Shell and inverter

Abstract

The utility model relates to a shell and an inverter, and relates to the technical field of inverters, the shell is provided with a containing cavity, at least one side of the shell is provided with a heat dissipation plate, the heat dissipation plate is provided with a first heat dissipation structure and a second heat dissipation structure, and the first heat dissipation structure and the second heat dissipation structure are arranged on the two sides of the heat dissipation plate. And the heat generated by the to-be-radiated part is transmitted to the second radiating structure through the first radiating structure to be radiated. According to the shell, the design of the heat dissipation plate, the first heat dissipation structure and the second heat dissipation structure is utilized, heat generated by the part to be subjected to heat dissipation is transmitted to the second heat dissipation structure through the first heat dissipation structure and then dissipated to the external environment through the second heat dissipation structure, and the heat dissipation and heat dissipation effects are achieved; the shell can meet the heat dissipation requirement of the part to be subjected to heat dissipation without additionally arranging a radiator or other heat dissipation equipment, the effect of saving the manufacturing cost and the layout space can be achieved, and the shell can be suitable for being used in various electronic devices or components needing heat dissipation.

Description

Technical Field

[0001] The present application relates to the technical field of inverters, and in particular to a housing and an inverter. Background Art

[0002] Currently, in the field of high-power photovoltaic inverters, heat dissipation has always been a major challenge that limits the inverter power; effectively dealing with the heat dissipation problem of the inverter directly affects the safety, reliability and service life of the inverter.

[0003] As the power density of high-power photovoltaic inverters continues to increase, heat dissipation inside the inverter cavity has become a huge challenge. How to effectively remove the heat inside the cavity has become the primary task in solving the inverter heat dissipation problem. Since the inverter cavity itself cannot effectively dissipate heat, the existing technology mainly enhances the heat dissipation performance by adding a radiator that runs through the cavity. One side of the radiator is set inside the cavity, and the other side is located outside the cavity. The air inside the cavity forms a circulating airflow through the internal fan, exchanges heat with the fins inside the radiator, and then transfers the heat to the fins outside the cavity, and finally takes the heat away through the external fan.

[0004] However, this method has some disadvantages: first, the inverter cavity needs to be installed with a heat sink that runs through the cavity, which increases the cost; second, the heat sink will occupy a certain space, affecting the layout of other components; finally, the heat sink requires an additional fan on the outside for cooling, which also increases the cost. Utility Model Content

[0005] In order to improve the problem that the spatial layout of the inverter is affected and the manufacturing cost is increased due to the additional addition of a heat sink for heat dissipation, the present application provides a housing and an inverter.

[0006] The present application provides a housing and an inverter adopting the following technical solutions:

[0007] A shell is used for heat dissipation of a heat dissipation component, the shell is provided with a accommodating cavity, at least one side of the shell is provided with a heat dissipation plate, the heat dissipation plate is provided with a first heat dissipation structure and a second heat dissipation structure, the first heat dissipation structure and the second heat dissipation structure are arranged on both sides of the heat dissipation plate, and the heat generated by the heat dissipation component is transferred to the second heat dissipation structure through the first heat dissipation structure for dissipation.

[0008] By adopting the above-mentioned technical scheme, the shell of the present application utilizes the design of a heat sink, a first heat dissipation structure and a second heat dissipation structure. The heat generated by the heat dissipation element is transferred to the second heat dissipation structure through the first heat dissipation structure, and then dissipated to the external environment through the second heat dissipation structure, thereby achieving heat dissipation and heat dissipation effects. The shell of the present application can meet the heat dissipation requirements of the heat dissipation element without the need for additional radiators or other heat dissipation devices, can achieve the effect of saving manufacturing costs and layout space, and can be suitable for use in various electronic devices or components that require heat dissipation.

[0009] In a specific possible implementation manner, a third heat dissipation structure is provided on a side of the housing away from the accommodating cavity.

[0010] By adopting the above technical solution and utilizing the setting of the third heat dissipation structure, the third heat dissipation structure can further enhance the heat dissipation capacity of the shell and can directly export the heat in the accommodating cavity, thereby improving the overall heat dissipation effect.

