Integrated controller with rapid heat dissipation function

Abstract

The utility model relates to the technical field of integrated controllers, and provides an integrated controller with a rapid heat dissipation function, which comprises a base, the top end of a buffer assembly is fixedly connected with a controller mainboard, the top end of the base is fixedly connected with a cover plate through bolts, and the lower end of the inner wall of a heat dissipation cover is fixedly connected with a heat dissipation fan. A speed reducer is fixedly connected to the upper end of the inner wall of the heat dissipation cover, a dustproof net is fixedly connected to the top end of the heat dissipation cover through bolts, a sweeping brush strip is fixedly connected to one side of a clamping block, and double heat dissipation of the interior of the base is achieved through a heat dissipation assembly and a semiconductor chilling plate by means of a heat dissipation fan and the semiconductor chilling plate; and in addition, the sweeping brush strips rotate to rotationally sweep the top end of the dustproof net, blockage caused by accumulation of impurities such as dust at the top end of the dustproof net is avoided, then the good ventilation and heat dissipation effects in the heat dissipation cover are guaranteed, and the practicability of the heat dissipation cover is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated controllers, in particular to an integrated controller with a rapid heat dissipation function. Background Art

[0002] An integrated controller is a controller that integrates multiple control functions. It can greatly simplify the system architecture and wiring, reduce the system size and load, and make the system more efficient and more stable. Therefore, it is widely used in many fields today, bringing great convenience to our lives and industrial production.

[0003] After searching, the existing patent (Announcement No.: CN220342651U) discloses a highly integrated controller. It relates to the technical field of integrated controllers. It is composed of an integrated combined bearing structure, a controller component and an integrated mounting seat group. During the installation of the controller component, only the specific component needs to be installed and fixed with the mounting seat that is compatible with it. When disassembling due to a fault in the later stage, only a single component needs to be disassembled. The flexibility of disassembly can be improved without affecting the installation performance of other components. At the same time, the wiring area can be set up to better install and adapt, avoiding the inconvenience of later maintenance caused by chaotic wiring. At the same time, the rotating plate frame can provide flexible component positioning and adjustment, which is convenient for use in different working environments. When it is necessary to load and unload components, the loading and unloading work area can be increased after rotation, and disassembly and maintenance can be performed without affecting the installation performance of other components.

[0004] However, in the above scheme, a certain amount of heat will be generated during the normal operation of the integrated controller, and the heat accumulation will affect the normal operation of the integrated controller, and in severe cases will cause serious safety hazards. When the fan is dissipating heat, the air inlet is easily blocked by dust and other impurities due to the air intake factor, which affects the subsequent air intake and heat dissipation effect, and is not conducive to normal long-term operation, resulting in inconvenience in its use.

[0005] In view of this, the utility model proposes an integrated controller with a rapid heat dissipation function. Utility Model Content

[0006] The utility model provides an integrated controller with a rapid heat dissipation function, which solves the problem of poor heat dissipation in the related art.

[0007] The technical solution of the utility model is as follows: an integrated controller with a rapid heat dissipation function, comprising a base, wherein a buffer assembly is arranged around the inner bottom wall of the base, a controller mainboard is fixedly connected to the top of the buffer assembly, a cover plate is fixedly connected to the top of the base by bolts, and a heat dissipation assembly is arranged at the middle position of the top of the cover plate.

[0008] The heat dissipation component comprises a heat dissipation cover, the heat dissipation cover is fixedly connected at the middle position of the top end of the cover plate, the lower end of the inner wall of the heat dissipation cover is fixedly connected with a heat dissipation fan, the upper end of the inner wall of the heat dissipation cover is fixedly connected with a reducer, the bottom end of the reducer is fixedly connected to the top end of the heat dissipation fan, the top end of the heat dissipation cover is fixedly connected with a dustproof net by bolts, the top end of the reducer is fixedly connected with a linkage rod penetrating the dustproof net, the top of the linkage rod is provided with a card slot on both sides of the top end of the linkage rod, the inside of the card slot is movably connected with a card block, and one side of the card block is fixedly connected with a cleaning brush strip, and the external fresh air is filtered by the dustproof net and blown to the inside of the base by starting the heat dissipation fan to achieve air-cooled heat dissipation, and the semiconductor refrigeration sheet can be started to transport cold air to the inside of the base, so as to cooperate with the heat dissipation fan to fill the cold air more quickly and evenly into the inside of the base, further improving the heat dissipation effect of the controller mainboard, and at the same time, the linkage rod is slowly rotated by the reducer, and then the cleaning brush strip is rotated to rotate and clean the top of the dustproof net, so as to avoid the blockage caused by the accumulation of dust and other impurities at the top of the dustproof net, thereby ensuring the good air intake and heat dissipation of the heat dissipation cover.

