Solder alloy melt surface oxidation state testing device

Abstract

The utility model discloses a device for testing the surface oxidation state of a solder alloy melt. The device comprises a fixed plate (1), a heating container (2) of the solder alloy melt, a horizontal slag scraping mechanism (3), a vertical clamping mechanism (4), a power mechanism (5) fixed on the fixed plate, an image acquisition device (6) fixed on the fixed plate and arranged above the heating container, and a counter (7) and a controller which are respectively fixed on the fixed plate, the horizontal slag scraping mechanism (3) comprises a scraper (31) arranged in the heating container, a first connecting rod (32) with one end fixed to the scraper, a second connecting rod (33) hinged to the first connecting rod, and a first sliding guide rail (34) fixed to the fixing plate and allowing the first connecting rod to penetrate through. The device can effectively simulate the dip soldering process in production, can automatically and continuously record the surface states of solder alloy melts in different oxidation stages in real time, and guides the development and model selection of high-temperature lead-free tin-based solder products for dip soldering according to the pictures of the surface states of the solder alloy melts.

Description

Technical Field

[0001] The invention belongs to the technical field of high-temperature solder dip soldering detection, and in particular relates to a device for testing the oxidation degree of the surface of a solder alloy melt. Background Art

[0002] The manufacturing process of consumer electronic power supplies (or components) such as electronic transformers and inductors requires the use of high-temperature lead-free tin-based solder for dip soldering at 360℃~480℃. The molten surface state of the high-temperature solder alloy affects the degree of tinning, appearance quality and solder joint reliability of the component pins after dip soldering. For example, if a solder with a severe degree of oxidation on the alloy melt surface is used, the melt surface will be transformed from a metal mirror to a yellow, gray, etc. surface. And if a solder with a large amount of slag is used, high-melting-point insoluble tin ash often floats on the melt surface. The above-mentioned severe oxidation or excessive slag can easily cause the component pins to lose their metallic luster or be mixed with oxidized slag, resulting in serious problems such as poor appearance after welding and reduced solder joint reliability.

[0003] From the perspective of solder alloy development and selection on the material side, there is currently a lack of effective testing for the surface state of high-temperature lead-free tin-based solder alloy melts. The surface state of the solder alloy melt is judged only through static, small-scale, discontinuous manual scraping operations combined with manual observation, and the impact of foreign component inclusions on the alloy melt surface is not considered. In addition, from the perspective of component welding on the application side, dip soldering is currently mainly performed using a dip soldering machine, and the surface state of the solder melt in the tin pool, such as cleanliness or oxidation degree, is not monitored in real time. The surface state of the melt is only roughly judged manually, and the dip soldering machine has a complex structure, a large amount of tin in the tin pool, and a high operating cost, which is not suitable for testing the oxidation state of the solder alloy melt surface. The patent with publication number CN1396803A, named as a dip soldering device and a corresponding fully automatic dip soldering machine, can operate the dip soldering machine, but cannot test and characterize the surface oxidation state of the alloy melt. The patent with publication number CN209841857U, named as a device for testing the high-temperature oxidation resistance of the surface of a metal material, is only applicable to solid alloys and cannot test the surface oxidation state of the molten tin-based solder alloy melt.

[0004] Therefore, it is critical to observe and record the surface cleanliness and oxidation evolution of the high-temperature solder alloy melt, taking into account its own antioxidant consumption and the influence of foreign elements on the surface of the solder alloy melt after immersion, which is helpful for developing and selecting suitable solder alloys for component dip soldering. Summary of the invention

[0005] The utility model aims to solve the deficiencies of the prior art and provide a solder alloy melt surface oxidation state testing device which takes into account the pollution factors of alloy elements and foreign components and can automatically and continuously record the surface state of solder alloy melt at different oxidation stages in real time.

[0006] The technical solution adopted by the utility model is as follows:

[0007] A device for testing the surface oxidation state of a solder alloy melt, comprising a fixed plate, a heating container for the solder alloy melt, a horizontal scraping mechanism, a vertical clamping mechanism, a power mechanism fixed on the fixed plate, an image acquisition device fixed on the fixed plate and arranged above the heating container, and a counter and a controller respectively fixed on the fixed plate; the counter is provided with a switch, and when the cam rotates to the counter position, one end of the switch is pressed, the switch is energized, and the controller counts once.

