Interface card device and heat dissipation module thereof

Abstract

The utility model relates to an interface card device and a heat dissipation module thereof. An interface card device comprises an interface card unit, a heat dissipation module and a heat conduction pad. The interface card unit is provided with a circuit board and a heating element. The heating element is fixedly arranged on one side of the circuit board. The heat dissipation module comprises a heat dissipation block and a concave-convex structure, the heat dissipation block is combined to the circuit board, and the concave-convex structure is arranged on the face, facing the circuit board, of the heat dissipation block in a protruding mode. The heat conduction pad has flexibility, is directly clamped between the concave-convex structure and the heating element, and is thermally connected with the heat dissipation block and the heating element. By means of the structure, the interface card device and the heat dissipation module of the interface card device are favorable for reducing resilience force and improving the heat dissipation efficiency of the heat conduction pad on the interface card device, and therefore the risk that the interface card device cannot operate due to overheating is reduced.

Description

Technical Field

[0001] The utility model relates to an interface card device, in particular to an interface card device which helps to reduce the rebound force and a heat dissipation module thereof. Background Art

[0002] In recent years, the object that needs to be cooled on the interface card device is no longer just the core chip (CPU / GPU), but also the surrounding parts of the interface card device (such as memory, MOS, inductor, etc.) need to be cooled. Generally speaking, the interface card device (such as the display card) mostly uses fans, thermal paste, thermal pads, heat sinks and / or heat sink fins to reduce the operating temperature of the above parts.

[0003] However, when a thermal pad is attached to the interface card device, since the thermal pad has a certain resilience, the resilience will inevitably affect the heat dissipation efficiency of the thermal pad for the interface card device, thereby increasing the risk of the interface card device being unable to operate due to overheating. Utility Model Content

[0004] The utility model provides an interface card device and a heat dissipation module thereof, which are used to solve the problems of the prior art.

[0005] According to one embodiment of the utility model, an interface card device includes an interface card unit, a heat dissipation module and a thermal pad. The interface card unit has a circuit board and at least one heating element. The heating element is fixed on one side of the circuit board. The heat dissipation module includes a heat dissipation block and at least one concave-convex structure. The heat dissipation block is combined with the circuit board, and the concave-convex structure is convexly arranged on the side of the heat dissipation block facing the circuit board. The thermal pad is flexible, sandwiched between the concave-convex structure and the heating element, and thermally connects the heat dissipation block and the heating element.

[0006] According to one or more embodiments of the present invention, in the above-mentioned interface card device, the concave-convex structure is integrally formed on the heat dissipation block.

[0007] According to one or more embodiments of the present invention, in the above-mentioned interface card device, the concave-convex structure can be detachably mounted on the heat sink.

[0008] According to one or more embodiments of the present invention, in the interface card device, the concave-convex structure is in one of a line shape, a dot shape and a mesh shape.

[0009] According to one or more embodiments of the present invention, in the interface card device, the concave-convex structure includes a plurality of convex portions and a plurality of concave portions, the convex portions are spaced apart from each other, and the concave portions are staggered with the convex portions. The convex portions together press one side of the thermal pad, so that the side of the thermal pad partially extends into the concave portions.

[0010] According to one or more embodiments of the present invention, in the above-mentioned interface card device, the heat dissipation module further includes a fin group, a heat pipe and a fan device. The fin group is fixedly connected to the side of the heat dissipation block facing away from the circuit board. The heat pipes are fixedly connected to the heat dissipation block and the fin group respectively. The fan device is located on the side of the fin group opposite to the heat dissipation block to generate airflow and take away the heat of the interface card unit.

[0011] According to one or more embodiments of the present invention, in the interface card device, the surface of the heat sink facing away from the circuit board further includes a plurality of fin slots. The fin assembly includes a plurality of fins, which are spaced apart from each other and respectively locked in the fin slots.

