Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device, which is used for cleaning a wafer and comprises a rack; the adsorption module is arranged on the rack and comprises a suction cup and a rotating unit for driving the suction cup to rotate, and the suction cup is used for adsorbing a wafer; the brushing module is arranged on the rack and comprises a spraying unit, a brushing unit and a translation driving unit, the translation driving unit is used for driving the spraying unit and the brushing unit to move, the spraying unit is used for spraying the wafer, and the brushing unit is used for brushing the wafer; the water surrounding module is arranged on the machine frame and comprises a peripheral water box and an inner water surrounding box arranged in the peripheral water box, the suction cup is arranged in the inner water surrounding box, and the peripheral water box and the inner water surrounding box can discharge cleaning water. According to the wafer cleaning device, automatic wafer cleaning is achieved, the manual labor amount is saved, personnel allocation is reduced, and working efficiency is improved in an automatic mode.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cleaning, in particular to a wafer cleaning device. Background Art

[0002] At present, in many links of sapphire wafer processing, it is necessary to clean it. For example, before performing chip mounting, it is necessary to clean it by a cleaning device. CN202222803699.8 discloses a chip mounter, a chip polishing pre-treatment device and a chip polishing device. The chip mounter is used to mount the chip on a ceramic disk (40). The chip mounter includes a chip mounting water tank (11) and an air nozzle (12). The chip mounting water tank (11) is divided into a chip mounting area and a chip mounting inspection area along its length. The depth of the chip mounting area is greater than the depth of the chip mounting inspection area, so that the water level of the chip mounting area is higher than the upper surface of the ceramic disk (40), and the water level of the chip mounting inspection area is lower than the upper surface of the ceramic disk (40). The air nozzle (12) is arranged corresponding to the chip mounting inspection area for drying the chip surface. The cleaning structure of this equipment is too simple, the degree of automation is low, and it is difficult to keep the cleaning environment clean.

[0003] Another example is a cleaning disk structure of a single-wafer cleaning device disclosed in CN202110239959.0, in which the wafer is cleaned by spraying cleaning liquid from a cleaning liquid nozzle facing upward, and then clean water is sprayed from a clean water nozzle to remove the cleaning agent residue on the wafer. When using the cleaning liquid nozzle and the clean water nozzle, the cleaning liquid nozzle and the clean water nozzle are rotated to reach the top of the wafer accordingly. When not in use, the cleaning liquid nozzle and the clean water nozzle are removed to prevent interference. There are several parallel cleaning liquid nozzles that can spray different types of cleaning liquids, thereby realizing multiple uses of one machine.

[0004] This cleaning device also has the technical problem of being difficult to maintain the cleanliness of the cleaning environment, and is difficult to meet existing needs. Utility Model Content

[0005] The utility model aims to avoid the shortcomings of the prior art and provides an automated, highly efficient and highly clean wafer cleaning device.

[0006] The utility model solves the technical problem by adopting the following technical solution: a wafer cleaning device for cleaning a wafer, comprising:

[0007] frame;

[0008] An adsorption module is arranged on the frame, the adsorption module comprises a suction cup and a rotating unit for driving the suction cup to rotate, the suction cup is used to adsorb the wafer;

[0009] A scrubbing module is arranged on the frame, the scrubbing module comprises a spray cleaning unit, a scrubbing unit and a translation driving unit, the translation driving unit is used to drive the spray cleaning unit and the scrubbing unit to move, the spray cleaning unit is used to spray the wafer, and the scrubbing unit is used to scrub the wafer;

[0010] A water enclosure module is arranged on the frame, and the water enclosure module includes an outer water box and an inner water box arranged in the outer water box. The suction cup is arranged in the inner water box. Both the outer water box and the inner water box can discharge cleaning water.

[0011] In several embodiments, the rotating unit includes a first support frame, a first rotating motor and a first rotating shaft. The first support frame is connected to the frame and is arranged below the water enclosure module. The first rotating motor is used to drive the first rotating shaft to rotate, and the first rotating shaft is used to drive the suction cup to rotate.

[0012] In several embodiments, the first support frame is further provided with a first lifting drive and a first sliding frame, the first lifting drive can drive the first sliding frame to perform lifting motion on the first support frame, and the first rotating motor and the first rotating shaft are connected to the first sliding frame and move therewith.