[0008] The horizontal scraping mechanism comprises a scraper arranged in the heating container, a first connecting rod with one end fixed to the scraper, a second connecting rod hingedly connected to the first connecting rod, and a first sliding guide rail fixed on the fixing plate for the first connecting rod to pass through;

[0009] The vertical clamping mechanism comprises a third connecting rod, a fourth connecting rod, a fifth connecting rod, a sixth connecting rod and a seventh connecting rod which are hingedly connected in sequence, a second sliding guide rail, a third sliding guide rail and a fourth sliding guide rail through which the third connecting rod, the fifth connecting rod and the seventh connecting rod pass respectively, a roller connected to the end of the seventh connecting rod, and a clamp installed at the front end of the third connecting rod; the second sliding guide rail, the third sliding guide rail and the fourth sliding guide rail are respectively fixed on a fixed plate, and the third connecting rod is arranged above the heating container;

[0010] The power mechanism includes a variable speed motor, a gear set connected to the variable speed motor, and a cam connected to the gear set; the rear end of the second connecting rod is connected to the cam, and the roller is arranged on the surface of the cam;

[0011] The switch of the counter contacts the surface of the major diameter end of the cam;

[0012] The image acquisition device, the timer and the variable speed motor are electrically connected to the controller respectively.

[0013] Furthermore, the fixing plate is L-shaped.

[0014] Furthermore, the scraper is threadedly connected to the first connecting rod.

[0015] Furthermore, the clamp is made of stainless steel.

[0016] Furthermore, the heating container is composed of a titanium-plated heating furnace and a temperature control device.

[0017] The utility model has the following advantages:

[0018] The utility model can replace the connecting rod and the scraper in the horizontal scraping mechanism, and can be compatible with different oxidation area areas and scraping rates through the speed regulation of the power mechanism, effectively simulating the dip soldering process in production, and can automatically, in real time and continuously record the surface state of the solder alloy melt in different oxidation stages, and guide the development and selection of high-temperature lead-free tin-based solder products for dip soldering according to the surface state photos of the solder alloy melt; the utility model can be arranged back-to-back into double stations to realize the synchronous testing of different high-temperature lead-free tin-based solders, which is convenient for the horizontal comparison of the oxidation performance of high-temperature lead-free tin-based solders under the same experimental conditions, and provides a basis for the development and selection of high-temperature lead-free tin-based solders. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of the utility model (controller is not shown);

[0020] Figure 2 for Figure 1 Schematic diagram of the back mirror;

[0021] Figure 3 for Figure 1 The main view;

[0022] Figure 4 This is a schematic diagram of the utility model being arranged back to back into a double working position. DETAILED DESCRIPTION

[0023] The technical solution of the utility model will be clearly and completely described below in combination with the accompanying drawings and embodiments.

[0024] like Figure 1~Figure 3 As shown, a solder alloy melt surface oxidation state testing device comprises a fixed plate 1, a solder alloy melt heating container 2, a horizontal scraping mechanism 3, a vertical clamping mechanism 4, a power mechanism 5 fixed on the fixed plate, an image acquisition device 6 fixed on the fixed plate and arranged above the heating container, a counter 7 and a controller respectively fixed on the fixed plate; the counter 7 is provided with a switch, when the cam rotates to the counter position, the long diameter surface of the cam presses one end of the switch, the switch is powered on, and the controller counts once; wherein the heating container 2 can be composed of a titanium-plated heating furnace and a temperature control device, and the temperature adjustment range is 30°C to 800°C;

[0025] The horizontal scraping mechanism 3 comprises a scraper 31 arranged in the heating container, a first connecting rod 32 with one end fixed on the scraper, a second connecting rod 33 hingedly connected to the first connecting rod, and a first sliding guide rail 34 fixed on the fixed plate for the first connecting rod to pass through; the scraper can be threadedly connected to the first connecting rod, which is convenient for disassembly and replacement of the connecting rod and scraper in the horizontal scraping mechanism, and the power mechanism is used to adjust the speed to be compatible with different oxidation area areas and scraping rates, effectively simulating the dip soldering process in production, and the scraper width and height dimensions are respectively smaller than the width and height of the tin melt heating device;

[0026] The vertical clamping mechanism 4 comprises a third connecting rod 41, a fourth connecting rod 42, a fifth connecting rod 43, a sixth connecting rod 44, and a seventh connecting rod 45 which are hingedly connected in sequence, a second sliding guide rail 46, a third sliding guide rail 47, and a fourth sliding guide rail 48 for the third connecting rod, the fifth connecting rod, and the seventh connecting rod to pass through respectively, a roller 49 connected to the end of the seventh connecting rod, and a clamp 410 installed at the front end of the third connecting rod, wherein the clamp can be made of stainless steel material to fix the test components to avoid the test error caused by the doping of non-essential elements such as Fe and the dissolution of the clamp; the second sliding guide rail, the third sliding guide rail, and the fourth sliding guide rail are respectively fixed on the fixed plate, and the third connecting rod is arranged above the heating container;

[0027] The power mechanism 5 includes a variable speed motor 51, the voltage range of the variable speed motor can be 0 V~3 V, a gear set 52 connected to the variable speed motor, and a cam 53 connected to the gear set; the rear end of the second connecting rod is connected to the cam, and the roller is arranged on the surface of the cam;

[0028] The image acquisition device, the timer, and the variable speed motor are electrically connected to the controller respectively, and the image acquisition device can be a digital camera.