[0009] Preferably, the upper ends of both sides of the front side of the linkage rod are movably connected with fixing bolts, and one side of the clamping block is provided with a bolt hole threadedly matched with the fixing bolt, so as to improve the firmness and stability of the clamping block and the inside of the clamping slot.

[0010] Preferably, a locking structure is formed between the clamping block and the inside of the clamping slot, and the shape of the clamping slot and the clamping block in a top view is an inverted convex shape, which improves the stability of the initial locking installation of the cleaning brush strip.

[0011] Preferably, semiconductor refrigeration plates are fixedly connected to both sides of the top of the cover plate, and the semiconductor refrigeration plates are symmetrically distributed about the vertical center axis of the cover plate, so as to facilitate further cooling of the inside of the base and further improve its heat dissipation effect.

[0012] Preferably, ventilation holes are provided at equal intervals around the base, and the cross section of the ventilation holes is inclined at an angle of thirty degrees to the horizontal direction, so that the interior of the base can be ventilated while reducing external dust and other impurities from entering the interior of the base through the ventilation holes.

[0013] Preferably, the buffer assembly includes a buffer seat, which is fixedly connected to the inner bottom wall of the base, the inner bottom wall of the buffer seat is fixedly connected with a damper, the top of the damper is fixedly connected with a sliding plate, the damper surface at the bottom end of the sliding plate is wound with a buffer spring, the bottom end of the buffer spring is fixedly connected to the inner bottom wall of the buffer seat, the top of the sliding plate is fixedly connected with a buffer column extending to the outside of the buffer seat, the top of the buffer column is fixedly connected to the bottom end of the controller mainboard by bolts, the buffer spring is used to absorb the vibration transmitted from the outside, and the damper is used to consume the elastic potential energy of the buffer spring, thereby reducing the movement amplitude of the controller mainboard, realizing buffering and shock absorption of the controller mainboard, and avoiding inconvenience caused by external vibration to the operation of the controller mainboard.

[0014] Preferably, a sliding structure is formed between the sliding plate and the inside of the buffer seat, and the shape of the sliding plate in the top view is a cross, so that the up and down sliding of the buffer column and the controller mainboard is smoother, and the sliding friction between the sliding plate and the inside of the buffer seat can also consume part of the elastic potential energy of the buffer spring.

[0015] Preferably, rubber strips are fixedly connected to the inner bottom wall of the base at equal intervals, and the cross-section of the rubber strips is arc-shaped, which further buffers and reduces shock to the bottom end of the controller mainboard when the controller mainboard moves too much.

[0016] The working principle and beneficial effects of the utility model are:

[0017] The utility model provides a heat dissipation component and a semiconductor refrigeration sheet, and starts the heat dissipation fan to blow the external fresh air into the base after being filtered by the dustproof net, so that the heat generated by the operation of the controller mainboard can be discharged through the ventilation holes, thereby realizing air cooling and heat dissipation. At the same time, the semiconductor refrigeration sheet can be started to transport cold air to the inside of the base, so that the cold air can be more quickly and evenly filled into the inside of the base in cooperation with the heat dissipation fan, thereby realizing double heat dissipation and improving its heat dissipation efficiency and heat dissipation effect. At the same time, the reducer is used to slowly rotate the linkage rod, so that the cleaning brush bar is rotated to rotate and clean the top of the dustproof net, thereby avoiding blockage caused by accumulation of dust and other impurities on the top of the dustproof net, ensuring good air intake and heat dissipation of the heat dissipation cover, and the cleaning brush bar can be disassembled and assembled to clean or replace the cleaning brush bar that is too dirty or damaged, thereby improving its practicality.