[0011] In a specific implementation scheme, the first heat dissipation structure includes a plurality of first heat dissipation fins, the second heat dissipation structure includes a plurality of second heat dissipation fins, and the third heat dissipation structure includes a plurality of third heat dissipation fins, and heat dissipation channels are left between adjacent first heat dissipation fins, between adjacent second heat dissipation fins, and between adjacent third heat dissipation fins.

[0012] By adopting the above technical solution and utilizing the above design method, the heat dissipation surface area can be effectively increased, the heat dissipation efficiency can be improved, and the setting of the heat dissipation channel can help the transfer and dissipation of heat. Such a structural design further improves the heat dissipation performance and ensures that the heat dissipation component can be maintained within a suitable temperature range during operation.

[0013] In a specific possible implementation scheme, the thickness of the first heat sink and the thickness of the second heat sink gradually decrease from the side close to the heat sink to the side away from the heat sink, and the thickness of the third heat sink gradually decreases from the side close to the accommodating cavity to the side away from the accommodating cavity.

[0014] By adopting the above technical solution, by gradually reducing the thickness of the first heat sink, the second heat sink, and the third heat sink from the side close to the heat sink to the side far from the heat sink, the sample can be more easily removed from the mold. The gradual reduction in thickness can reduce the adhesion between the mold and the sample, making it easier to separate the sample during demolding, thereby reducing damage and scrap rates during the production process.

[0015] In a specific possible implementation manner, the housing and / or the heat dissipation plate and / or the first heat dissipation structure and / or the second heat dissipation structure and / or the third heat dissipation structure are integrally formed.

[0016] By adopting the above technical solution and utilizing an integrated design, the contact between the heat sink, the housing, and the heat dissipation structure can be made closer, which is beneficial to the rapid transfer and dissipation of heat and improves the heat dissipation efficiency.

[0017] In a specific possible implementation manner, the housing and / or the heat sink are provided with mounting holes.

[0018] By adopting the above technical solution and utilizing the design of the mounting holes, the requirements for shell installation can be met, the installation is simple and quick, the assembly efficiency is improved, and subsequent repair and maintenance work can also be facilitated. If parts need to be replaced or adjusted, the operation can be quickly performed through the mounting holes.

[0019] In a specific possible implementation manner, the shell and the heat sink are jointly provided with a sealing groove, the sealing groove is arranged along the circumference of the shell and the heat sink, and a sealing ring is provided in the sealing groove.

[0020] By adopting the above technical solution and utilizing the setting of the sealing groove and the sealing ring, after the shell is installed, the sealing ring can effectively prevent external liquid, dust or other impurities from invading the interior of the heat dissipation component, thereby protecting the heat dissipation component from damage.

[0021] An inverter comprises a shell as described above, wherein the inverter comprises a box body and components arranged in the box body, the shell body is arranged on the box body, and the components are arranged in the accommodating cavity of the shell body; the first heat dissipation structure of the heat sink passes through the box body and extends into the box body, and the second heat dissipation structure is located outside the box body, and the heat generated in the inverter is transferred to the second heat dissipation structure through the first heat dissipation structure and dissipated through the second heat dissipation structure.

[0022] By adopting the above technical solution, when working, the heat generated inside the inverter is conducted from the inside to the outside through the first heat dissipation structure on the heat dissipation plate of the shell and enters the second heat dissipation structure. The heat is dissipated outside the shell through the second heat dissipation structure, and the atmosphere or other cooling equipment is used to help dissipate heat to keep the temperature inside the inverter within a safe range. In this process, the shell integrates heat sinks that run through both sides of the inverter cavity inside and outside, and no additional heat sink that runs through the cavity is required, so that the application does not increase the number of devices, and only improves the existing device shell to achieve enhanced heat dissipation capacity in the cavity, occupies a small space, has low cost, and is suitable for most high-power inverters.

[0023] In a specific implementation manner, a fan is further included, and the fan guides airflow to blow toward the first heat dissipation structure, the second heat dissipation structure, and the third heat dissipation structure.