[0013] In several embodiments, the translation drive unit includes a linear module, a second support frame, a second sliding frame, a third sliding frame, a second lifting drive, a third lifting drive, a second rotating motor and a second rotating shaft, the linear module is used to drive the linear motion of the second support frame, the second lifting drive is arranged on the second support frame and is used to drive the lifting motion of the second sliding frame, the third lifting drive is arranged on the second sliding frame and is used to drive the lifting motion of the third sliding frame, the second rotating motor is arranged on the third sliding frame and is used to drive the rotation of the second rotating shaft, and the brushing unit is connected to the second rotating shaft.

[0014] In several embodiments, a protective cover is disposed outside the translation driving unit, and the spray cleaning unit is connected to the protective cover and is close to the brush cleaning unit.

[0015] In several embodiments, a drainage hole is provided in the peripheral water box.

[0016] In several embodiments, the inner surrounding water box includes a main box body and a connecting arm, wherein the connecting arm is connected to the main box body, and the connecting arm is arranged on the outer surrounding water box and connected to the water outlet pipe.

[0017] In several embodiments, the spray washing unit includes a water separator and at least two spray heads disposed on the water separator.

[0018] In several embodiments, the brushing unit is a brush.

[0019] In several embodiments, a pneumatic control box and a fan filter unit are also provided on the frame.

[0020] The beneficial effects of the utility model are:

[0021] The utility model realizes automatic wafer cleaning, saves manual labor, reduces personnel allocation, and increases work efficiency in an automated manner; the utility model adopts a method of combining flushing and brushing to improve the cleaning effect; the utility model can avoid water splashing during cleaning through a water surrounding module, and recycles water to keep the cleaning environment clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are for illustrative purposes only of selected embodiments and do not represent all possible implementations, and should not be considered to limit the scope of the present invention.

[0023] Figure 1 The overall structure of the wafer cleaning device in this embodiment is schematically shown;

[0024] Figure 2 Schematically shows Figure 1 The enlarged structure of the adsorption module, the scrubbing module and the water surrounding module;

[0025] Figure 3 Schematically shows Figure 2 The enlarged structure of the inner water box;

[0026] Figure 4 Schematically shows Figure 2 The side view structure of

[0027] Figure 5 Schematically shows Figure 2 An amplifying structure at the translation drive unit. DETAILED DESCRIPTION

[0028] Below, embodiments of the present invention are described in detail with reference to the accompanying drawings. To make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in conjunction with the accompanying drawings is not intended to limit the scope of the present invention for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention.

[0030] like Figure 1 As shown, the wafer cleaning device in this embodiment mainly includes a frame 10 and an adsorption module, a scrubbing module 30, a water surrounding module 40, a pneumatic control box 50 and a fan filter unit 60 arranged on the frame 10, wherein three partitions 11 are arranged on the frame 10, the adsorption module, the scrubbing module 30, and the water surrounding module 40 are jointly arranged on the middle partition 11, the pneumatic control box 50 is arranged on the lower partition 11, and the fan filter unit 60 is arranged on the upper partition 11, the pneumatic control box 50 is used to control the adsorption module, and the fan filter unit 60 is FFU, which is a self-powered air supply and filtering device, a modular terminal air supply device with filtering function, and is a conventional accessory in the field, and is not further limited here.

[0031] Specifically, Figure 1-Figure 4 As shown, the adsorption module includes a suction cup 21 and a rotating unit 22 for driving the suction cup 21 to rotate, the suction cup 21 is used to adsorb the wafer, and the suction cup 21 is controlled by starting the control box 50. The rotating unit 22 includes a first support frame 221, a first rotating motor 222 and a first rotating shaft 223. The first support frame 221 is connected to the frame 10 and is arranged below the water enclosure module 40. The first rotating motor 222 is used to drive the first rotating shaft 223 to rotate, and the first rotating shaft 223 is used to drive the suction cup 21 to rotate. The first support frame 221 is also provided with a first lifting driver 224 and a first sliding frame 225. The first lifting driver 224 can drive the first sliding frame 225 to perform lifting movement on the first support frame 221. The first rotating motor 222 and the first rotating shaft 223 are connected to the first sliding frame 225 and move therewith. The first lifting driver 224 is a cylinder, and the first rotating motor 222 and the first rotating shaft 223 are driven by pulleys and belts.

