System for providing pressure to semiconductor device

Abstract

The utility model discloses a system for providing pressure for a semiconductor device. The system comprises at least one pressing block configured to accommodate at least one pressing head; at least one actuator adapted to apply a force to at least one sputtering target unit placed on the inelastic platform, whereby the indenter is capable of applying a linear force on its respective semiconductor device and the indenter is capable of applying a predetermined force on the semiconductor device without providing further pressure on the inelastic platform.

Description

Technical Field

[0001] The utility model provides a system for providing pressure to at least one semiconductor device, the system comprising at least one pressure block, the pressure block being configured to accommodate at least one pressure head and at least one actuator, and being suitable for providing force on at least one sputtering target unit placed on a non-elastic platform, wherein each pressure head can provide a linear force to a corresponding semiconductor device on the sputtering target unit, and the pressure head can provide a preset force to the semiconductor device without applying further pressure to the non-elastic platform. Background Art

[0002] Sputtering deposition is a physical vapor deposition (PVD) process used to form a thin film on a specific surface, in some cases, the surface of a silicon wafer, a semiconductor device, etc. In the case of sputtering semiconductor devices, the sputtering process is usually completed using a sputtering machine, wherein a number of semiconductor devices are placed on an adhesive tape of a sputtering frame, the adhesive tape is placed on a platform, and then the semiconductor devices are pressed or squeezed by the equipment to adhere the semiconductor devices to the adhesive tape before the sputtering process.

[0003] Problems arise when several semiconductor devices placed on the adhesive tape have different thicknesses. In this case, some semiconductor devices cannot be pressed by the pressing device because the pressing device consists of a single large pressing block, and when the pressing device abuts against the thickest semiconductor device, it cannot press other semiconductor devices with smaller thicknesses. When the semiconductor device cannot be fully adhered to the adhesive tape, material reflow will occur during the sputtering process, and the sputtered material will penetrate into the gap between the semiconductor device and the adhesive tape.

[0004] In some solutions, the platform is made of elastic material, so the pressing device can provide further pressure to the semiconductor device. Due to the elastic nature of the platform, the semiconductor device can be further pushed toward the platform to ensure that all semiconductor devices can receive pressure from the pressing device. This solution is less effective because it is an open-loop solution, the user cannot know the magnitude of the force applied to each semiconductor device, and when too much force is applied to a semiconductor device, the semiconductor device may be damaged.

[0005] Another problem arises when the number of semiconductor devices on the adhesive tape varies. If more semiconductor devices are pressed by the same force generated by the actuator, the effective force on each semiconductor device will decrease, affecting the adhesion quality of the semiconductor devices on the adhesive tape.

[0006] Chinese patent CN218730820U discloses a QFN packaging heating fixture for power products, which relates to the technical field of QFN packaging and heating of power products, wherein the power QFN chip frame is provided with a downward pressing resistance heating plate for pressing down in the vertical upward position, and the resistance heating plate is a single plate for providing downward pressure.

[0007] It would therefore be beneficial to mitigate the above disadvantages by having a system for providing pressure on at least one semiconductor device that enables each indenter to provide sufficient force to its corresponding semiconductor device, even if the platform is non-elastic. Utility Model Content

[0008] Based on this, the main object of the present invention is to provide a system for providing pressure to at least one semiconductor device so that each pressure head can provide sufficient force to its corresponding semiconductor device, even if the semiconductor devices on the same adhesive tape have different thicknesses, and the sufficient force means that no reflow is observed during and after sputtering.

[0009] Another object of the present invention is to provide a system for providing pressure to at least one semiconductor device that can be used with a non-elastic platform housing a sputtering target unit, since no forces are observed on the side of the semiconductor device connected to the platform.

[0010] Another object of the present invention is to provide a system for applying pressure to at least one semiconductor device that allows each pressure head to apply a preset controlled force on each individual and corresponding semiconductor device.

[0011] Another object of the present invention is to provide a system for applying pressure to at least one semiconductor device that allows for measuring the force applied by each indenter on its corresponding semiconductor device.

[0012] Other objects of the present invention will become clear by understanding the following detailed description of the present invention or using the present invention in practice.

[0013] According to the preferred embodiment of the present utility model, the following contents are provided:

[0014] A system for providing stress to at least one semiconductor device, comprising:

[0015] at least one press block configured to receive at least one press head;

[0016] at least one actuator configured to couple with the pressure block and provide a linear force to the pressure block to move linearly toward at least one platform;

[0017] The platform is configured to accommodate at least one sputtering target unit; wherein the sputtering target unit includes at least one adhesive tape having an adhesive surface facing the pressing block; the sputtering target unit also includes at least one holding mechanism disposed at the periphery of the adhesive tape, which is configured to hold the adhesive tape in a planar position; the sputtering target unit also includes at least one semiconductor device disposed on the adhesive surface of the adhesive tape;

[0018] The sputtering target unit is arranged between the platform and the pressing block;

[0019] Each of the pressing heads comprises at least one compression device; each of the pressing heads is configured to be aligned with the semiconductor device; wherein each of the pressing heads is configured to provide a preset force on its corresponding semiconductor device when the pressing block is driven by the actuator;

[0020] The surface of the platform accommodating the sputtering target unit is non-elastic;

[0021] The system further comprises at least one force measuring mechanism, which is configured to measure the force applied by its corresponding indenter on each semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other aspects and advantages of the present invention will be discerned after studying the specific embodiments in conjunction with the accompanying drawings, in which:

[0023] Figure 1 It is a side view of the utility model before the actuator provides force to the pressing block;

[0024] Figure 2 It is a side view of the utility model after the actuator provides force to the pressing block until any one pressing head contacts the thickest semiconductor device on the adhesive tape;

[0025] Figure 3 It is a side view of the utility model after the actuator provides further force to the pressing block and all the pressing heads contact their corresponding semiconductor devices;

[0026] Figure 4 It is a flow chart of the utility model. DETAILED DESCRIPTION

[0027] In the following detailed description, many specific details are provided so that the utility model can be thoroughly understood. However, it is understood by those skilled in the art that the utility model can still be implemented without these specific details. In other cases, known methods, steps and / or components are not described in detail to avoid obscuring the utility model.

