Plastic package DC / DC module power supply aging test seat
By designing an old test seat for DC/DC module power supply, using contact test probes and temperature control systems, the problem of traditional welding test time and pin damage is solved, and efficient and accurate module power supply is achieved test.
Patent Information
- Application Number
- CN202323424777.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-15
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2033-12-15
AI Technical Summary
The traditional plastic sealed DC/DC module power supply testing method requires welding, which takes a long time and is prone to damage the welding pins, and lacks efficient disassembly and protection measures.
A plastic-sealed DC/DC module power supply test seat is designed, using a contact test probe to contact the circuit board pad, and the cover plate and the base are opened and closed through the movable switch assembly and elastic floating plate, combined with the temperature control system. Circulate cooling.
Weldless testing is realized, reducing the number of disassembly and assembly of the module power supply, protecting the test probe, improving the testing efficiency and accuracy, and avoiding the problem of heat accumulation caused by untimely heat dissipation.
Smart Images
Figure CN222439535U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of module power supply testing, in particular to a plastic-sealed DC / DC module power supply aging test socket. Background Art
[0002] The traditional plastic-encapsulated DC / DC module power supply test method connects the module power supply to the circuit board mainboard by direct welding. After the test, the pins of the module power supply need to be heated again with a soldering iron to separate the soldering pads of the circuit board mainboard. The whole operation process is time-consuming. In addition, each test requires welding, which is easy to damage the welding pins. Therefore, an improved module power supply aging test socket is needed. Utility Model Content
[0003] The purpose of the utility model is to provide a burn-in test socket for a plastic-encapsulated DC / DC module power supply in view of the problems existing in the above-mentioned prior art. The module power supply is assembled on the burn-in test socket, and the burn-in test socket is assembled on the main board of the circuit board. The pins of the test module can contact the probes on the base, and the probes contact the pads on the circuit board. After the test, the burn-in test socket is disassembled.
[0004] The technical solution to achieve the purpose of the utility model is as follows: on the one hand, a plastic-encapsulated DC / DC module power supply aging test socket is provided, and the aging test socket is assembled on the circuit board mainboard, including a cover plate, a base, a floating plate, a movable switch assembly and a test sleeve; the cover plate and the base are rotatably connected to achieve opening and closing; the movable switch assembly is assembled on the base to control the opening and closing of the cover plate and the base; the base includes a base limiting cavity, and a test probe that passes through the upper and lower surfaces of the base; the floating plate is provided with a groove that matches the base limiting cavity structure, which is used to place the module under test The power supply is a power supply, and the pin of the power supply of the module under test contacts with the test probe; the floating plate is an elastically crimped floating plate, which is suspended in the limiting cavity of the base. When the cover plate and the base are opened and closed, they can move up and down under the squeezing of the cover plate, and a through hole is provided on it for the test probe to pass through; the cover plate is provided with a heat sink; the area on the cover plate where the heat sink is not distributed is equipped with the test sleeve, and the thermistor assembly passes through the cover plate through the test sleeve and the through hole on the lower surface of the cover plate corresponding to the test sleeve, directly contacts the surface of the power supply of the module under test, and monitors the surface temperature of the power supply of the module under test in real time.
[0005] Furthermore, the cover plate and the base are rotationally connected via a connecting shaft and a torsion spring. The connecting shaft passes through a first axial hole on the cover plate and a second axial hole on the base to achieve a static connection between the cover plate and the base without relative sliding. The torsion spring is assembled on the connecting shaft to achieve elastic opening and closing between the cover plate and the base.
[0006] Furthermore, the movable switch assembly includes two movable switches connected by springs, and an movable switch base on which the movable switches are assembled, and the movable switch base is installed on the base; the opening and closing of the base and the cover plate are controlled by pressing the movable switch, and the opening and closing of the cover plate and the base are jointly controlled by the movable switch, the connecting shaft and the torsion spring.
[0007] Furthermore, the movable switch is provided with a first limiting platform for limiting the maximum contact height between the cover plate and the base.
[0008] Furthermore, a second limiting platform is provided on the base to limit the minimum contact height between the cover plate and the base.
[0009] Furthermore, a test probe area is extended from the lower surface of the base, and a detachable insulating plastic plate is installed to protect the test probe; when testing is to be performed, the insulating test plate is uninstalled.
[0010] Furthermore, a pressing block is provided on the lower surface of the cover plate, which is used to control the downward pressing distance of the power supply of the module under test under the action of the cover plate, and the sinking height of the power supply of the module under test is consistent with the height of the pressing block.
[0011] Furthermore, the floating plate is limited by a spring mounted on the limiting cavity of the base, a third limiting platform on the floating plate and screws on the base; the third limiting platform contacts a positioning pin mounted on the base to limit the high point of the floating plate.