[0032] like Figure 1-Figure 3 As shown, the surrounding water module 40 includes an outer water box 41 and an inner water box 42 arranged in the outer water box 41, the suction cup 21 is arranged in the inner water box 42, and its body is surrounded by the inner water box 42, the outer water box 41 and the inner water box 42 can both discharge the cleaning water, a drainage hole 411 is arranged in the outer water box 41, and the inner water box 42 includes a main box body 421 and a connecting arm 422, the connecting arm 422 is connected to the main box body 421, the connecting arm 422 is arranged on the outer water box 41 and is connected to the water outlet pipe 401, the water outlet pipe 401 can be connected to an external pumping mechanism to pump out the accumulated water in the main box body 421, and the accumulated water overflowing to the outside of the inner water box 42 is pumped out or discharged through the drainage hole 411.

[0033] like Figure 1-Figure 5As shown, the brushing module 30 includes a spraying unit 31, a brushing unit 32 and a translation driving unit, wherein the translation driving unit is used to drive the spraying unit 31 and the brushing unit 32 to move, the spraying unit 31 is used to spray the wafer, and the brushing unit 32 is used to brush the wafer.

[0034] Among them, the translation drive unit includes a linear module 33, a second support frame 34, a second sliding frame 35, a third sliding frame 36, a second lifting drive 37, a third lifting drive 38, a second rotary motor 39 and a second rotary shaft 310, the linear module 33 is used to drive the linear movement of the second support frame 34, the second lifting drive 37 is arranged on the second support frame 34 and is used to drive the lifting movement of the second sliding frame 35, the third lifting drive 38 is arranged on the second sliding frame 35 and is used to drive the lifting movement of the third sliding frame 36, the second rotary motor 39 is arranged on the third sliding frame 36 and is used to drive the rotation of the second rotary shaft 310, and the brushing unit 32 is connected to the second rotary shaft 310.

[0035] The linear module 33 is a conventional unit mechanical component in the field, such as a linear slide, which is used to drive linear motion and is not further limited here.

[0036] The second lifting driver 37 and the third lifting driver 38 are cylinders, and the second rotary motor 39 and the second rotary shaft 310 are driven by a belt.

[0037] A protective cover 301 is arranged outside the translation driving unit, and the spray unit 31 is connected to the protective cover 301 and close to the brush unit 32. The spray unit 31 includes a water divider and at least two nozzles 312 arranged on the water divider 311. The brush unit 32 is a brush.

[0038] When the utility model is in use, after the sapphire sheet is centered and placed on the suction cup 21, the suction cup 21 draws out air through the vacuum air pipe to suck the sapphire sheet, and the suction cup 21 is lowered back to its original position through the first lifting driver 224 and driven to rotate by the first rotating motor 222; at the same time, the second lifting driver 37 and the third lifting driver 38 drive the spraying unit 31 and the brushing unit 32 to rise, and the second rotating shaft 310 drives the brushing unit 32 to rotate. When the linear module 33 drives the spraying unit 31 to move to the center position of the sapphire sheet, the spraying unit 3 1 sprays water; at this time, the scrubbing unit 32 descends until it contacts the sapphire sheet, and the linear module 33 drives the spraying unit 31 and the scrubbing unit 32 to move back and forth to scrub the sapphire sheet; after scrubbing is completed, the spraying unit 31 and the scrubbing unit 32 rise, the scrubbing unit 32 stops rotating, and the spraying unit 31 continues to move back and forth to spray water for rinsing; after rinsing is completed, the spraying unit 31 stops spraying water, and the scrubbing module 30 returns to its original position; the suction cup 21 continues to rotate to dry the water, and the suction cup 21 rises and releases the sapphire sheet to complete the scrubbing.

[0039] All the methods described herein can be performed in any suitable order. Any and all examples used, or exemplary language provided herein (such as "for example") are merely to better illustrate the present invention, and are not intended to limit the scope of the present invention, unless the claims are included. The language in the detailed description should not be understood as indicating any essential factors for practicing the present invention that are not claimed.

