heat, and the inside uses one or more fans to enhance convection heat dissipation, thereby reducing the temperature rise inside the equipment. However, considering the life of the components inside the cabinet, the heat dissipation capacity of this heat dissipation solution has a limit and cannot solve the problem of gradually increasing heat.

[0003] Photovoltaic power generation is a technology that uses the photoelectric effect of semiconductor materials to convert light energy into electrical energy. The huge area of ​​photovoltaic cell modules generates a large amount of DC power by absorbing light energy. Power electronic power equipment is an indispensable device that converts DC power into AC power that can be connected to the power grid. The photovoltaic power generation device itself has a service life of up to 20 years, and is used outdoors in remote and harsh environments, requiring the device itself to be fully sealed. As the power density of the power device increases, the internal temperature gradually increases, and the life of temperature-sensitive devices will be greatly reduced, resulting in an increase in the service life or failure rate of the equipment. For sealed equipment with high power density, adding a heat exchanger is a feasible option; but it also requires that the method and form of using the heat exchanger need to be matched and applied according to the characteristics of the equipment itself. Utility Model Content

[0004] The purpose of the utility model is to provide a power electronic device and a heat dissipation system thereof, which can reduce the waste of cabinet size as a whole and improve the cooling effect of the components inside the cabinet by reasonably arranging the relative positions of the electronic components of the power electronic device and the heat dissipation components.

[0005] In order to achieve the above-mentioned purpose, the technical solution of the utility model provides a power electronic device and a heat dissipation system thereof, which includes a cabinet containing a heating device, a heat exchanger arranged on one side of the cabinet, and a heat exchange device mounted on the heat exchanger; the heat exchange device is provided with a third opening for communicating with the external environment, an external fan for blowing or taking in air, and a seal for guiding air to contact the heat exchanger; the heat exchanger is provided with a first air collecting shell and a second air collecting shell connected to the cabinet, a heat exchanger flow channel shell is provided between the first air collecting shell and the second air collecting shell, and the air in the cabinet can achieve heat exchange through the heat exchanger.

[0006] Preferably, a first internal fan for exchanging air between the cabinet and the heat exchanger is provided in the cabinet.

[0007] Preferably, the first internal fan is arranged at an air outlet of the first opening or the second opening of the heat exchanger in the cabinet.

[0008] Preferably, the cabinet is further provided with a second internal fan, and the first internal fan and the second internal fan are arranged diagonally.

[0009] Preferably, the heat exchanger flow channel shell adopts flat tubes, and wave-shaped teeth are provided between the flat tubes.

[0010] Preferably, the heat exchanger flow channel shell adopts a round tube, and the round tube can be arranged in a row, arranged in a staggered row, or provided with a heat exchange fin passing through the cross section of the round tube.

[0011] Preferably, a heat dissipation unit is provided on an outer wall of the cabinet, and the heat dissipation unit and the heat exchanger are arranged on the same side or different sides of the cabinet.

[0012] Preferably, the heat dissipation unit comprises a heat sink and a heat dissipation fan, the heat sink indirectly contacts the heat generating device in the cabinet via an interface material, and the heat dissipation fan guides air from the external environment to the heat sink to indirectly cool the heat generating device.

[0013] Preferably, a capacitor cavity that can accommodate a capacitor plate is provided in the cabinet, and the capacitor cavity is respectively connected to the first air collecting cavity in the heat exchanger and the first cavity in the cabinet, and the first internal fan is arranged at the air outlet where the capacitor cavity is connected to the first cavity.

[0014] Preferably, the external fan is adjacent to the second air collecting shell, and the capacitor cavity is arranged on the inner wall of the cabinet on the side where the first opening is located; or,

[0015] The external fan is adjacent to the first air collecting shell, and the capacitor cavity is arranged on an inner wall of the cabinet which is perpendicular to the side where the first opening is located.