[0012] Furthermore, first grooves are formed on both sides of the base, and second grooves corresponding to the positions of the first grooves are formed on both sides of the floating plate.
[0013] On the other hand, an aging test device based on the aging test socket is provided, the device comprising a test frame, and several groups of test units installed on the test frame, each group of test units comprising a thermistor assembly, a fan, a temperature control processing unit and an aging test socket; the thermistor assembly is used to collect temperature data of the power supply of the module under test and transmit it to the temperature control processing unit, the temperature control processing unit controls the start and stop of the fan according to the temperature measurement data, and performs cooling treatment through the fan and the heat sink on the cover of the aging test socket, thereby realizing the regulation of the surface temperature of the DC / DC module power supply.
[0014] Compared with the prior art, the utility model has the following significant advantages:
[0015] (1) The test method using a contact test probe with the circuit board mainboard does not require soldering on the circuit board and is easy to disassemble.
[0016] (2) The test socket can avoid multiple disassembly and assembly of the module power supply to be tested, reduce damage to the module pins, and save time in changing the test product type.
[0017] (3) Equip a removable insulating plastic plate to protect the test probe from contact damage.
[0018] (4) A heat sink made of metal sheets is arranged on the cover plate to dissipate heat from the contact test module power supply in the aging test socket, effectively avoiding the influence of heat accumulation caused by untimely heat dissipation of the module power supply on the accuracy of the test results.
[0019] (5) The temperature control system is used to achieve circulating cooling of the aging test socket, which solves the problem that the heat inside the test socket cannot be dissipated in time, resulting in heat accumulation inside, causing important power components inside the test socket to easily malfunction, affecting the normal testing of subsequent resistors and capacitors.
[0020] The utility model is described in further detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 Schematic diagram of the aging test socket structure perspective 1 in one embodiment.
[0022] Figure 2 Schematic diagram of the aging test socket structure view 2 in one embodiment.
[0023] Figure 3 It is a schematic diagram of the structure of the aging test socket base from perspective 1 in one embodiment.
[0024] Figure 4 Schematic diagram of the aging test socket base structure from perspective 2 in one embodiment.
[0025] Figure 5 Schematic diagram of a floating plate structure of an aging test seat in one embodiment.
[0026] Figure 6 A schematic diagram of a method for using a burn-in test socket for assembling a module power supply in an implementation example. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0028] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0029] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0030] In addition, if there are descriptions involving "springs", "screws", etc. in the embodiments of the utility model, the descriptions of "springs", "screws", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "springs" and "screws" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0031] In one embodiment, in combination Figures 1 to 5 , provides a plastic-encapsulated DC / DC module power supply aging test socket, the aging test socket is assembled on the circuit board mainboard, and includes a cover plate 1, a base 2, a floating plate 3, an active switch assembly 4 and a test sleeve 5; the cover plate 1 is rotatably connected to the base 2 and can be opened and closed; the active switch assembly 4 is assembled on the base 2, and is used to control the opening and closing of the cover plate 1 and the base 2; the base 2 includes a base limiting cavity 2.1, and a test probe 2.1.1 that passes through the upper and lower surfaces of the base 2; the floating plate 3 is provided with a groove that matches the structure of the base limiting cavity 2.1, and is used to place the module power supply under test, and the pins of the module power supply under test are connected to the test The test probe 2.1.1 contacts the cover plate 1; the floating plate 3 is an elastically crimped floating plate, which is suspended in the base limiting cavity 2.1. When the cover plate 1 and the base 2 are opened and closed, it can move up and down under the squeezing of the cover plate 1, and at the same time, a through hole 3.1.1 is provided thereon for the test probe 2.1.1 to pass through; a heat sink 1.1 is distributed on the cover plate 1; the test sleeve 5 is assembled in the area on the cover plate 1 where the heat sink 1.1 is not distributed, and the thermistor assembly 7 passes through the cover plate 1 through the test sleeve 5 and the through hole 1.3 at the position corresponding to the test sleeve 5 on the lower surface of the cover plate 1, directly contacts the surface of the power supply of the module under test, and monitors the surface temperature of the power supply of the module under test in real time.
[0032] Here, a heat sink 1.1 made of metal sheets is arranged on the cover plate 1 to dissipate heat from the contact test module power supply 8 in the aging test socket, so as to avoid heat accumulation due to untimely heat dissipation of the module power supply and affect the accuracy of the test results.