[0012] According to one or more embodiments of the present invention, the interface card device further comprises a plurality of locking elements. Each locking element comprises a gasket, a bolt and a spring. The gasket covers the side of the circuit board facing away from the heating element. The bolt passes through the gasket and the circuit board and is connected to the heat sink. The spring surrounds the bolt and abuts against the gasket and the head of the bolt respectively to tightly combine the heat sink module and the interface card unit.

[0013] According to one embodiment of the utility model, a heat dissipation module is used to be installed on an interface card unit, and the heat dissipation module includes a heat dissipation block and at least one concave-convex structure. The concave-convex structure is convexly arranged on one side of the heat dissipation block. Therefore, when the heat dissipation block is combined with the circuit board of the interface card unit, and a thermal pad is directly sandwiched between the concave-convex structure and the heating element of the circuit board, the thermal pad thermally connects the heat dissipation block and the heating element.

[0014] According to one or more embodiments of the present invention, in the heat dissipation module, the concave-convex structure is integrally formed on the heat dissipation block.

[0015] According to one or more embodiments of the present invention, in the heat dissipation module, the concave-convex structure can be detachably mounted on the heat dissipation block.

[0016] According to one or more embodiments of the present invention, in the heat dissipation module, the concave-convex structure is in one of a line shape, a mesh shape, and a woven mesh shape.

[0017] According to one or more embodiments of the present invention, in the heat dissipation module, the concave-convex structure includes a plurality of convex portions and a plurality of concave portions, the convex portions are spaced apart from each other, and the concave portions and the convex portions are staggered with each other.

[0018] According to one or more embodiments of the utility model, in the above heat dissipation module, the heat dissipation module further includes a fin group, a heat pipe and a fan device. The fin group is fixedly connected to the other side of the heat dissipation block. The heat pipes are respectively fixedly connected to the heat dissipation block and the fin group. The fan device is located on the side of the fin group opposite to the heat dissipation block to generate airflow and take away the heat of the interface card unit.

[0019] According to one or more embodiments of the present invention, in the heat dissipation module, the surface of the heat dissipation block facing away from the circuit board further includes a plurality of fin slots. The fin assembly includes a plurality of fins, which are spaced apart from each other and respectively locked in the fin slots.

[0020] Thus, through the above structure, the interface card device and the heat dissipation module thereof of the present invention can help reduce the rebound force, improve the heat dissipation efficiency of the thermal pad for the interface card device, and thus reduce the risk of the interface card device being unable to operate due to overheating.

[0021] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the technical effects produced, etc. The specific details of the present invention will be described in detail in the following implementation methods and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to make the above and other purposes, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:

[0023] Figure 1 It is a three-dimensional diagram of an interface card device according to an embodiment of the present invention.

[0024] Figure 2 for Figure 1 Exploded view of the interface card assembly.

[0025] Figure 3 for Figure 1 An exploded view of the interface card device viewed from another perspective.

[0026] Figure 4 for Figure 3 A local enlarged view of area M.

[0027] Figure 5 For along Figure 1 A partial cross-sectional view of line segment AA.

[0028] Figure 6 for Figure 2 An exploded view of the heat dissipation module and a magnified view of a specific location.

[0029] Explanation of symbols

[0030] 10: Interface card device

[0031] 100: Interface card unit

[0032] 110: Bracket

[0033] 120: Circuit board

[0034] 121: Long Sides

[0035] 122: Short Sides

[0036] 123: Positive

[0037] 124: Back

[0038] 130: Core components

[0039] 140: Peripheral components

[0040] 150: Connection interface

[0041] 200: Cooling module

[0042] 210: Heat sink

[0043] 211: Connection surface

[0044] 212: Joint surface

[0045] 213: First side

[0046] 214: Second side

[0047] 215: Fin slot

[0048] 220: Linear slot

[0049] 230: Concave and convex structure

[0050] 231: convex part

[0051] 232: concave part

[0052] 240: Fin set

[0053] 241: Fins

[0054] 250: Fan unit

[0055] 260: Heat pipe

[0056] 261: First Segment

[0057] 262: Second Segment

[0058] 263: The third section

[0059] 300: Thermal pad

[0060] 400: Locking element

[0061] 410: Padding

[0062] 420: Bolt

[0063] 421: Head

[0064] 430: Spring

[0065] AA: Line segment

[0066] B: Stud

[0067] M: Area

[0068] X,Y,Z: Axis DETAILED DESCRIPTION

[0069] The following will disclose multiple embodiments of the utility model with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, those skilled in the art should understand that in some embodiments of the utility model, these practical details are not necessary and should not be used to limit the utility model. In addition, in order to simplify the drawings, some conventional structures and components will be shown in a simple schematic manner in the drawings. In addition, for the convenience of readers, the sizes of the components in the drawings are not shown according to the actual proportion.