[0016] The beneficial effects of this patent are:

[0017] The utility model can reduce the waste of size of power electronic equipment and improve the cooling effect of components inside the power electronic equipment cabinet by reasonably arranging the positions of heat exchangers and cooling fans in the power electronic equipment, thereby improving the reliability of the power electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A three-dimensional diagram showing the internal structure of a cabinet of the power electronic device of Example 1;

[0019] Figure 2 is a three-dimensional cross-sectional view of the power electronic device of Example 1;

[0020] Figure 3 It is a front cross-sectional view of the power electronic device of Example 1;

[0021] Figure 4 is a bottom cross-sectional view of the power electronic device of Example 1;

[0022] Figure 5 A side cross-sectional view of the power electronic device of Example 1 Figure 1 ;

[0023] Figure 6 A side cross-sectional view of the power electronic device of Example 1 Figure 2 (The internal structure of the heat dissipation unit is omitted);

[0024] Figure 7 It is a front cross-sectional view of the power electronic device of Example 2;

[0025] Figure 8 It is a front cross-sectional view of the power electronic device of Example 3;

[0026] Fig. 9 This is a front cross-sectional view of the power electronic device of Example 4.

[0027] Reference numerals: 100, cabinet; 1001, first housing; 1002, second housing; 1003, third housing; 1004, fourth housing; 110, fifth housing; 1101, first opening; 1102, second opening; 120, cover plate; 130, first cavity; 1301, capacitor cavity;

[0028] 200, heat exchanger; 210, second cavity; 2101, first air collecting cavity; 2102, second air collecting cavity; 2103, heat exchanger flow channel cavity; 220, heat exchanger flow guide shell; 2201, first air collecting shell; 2202, second air collecting shell; 2203, heat exchanger flow channel shell;

[0029] 300, heat exchange device; 310, third cavity; 3101, heat exchange device housing; 3102, sealing element; 3103, third opening;

[0030] 400, external fan; 510, output board; 520, power board; 530, power module; 540, capacitor board; 600, heat dissipation unit; 610, radiator; 620, cooling fan; 630, first inductor; 640, second inductor; 700, first internal fan; 800, second internal fan. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Embodiment 1:

[0033] The utility model embodiment discloses a power electronic device and a heat dissipation system thereof. Figure 1-6 As shown, the device mainly includes a cabinet 100 containing a heating device, a heat exchanger 200, a heat exchange device 300 forming an independent air duct, and a heat dissipation unit 600, etc.

[0034] The cabinet 100 includes a first housing 1001, a second housing 1002, a third housing 1003, a fourth housing 1004, a fifth housing 110 and a cover plate 120, forming a first cavity 130 for accommodating different heating devices. The first cavity 130 includes an output board 510, a power board 520, a power module 530 with pins welded on the power board 520, and a capacitor board 540. These heating devices include but are not limited to the above-mentioned power board 520, the output board 510, the capacitor board 540, and the power module 530 with pins welded on the power board 520 that perform an inversion function, and may also include a control board and heating devices thereon, such as common mode inductors, capacitors, relays, and cables.

[0035] A heat exchanger 200 is provided outside the cabinet 100, which includes a heat exchanger guide shell 220 and a second cavity 210 surrounded by the heat exchanger guide shell 220. The heat exchanger guide shell 220 is composed of a first air collecting shell 2201, a second air collecting shell 2202 and a plurality of heat exchanger flow channel shells 2203. The second cavity 210 is composed of a first air collecting cavity 2101, a second air collecting cavity 2102 and a plurality of heat exchanger flow channel cavities 2103. A space for air flow is formed between the plurality of heat exchanger flow channel shells 2203, namely, a heat exchanger flow channel cavity 2103, through which air exchanges heat. The first air collecting shell 2201 and the second air collecting shell 2202 are connected at the position where they contact the fifth shell 110 through a sealing nut, and a groove is provided on the contact surface, in which a sealing material can be embedded, and the sealing material can be foam, a silicone gasket, a foaming material, etc.

[0036] The heat exchange device 300 includes a heat exchange device housing 3101, a seal 3102 and a third opening 3103. The heat exchanger 200 and the external fan 400 are both disposed inside the heat exchange device 300. A third cavity 310 is formed between the heat exchange device 300 and the heat exchanger 200. Figure 2, the third cavity 310 is connected to the external environment through the third opening 3103. The seal 3102 is used to form an independent air duct that allows most air to pass only through the heat exchanger flow channel cavity 2103, so as to avoid the external fan 400 from short-circuiting the air between the heat exchange device 300 and the heat exchanger 200, thereby reducing the heat exchange effect. The fifth shell 110 separates the first cavity 130 and the second cavity 210, and is provided with a first opening 1101 and a second opening 1102. The first opening 1101 and the second opening 1102 respectively connect the first air collecting cavity 2101 with the first cavity 130 and the second air collecting cavity 2102 with the first cavity 130.

