Heterogeneous sintered tube
By using a capillary structure layer with heterogeneous thickness in the sintered tube, the problem of consistent thermal resistance of existing homogeneous sintered tubes in the chip hot spot uneven scenarios is solved, and more efficient heat transfer and return water capacity is achieved.
Patent Information
- Application Number
- CN202420343401.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-23
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-02-23
AI Technical Summary
In actual use, existing homogeneous sintered tubes are difficult to adapt to scenes where the chip is uneven hot spots, resulting in consistent thermal resistance and difficulty in effective heat transfer.
A heterogeneous sintered tube is adopted, and a capillary structure layer of non-uniform thickness is provided inside it. It is formed by arranging multiple pore units along the circumference of the heat pipe body, which increases the contact area between the capillary structure layer and the steam cavity channel and increases the Capillary force.
In the case of uneven heat source distribution, the thermal resistance of the multi-region of the heterogeneous sintered tube is small and the heat transfer is fast, which can quickly transfer heat into the steam chamber, and has a stronger ability to return water at the condensation end, effectively solving the heat The problem of uniform resistance and difficulty in adapting to uneven hot spots.
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Figure CN222438623U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of heat dissipation devices, and in particular to a heterogeneous sintered tube. Background Art
[0002] In the prior art, the heat pipes of laptop computers all use uniform and homogeneous capillary sintered tubes. Such heat pipes are generally composed of a tube, a shell, a liquid wick and an end cap. The tube wall has a liquid wick made of a capillary porous material. One end of the heat pipe is the evaporation end and the other end is the condensation end. When one section of the heat pipe is heated, the liquid in the capillary tube evaporates rapidly, and the steam flows to the other end under a slight pressure difference, releasing heat and recondensing into liquid. The liquid then flows back to the evaporation section along the porous material by the action of capillary force, and the cycle continues.
[0003] However, in actual use, due to the uneven distribution of chip hot spots, some places are high in temperature and some places are low in temperature, and the copper powder on the inner wall of the flattened sintering tube has a uniform thickness. The thermal resistance of heat transfer is the same in hot and cold places, which makes it difficult to adapt to the actual use scenarios where the chip hot spots are uneven.
[0004] In view of this, a sintered tube with a new structure is urgently needed in the market to solve the problem of consistent thermal resistance and difficulty in adapting to uneven chip hotspots in the actual use of homogeneous sintered tubes in the prior art. Utility Model Content
[0005] The embodiment of the present disclosure provides a heterogeneous sintered tube, characterized in that it includes a heat pipe body and a capillary structure layer;
[0006] The heat pipe body has a steam cavity inside for steam to flow;
[0007] The capillary structure layer is attached to the inner tube wall of the heat pipe body and at least partially protrudes and extends into the steam cavity;
[0008] Wherein, the capillary structure layer is formed by arranging a plurality of pore unit bodies with non-homogeneous thickness along the circumference of the heat pipe body.
[0009] In one possible implementation manner, the pore unit body is arranged to extend along the inner circumference of the heat pipe body;
[0010] The pore unit body at least comprises a first sub-body and a second sub-body which are sequentially arranged along the circumference of the heat pipe body;
[0011] The thickness of the first sub-body is greater than the thickness of the second sub-body.
[0012] In one possible implementation manner, the first sub-body and the second sub-body are both configured to be rectangular capillary strips with a rectangular cross-sectional shape.
[0013] In one possible implementation, a third sub-body is further disposed between the first sub-body and the second sub-body;
[0014] And the thickness of the second sub-body is greater than the thickness of the third sub-body.
[0015] In one embodiment, the first sub-body and the second sub-body are both configured as trapezoidal capillary strips with a cross-sectional shape of an isosceles trapezoid;
[0016] The upper bottom side surface of the trapezoidal capillary strip is arranged away from the pipe wall of the heat pipe body.
[0017] In one embodiment, the first sub-body and the second sub-body are both configured as triangular capillary strips with a cross-sectional shape of an isosceles triangle;
[0018] One side edge of the triangular capillary strip is arranged away from the tube wall of the heat pipe body.
[0019] In one embodiment, the first sub-body and the second sub-body are arranged adjacent to each other, and a wedge-shaped capillary gap is formed therebetween.
[0020] In one possible implementation manner, the heat pipe body can be extruded into an oblate tube having a waist-shaped cross-section;
[0021] The capillary structure layer can adapt and deform along with the inner pipe wall of the heat pipe body.