[0018] By providing a buffer assembly and a rubber strip in the utility model, the vibration generated by the operation of the controller mainboard or the vibration generated by external collision will cause the controller mainboard to move. At this time, the buffer spring can be used to absorb the vibration transmitted from the outside, and the damper can be used to consume the elastic potential energy of the buffer spring, thereby reducing the movement amplitude of the controller mainboard and achieving buffering and shock absorption of the controller mainboard. In addition, the arc-shaped rubber strip can be used to further buffer and absorb the shock of the bottom end of the controller mainboard when the movement amplitude of the controller mainboard is too large, thereby avoiding the inconvenience caused by external vibration to the operation of the controller mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0020] Figure 1 It is a schematic diagram of the overall cross-sectional structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the controller mainboard of the utility model when viewed from above;

[0023] Figure 4 It is a schematic diagram of the partial explosion structure of the heat dissipation cover of the utility model;

[0024] Figure 5 It is a schematic diagram of the partial explosion structure of the buffer component of the utility model;

[0025] Figure 6 For the utility model Figure 4 Enlarged structural diagram at A in the middle.

[0026] In the figure: 1. heat dissipation assembly; 101. reducer; 102. cooling fan; 103. heat dissipation cover; 104. dustproof net; 105. cleaning brush strip; 106. fixing bolt; 107. linkage rod; 108. slot; 109. bolt hole; 110. block; 2. semiconductor cooling plate; 3. cover plate; 4. ventilation hole; 5. base; 6. buffer assembly; 601. buffer seat; 602. buffer column; 603. sliding plate; 604. buffer spring; 605. damper; 7. controller main board; 8. rubber strip. DETAILED DESCRIPTION

[0027] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Example 1

[0028] The preferred embodiment of the integrated controller with rapid heat dissipation function provided by the utility model is as follows: Figures 1 to 6 As shown: an integrated controller with rapid heat dissipation function, including a base 5, a buffer assembly 6 is arranged around the inner bottom wall of the base 5, a controller mainboard 7 is fixedly connected to the top of the buffer assembly 6, a cover plate 3 is fixedly connected to the top of the base 5 by bolts, and a heat dissipation assembly 1 is arranged at the middle position of the top of the cover plate 3.

[0029] The heat dissipation assembly 1 includes a heat dissipation cover 103, which is fixedly connected to the middle position of the top of the cover plate 3, and the lower end of the inner wall of the heat dissipation cover 103 is fixedly connected to the heat dissipation fan 102, and the upper end of the inner wall of the heat dissipation cover 103 is fixedly connected to the reducer 101, and the bottom end of the reducer 101 is fixedly connected to the top of the heat dissipation fan 102, and the top of the heat dissipation cover 103 is fixedly connected to the dustproof net 104 by bolts, and the top of the reducer 101 is fixedly connected to the linkage rod 107 that penetrates the dustproof net 104, and the two sides of the top of the linkage rod 107 are provided with a card slot 1 08, the card slot 108 is movably connected to a card block 110, and one side of the card block 110 is fixedly connected to a cleaning brush strip 105. By starting the cooling fan 102, the external fresh air is filtered by the dustproof net 104 and blown to the inside of the base 5 to achieve air cooling and heat dissipation. The reducer 101 is used to make the linkage rod 107 rotate slowly, and then the cleaning brush strip 105 rotates to clean the top of the dustproof net 104, avoiding blockage caused by the accumulation of dust and other impurities on the top of the dustproof net 104, thereby ensuring good air intake and heat dissipation of the heat dissipation cover 103.

[0030] In this embodiment, the upper ends of both sides of the front side of the linkage rod 107 are movably connected with fixing bolts 106, and a bolt hole 109 threadedly matched with the fixing bolt 106 is opened on one side of the clamping block 110. The fixing bolt 106 is threadedly matched with the internal thread of the bolt hole 109 to improve the firmness and stability of the clamping block 110 and the internal clamping slot 108.

[0031] In this embodiment, a locking structure is formed between the block 110 and the inside of the slot 108. The shape of the slot 108 and the block 110 in the top view is inverted convex. The locking of the inverted convex block 110 with the inside of the slot 108 improves the stability of the initial locking installation of the cleaning brush strip 105.