[0029] Please refer to Figure 4 The fixing plate can be L-shaped, and the device can be set back to back into a double station to achieve simultaneous testing of different high-temperature lead-free tin-based solders, which is convenient for horizontal comparison of the oxidation performance of high-temperature lead-free tin-based solders under the same experimental conditions, providing a basis for the selection and production monitoring of high-temperature lead-free tin-based solders in production, and can improve work efficiency.

[0030] The working process of the utility model is as follows: add a tin solder alloy sample into a heating container, set the temperature to 400°C, wait for the solder alloy to melt into a molten state, control the variable speed motor to adjust the voltage to 0.3 V through the controller, start the power supply, and drive the variable speed motor to drive the gear set to drive the cam to operate. In the horizontal direction, the cam drives the first connecting rod, the second connecting rod, and the scraper to run back and forth in the horizontal direction on the surface of the tin solder alloy melt to scrape the slag back and forth to remove the oxide layer, expose the fresh tin liquid to oxidation in the atmosphere, consume the antioxidant elements of the alloy matrix, and push the oxide slag to the edge of the melt heating device; in the vertical direction, the cam contacts with the roller, and through the vertical clamping mechanism with the downward vertical movement of the clamp on the third connecting rod, immerses the test element in the tin solder alloy melt and lifts it to reciprocate, and the image acquisition device records the video in real time, and every 5 min to take photos of the surface state of the tin solder alloy, and the controller presets the number of times. When the number of rotations is reached, the controller controls the motor to stop rotating. The controller is a single-chip microcomputer system, which records the cleanliness and oxidation evolution of the solder alloy melt surface by taking photos of the surface state of the tin solder alloy. The device of the utility model can test two groups of samples at the same time, the melt temperature is adjustable, the scraping rate is adjustable, the oxidation surface state is recorded in real time, the test efficiency is higher, the test error is smaller, and it is easy to operate.

[0031] The above are only preferred embodiments of the present invention. For those skilled in the art, it can be understood that without departing from the concept of the present invention, further modifications and replacements of these embodiments are within the protection scope of the present invention.

Claims

1. A device for testing the surface oxidation state of a solder alloy melt, characterized in that: It comprises a fixed plate (1), a heating container (2) for a solder alloy melt, a horizontal scraping mechanism (3), a vertical clamping mechanism (4), a power mechanism (5) fixed to the fixed plate, an image acquisition device (6) fixed to the fixed plate and arranged above the heating container, and counters (7) and a controller respectively fixed to the fixed plate; The horizontal scraping mechanism (3) comprises a scraper (31) arranged in the heating container, a first connecting rod (32) with one end fixed to the scraper, a second connecting rod (33) hingedly connected to the first connecting rod, and a first sliding guide rail (34) fixed to the fixing plate and through which the first connecting rod passes; The vertical clamping mechanism (4) comprises a third connecting rod (41), a fourth connecting rod (42), a fifth connecting rod (43), a sixth connecting rod (44), and a seventh connecting rod (45) which are hingedly connected in sequence, a second sliding guide rail (46), a third sliding guide rail (47), and a fourth sliding guide rail (48) for the third connecting rod, the fifth connecting rod, and the seventh connecting rod to pass through respectively, a roller (49) connected to the end of the seventh connecting rod, and a clamp (410) installed at the front end of the third connecting rod; the second sliding guide rail, the third sliding guide rail, and the fourth sliding guide rail are respectively fixed to a fixed plate, and the third connecting rod is arranged above the heating container; The power mechanism (5) comprises a variable speed motor (51), a gear set (52) connected to the variable speed motor, and a cam (53) connected to the gear set; the rear end of the second connecting rod is connected to the cam, and the roller is arranged on the surface of the cam; The switch of the counter contacts the surface of the major diameter end of the cam; The image acquisition device, the counter and the variable speed motor are electrically connected to the controller respectively.

2. A solder alloy melt surface oxidation state testing device according to claim 1, characterized in that: The fixing plate is L-shaped.

3. A solder alloy melt surface oxidation state testing device according to claim 1, characterized in that: The scraper is threadedly connected to the first connecting rod.

4. A solder alloy melt surface oxidation state testing device according to any one of claims 1 to 3, characterized in that: The clamp is made of stainless steel.

5. A solder alloy melt surface oxidation state testing device according to any one of claims 1 to 3, characterized in that: The heating container is composed of a titanium-plated heating furnace and a temperature control device.

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