Wafer unstacking unit

Abstract

The utility model relates to a wafer unstacking unit which is characterized in that a magnetic conveying belt is arranged at the bottom of an upper frame of an unstacking frame body, a cover taking device is connected with the upper frame of the unstacking frame body, and the movable end of the cover taking device penetrates through the magnetic conveying belt and corresponds to a wafer stack in position; a wafer conveying belt is arranged below the tail end of the magnetic conveying belt; a conveying fixing frame is arranged above the wafer conveying belt, and a moving frame which is in sliding fit with the track is arranged in the conveying fixing frame; a push rod extending in the conveying direction is arranged on the top face of the movable frame, a one-way baffle is arranged on the lower surface of the push rod, and the positions of the one-way baffle and the push rod correspond to the conveying height of the wafer conveying belt. According to the wafer unstacking unit, the required barrel bottom or barrel cover can be obtained only by splitting the whole stack of wafers into single pieces and then feeding the single pieces into the die to be stamped, and then the next barrel manufacturing link is carried out from the discharging opening, so that the tedious process of independently machining the barrel bottom and the barrel cover is omitted, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to a disc destacking machine group, belonging to the technical field of barrel making equipment. Background Art

[0002] In the past, the bottom and cover of steel drums were directly stamped on steel plates using specially matched molds. However, this production method has limitations. Different molds need to be replaced for different specifications, and the bottom and cover take up most of the space when stored. When producing steel drums, the bottom and cover need to be placed in a fixed position manually, which wastes manpower and material resources. Summary of the invention

[0003] The technical problem to be solved by the utility model is to provide a disc destacking unit, which only needs to split the discs from a whole stack into single pieces, and then send them into a mold for stamping to obtain the required barrel bottom or barrel cover, and then carry out the next barrel making link from the discharge port, thereby saving the cumbersome process of separately processing the barrel bottom and barrel cover, thereby reducing production costs.

[0004] To solve the above problems, the specific technical scheme of the utility model is as follows: a wafer destacking unit, a wafer stack is provided at the lower part of a destacking frame, a sheet separating device is provided at the side end of the wafer stack, a magnetic conveying belt is provided at the bottom of the upper frame of the destacking frame, a cover removing device is connected to the upper frame of the destacking frame, and the movable end of the cover removing device passes through the magnetic conveying belt and corresponds to the position of the wafer stack; a wafer conveyor belt is provided below the end of the magnetic conveyor belt, and the height of the wafer conveyor belt corresponds to the position of the inlet of an external press; a conveying fixed frame is provided above the wafer conveyor belt, a moving frame that slides with a track is provided inside the conveying fixed frame, a servo motor is provided on the conveying fixed frame, the output shaft of the servo motor is connected to a gear, a rack is provided on the moving frame, and the gear and the rack are meshed for transmission; a push rod extending in the conveying direction is provided on the top surface of the moving frame, a one-way baffle is provided on the lower surface of the push rod, and the positions of the one-way baffle and the push rod correspond to the conveying height of the wafer conveyor belt.

[0005] An outlet blocking cylinder is arranged on the conveying fixed frame, and the movable end of the outlet blocking cylinder extends upwardly out of the wafer conveying belt; the outlet blocking cylinder is located at the output side of the one-way baffle.

[0006] An oiling device is provided between the starting end of the wafer conveyor belt and the movable frame, and the oiling device comprises an oiling lifting cylinder, an oiling ring and a fixed ring. The fixed ring is fixed on the frame, and the wafer conveyor belt is located between the fixed ring and the oiling ring. The oiling lifting cylinder drives the oiling ring to be pressed toward the fixed ring.

[0007] An oil-coated blocking cylinder is arranged on the right side of the fixing ring.

[0008] An oiling groove is arranged on the circumference of the oiling ring, a through hole is arranged on the oiling groove, and the oiling groove is communicated with the oiling felt cloth material on the bottom surface of the oiling ring; the oiling groove of the oiling ring is connected with an external oil supply device.

[0009] A wafer stack conveyor belt is arranged below the destacking frame, and a plurality of wafer pallets are arranged in parallel on the wafer stack conveyor belt.

[0010] The wafer stack conveyor belt is L-shaped, and the destacking wafer pallet is output from the rear surface perpendicular to the destacking frame.