[0022] In one possible implementation, the steam cavity in the heat pipe body can be plugged with a heat pipe core rod;
[0023] The heat pipe core rod and the inner pipe wall of the heat pipe body directly form a filling gap for filling sintered copper powder, and the sintered copper powder can be sintered and solidified to form the capillary structure layer.
[0024] In one possible implementation manner, the heterogeneous sintered tube includes an evaporation end and a condensation end located at both ends, and a heat insulation section connecting the two ends;
[0025] Wherein, the particle size of the sintered copper powder of the capillary structure layer in the evaporation end is smaller than the particle size of the sintered copper powder of the capillary structure layer in the condensation end.
[0026] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:
[0027] The heterogeneous sintered tube provided by the embodiment of the present disclosure has a non-uniform capillary structure layer, which can strengthen its own capillary force while increasing the contact area between the capillary structure layer and the steam cavity, which is more conducive to the endothermic evaporation of the evaporating liquid in the capillary structure layer. Moreover, in the scenario of uneven distribution of heat sources, most areas of the capillary structure layer with non-uniform thickness have small thermal resistance and fast heat transfer, and can transfer the heat of the heat source to the steam cavity faster in the same time. In addition, the protruding part of the capillary structure layer with non-uniform thickness has stronger water return capacity at the condensation end, which can effectively solve the problem of consistent thermal resistance and difficulty in adapting to the scenario of uneven chip hot spots when the sintered tube is actually used.
[0028] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:
[0030] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0031] Figure 1 A cross-sectional view of a first structure of a heterogeneous sintered tube provided in an embodiment of the present disclosure is shown;
[0032] Figure 2 A cross-sectional view showing a second structure of a heterogeneous sintered tube provided in an embodiment of the present disclosure is shown;
[0033] Figure 3 A cross-sectional view of a third structure of a heterogeneous sintered tube provided in an embodiment of the present disclosure is shown.
[0034] Explanation of the numbers in the figure: 1, heat pipe body; 2, capillary structure layer; 21, pore unit body; 211, first sub-body; 212, second sub-body; 213, third sub-body. DETAILED DESCRIPTION
[0035] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.
[0036] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
[0037] Combination Figure 1 As shown, an embodiment of the present disclosure provides a heterogeneous sintered tube, which includes a heat pipe body 1 and a capillary structure layer 2; the interior of the heat pipe body 1 has a steam cavity for steam flow; the capillary structure layer 2 is attached to the inner tube wall of the heat pipe body 1 and at least partially protrudes and extends from the steam cavity; wherein the capillary structure layer 2 is formed by a plurality of pore unit bodies 21 with heterogeneous thickness arranged along the circumference of the heat pipe body 1.
[0038] Before the heterogeneous sintered tube is used, one end of the heat pipe body 1 can be connected to a heat source (for example, a CPU in a laptop computer) as an evaporation end, and the other end can be sealed as a condensation end. Before sealing the heat pipe body 1, some evaporation liquid (for example, pure water) is partially added to the steam cavity therein, and the interior of the steam cavity is evacuated.
[0039] In this way, when the heterogeneous sintered tube is used, when the heat source transfers heat to the evaporation end of the heat pipe body 1, the evaporating liquid can be heated and begin to evaporate, and because the capillary structure layer 2 is attached to the inner tube wall of the heat pipe body 1, the evaporating liquid in the capillary structure layer 2 can quickly absorb heat and evaporate and dissipate toward the condensation end. Since the capillary structure layer 2 is formed by the arrangement of a plurality of pore unit bodies 21 with heterogeneous thickness, the thickness of the capillary structure layer 2 is non-uniform, and at least a high and a low drop will be formed. On the one hand, this will increase the contact area between the capillary structure layer 2 and the steam cavity, which is more conducive to the evaporating liquid in the capillary structure layer 2 to absorb heat and evaporate. On the other hand, it is equivalent to further strengthening the capillary structure of the capillary structure layer 2 and improving the capillary force.