[0033] Furthermore, in one of the embodiments, the cover plate 1 and the base 2 are rotationally connected via a connecting shaft and a torsion spring. The connecting shaft passes through a first axial hole 1.2 on the cover plate 1 and a second axial hole 2.2 on the base 2, and is used to achieve a static connection between the cover plate 1 and the base 2 without relative sliding; the torsion spring is assembled on the connecting shaft, and is used to achieve elastic opening and closing between the cover plate 1 and the base 2.
[0034] Furthermore, in one embodiment, the movable switch assembly 4 includes two movable switches 4.1 connected by springs, and an movable switch base 4.2 on which the movable switches 4.1 are assembled, and the movable switch base 4.2 is installed on the base 2; the opening and closing of the cover 1 and the base 2 are jointly controlled by the movable switch 4.1, the connecting shaft and the torsion spring.
[0035] Furthermore, in one of the embodiments, a first limiting platform 4.1.1 is provided on the movable switch 4.1 for limiting the maximum contact height between the cover plate 1 and the base 2.
[0036] Furthermore, in one of the embodiments, a second limiting platform 2.4 is provided on the base 2 for limiting the minimum contact height between the cover plate 1 and the base 2.
[0037] Furthermore, in one of the embodiments, the lower surface of the base 2 extends out of the test probe area and is equipped with a removable insulating plastic plate 6 to protect the test probe 2.1.1; when testing, the insulating test board 6 is uninstalled, and the aging test socket is assembled on the circuit board mainboard and fixed with screws. After use, the insulating plastic plate 6 is assembled to protect the test probe 2.1.1 from contact damage.
[0038] Furthermore, in one of the embodiments, a pressing block 1.4 is provided on the lower surface of the cover plate 1 for controlling the downward pressing distance of the power supply of the module under test under the action of the cover plate 1, and the sinking height of the power supply of the module under test is consistent with the height of the pressing block 1.4.
[0039] Furthermore, in one of the embodiments, the floating plate 3 is limited by a spring assembled on the base limiting cavity 2.1, a third limiting platform 3.2 on the floating plate 3 and a screw on the base 2; the third limiting platform 3.2 contacts a positioning pin assembled on the base 2, and is used for high point limiting of the floating plate 3.
[0040] Preferably, the third limiting platform 3 . 2 is a recessed limiting platform located at the four corners of the floating plate 3 .
[0041] Here, preferably, the positioning pin is assembled on the groove 2.1.3 on the edge of the base 2.
[0042] Here, preferably, the spring is assembled in the circular hole groove 2.1.2 in the base limit cavity 2.1, exerting an elastic force upward on the floating plate 3; the limit and the spring form a suspended floating plate that can be elastically pressed.
[0043] The floating plate 3 is subjected to a downward force, and the spring at the bottom of the floating plate 3 retracts due to the extrusion force, and the floating plate 3 sinks until it contacts the surface of the base limit cavity 2.1 and stops. At this time, the test probe 2.1.1 assembled on the base 2 can extend out through the through hole 3.1 of the floating plate.
[0044] It should be noted here that it is not limited to the spring, and other elastic devices that can achieve the corresponding functions are also acceptable.
[0045] Furthermore, in one of the embodiments, first grooves 2.3 are formed on both sides of the base 2, and second grooves 3.3 corresponding to the positions of the first grooves 2.3 are formed on both sides of the floating plate 3.
[0046] The solution of this embodiment is adopted to facilitate the taking and placing of products.
[0047] In one embodiment, in combination Figure 6 , provides an aging test device for an aging test socket, the device includes a test frame 10, and a plurality of test units installed on the test frame 10, each test unit includes a thermistor assembly 7, a fan 8, a temperature control processing unit 9 and an aging test socket; the thermistor assembly 7 is used to collect temperature data of a power supply of a module under test and transmit it to the temperature control processing unit 9, the temperature control processing unit controls the start and stop of the fan 8 according to the temperature measurement data, and performs cooling treatment through the fan 8 and the heat sink 1.1 on the aging test socket cover 1, thereby realizing the regulation of the surface temperature of the DC / DC module power supply.
[0048] The test method of the burn-in test socket is as follows:
[0049] Step 1, remove the insulating plastic plate 6 on the aging test seat base 2;
[0050] Step 2, assembling the aging test seat on the aging test device;
[0051] Step 3, assemble the module power supply in the aging test socket;
[0052] Step 4, the test sleeve is connected to the thermistor assembly 7 and the test starts;
[0053] The temperature measurement data of the module surface collected by the thermistor component 7 is transmitted to the temperature control processing unit 9. The temperature control processing unit 9 controls the start and stop of the fan 8 according to the temperature measurement data, and performs cooling treatment through the fan and the heat sink on the aging test seat cover; so as to regulate the temperature of the DC / DC module power supply surface.