[0024] By adopting the above technical solution and utilizing the design of the inverter itself with a fan, the wind blown by the fan can accelerate the conduction of heat between the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure, and quickly bring the heat out of the box, so that the heat can be discharged from the inverter more quickly, thereby improving the heat dissipation efficiency and effectively reducing the internal temperature of the inverter.

[0025] In a specific possible implementation manner, the sealing ring in the sealing groove abuts against the outer wall of the box body.

[0026] By adopting the above technical solution, after the shell is installed on the inverter box, the sealing ring of the shell will contact the outer wall of the box, ensuring that the inverter can effectively prevent external moisture, dust or other impurities from entering the inverter when it is working, thereby protecting the electronic components and circuits inside the inverter. Through a good sealing design, the durability of the inverter can be improved and the maintenance requirements can be reduced, which also helps to ensure its performance and safe operation.

[0027] In summary, the present application includes at least one of the following beneficial technical effects:

[0028] 1. When the housing of the present application is in operation, the heat generated by the heat dissipation element is transferred to the second heat dissipation structure through the first heat dissipation structure, and then dissipated to the external environment through the second heat dissipation structure, thereby achieving heat dissipation and heat dissipation effects; the housing of the present application can meet the heat dissipation requirements of the heat dissipation element without the need for additional radiators or other heat dissipation devices, can achieve the effect of saving manufacturing costs and layout space, and can be applicable to the use of various electronic devices or components that require heat dissipation;

[0029] 2. The inverter of the present application has a shell that integrates a first heat dissipation structure and a second heat dissipation structure that penetrate both sides of the inverter cavity. The shell used for the inductor in the inverter can achieve heat dissipation from the inside to the outside, and no additional heat sink that penetrates the cavity is required. This means that the present application does not increase the number of components, and only improves the existing device shell to enhance the heat dissipation capacity in the cavity. It occupies a small space, has low cost, and is suitable for most high-power inverters. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the structure of the shell in the embodiment of the present application.

[0031] Figure 2 It is a schematic diagram for showing the positional relationship among the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure.

[0032] Figure 3 It is a structural diagram used to show the sealing groove and mounting holes.

[0033] Figure 4It is a schematic diagram of the structure of the box of the inverter in the embodiment of the present application.

[0034] Figure 5 It is a schematic diagram used to show the installation of the housing on the inverter box.

[0035] Explanation of the accompanying drawings: 1. Shell; 11. Accommodating cavity; 12. Boss; 13. Arc surface; 2. Heat dissipation plate; 3. First heat dissipation structure; 31. First heat sink; 4. Second heat dissipation structure; 41. Second heat sink; 5. Third heat dissipation structure; 51. Third heat sink; 6. Heat dissipation channel; 7. Mounting hole; 8. Box; 81. Mounting port; 9. Sealing groove. DETAILED DESCRIPTION

[0036] The following is combined with Figure 1-5 This application is described in further detail.

[0037] Embodiment 1

[0038] Reference Figure 1 and Figure 2 The embodiment of the present application discloses a housing for heat dissipation of a heat dissipation element. In the embodiment, the housing 1 is an improved housing of the shell structure of the heat dissipation element. The heat dissipation element includes but is not limited to electronic equipment and electronic components. The housing 1 is provided with a receiving cavity 11. In the embodiment, a boss 12 is extended from the inner wall of the housing 1 toward the receiving cavity 11. The boss 12 has two arc-shaped surfaces 13. The boss 12 and the two arc-shaped surfaces 13 are used together to fit the heat dissipation element and prevent it from being displaced.

[0039] A heat sink 2 is provided on at least one side of the housing 1. In the present embodiment, a heat sink 2 is provided on one side of the housing 1. The heat sink 2 is provided with a first heat sink structure 3 and a second heat sink structure 4. The first heat sink structure 3 and the second heat sink structure 4 are provided on both sides of the heat sink 2. The heat generated by the heat sink is transferred to the second heat sink structure 4 through the first heat sink structure 3 for dissipation.