[0032] In this embodiment, semiconductor refrigeration plates 2 are fixedly connected to both sides of the top of the cover plate 3. The semiconductor refrigeration plates 2 are symmetrically distributed about the vertical center axis of the cover plate 3. The symmetrical cover plate 3 is used to facilitate further cooling of the inside of the base 5, thereby further improving its heat dissipation effect.

[0033] In this embodiment, ventilation holes 4 are evenly spaced around the base 5, and the cross section of the ventilation holes 4 is inclined at an angle of thirty degrees to the horizontal direction. The inclined ventilation holes 4 can be used to ventilate the interior of the base 5 while reducing the entry of external dust and other impurities into the interior of the base 5 through the ventilation holes 4. Example 2

[0034] Based on Example 1, a preferred embodiment of the integrated controller with rapid heat dissipation function provided by the present invention is as follows: Figures 1 to 6 As shown: the buffer assembly 6 includes a buffer seat 601, which is fixedly connected to the inner bottom wall of the base 5. The inner bottom wall of the buffer seat 601 is fixedly connected with a damper 605. The top of the damper 605 is fixedly connected with a sliding plate 603. The surface of the damper 605 at the bottom of the sliding plate 603 is wound with a buffer spring 604. The bottom end of the buffer spring 604 is fixedly connected to the inner bottom wall of the buffer seat 601. The top of the sliding plate 603 is fixedly connected with a buffer column 602 extending to the outside of the buffer seat 601. The top of the buffer column 602 is fixedly connected to the bottom end of the controller main board 7 by bolts. The vibration generated by the operation of the controller main board 7 or the vibration generated by external collision will cause the controller main board 7 to move. At this time, the buffer spring 604 is used to absorb the vibration transmitted from the outside, and the damper 605 is used to consume the elastic potential energy of the buffer spring 604, thereby reducing the movement amplitude of the controller main board 7, realizing the buffering and shock absorption of the controller main board 7, and avoiding the inconvenience caused by external vibration to the operation of the controller main board 7.

[0035] In this embodiment, a sliding structure is formed between the sliding plate 603 and the interior of the buffer seat 601. The shape of the sliding plate 603 in a top view is a cross. The sliding of the cross-shaped sliding plate 603 inside the buffer seat 601 makes the buffer column 602 and the controller main board 7 slide up and down more smoothly, and the sliding friction between the two can also consume a part of the elastic potential energy of the buffer spring 604.

[0036] In this embodiment, rubber strips 8 are fixedly connected to the inner bottom wall of the base 5 at equal intervals. The cross-section of the rubber strips 8 is arc-shaped. The arc-shaped rubber strips 8 can further buffer and reduce shock to the bottom of the controller mainboard 7 when the controller mainboard 7 moves too much.

[0037] The working principle and use process of the utility model are as follows: first, during the normal operation of the controller mainboard 7, the vibration generated by the operation of the controller mainboard 7 or the vibration generated by external collisions will cause the controller mainboard 7 to move, thereby causing the buffer column 602 and the sliding plate 603 to slide inside the buffer seat 601 to compress the buffer spring 604 and the damper 605, and the buffer spring 604 is used to absorb the vibration transmitted from the outside, and the damper 605 is used to consume the elastic potential energy of the buffer spring 604, thereby reducing the movement amplitude of the controller mainboard 7, achieving buffering and shock absorption of the controller mainboard 7, and using the arc-shaped rubber strip 8, when the movement amplitude of the controller mainboard 7 is too large, the bottom end of the controller mainboard 7 is further buffered and shock-absorbed, thereby avoiding the inconvenience caused by external vibration to the operation of the controller mainboard 7;

[0038] At the same time, the cooling fan 102 can be started to filter the external fresh air through the dustproof net 104 and blow it into the base 5, so that the heat generated by the controller mainboard 7 can be discharged from the ventilation hole 4 to achieve air cooling and heat dissipation. At the same time, the semiconductor refrigeration sheet 2 can be started to transport cold air into the base 5, so as to cooperate with the cooling fan 102 to fill the base 5 with cold air more quickly and evenly, further improving the heat dissipation effect and heat dissipation efficiency of the controller mainboard 7;