[0040] In addition, the capillary structure layers 2 of different thicknesses also have different thermal resistance capabilities, so that the thermal resistance of the non-homogeneous sintered tube in the place where the heat source hotspots are unevenly distributed can be reduced, making it more suitable for uneven distribution of heat sources, with single or multiple hotspots. When the heat source is unevenly distributed, the capillary structure layer 2 with non-uniform thickness has a small thermal resistance in most areas and a fast heat transfer, and can quickly transfer the heat of the heat source to the steam cavity in the same time. The protruding part of the capillary structure layer 2 with non-uniform thickness has a stronger water return capacity at the condensation end, which is very helpful for water return.
[0041] To sum up, the heterogeneous sintered tube provided by the embodiment of the present invention has a non-uniform capillary structure layer 2 compared with the uniform and homogeneous capillary sintered tube in the prior art. While strengthening its own capillary force, it can also increase the contact area between the capillary structure layer 2 and the steam cavity, which is more conducive to the endothermic evaporation of the evaporating liquid in the capillary structure layer 2. Moreover, in the scenario of uneven distribution of heat sources, most areas of the capillary structure layer 2 with non-uniform thickness have small thermal resistance and fast heat transfer, and can transfer the heat of the heat source to the steam cavity faster in the same time. Moreover, the protruding part of the capillary structure layer 2 with non-uniform thickness has stronger water return capacity at the condensation end, which can effectively solve the problem of consistent thermal resistance and difficulty in adapting to the uneven chip hotspot scenario when the sintered tube is actually used.
[0042] In one embodiment, the porous unit body 21 is extended along the inner circumference of the heat pipe body 1; the porous unit body 21 at least includes a first sub-body 211 and a second sub-body 212 arranged in sequence along the circumference of the heat pipe body 1; the thickness of the first sub-body 211 is greater than the thickness of the second sub-body 212.
[0043] Specific, combined Figure 1 To further explain in detail, the porous unit body 21 is specifically configured to be a first sub-body 211 and a second sub-body 212 which are sequentially arranged along the circumferential direction of the heat pipe body 1, and the thickness of the first sub-body 211 is greater than the thickness of the second sub-body 212, and the thickness difference between the two can be specifically set between 0.2 mm and 0.4 mm, so that a height difference can be formed between the first sub-body 211 and the second sub-body 212, so that the thermal resistance of the porous unit body 21 can be suddenly changed, and the capillary force between the first sub-body 211 with a higher thickness and the second sub-body 212 with a lower thickness can be more obvious.
[0044] Moreover, the second sub-body 212 has a smaller thickness and lower thermal resistance, so that in the early stage of design, we can pre-measure the position of the heat source area of the chip and adjust the distribution points of the second sub-body 212 in the pore unit body 21 to maximize the overlap between the second sub-body 212 with low thermal resistance and the heat source area.
[0045] In one embodiment, the first sub-body 211 and the second sub-body 212 are both configured as rectangular capillary strips with a rectangular cross-section.
[0046] Specific, combined Figure 1To further explain in detail, the first sub-body 211 and the second sub-body 212 are both set to be rectangular capillary strips with a rectangular cross-sectional shape. In this way, when manufacturing the heterogeneous sintered tube, the heat pipe rod can be pre-installed in the steam cavity, and the surrounding wall of the heat pipe rod is correspondingly provided with concave and convex staggered stripes, and then the gap formed by the steam cavity and the heat pipe rod is filled with copper powder and sintered to form the capillary structure layer 2. The concave and convex staggered stripes on the surrounding wall of the heat pipe rod can form the first sub-body 211 and the second sub-body 212 with a rectangular cross-sectional shape and a certain height difference.
[0047] The specific arrangement of the first sub-body 211 and the second sub-body 212 enables the first sub-body 211 and the second sub-body 212 to directly form a capillary structure with a sudden height difference, so that the pore unit body 21 can produce a better capillary effect.
[0048] In one embodiment, a third sub-body 213 is further disposed between the first sub-body 211 and the second sub-body 212 ; and the thickness of the second sub-body 212 is greater than the thickness of the third sub-body 213 .
[0049] Specific, combined Figure 1 To further explain in detail, a third sub-body 213 with the lowest thickness is provided between the first sub-body 211 and the second sub-body 212, so that a "high-low-middle" mutation structure can be formed in a pore unit body 21, which can fully enhance the capillary action while allowing the first sub-body 211 and the second sub-body 212 to form a "gap" separated by the lowest third sub-body 213, facilitating the flow of evaporated water vapor.