[0040] During operation, the heat generated by the heat dissipation component is transferred to the second heat dissipation structure 4 through the first heat dissipation structure 3, and then dissipated to the external environment through the second heat dissipation structure 4, thereby achieving heat dissipation and heat dissipation effects; the shell 1 of the present application can meet the heat dissipation requirements of the heat dissipation component without the need for additional radiators or other heat dissipation devices, can achieve the effect of saving manufacturing costs and layout space, and can be suitable for use in various electronic devices or components that require heat dissipation.

[0041] A third heat dissipation structure 5 is provided on the side of the shell 1 away from the accommodating cavity 11, and the third heat dissipation structure 5 and the second heat dissipation structure 4 are located on the same side; the third heat dissipation structure 5 can further enhance the heat dissipation capacity of the shell 1, and can directly export the heat in the accommodating cavity 11, thereby improving the overall heat dissipation effect.

[0042] Reference Figure 2 and Figure 3 , the housing 1 and / or the heat sink 2 and / or the first heat sink structure 3 and / or the second heat sink structure 4 and / or the third heat sink structure 5 are integrally formed. In the present embodiment, the housing 1, the heat sink 2, the first heat sink structure 3, the second heat sink structure 4 and the third heat sink structure 5 include but are not limited to being integrally formed by a die-casting process. In the present embodiment, a stamping column with a columnar or columnar hole-shaped structure is left on the first heat sink structure 3 and / or the second heat sink structure 4 and / or the third heat sink structure 5, and the stamping column can facilitate the demoulding and positioning of the die-casting of the entire housing 1;

[0043] The die-casting manufacturing process can ensure the surface flatness, shape accuracy and internal structure consistency and uniformity of the heat sink 2 and the heat dissipation structure, which is beneficial to the conduction and dissipation of heat, thereby improving the heat dissipation effect. The one-piece molding design can make the contact between the heat sink 2, the shell 1 and the heat dissipation structure closer, which is beneficial to the rapid transfer and dissipation of heat and improves the heat dissipation efficiency.

[0044] Reference Figure 2 and Figure 3 The first heat dissipation structure 3 includes a plurality of first heat dissipation fins 31. In the present embodiment, the plurality of first heat dissipation fins 31 include but are not limited to being uniformly distributed along the width direction of the heat dissipation plate 2. The second heat dissipation structure 4 includes a plurality of second heat dissipation fins 41. In the present embodiment, the plurality of second heat dissipation fins 41 include but are not limited to being uniformly distributed along the length direction of the heat dissipation plate 2. The third heat dissipation structure 5 includes a plurality of third heat dissipation fins 51. In the present embodiment, the plurality of third heat dissipation fins 51 include but are not limited to being uniformly distributed along the width direction of the housing 1. Heat dissipation channels 6 are left between adjacent first heat dissipation fins 31, between adjacent second heat dissipation fins 41, and between adjacent third heat dissipation fins 51.

[0045] By utilizing the uniform distribution of the heat sinks and the design of leaving heat dissipation channels 6, the heat dissipation surface area can be effectively increased, which is beneficial to the conduction and dissipation of heat, thereby improving the overall heat dissipation efficiency. Such a structural design further enhances the heat dissipation performance and ensures that the heat dissipation component can be maintained within a suitable temperature range during operation.

[0046] Reference Figure 2 and Figure 3 , the thickness of the first heat sink 31 and the thickness of the second heat sink 41 gradually decrease from the side close to the heat sink 2 to the side away from the heat sink 2, and the thickness of the third heat sink 51 gradually decreases from the side close to the accommodating cavity 11 to the side away from the accommodating cavity 11;

[0047] In this embodiment, the shell 1, heat sink 2, first heat sink structure 3, second heat sink structure 4, and third heat sink structure 5 of the present application are integrally formed through a die-casting process. At this time, by gradually reducing the thickness of the first heat sink 31, the second heat sink 41, and the third heat sink 51 from the side close to the heat sink 2 to the side far from the heat sink 2, it can help the sample to fall off from the mold more easily. The gradual reduction in thickness can reduce the adhesion between the mold and the sample, making it easier to separate the sample during demolding, thereby reducing damage and scrap rate during the production process.