[0039] In addition, when the cooling fan 102 is working, the reducer 101 will cause the linkage rod 107 to rotate slowly, thereby causing the cleaning brush strip 105 to rotate and clean the top of the dustproof net 104, avoiding blockage caused by the accumulation of dust and other impurities on the top of the dustproof net 104, ensuring good air intake and heat dissipation of the heat dissipation cover 103, and the fixing bolt 106 can be rotated by a tool such as a screwdriver until it is completely disengaged from the inside of the bolt hole 109, and then the cleaning brush strip 105 is pulled hard to remove the block 110 from the inside of the slot 108, so as to facilitate the cleaning or replacement of the cleaning brush strip 105 that is too dirty or damaged.

[0040] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated controller with a rapid heat dissipation function, comprising a base (5), characterized in that: A buffer component (6) is arranged around the inner bottom wall of the base (5); the top of the buffer component (6) is fixedly connected to a controller mainboard (7); the top of the base (5) is fixedly connected to a cover plate (3) via bolts; a heat dissipation component (1) is arranged at the middle position of the top of the cover plate (3); The heat dissipation assembly (1) comprises a heat dissipation cover (103), wherein the heat dissipation cover (103) is fixedly connected to the middle position of the top of the cover plate (3), the lower end of the inner wall of the heat dissipation cover (103) is fixedly connected to a heat dissipation fan (102), the upper end of the inner wall of the heat dissipation cover (103) is fixedly connected to a reducer (101), the bottom end of the reducer (101) is fixedly connected to the top of the heat dissipation fan (102), the top of the heat dissipation cover (103) is fixedly connected to a dustproof net (104) by bolts, the top of the reducer (101) is fixedly connected to a linkage rod (107) that passes through the dustproof net (104), the top of the linkage rod (107) is provided with a card slot (108) on both sides of the top of the linkage rod (107), the inside of the card slot (108) is movably connected to a card block (110), and one side of the card block (110) is fixedly connected to a cleaning brush strip (105).

2. The integrated controller with rapid heat dissipation function according to claim 1, characterized in that: The upper ends of both sides of the front side of the linkage rod (107) are movably connected with fixing bolts (106), and one side of the clamping block (110) is provided with bolt holes (109) threadably matched with the fixing bolts (106).

3. The integrated controller with rapid heat dissipation function according to claim 1, characterized in that: A locking structure is formed between the locking block (110) and the interior of the locking slot (108); the shape of the locking slot (108) and the locking block (110) in a top view is an inverted convex shape.

4. The integrated controller with rapid heat dissipation function according to claim 1, characterized in that: Semiconductor cooling sheets (2) are fixedly connected to both sides of the top of the cover plate (3), and the semiconductor cooling sheets (2) are symmetrically distributed about the vertical center axis of the cover plate (3).

5. The integrated controller with rapid heat dissipation function according to claim 1, characterized in that: Ventilation holes (4) are provided at equal intervals around the base (5), and the cross section of the ventilation hole (4) is inclined at an angle of thirty degrees to the horizontal direction.

6. The integrated controller with rapid heat dissipation function according to claim 1, characterized in that: The buffer assembly (6) comprises a buffer seat (601), wherein the buffer seat (601) is fixedly connected to the inner bottom wall of the base (5), a damper (605) is fixedly connected to the inner bottom wall of the buffer seat (601), a sliding plate (603) is fixedly connected to the top of the damper (605), a buffer spring (604) is wound around the surface of the damper (605) at the bottom end of the sliding plate (603), the bottom end of the buffer spring (604) is fixedly connected to the inner bottom wall of the buffer seat (601), the top end of the sliding plate (603) is fixedly connected to a buffer column (602) extending to the outside of the buffer seat (601), and the top end of the buffer column (602) is fixedly connected to the bottom end of the controller mainboard (7) via bolts.

7. The integrated controller with rapid heat dissipation function according to claim 6, characterized in that: A sliding structure is formed between the sliding plate (603) and the interior of the buffer seat (601); the shape of the sliding plate (603) in a top view is a cross.

8. The integrated controller with rapid heat dissipation function according to claim 1, characterized in that: The inner bottom wall of the base (5) is fixedly connected with rubber strips (8) at equal intervals, and the cross-section of the rubber strips (8) is in the shape of an arc.

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