[0070] Figure 1 FIG. 1 is a perspective view of an interface card device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 In this embodiment, as shown in FIG. Figure 1 and Figure 2 As shown, the interface card device 10 comprises an interface card unit 100, a heat dissipation module 200, a plurality of thermal pads 300 and a plurality of locking elements 400. The locking elements 400 force the heat dissipation module 200 and the interface card unit 100 to be combined with each other, so that the thermal pads 300 are sandwiched between the heat dissipation module 200 and the interface card unit 100.

[0071] More specifically, if Figure 2 As shown, the interface card unit 100 has a bracket 110, a circuit board 120, a core component 130 and a plurality of peripheral components 140. The circuit board 120 has a long side 121 and a short side 122 adjacent to each other, and a front 123 and a back 124 opposite to each other. The bracket 110 is fixedly connected to one of the short sides 122 of the circuit board 120, and one of the long sides 121 of the circuit board 120 has a connection interface 150 (such as a gold finger). The core component 130 and these peripheral components 140 are all fixedly arranged on the front side 123 of the circuit board 120. It should be understood that the core component 130 and these peripheral components 140 will generate residual heat when working, so they can also be called heating elements in this embodiment.

[0072] Figure 3 for Figure 1 The interface card device 10 is an exploded view viewed from another perspective. Figure 2 and Figure 3As shown, the heat dissipation module 200 includes a heat dissipation block 210 and a plurality of concave-convex structures 230. The heat dissipation block 210 is fixedly coupled to the circuit board 120 via studs B. These concave-convex structures 230 are respectively convexly disposed on a side of the heat dissipation block 210 facing the circuit board 120 (hereinafter referred to as the coupling surface 212 of the heat dissipation block 210). These concave-convex structures 230 are respectively aligned with the peripheral components 140, and the area of ​​each concave-convex structure 230 is substantially the same as the area of ​​the peripheral components 140.

[0073] Figure 4 for Figure 3 A partial enlarged view of the area M. Figure 3 and Figure 4 As shown, in this embodiment, the heat dissipation block 210 is rectangular, having a first side 213 and a second side 214, and the long axis extension direction of the first side 213 and the long axis extension direction of the second side 214 are adjacent to each other. A portion of the concave-convex structures 230 are arranged in sequence along the first side 213, and another portion of the concave-convex structures 230 are arranged in sequence along the second side 214. Further, each concave-convex structure 230 is formed integrally on the bonding surface 212 of the heat dissipation block 210.

[0074] However, the present invention is not limited thereto. In other embodiments, the concave-convex structure 230 may also be detachably mounted on the heat dissipation block 210 , for example, locked on the heat dissipation block 210 .

[0075] Figure 5 For along Figure 1 The local section view of line segment AA. Figure 4 and Figure 5 As shown, each thermal pad 300 is flexible, and is directly sandwiched between the corresponding concave-convex structure 230 and the peripheral element 140 . It is directly squeezed by the concave-convex structure 230 to form a depression, and is thermally connected to the heat sink 210 and the peripheral element 140 .