[0048] Reference Figure 2 and Figure 3 In this embodiment, the arrangement direction of the first heat sink 31 and the second heat sink 41 includes but is not limited to: the arrangement direction of the first heat sink 31 is different from the arrangement direction of the second heat sink 41; in this embodiment, the second heat sink 41 includes but is not limited to being arranged along the length direction of the heat sink 2, the first heat sink 31 includes but is not limited to being arranged obliquely, and the angle range of the first heat sink 31 and the second heat sink 41 needs to be adjusted and optimized according to specific design requirements and actual conditions. In this embodiment, the angle between the first heat sink 31 and the second heat sink 41 includes but is not limited to being arranged at 15-45°;

[0049] By designing that the setting direction of the first heat sink 31 is different from the setting direction of the second heat sink 41, the setting directions of the heat sinks located on both sides of the heat sink 2 are different, which can increase the surface area of ​​the overall structure of the heat sink 2 and improve air flow, and reduce hot spot concentration during heat transfer, improve the uniformity of heat transfer, avoid local overheating, thereby improving the overall heat dissipation efficiency, and more effectively reducing the temperature.

[0050] Reference Figure 2 and Figure 3 In this embodiment, the setting direction of the second heat sink 41 and the third heat sink 51 includes but is not limited to: the setting direction of the second heat sink 41 is the same as the setting direction of the third heat sink 51; in this embodiment, the third heat sink 51 includes but is not limited to being set along the length direction of the shell 1, and the setting direction of the third heat sink 51 includes but is not limited to being parallel to the setting direction of the second heat sink 41; by designing that the setting direction of the second heat sink 41 is the same as the setting direction of the third heat sink 51, the setting direction of the heat sinks located on the same side of the shell 1 and the heat sink 2 is the same, thereby enhancing the synergy between the heat dissipation structures on the shell 1 and the heat sink 2, making the overall heat dissipation process more uniform and stable, and improving the overall heat dissipation efficiency.

[0051] Reference Figure 3, a mounting hole 7 is provided on the shell 1 and / or the heat sink 2. In the present embodiment, both the shell 1 and the heat sink 2 are provided with a mounting hole 7; the design of the mounting hole 7 can meet the installation requirements of the shell 1, and the installation is simple and quick, which improves the assembly efficiency and is also convenient for subsequent repair and maintenance work. If parts need to be replaced or adjusted, the operation can be quickly performed through the mounting hole 7.

[0052] Reference Figure 3 The shell 1 and the heat sink 2 are jointly provided with a sealing groove 9, which is arranged circumferentially along the shell 1 and the heat sink 2, and a sealing ring is arranged in the sealing groove 9; the sealing ring can increase the sealing performance of the shell 1 after installation, and the sealing ring can effectively prevent external liquid, dust or other impurities from invading the interior of the heat sink to be cooled, thereby protecting the heat sink to be cooled from damage.

[0053] The implementation principle of the first embodiment is as follows: the housing 1 of the present application can meet the heat dissipation requirements of the heat dissipation component without the need for an additional radiator or other heat dissipation device, can achieve the effect of saving manufacturing costs and layout space, and can be applicable to the use of various electronic devices or components that require heat dissipation;

[0054] Before work, the shell 1 is installed on the heat dissipation component through the mounting hole 7; during work, the heat generated by the heat dissipation component is transferred to the second heat dissipation structure 4 through the first heat dissipation structure 3, and then dissipated to the external environment through the second heat dissipation structure 4. The heat in the housing cavity 11 of the shell 1 will be directly dissipated to the external environment through the third heat dissipation structure 5, thereby achieving rapid heat dissipation and rapid heat dissipation effect.