[0011] The wafer destacking unit of the present application adopts the above structure and has the following advantages:

[0012] 1. The originally stacked wafers are transported one by one into the press for molding through magnetic suction. The molded wafers can be automatically pushed to the next assembly line, saving the cost of manual collection and transportation.

[0013] 2. An oiling device is set in the middle to complete the automatic oiling action at one time.

[0014] 3. By blocking the cylinder action, the export rhythm is controlled to ensure the processing rhythm of the entire assembly line.

[0015] 4. A one-way baffle is set on the push rod to enable the wafer to enter the pushing area, and the wafer is pushed into the press through the one-way baffle, thereby solving the problem that the conveyor belt cannot deliver the wafer to the right place. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is the front view of the wafer destacking unit.

[0017] Figure 2 This is a top view of the wafer conveyor belt.

[0018] Figure 3 for Figure 1 A partial enlarged view of point A. DETAILED DESCRIPTION

[0019] like Figures 1 to 3As shown, a wafer destacking unit has the following structure: a wafer stack 12 is provided at the lower part of a destacking frame 11, a sheet separation device 13 is provided at the side end of the wafer stack 12, a magnetic conveying belt 14 is provided at the bottom of the upper frame of the destacking frame 11, a cover removal device 15 is connected to the upper frame of the destacking frame 11, and the movable end of the cover removal device 15 passes through the magnetic conveying belt 14 and corresponds to the position of the wafer stack 12; a wafer conveying belt 16 is provided below the end of the magnetic conveying belt 14, and the height of the wafer conveying belt 16 corresponds to the position of the inlet of the external press; A conveying fixed frame 21 is provided above the wafer conveyor belt 16, a moving frame 22 that is slidably matched with the track is provided inside the conveying fixed frame 21, a servo motor 23 is provided on the conveying fixed frame 21, the output shaft of the servo motor 23 is connected to a gear, a rack is provided on the moving frame 22, and the gear and the rack are meshed for transmission; a push rod 24 extending in the conveying direction is provided on the top surface of the moving frame 22, a one-way baffle 25 is provided on the lower surface of the push rod 24, and the positions of the one-way baffle 25 and the push rod 24 correspond to the conveying height of the wafer conveyor belt 16. The one-way baffle 25 is a one-way rotating structure, and the wafers can pass through the one-way baffle 25 and move to the right. When the moving frame 22 drives the elastic baffle 25 to move, it cannot rotate to the left, so the wafer on the right is pushed to continue to move to the right, and at the same time, the push rod 24 on the right will extend into the press to push out the processed wafers.

[0020] An outlet blocking cylinder 26 is provided on the conveying fixed frame 21 , and a movable end of the outlet blocking cylinder 26 extends upward from the wafer conveying belt 16 ; the outlet blocking cylinder 26 is located at the output side of the one-way baffle 25 .

[0021] An oiling device is provided between the starting end of the wafer conveyor belt 16 and the conveying fixed frame 21, and the oiling device includes an oiling lifting cylinder 31, an oiling ring 32 and a fixed ring 33. The fixed ring 33 is fixed on the frame, and the wafer conveyor belt 16 is located between the fixed ring 33 and the oiling ring 32. The oiling lifting cylinder 31 drives the oiling ring 32 to be pressed toward the fixed ring 33. An oiling blocking cylinder 34 is provided on the right side of the fixed ring 33. The oiling blocking cylinder 34 blocks the unoiled wafers and releases the oiled wafers.

[0022] The circumference of the oiling ring 32 is provided with an oiling groove, and a through hole is provided on the oiling groove, which is connected to the oiling felt cloth material on the bottom surface of the oiling ring 32; the oiling groove of the oiling ring 32 is connected to the external oil supply device 35. The oiling felt cloth material will continuously absorb oil and grease and smear it on the disc.

[0023] A wafer stack conveyor belt 1 is provided below the destacking frame 11 , and a plurality of wafer pallets 2 are arranged in parallel on the wafer stack conveyor belt 1 .

[0024] The wafer stack conveyor belt 1 is L-shaped, and the destacking wafer pallet 2 is output from a rear surface perpendicular to the destacking frame 11 .