[0037] The external ambient air flows into the third cavity 310 through the third opening 3103 in the third direction, contacts with the plurality of heat exchanger flow channel shells 2203 to achieve heat exchange, and then flows to the air collecting cavity (not shown in the figure) between the heat exchanger 200 and the third cavity 310, and then flows toward the first direction to the cavity near the external fan 400, and finally is drawn out to the external environment through the external fan 400. The hot air in the first cavity 130 enters the second air collecting cavity 2102 in the second cavity 210 through the second opening 1102, and then flows into the first air collecting cavity 2101 in the second cavity 210 through the plurality of heat exchanger flow channel cavities 2103 in the second cavity 210 in the first direction. The hot air contacts with the outer surface of the heat exchanger flow channel shell 2203 to perform convection heat exchange, thereby reducing the temperature. The cold air after heat exchange flows to the first cavity 130 through the first opening 1101 and is drawn out through the first internal fan 700, thereby cooling the heat generating unit in the first cavity 130. The first internal fan 700 is provided with a corresponding guide component for fixing the fan and guiding the air flow. The cold air is sprayed toward the first cavity 130 through the air outlet of the first internal fan 700, and absorbs the heat of the components through the gap between the power board 520 and the output board 510 and the components thereon. The second internal fan 800 is arranged diagonally with the first internal fan 700, which plays a role in strengthening the air convection in the first cavity 130 and helps to improve the heat exchange effect.

[0038] The heat exchanger flow channel shell 2203 of the heat exchanger 200 can be a flat tube, a round tube, such as a thin-walled round tube, or other special-shaped tubes. Tooth plates can be set between the heat exchanger flow channel shells 2203. For flat tubes, tooth plates can be set between the flat tubes, and the tooth plates are wavy tooth plates to enhance the heat exchange effect; for round tubes, the round tubes can be arranged in a row or in a staggered row to improve the heat exchange effect, and heat exchange plates passing through the cross-section of the round tube can be set to support the round tube and enhance the heat exchange. The angle between the hot air flow direction inside the heat exchanger flow channel shell 2203 of the heat exchanger 200 and the cold air flow direction outside is a certain angle, which is greater than 0° and less than or equal to 90°, and is preferably 90° in this embodiment.

[0039] The heat dissipation unit 600 can be disposed on the same side of the cabinet as the heat exchanger 200, or on a different side of the cabinet as the heat exchanger 200. Figure 1-5 , the heat dissipation unit 600 is arranged at the back of the cabinet, and the heat exchanger 200 is arranged at the left side of the cabinet. The heat dissipation unit 600 at least includes a heat sink 610 and a heat dissipation fan 620. In this embodiment, the heat dissipation unit 600 also includes a first inductor 630 and a second inductor 640. There are one or more openings on the cabinet wall between the power module 530 and the heat sink 610. The interface material is arranged on the side where the power module 530 is located. The power module 530 is indirectly in contact with the heat sink 610 through the interface material. Among them, the interface material is a filler used between two materials and is an important bridge for heat transfer; the interface material is arranged between two bonding materials to fill the gap, improve the heat transfer efficiency, and reduce the thermal impedance; the interface material is divided into traditional thermal conductive interface materials and new thermal conductive interface materials, such as traditional thermal conductive paste, elastic thermal conductive cloth, thermal conductive gel, thermal conductive belt, etc., and new types such as indium-based alloy thermal conductive pads, liquid metal thermal conductive agents, carbon fiber thermal conductive pads, etc. This application does not specifically limit the interface material. In actual applications, the selection of interface materials is determined according to actual needs. One or more cooling fans 620 draw air from the external environment and blow air to the heat sink 610 , thereby cooling the power module 530 , the first inductor 630 , and the second inductor 640 .

[0040] Embodiment 2:

[0041] This embodiment is an improvement on embodiment 1. Figure 7 , a capacitor cavity 1301 accommodating a capacitor plate 540 is provided inside the first cavity 130 of the present embodiment. The cavity is connected to the first air collecting cavity 2101 of the heat exchanger 200 and is connected to the first cavity 130. Typically, power electronic equipment uses temperature-sensitive electrolytic capacitors, and high temperatures significantly affect the service life of electrolytic capacitors. Since the air temperature of the capacitor cavity 1301 is relatively low and the electrolytic capacitor can be cooled separately, its service life can be greatly improved, or the number of capacitors used can be reduced to reduce size and save costs.