[0055] Embodiment 2

[0056] Reference Figure 4 and Figure 5 This embodiment provides an inverter, using the housing 1 described in the first embodiment (the specific structure of the housing 1 is shown in FIG. Figure 1-3 As shown in the figure), the inverter includes a box 8 and components arranged in the box 8. In this embodiment, the components in the inverter include but are not limited to inductors, capacitors, diodes, resistors, integrated circuits and other components (not shown in the figure);

[0057] The housing 1 is disposed on the box body 8. In this embodiment, the box body 8 is provided with a mounting opening 81 corresponding to the housing 1. The housing 1 and the heat sink 2 are located outside the box body 8 and are blocked on the mounting opening 81. The mounting opening 81 is communicated with the accommodating cavity 11. The components are disposed in the accommodating cavity 11 of the housing 1. In this embodiment, the housing 1 is used to place and install the inductor. The inductor is accommodated in the accommodating cavity 11 of the housing 1 and is in contact with and fits the boss 12 and the arc surface 13.

[0058] The first heat dissipation structure 3 on the heat dissipation plate 2 of the shell 1 passes through the installation opening 81 of the box body 8 and extends into the box body 8. The second heat dissipation structure 4 on the heat dissipation plate 2 is located outside the box body 8. The third heat dissipation structure 5 is located outside the box body 8 and is arranged on the same side as the second heat dissipation structure 4. The heat dissipation plate 2 abuts against the outer wall of the box body 8. The shell 1 and the heat dissipation plate 2 are fixed to the box body 8 through the installation hole 7. The sealing rings in the sealing grooves 9 on the shell 1 and the heat dissipation plate 2 abut against the outer wall of the box body 8 to achieve sealing between the shell 1 and the box body 8; thereby ensuring that the inverter can effectively prevent external moisture, dust or other impurities from entering the inverter when working, thereby protecting the components and circuits inside the inverter. Through a good sealing design, the durability of the inverter can be improved and the maintenance requirements can be reduced, and it also helps to ensure its performance and safe operation;

[0059] The heat generated in the inverter is transferred to the second heat dissipation structure 4 through the first heat dissipation structure 3 and dissipated through the second heat dissipation structure 4. The heat generated by the inductor in the housing cavity 11 of the housing 1 can be directly dissipated through the third heat dissipation structure 5.

[0060] During operation, the heat generated by the various components inside the inverter is directly dissipated through the shell 1 that accommodates the inductor. Specifically, the heat is conducted from the inside to the outside through the first heat dissipation structure 3 on the heat dissipation plate 2 of the shell 1 and enters the second heat dissipation structure 4. The heat is dissipated outside the shell 1 through the second heat dissipation structure 4, and the atmosphere or other cooling equipment is used to help dissipate the heat to keep the temperature inside the inverter within a safe range. In this process, the shell 1 integrates the first heat dissipation structure 3 and the second heat dissipation structure 4 that run through both sides of the inverter cavity. The shell 1 used for the inductor in the inverter can achieve heat dissipation from the inside to the outside, and no additional radiator that runs through the cavity is required, so that the application does not increase the number of devices, and only improves the existing device housing to achieve enhanced cavity heat dissipation capabilities, occupies a small space, has low cost, and is suitable for most high-power inverters.

[0061] The inverter further includes a fan (not shown in the figure), which is arranged on the box body 8. In the present embodiment, fans are arranged inside and outside the box body 8. The fan located outside the box body 8 is arranged at the bottom of the housing 1, and guides the airflow to blow toward the heat dissipation channel 6 of the second heat dissipation structure 4 and the third heat dissipation structure 5; the fan located inside the box body 8 is arranged at the bottom of the housing 1, and guides the airflow to blow toward the heat dissipation channel 6 of the first heat dissipation structure 3;

[0062] The inverter of the present application is designed with a fan. The wind blown by the fan can accelerate the conduction of heat between the first heat dissipation structure 3, the second heat dissipation structure 4 and the third heat dissipation structure 5, and quickly bring the heat out of the box 8, so that the heat can be discharged from the inverter more quickly, thereby improving the heat dissipation efficiency and effectively reducing the internal temperature of the inverter.