[0025] The working process of the wafer destacking unit of the present application is as follows: the wafer plate 2 carrying a certain amount of wafers is placed on the wafer stack conveyor belt 1 and moves to the bottom of the cover removal device 15. The sheet separation device 13 separates the stacked wafers. The sheet separation device is a prior art and is not described in the present application. The cover removal device 15 uses the magnetic principle to attract the top wafer, which is attracted and moved on the magnetic conveyor belt 14 during the rising process and falls on the wafer conveyor belt 16. The wafer moves on the wafer conveyor belt 16 and stops after reaching the oiling blocking cylinder 34. The oiling ring 32 moves downward under the drive of the lifting cylinder 31 and applies oil on the circumference of the wafer. When the oiling is completed, the oiling blocking cylinder 34 descends and the wafer continues to move. When it reaches the outlet blocking cylinder 26, the blocking cylinder 26 is lowered according to the processing rhythm of the input press. The wafer passes through the one-way baffle 25 and reaches the end of the wafer conveyor belt 16. The servo motor 23 is started, and the moving frame 22 drives the one-way baffle 25 to push the wafer in front to continue to move toward the press platform. At the same time, the processed wafer is removed from the press through the push rod 24.

[0026] When all the wafers on one wafer pallet 2 are destackered, the wafer stack conveyor belt 1 drives the empty wafer pallet 2 to move toward the exit, and another wafer pallet 2 with a wafer stack moves to the bottom of the cover removal device 15 .

Claims

1. A wafer destacking unit, characterized in that: A wafer stack (12) is provided at the lower part of the destacking frame (11), a sheet separation device (13) is provided at the side end of the wafer stack (12), a magnetic conveying belt (14) is provided at the bottom of the upper frame of the destacking frame (11), a cover removal device (15) is connected to the upper frame of the destacking frame (11), and a movable end of the cover removal device (15) passes through the magnetic conveying belt (14) and corresponds to the position of the wafer stack (12); a wafer conveying belt (16) is provided below the end of the magnetic conveying belt (14), and the height of the wafer conveying belt (16) corresponds to the position of the inlet of the external press; and a magnetic conveying belt (16) is provided at the bottom of the upper frame of the destacking frame (11). ) is provided above the conveying fixed frame (21), a moving frame (22) slidably matched with the track is provided inside the conveying fixed frame (21), a servo motor (23) is provided on the conveying fixed frame (21), an output shaft of the servo motor (23) is connected to a gear, a rack is provided on the moving frame (22), and the gear and the rack are meshed for transmission; a push rod (24) extending in the conveying direction is provided on the top surface of the moving frame (22), a one-way baffle (25) is provided on the lower surface of the push rod (24), and the positions of the one-way baffle (25) and the push rod (24) correspond to the conveying height of the wafer conveyor belt (16).

2. The wafer destacking unit according to claim 1, characterized in that: An outlet blocking cylinder (26) is provided on the conveying fixed frame (21), and a movable end of the outlet blocking cylinder (26) extends upward from the wafer conveying belt (16); the outlet blocking cylinder (26) is located on the output side of the one-way baffle (25).

3. The wafer destacking unit according to claim 1, characterized in that: An oiling device is provided between the starting end of the wafer conveyor belt (16) and the movable frame (22), the oiling device comprising an oiling lifting cylinder (31), an oiling ring (32) and a fixing ring (33), the fixing ring (33) being fixed on the frame, the wafer conveyor belt (16) being located between the fixing ring (33) and the oiling ring (32), and the oiling lifting cylinder (31) driving the oiling ring (32) to be pressed toward the fixing ring (33).

4. The wafer destacking unit according to claim 3, characterized in that: An oil-coated blocking cylinder (34) is provided on the right side of the fixing ring (33).

5. The wafer destacking unit according to claim 3, characterized in that: An oiling groove is provided on the circumference of the oiling ring (32), and a through hole is provided on the oiling groove, which is in communication with the oiling felt cloth material on the bottom surface of the oiling ring (32); the oiling groove of the oiling ring (32) is connected to an external oil supply device (35).

6. The wafer destacking unit according to claim 1, characterized in that: A wafer stack conveyor belt (1) is provided below the destacking frame (11), and a plurality of wafer pallets (2) are arranged in parallel on the wafer stack conveyor belt (1).

7. The wafer destacking unit according to claim 6, characterized in that: The wafer stack conveyor belt (1) is L-shaped, and the destacking wafer pallet (2) is output from a rear surface perpendicular to the destacking frame (11).

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