[0028] The invention will be more clearly understood from the following description of embodiments thereof, given by way of example only, and with reference to the accompanying drawings, which are not drawn to scale.

[0029] This embodiment provides a system 101 for providing pressure to at least one semiconductor device 103, comprising at least one pressure block 105 configured to accommodate at least one pressure head 107, and at least one actuator 109, which is configured to be connected to the pressure block 105 and provide a linear force to the pressure block 105 to linearly move toward at least one platform 111. The actuator 109 may be a pressure motor.

[0030] The platform 111 is configured to accommodate at least one sputtering target unit 115; wherein the sputtering target unit 115 includes at least one adhesive tape 117 having an adhesive surface 117A facing the pressing block 105; the sputtering target unit 115 also includes at least one holding mechanism 119 disposed on the periphery of the adhesive tape 117, which is configured to hold the adhesive tape 117 in a planar position; the sputtering target unit 115 also includes at least one semiconductor device 103 disposed on the adhesive surface 117A of the adhesive tape 117. Multiple semiconductor devices 103 are arranged equidistantly. The sputtering target unit 115 is disposed on the platform 111 and is located between the platform 111 and the pressing block 105. The surface of the platform 111 accommodating the sputtering target unit 115 is non-elastic. The semiconductor device 103 may be a QFN device. The tape holding mechanism 119 may be a fixture, a clamp or a sputtering frame.

[0031] The system 101 also includes at least one force measurement mechanism, such as a load cell, configured to measure the force exerted on each semiconductor device 103 by its corresponding indenter 107 .

[0032] Each of the pressing heads 107 includes at least one compression device 113; each of the pressing heads 107 is configured to be aligned with the semiconductor device 103; wherein each of the pressing heads 107 is configured to provide a preset force on its corresponding semiconductor device 103 when the pressing block 105 is driven by the actuator 109. The preset force provided by each of the pressing heads 107 is inversely proportional to the thickness of the corresponding semiconductor device 103.

[0033] The system 101 further comprises at least one data processing device configured to instruct the pressing block 105 to provide the linear force, instruct the pressing head 107 to provide the preset force or a combination thereof. The preset force applied by each pressing head 107 to its corresponding semiconductor device 103 can be controlled by the data processing device. In view of the preset force applied by the pressing head 107 to its corresponding semiconductor device 103 and the non-elasticity of the platform 111, the side of the semiconductor device 103 in contact with the adhesive tape 117 is not subjected to force.

[0034] Although the present invention has been shown and described herein by its preferred embodiments, illustrating the results and advantages obtained by the present invention relative to the prior art, the present invention is not limited to these specific embodiments. Therefore, the inventive forms shown and described herein are only illustrative examples, and other embodiments may be selected without departing from the scope of the present invention, as described in the claims attached hereto.

Claims

1. A system (101) for providing pressure to a semiconductor device (103), comprising at least one pressure block (105) configured to accommodate at least one pressure head (107); at least one actuator (109) configured to be connected to the pressure block (105) and to provide a linear force to the pressure block (105) to linearly move at least one platform (111); characterized in that The platform (111) is configured to accommodate at least one sputtering target unit (115); wherein the sputtering target unit (115) comprises at least one adhesive tape (117) having an adhesive surface (117A) facing the pressing block (105); the sputtering target unit (115) further comprises at least one holding mechanism (119) arranged at the periphery of the adhesive tape (117) and configured to hold the adhesive tape (117) in a planar position; the sputtering target unit (115) further comprises at least one semiconductor device (103) arranged on the adhesive surface (117A) of the adhesive tape (117); The sputtering target unit (115) is arranged between the platform (111) and the pressing block (105); Each of the pressing heads (107) comprises at least one compression device (113); each of the pressing heads (107) is configured to be aligned with the semiconductor device (103); wherein each of the pressing heads (107) is configured to provide a preset force on its corresponding semiconductor device (103) when the pressing block (105) is driven by the actuator (109); The surface of the platform (111) accommodating the sputtering target unit (115) is non-elastic; The system (101) further comprises at least one force measuring mechanism, which is configured to measure the force applied to each semiconductor device (103) by its corresponding indenter (107).

2. The system (101) for providing pressure to a semiconductor device (103) according to claim 1, characterized in that: The invention also comprises at least one data processing device, which is configured to instruct the pressing block (105) to provide the linear force, instruct the pressing head (107) to provide the preset force or a combination thereof.

3. The system (101) for providing pressure to a semiconductor device (103) according to claim 1 or 2, characterized in that: The actuator (109) is a pressure motor.

4. The system (101) for providing pressure to a semiconductor device (103) according to claim 1 or 2, characterized in that: The plurality of semiconductor devices (103) are arranged at equal distances from each other.

5. The system (101) for providing pressure to a semiconductor device (103) according to claim 1 or 2, characterized in that: The preset force provided by each pressing head (107) is inversely proportional to the thickness of the corresponding semiconductor device (103).

6. The system (101) for providing pressure to a semiconductor device (103) according to claim 1 or 2, characterized in that: The force measuring mechanism is a weighing sensor.

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