[0054] Step 5: After the test is completed, remove the power supply of the module under test and remove the burn-in test socket from the burn-in test device;
[0055] Step 6, reassemble the insulation test board 6 on the aging test seat base.
[0056] In summary, the plastic-encapsulated DC / DC module power supply aging test socket of the utility model adopts a contact test method, which has the advantages of small size, easy use, simple operation, etc., and can better support the module power supply, making it convenient for staff to test it.
[0057] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.
Claims
1. A plastic-encapsulated DC / DC module power supply aging test socket, characterized in that: The aging test socket is mounted on a circuit board mainboard, and comprises a cover plate (1), a base (2), a floating plate (3), a movable switch assembly (4) and a test sleeve (5); the cover plate (1) and the base (2) are rotatably connected and can be opened and closed; the movable switch assembly (4) is mounted on the base (2) and is used to control the opening and closing of the cover plate (1) and the base (2); the base (2) comprises a base limiting cavity (2.1) and a test probe (2.1.1) passing through the upper and lower surfaces of the base (2); the floating plate (3) is provided with a groove matching the structure of the base limiting cavity (2.1) and is used to place the power supply of the module under test, and the pins of the power supply of the module under test are in contact with the test probe (2.1.1); The floating plate (3) is an elastically crimped floating plate, suspended in the base limiting cavity (2.1), and can move up and down under the pressure of the cover plate (1) when the cover plate (1) and the base (2) are opened and closed, and is provided with a through hole (3.1.1) for the test probe (2.1.1) to pass through; a heat sink (1.1) is distributed on the cover plate (1); the test sleeve (5) is assembled in an area on the cover plate (1) where the heat sink (1.1) is not distributed, and the thermistor assembly (7) passes through the cover plate (1) through the test sleeve (5) and the through hole (1.3) at a position corresponding to the test sleeve (5) on the lower surface of the cover plate (1), directly contacts the surface of the power supply of the module under test, and monitors the temperature of the surface of the power supply of the module under test in real time.
2. The plastic-encapsulated DC / DC module power supply aging test socket according to claim 1, characterized in that: The cover plate (1) and the base (2) are rotatably connected via a connecting shaft and a torsion spring; the connecting shaft passes through a first axial center hole (1.2) on the cover plate (1) and a second axial center hole (2.2) on the base (2) to achieve a static connection between the cover plate (1) and the base (2) without relative sliding; the torsion spring is mounted on the connecting shaft to achieve elastic opening and closing between the cover plate (1) and the base (2).
3. The plastic-encapsulated DC / DC module power supply aging test socket according to claim 2, characterized in that: The movable switch assembly (4) comprises two movable switches (4.1) connected by springs, and a movable switch base (4.2) on which the movable switches (4.1) are assembled, and the movable switch base (4.2) is mounted on the base (2); the opening and closing of the cover plate (1) and the base (2) are controlled by the movable switches (4.1), the connecting shaft and the torsion spring.
4. The plastic-encapsulated DC / DC module power supply aging test socket according to claim 3, characterized in that: The movable switch (4.1) is provided with a first limiting platform (4.1.1) for limiting the maximum contact height between the cover plate (1) and the base (2).
5. The plastic-encapsulated DC / DC module power supply aging test socket according to claim 1, characterized in that: The base (2) is provided with a second limiting platform (2.4) for limiting the minimum contact height between the cover plate (1) and the base (2).
6. The plastic-encapsulated DC / DC module power supply aging test socket according to claim 1, characterized in that: The lower surface of the base (2) extends out of the test probe area and is equipped with a detachable insulating plastic plate (6) for protecting the test probe (2.1.1); when testing is to be performed, the insulating plastic plate (6) is removed.
7. The plastic-encapsulated DC / DC module power supply aging test socket according to claim 1, characterized in that: A pressing block (1.4) is provided on the lower surface of the cover plate (1) for controlling the downward pressing distance of the module power supply under the action of the cover plate (1); the sinking height of the module power supply under the test is consistent with the height of the pressing block (1.4).
8. The plastic-encapsulated DC / DC module power supply aging test socket according to claim 1, characterized in that: The floating plate (3) is limited by a spring mounted on the base limiting cavity (2.1), a third limiting platform (3.2) on the floating plate (3), and screws on the base (2); the third limiting platform (3.2) contacts a positioning pin mounted on the base (2) to limit the high point of the floating plate (3).
9. The plastic-encapsulated DC / DC module power supply aging test socket according to claim 1, characterized in that: First grooves (2.3) are provided on both sides of the base (2), and second grooves (3.3) corresponding to the positions of the first grooves (2.3) are provided on both sides of the floating plate (3).