[0042] Embodiment 3:

[0043] This embodiment is an improvement on Embodiment 2. Figure 8 The first internal fan 700 is arranged at the second opening 1102, which has the beneficial effect of reducing the space occupied by the fan and the capacitor cavity 1301 accommodating the capacitor plate 540 in the cabinet.

[0044] Embodiment 4:

[0045] This embodiment is an improvement on Embodiment 2. Fig. 9, an external fan 400 is placed at the bottom of the heat exchange device 300. The fan can be a blower or an intake fan. Preferably, the heat exchanger 200 is blown to prevent the short circuit of the hot and cold air. Accordingly, the capacitor plate 540, the capacitor cavity 1301 and the first internal fan 700 can be arranged at the top of the inner side of the cabinet 100, above the heating device in the cabinet 100. The cold air inside the cabinet 100 cools the electrolytic capacitor plate 540, and the high-density cold air at the top is used to promote the circulation of the air inside the cabinet 100, thereby enhancing the heat exchange performance.

[0046] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A power electronic device and a heat dissipation system thereof, characterized in that: The invention comprises a cabinet (100) containing a heating device, a heat exchanger (200) arranged on one side of the cabinet (100), and a heat exchange device (300) sleeved with the heat exchanger (200); the heat exchange device (300) is provided with a third opening (3103) for communicating with the external environment, an external fan (400) for blowing or taking in air, and a sealing member (3102) for guiding air to contact the heat exchanger (200); the heat exchanger (200) is provided with a first air collecting shell (2201) and a second air collecting shell (2202) which are connected to the cabinet (100); a heat exchanger flow channel shell (2203) is provided between the first air collecting shell (2201) and the second air collecting shell (2202); and the air in the cabinet (100) can achieve heat exchange through the heat exchanger (200).

2. A power electronic device and a heat dissipation system thereof according to claim 1, characterized in that: The cabinet (100) is provided with a first internal fan (700) for exchanging air between the cabinet (100) and the heat exchanger (200).

3. A power electronic device and a heat dissipation system thereof according to claim 2, characterized in that: The first internal fan (700) is arranged at an air outlet of the first opening (1101) or the second opening (1102) of the heat exchanger (200) in the cabinet (100).

4. A power electronic device and a heat dissipation system thereof according to claim 2, characterized in that: The cabinet (100) is further provided with a second internal fan (800), and the first internal fan (700) and the second internal fan (800) are arranged diagonally.

5. A power electronic device and a heat dissipation system thereof according to claim 1, characterized in that: The heat exchanger flow channel shell (2203) adopts flat tubes, and wave-shaped teeth are arranged between the flat tubes.

6. A power electronic device and a heat dissipation system thereof according to claim 1, characterized in that: The heat exchanger flow channel shell (2203) is made of round tubes, and the round tubes can be arranged in a row, in a staggered row, or with heat exchange fins passing through the cross section of the round tubes.

7. A power electronic device and a heat dissipation system thereof according to claim 1, characterized in that: A heat dissipation unit (600) is provided on the outer wall of the cabinet (100); the heat dissipation unit (600) and the heat exchanger (200) are arranged on the same side or different sides of the cabinet (100).

8. A power electronic device and a heat dissipation system thereof according to claim 7, characterized in that: The heat dissipation unit (600) comprises a heat sink (610) and a heat dissipation fan (620); the heat sink (610) is in indirect contact with a heat-generating device in the cabinet (100) via an interface material; and the heat dissipation fan (620) guides air from the external environment to the heat sink (610) to indirectly cool the heat-generating device.

9. A power electronic device and a heat dissipation system thereof according to claim 2, characterized in that: The cabinet (100) is provided with a capacitor cavity (1301) capable of accommodating a capacitor plate (540); the capacitor cavity (1301) is respectively connected to a first air collecting cavity (2101) in the heat exchanger (200) and a first cavity (130) in the cabinet (100); and the first internal fan (700) is arranged at an air outlet where the capacitor cavity (1301) is connected to the first cavity (130).

10. A power electronic device and a heat dissipation system thereof according to claim 9, characterized in that: The external fan (400) is adjacent to the second air collecting shell (2202), and the capacitor cavity (1301) is arranged on the inner wall of the cabinet (100) on the side where the first opening (1101) is located; or, The external fan (400) is adjacent to the first air collecting shell (2201), and the capacitor cavity (1301) is arranged on the inner wall of the cabinet (100) which is perpendicular to the side where the first opening (1101) is located.