[0040] The present invention describes preferred embodiments, including the best way to carry out the present invention known to the inventor. Of course, variations of these preferred embodiments will be apparent to those skilled in the art. The inventors anticipate that skilled artisans may use such variations as appropriate, and the inventors point out that the present invention may be implemented in other ways than those specifically described herein. Therefore, the present invention includes all improvements included in the spirit and scope of the present invention as defined by the claims. Moreover, unless otherwise stated or clearly contradictory in content, the present invention includes any of the above factors and all possible variations thereof.

Claims

1. A wafer cleaning device for cleaning a wafer, characterized in that: include: Frame (10); An adsorption module arranged on a frame (10), the adsorption module comprising a suction cup (21) and a rotating unit (22) for driving the suction cup (21) to rotate, the suction cup (21) being used to adsorb a wafer; A brush cleaning module (30) is arranged on the frame (10), the brush cleaning module (30) comprising a spray cleaning unit (31), a brush cleaning unit (32) and a translation driving unit, the translation driving unit is used to drive the spray cleaning unit (31) and the brush cleaning unit (32) to move, the spray cleaning unit (31) is used to spray clean the wafer, and the brush cleaning unit (32) is used to brush clean the wafer; A water enclosure module (40) is arranged on the frame (10), the water enclosure module (40) comprising an outer water box (41) and an inner water box (42) arranged inside the outer water box (41), the suction cup (21) is arranged inside the inner water box (42), and both the outer water box (41) and the inner water box (42) can discharge cleaning water.

2. A wafer cleaning device according to claim 1, characterized in that: The rotating unit (22) comprises a first support frame (221), a first rotating motor (222) and a first rotating shaft (223); the first support frame (221) is connected to the frame (10) and is arranged below the water surrounding module (40); the first rotating motor (222) is used to drive the first rotating shaft (223) to rotate; and the first rotating shaft (223) is used to drive the suction cup (21) to rotate.

3. A wafer cleaning device according to claim 2, characterized in that: The first support frame (221) is also provided with a first lifting driver (224) and a first sliding frame (225); the first lifting driver (224) can drive the first sliding frame (225) to perform lifting movement on the first support frame (221); the first rotating motor (222) and the first rotating shaft (223) are connected to the first sliding frame (225) and move with it.

4. A wafer cleaning device according to claim 1, characterized in that: The translation drive unit comprises a linear module (33), a second support frame (34), a second sliding frame (35), a third sliding frame (36), a second lifting drive (37), a third lifting drive (38), a second rotary motor (39) and a second rotary shaft (310); the linear module (33) is used to drive the linear motion of the second support frame (34); the second lifting drive (37) is arranged on the second support frame (34) and is used to drive the lifting motion of the second sliding frame (35); the third lifting drive (38) is arranged on the second sliding frame (35) and is used to drive the lifting motion of the third sliding frame (36); the second rotary motor (39) is arranged on the third sliding frame (36) and is used to drive the rotation of the second rotary shaft (310); and the scrubbing unit (32) is connected to the second rotary shaft (310).

5. A wafer cleaning device according to claim 4, characterized in that: A protective cover (301) is arranged outside the translation drive unit, and the spray cleaning unit (31) is connected to the protective cover (301) and is close to the brush cleaning unit (32).

6. A wafer cleaning device according to claim 1, characterized in that: A drainage hole (411) is provided in the peripheral water box (41).

7. A wafer cleaning device according to claim 1, characterized in that: The inner water box (42) comprises a main box body (421) and a connecting arm (422), wherein the connecting arm (422) is connected to the main box body (421), and the connecting arm (422) is arranged on the outer water box (41) and is connected to the water outlet pipe (401).

8. A wafer cleaning device according to claim 1, characterized in that: The spray washing unit (31) comprises a water separator and at least two spray heads (312) arranged on the water separator (311).

9. A wafer cleaning device according to claim 1, characterized in that: The scrubbing unit (32) is a brush.

10. The wafer cleaning device according to claim 1, characterized in that: A pneumatic control box (50) and a fan filter unit (60) are also provided on the frame (10).

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