[0076] In the present embodiment, each concave-convex structure 230 includes a plurality of convex portions 231 and a plurality of concave portions 232, wherein the convex portions 231 are spaced apart from each other, and the concave portions 232 and the convex portions 231 are arranged alternately in sequence. More specifically, each concave-convex structure 230 is in the shape of a line, in other words, the concave portions 232 and the convex portions 231 are in the shape of long columns. The convex portions 231 are linearly arranged spaced apart from each other along the first side 213 or the second side 214 of the heat dissipation block 210, and the long axis direction of each convex portion 231 is parallel to the first side 213 (such as the Y axis) or the second side 214 (such as the X axis) of the heat dissipation block 210. The concave portion 232 is directly connected to the bonding surface 212 of the heat dissipation block 210. Thus, when the thermal pad 300 is directly sandwiched between the concave-convex structure 230 and the peripheral element 140 , the convex portions 231 together press a corresponding side of the thermal pad 300 , so that the side of the thermal pad 300 partially extends into the concave portions 232 .

[0077] However, the present invention is not limited thereto, and in other embodiments, for example, the concave-convex structure may be changed to a mesh shape or a woven mesh shape, etc.; or, the thermal pad may be changed to be sandwiched between the concave-convex structure and the core element.

[0078] In addition, if Figures 3 to 5 As shown, each locking element 400 includes a gasket 410, a bolt 420 and a spring 430. The gasket 410 covers the side of the circuit board 120 that faces away from the peripheral components 140 (hereinafter referred to as the back side 124 of the circuit board 120). The bolt 420 passes through the gasket 410 and the circuit board 120 and is connected to the heat sink 210. The spring 430 surrounds the bolt 420 and abuts against the gasket 410 and the head 421 of the bolt 420, respectively, so as to force the heat sink module 200 and the interface card unit 100 to be tightly combined with each other ( Figure 1 ).

[0079] Figure 6 for Figure 2 The exploded view of the heat dissipation module 200 and the enlarged view of a specific location are shown. Figure 6 As shown, the heat dissipation module 200 further includes a fin group 240, a fan device 250 and a plurality of heat pipes 260. The fin group 240 is fixedly connected to a side of the heat dissipation block 210 facing away from the circuit board 120 (hereinafter referred to as the connection surface 211 of the heat dissipation block 210). The heat pipes 260 are respectively fixedly connected to the heat dissipation block 210 and the fin group 240. The fan device 250 is located on a side of the fin group 240 opposite to the heat dissipation block 210 to generate airflow and take away the heat of the interface card unit 100.

[0080] More specifically, the fin group 240 includes a plurality of fins 241. These fins 241 are arranged at intervals from each other, and the long axis direction (such as the X axis) of each fin 241 is parallel to the long axis direction (such as the X axis) of the circuit board 120. The bonding surface 212 of the heat sink 210 has a plurality of linear grooves 220. The long axis directions (such as the X axis) of these linear grooves 220 are parallel to each other. Each heat pipe 260 is bent, wherein the first section 261 of a heat pipe 260 passes through the fin group 240 along the Y axis, the second section 262 is placed in one of the linear grooves 220 along the Y axis, and the third section 263 connects the first section 261 and the second section 262 respectively, and the long axis extension direction (such as the X axis) of the third section 263 is orthogonal to or at least intersects with the long axis extension direction (such as the Y axis) of the first section 261 and the second section 262. The long axis direction (such as the Y axis) of each linear slot 220 is orthogonal to the long axis direction (such as the X axis) of the third section 263 of the heat pipe 260. The connection surface 211 of the heat sink 210 also has a plurality of fin slots 215. Each fin slot 215 is used to clamp one of the fins 241. The fins 241 of the fin group 240 are respectively clamped in the fin slots 215, so that the fin group 240 is tightly connected to the heat sink 210. However, the present invention is not limited to the above configuration.

[0081] In this embodiment, the interface card unit 100 is, for example, a display card, the core component 130 is, for example, a central processing chip or a graphics processing chip, etc., the peripheral component 140 is, for example, a memory, an inductor and a metal oxide semiconductor field effect transistor (MOSFET), etc., and the thermal pad 300 is, for example, a thermally conductive silicone pad or a conductive sponge, etc., however, the present invention is not limited to this.

[0082] Thus, through the above structure, the concave-convex structure of the interface card device and its heat dissipation module of the present invention can help reduce the rebound force of the thermal pad, improve the heat dissipation efficiency of the thermal pad for the interface card device, and thus reduce the risk of the interface card device failing to operate due to overheating.