[0050] In one embodiment, the first sub-body 211 and the second sub-body 212 are both configured as trapezoidal capillary strips with isosceles trapezoidal cross-sections; and the upper and lower sides of the trapezoidal capillary strips are configured away from the tube wall of the heat pipe body 1 .
[0051] Specific, combined Figure 2 To further explain in detail, the first sub-body 211 and the second sub-body 212 are both set as trapezoidal capillary strips with isosceles trapezoidal cross-sectional shapes. At this time, the first sub-body 211 is an isosceles trapezoid with a higher protrusion height, and the second sub-body 212 is an isosceles trapezoid with a lower protrusion height. A height difference can also be formed between the two, which will also make the thermal resistance of the second sub-body 212 smaller than the thermal resistance of the first sub-body 211, so that the pore unit body 21 can also form a staggered change in the overall thermal resistance and increase the contact area between the capillary structure layer 2 and the steam cavity.
[0052] Furthermore, since the upper and lower sides of the trapezoidal capillary strips are arranged away from the tube wall of the heat pipe body 1 , an air flow gap can be formed between the first sub-body 211 and the second sub-body 212 , which also facilitates the flow of evaporated water vapor.
[0053] In one embodiment, the first sub-body 211 and the second sub-body 212 are both configured as triangular capillary strips with a cross-sectional shape of an isosceles triangle; and one side edge of the triangular capillary strip is configured away from the pipe wall of the heat pipe body 1 .
[0054] Specific, combined Figure 3 To further explain in detail, the first sub-body 211 and the second sub-body 212 are both set as triangular capillary strips with isosceles triangle cross-sections. At this time, the first sub-body 211 is an isosceles triangle with a higher protrusion height, and the second sub-body 212 is an isosceles triangle with a lower protrusion height. A height difference can also be formed between the two, which will also make the thermal resistance of the second sub-body 212 smaller than the thermal resistance of the first sub-body 211, so that the pore unit body 21 can also form a staggered change in the overall thermal resistance and increase the contact area between the capillary structure layer 2 and the steam cavity.
[0055] Furthermore, an airflow gap may also be formed between the first sub-body 211 and the second sub-body 212 in the shape of an isosceles triangle, which also facilitates the flow of evaporated water vapor.
[0056] In one embodiment, the first sub-body 211 and the second sub-body 212 are arranged adjacent to each other, and a wedge-shaped capillary gap is formed therebetween.
[0057] Specific, combined Figure 2 or Figure 3 To further explain in detail, the first sub-body 211 and the second sub-body 212 are arranged adjacent to each other, so that no matter whether the first sub-body 211 and the second sub-body 212 are arranged as an isosceles trapezoid or an isosceles triangle, a wedge-shaped capillary gap can be formed between the two, and the side with a larger opening of the wedge-shaped capillary gap is also facing the steam cavity, thereby making it easier for the first sub-body 211 and the second sub-body 212 to evaporate water vapor in the steam cavity, and for the water droplets condensed in the steam cavity to accumulate and converge in the wedge-shaped capillary gap.
[0058] In one possible implementation manner, the heat pipe body 1 is configured to be extruded into an oblate tube with a waist-shaped cross-section; the capillary structure layer 2 can adapt to the deformation of the inner tube wall of the heat pipe body 1 .
[0059] Before preliminary processing, the heat pipe body 1 can adopt a conventional round copper tube, and after being made into a non-homogeneous sintered tube, it can be extruded into a flat round tube with a waist-shaped cross-section by clamping and pressing, and the capillary structure layer 2 can adapt to the deformation of the inner tube wall of the heat pipe body 1 without affecting the normal capillary evaporation function of the capillary structure layer 2.
[0060] The specific configuration of the heat pipe body 1 can increase the contact area between the heterogeneous sintered tube and the heat source, thereby better facilitating heat exchange between the heterogeneous sintered tube and the heat source.
[0061] In one embodiment, the steam cavity in the heat pipe body 1 can be plugged with a heat pipe core rod; the heat pipe core rod and the inner tube wall of the heat pipe body 1 directly form a filling gap for filling sintered copper powder, and the sintered copper powder can be sintered and solidified to form a capillary structure layer 2.
[0062] Similarly, the steam cavity in the heat pipe body 1 can be preset into a circle before processing and manufacturing, and the heat pipe core rod can be correspondingly set as a cylindrical rod with a smaller diameter and fixed concentrically therewith, so that an annular filling gap for filling sintered copper powder is formed between the two. After the copper powder is filled, sintered and solidified, a cylindrical capillary structure layer 2 can be formed, and it can be extruded and deformed together with the heat pipe body 1 to form a flat cylindrical structure.