[0063] The implementation principle of the second embodiment is as follows: the inverter of the present application uses the housing 1 of the first embodiment, the housing 1 is the shell structure of the inductor component of the inverter, and a heat dissipation plate 2 and a heat dissipation structure are added to the housing 1 to achieve a heat dissipation method from the inside to the outside of the inverter;

[0064] Before operation, the housing 1 is placed on the mounting opening 81 of the inverter housing 8, so that the first heat dissipation structure 3 passes through the mounting opening 81 and enters the interior of the housing 8, the housing 1 and the heat dissipation plate 2 block the mounting opening 81 and abut against the outer wall of the housing 8, and the housing 1 and the heat dissipation plate 2 are fixed to the housing 8 through the mounting holes 7. At this time, the sealing ring on the housing 1 abuts against the sealing groove 9 and the outer wall of the housing 8; during operation, the heat generated by the components inside the inverter is directly dissipated through the housing 1 containing the inductor, specifically, the heat is conducted from the inside to the outside through the first heat dissipation structure 3 on the heat dissipation plate 2 of the housing 1 and enters the second heat dissipation structure 4, and the heat is dissipated outside the housing 1 through the second heat dissipation structure 4, and the air or other cooling equipment is used to help dissipate heat to keep the temperature inside the inverter within a safe range;

[0065] In this process, the shell 1 integrates the first heat dissipation structure 3 and the second heat dissipation structure 4 that pass through both sides of the inverter cavity. The shell 1 used for the inductor in the inverter can achieve heat dissipation from the inside to the outside, and no additional heat sink that passes through the cavity is required. This means that the application does not increase the number of components, and only improves the existing device casing to enhance the heat dissipation capacity in the cavity, occupies a small space, has low cost, and is suitable for most high-power inverters.

[0066] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A housing for heat dissipation of a heat dissipation element, characterized in that: The shell is provided with a accommodating cavity, and at least one side of the shell is provided with a heat dissipation plate. The heat dissipation plate is provided with a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure and the second heat dissipation structure are arranged on both sides of the heat dissipation plate. The heat generated by the heat dissipation component is transferred to the second heat dissipation structure through the first heat dissipation structure for dissipation.

2. The housing according to claim 1, characterized in that: A third heat dissipation structure is provided on a side of the shell away from the accommodating cavity.

3. The housing according to claim 2, characterized in that: The first heat dissipation structure includes a plurality of first heat dissipation fins, the second heat dissipation structure includes a plurality of second heat dissipation fins, and the third heat dissipation structure includes a plurality of third heat dissipation fins. Heat dissipation channels are left between adjacent first heat dissipation fins, between adjacent second heat dissipation fins, and between adjacent third heat dissipation fins.

4. The housing according to claim 3, characterized in that: The thickness of the first heat sink and the thickness of the second heat sink gradually decrease from a side close to the heat sink to a side away from the heat sink, and the thickness of the third heat sink gradually decreases from a side close to the accommodating cavity to a side away from the accommodating cavity.

5. The housing according to claim 2, characterized in that: The housing and / or the heat dissipation plate and / or the first heat dissipation structure and / or the second heat dissipation structure and / or the third heat dissipation structure are integrally formed.

6. The housing according to claim 1, characterized in that: The housing and / or the heat sink are provided with mounting holes.

7. The housing according to claim 1, characterized in that: The shell and the heat sink are jointly provided with a sealing groove, the sealing groove is arranged along the circumference of the shell and the heat sink, and a sealing ring is arranged in the sealing groove.

8. An inverter, comprising a housing as claimed in any one of claims 1 to 7, characterized in that: The inverter includes a box body and components arranged in the box body, the shell is arranged on the box body, and the components are arranged in the accommodating cavity of the shell body; the first heat dissipation structure of the heat sink passes through the box body and extends into the box body, and the second heat dissipation structure is located outside the box body. The heat generated in the inverter is transferred to the second heat dissipation structure through the first heat dissipation structure and dissipated through the second heat dissipation structure.

9. The inverter according to claim 8, characterized in that: A fan is also included, and the fan guides airflow to blow toward the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure.

10. The inverter according to claim 8, characterized in that: The sealing ring in the sealing groove abuts against the outer wall of the box body.

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