[0083] Finally, the above disclosed embodiments are not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the concept and scope of the present invention, and all of them can be protected by the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. An interface card device, characterized in that: Include: An interface card unit has a circuit board and at least one heating element, wherein the heating element is fixed on one side of the circuit board; a heat dissipation module, comprising a heat dissipation block and at least one concave-convex structure, the heat dissipation block is combined with the circuit board, and the concave-convex structure is convexly disposed on a side of the heat dissipation block facing the circuit board; and At least one thermally conductive pad is flexible and is directly sandwiched between the concave-convex structure and the heating element, and thermally connects the heat sink and the heating element.

2. The interface card device according to claim 1, characterized in that: The concave-convex structure is integrally formed on the heat dissipation block.

3. The interface card device according to claim 1, wherein: The concave-convex structure can be detachably mounted on the heat dissipation block.

4. The interface card device according to claim 1, wherein: The concave-convex structure is in one of a line shape, a dot shape and a woven mesh shape.

5. The interface card device according to claim 1, wherein: The concave-convex structure includes a plurality of convex portions and a plurality of concave portions, the plurality of convex portions are spaced apart from each other, and the plurality of concave portions and the plurality of convex portions are staggered with each other. The plurality of protrusions jointly press one side of the thermal pad, so that the side of the thermal pad partially extends into the plurality of recesses.

6. The interface card device according to claim 1, wherein: The heat dissipation module also includes: A fin group fixedly connected to a side of the heat sink facing away from the circuit board; a heat pipe, fixedly connecting the heat sink and the fin group; and A fan device is located on a side of the fin group opposite to the heat sink, and is used to generate airflow and take away the heat of the interface card unit.

7. The interface card device according to claim 6, characterized in that: The surface of the heat sink facing away from the circuit board further comprises a plurality of fin grooves; and The fin group includes a plurality of fins, the plurality of fins are arranged at intervals from each other and are respectively clamped in the plurality of fin slots.

8. The interface card device according to claim 1, wherein: Also included are a plurality of locking elements, each of the plurality of locking elements comprising: A pad covering a side of the circuit board facing away from the heating element; a bolt passing through the gasket and the circuit board and connected to the heat sink; and A spring surrounds the bolt and respectively abuts against the pad and the head of the bolt to tightly combine the heat dissipation module and the interface card unit.

9. A heat dissipation module, characterized in that: For installation on an interface card unit, comprising: a heat sink; and At least one concave-convex structure is convexly disposed on one side of the heat dissipation block, When the heat sink is coupled to a circuit board of the interface card unit, a heat conducting pad is directly sandwiched between the concave-convex structure and the heating element of the circuit board, so that the heat conducting pad is thermally connected to the heat sink and the heating element.

10. The heat dissipation module according to claim 9, characterized in that: The concave-convex structure is integrally formed on the heat dissipation block.

11. The heat dissipation module according to claim 9, characterized in that: The concave-convex structure can be detachably mounted on the heat dissipation block.

12. The heat dissipation module according to claim 9, characterized in that: The concave-convex structure is in one of a line shape, a dot shape and a woven mesh shape.

13. The heat dissipation module according to claim 9, characterized in that: The concave-convex structure includes a plurality of convex portions and a plurality of concave portions. The plurality of convex portions are spaced apart from each other, and the plurality of concave portions and the plurality of convex portions are alternately arranged.

14. The heat dissipation module according to claim 9, characterized in that: Also includes: a fin group fixedly connected to the other side of the heat sink; a heat pipe, fixedly connecting the heat sink and the fin group; and A fan device is located on a side of the fin group opposite to the heat sink, and is used to generate airflow and take away the heat of the interface card unit.

15. The heat dissipation module according to claim 14, characterized in that: The other side of the heat sink also includes a plurality of fin slots; and The fin group includes a plurality of fins, the plurality of fins are arranged at intervals from each other and are respectively clamped in the plurality of fin slots.

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