[0063] The specific arrangement of the steam cavity has the beneficial effect of being simple in structure and convenient for filling the sintered capillary structure layer 2 .
[0064] In one embodiment, the heterogeneous sintered tube includes an evaporation end and a condensation end located at both ends, and an insulation section connecting the two; wherein the particle size of the sintered copper powder of the capillary structure layer 2 in the evaporation end is smaller than the particle size of the sintered copper powder of the capillary structure layer 2 in the condensation end.
[0065] The heterogeneous sintered tube is specifically configured to be divided into three parts, namely, an evaporation end, an insulation section and a condensation end, and the particle size of the sintered copper powder of the capillary structure layer 2 in the evaporation end is specifically configured to be smaller than the particle size of the sintered copper powder of the capillary structure layer 2 in the condensation end. In this way, the pores in the capillary structure layer 2 in the evaporation end are relatively small and dense, which is more conducive to capillary volatilization, and the pores in the capillary structure layer 2 at the condensation end are relatively large, which is more conducive to the convergence and reflux of cooling water droplets.
[0066] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0067] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A heterogeneous sintered tube, characterized in that: include: The heat pipe body (1) has a steam cavity inside for steam to flow; A capillary structure layer (2) is attached to the inner tube wall of the heat pipe body (1) and at least partially protrudes and extends into the steam cavity; The capillary structure layer (2) is formed by arranging a plurality of pore unit bodies (21) of non-homogeneous thickness along the circumference of the heat pipe body (1).
2. The heterogeneous sintered tube according to claim 1, characterized in that: The pore unit body (21) is arranged to extend along the inner circumference of the heat pipe body (1); The pore unit body (21) comprises at least a first sub-body (211) and a second sub-body (212) which are sequentially arranged along the circumference of the heat pipe body (1); The thickness of the first sub-body (211) is greater than the thickness of the second sub-body (212).
3. The heterogeneous sintered tube according to claim 2, characterized in that: The first sub-body (211) and the second sub-body (212) are both configured as rectangular capillary strips with a rectangular cross-sectional shape.
4. The heterogeneous sintered tube according to claim 3, characterized in that: A third sub-body (213) is also arranged between the first sub-body (211) and the second sub-body (212); Furthermore, the thickness of the second sub-body (212) is greater than the thickness of the third sub-body (213).
5. The heterogeneous sintered tube according to claim 2, characterized in that: The first sub-body (211) and the second sub-body (212) are both configured as trapezoidal capillary strips with a cross-sectional shape of an isosceles trapezoid; Furthermore, the upper bottom side surface of the trapezoidal capillary strip is arranged away from the tube wall of the heat pipe body (1).
6. The heterogeneous sintered tube according to claim 2, characterized in that: The first sub-body (211) and the second sub-body (212) are both configured as triangular capillary strips with a cross-sectional shape of an isosceles triangle; Furthermore, one side edge of the triangular capillary strip is arranged away from the tube wall of the heat pipe body (1).
7. The heterogeneous sintered tube according to claim 5 or 6, characterized in that: The first sub-body (211) and the second sub-body (212) are arranged closely together, and a wedge-shaped capillary gap is formed between the two.
8. The heterogeneous sintered tube according to claim 1, characterized in that: The heat pipe body (1) is configured to be a flat round tube that can be extruded into a waist-shaped cross-sectional shape; The capillary structure layer (2) is capable of adaptively deforming along with the inner tube wall of the heat pipe body (1).
9. The heterogeneous sintered tube according to claim 1, characterized in that: The steam cavity in the heat pipe body (1) can be plugged with a heat pipe core rod; The heat pipe core rod and the inner pipe wall of the heat pipe body (1) directly form a filling gap for filling sintered copper powder, and the sintered copper powder can be sintered and solidified to form the capillary structure layer (2).
10. The heterogeneous sintered tube according to claim 1, characterized in that: The heterogeneous sintered tube includes an evaporation end and a condensation end located at both ends, and a heat insulation section connecting the two ends; Wherein, the particle size of the sintered copper powder of the capillary structure layer (2) in the evaporation end is smaller than the particle size of the sintered copper powder of the capillary structure layer (2) in the condensation end.